TWM457014U - Ultra-thin wafer suction plate - Google Patents

Description

Ultra-thin wafer pick-up tray

This author is about an ultra-thin wafer pick-up disc, especially for an ultra-thin wafer that uses internal and external vacuum adsorption and suction to drive gravity or self-warping deformation to present a fully stable positioning and adsorption fast-moving field.

With the rapid development of technology, traditional slab wafer production has gradually evolved into ultra-thin wafers. The general wafer fabrication process must also be carried out by the front end of the robot arm to transfer the conversion process, while the suction method is divided into electrostatic adsorption ESC (Electro- Static chuck) structure, mechanical claw tamping structure and white pressure law of fluid pressure (non-contact) suction structure three, the former, electrostatic adsorption due to the operation process will have the disadvantage of electrostatic damage to the wafer, the middle, the mechanical claw easy to apply The patience of breaking the wafer is too large, and the latter is shown in Figure 1. As disclosed in the Taiwan Invention Patent No. I331981, the tangential lead-out hole is formed in the central annular groove of the tip to generate an instantaneous maximum pressure airflow pulling force. The upper end wafer is forced to float upward and adsorbed on the air outlet of the annular groove. However, when the ultra-thin wafer is in a floating state, it is easy to cause uneven adsorption due to gravity sagging or self-warping deformation of the outer ring diameter of the wafer. And super The thin wafer piece floats and rotates with the airflow of the lead-out hole, and the easy peeling and positioning deviation under rapid movement, which leads to an increase in the defect rate of scrapping, which is not in need of the industry, and is urgently needed for improvement.

In view of this, the creator of this case believes that only the improvement of the wafer can be improved, and it is a solution to the dilemma. It is also a pioneering experiment, and is actively engaged in the experiment of the accumulation of months, which is more effective than the past. The pioneer.

The main purpose of the present invention is to provide an ultra-thin wafer suction tray, in particular, the suction tray body comprises a central vacuum adsorption groove and a plurality of outer non-vacuum vortex adsorption holes, and utilizes internal and external vacuum adsorption attraction effects to drive gravity or The self-warping deformation of the ultra-thin wafer exhibits a fully smooth positioning and adsorption fast movement.

The secondary objective of the present invention is to provide an ultra-thin wafer pick-up disc, in particular, the central vacuum suction groove is disposed at the center of the body to extend outwardly from the surface of the micro-convex chuck, and the central torus of the ultra-thin wafer is completely flattened. The surface of the convex chuck is characterized by the function of forming a first vacuum-adsorbing ultra-thin wafer structure.

Another object of the present invention is to provide an ultra-thin wafer pick-up disc, wherein the outer non-vacuum vortex adsorption hole is arranged to form a second adsorption structure around the central micro-convex suction cup, and the outer ring generates a low-pressure vortex upward attraction effect. , so that the outer surface of the ultra-thin wafer is attracted to the floating flattening The function attached to the surface of the suction cup is characterized by it.

Another object of the present invention is to provide an ultra-thin wafer pick-up tray, which is characterized by the use of internal and external vacuum adsorption to attract the flattening, and to achieve the precise movement of the suction and take-off function.

1‧‧‧ Ontology

11‧‧‧ Vacuum suction groove

1A‧‧‧Micro-convex suction cup surface

2‧‧‧Non-vacuum vortex adsorption holes

21‧‧‧ semicircular concave arc

211‧‧‧Air supply passage

A‧‧‧Ultra-thin wafer

Fig. 1 is a schematic diagram showing the deviation or drop of the tip of the conventional tip.

Figure 2 is a perspective view of the creation.

Figure 3 is a top view of the creation.

The fourth figure is a schematic diagram of the non-vacuum vortex adsorption hole of the present invention to attract the ultra-thin wafer to level the positioning function.

In order to have a specific understanding of the purpose of the construction of the case and the purpose of the feature, a preferred embodiment is shown below: Please refer to Figure 2 and Figure 3. This creation provides an ultra-thin wafer pick-up disk. The suction tray body (1) comprises: a central vacuum adsorption groove (11) and a plurality of outer non-vacuum vortex adsorption holes (2); the suction disk body (1) is a circular suction disk disposed on the machine Grasping the front end; the central vacuum adsorption groove (1) is a central convex portion extending downwardly from the bottom of the body, and the surface of the micro-convex suction cup (1A) is provided with a connecting groove, which is formed to be connected with the vacuum passage for the rear end. a first adsorption structure; the outer non-vacuum vortex adsorption hole (2) is provided with a semicircular concave arc (21) around the central micro-convex suction cup, and the arc wall of each semicircular concave arc (21) is also The connecting air supply passages (211) are connected to form a second adsorption structure, and the air supply passage and the semicircular concave arc center are not straight, which is the main structural feature of the creation.

For the implementation of this creation, please refer to Fig. 4, which is fed into the airflow through the arc wall passage (211) of the semicircular concave arc (21) of the outer ring, and the air supply passage and the semicircular concave arc center are not in a straight line design. The airflow vortex is formed to form a low air pressure, which exhibits the attraction effect of the lower high pressure to the upper low pressure, so that the outer ring diameter of the ultra-thin wafer (A) is attracted to the floating position without rotation, and the compound toroidal ultra-thin wafer central torus Fully flattened on the surface of the micro-convex chuck (1A) of the central vacuum suction groove, the ultra-thin wafer that makes gravity or self-warping deformation presents a constructor that can completely and smoothly locate the adsorption fast-moving function.

However, the above is only the preferred embodiment of the present invention. When it is not possible to limit the scope of the creation of the present invention, the simple equivalent changes made by applying the scope of the patent application and the contents of the specification and the drawings are Modifications shall remain within the scope of this Creative Patent and shall be given to Chen Ming.

In summary, the creation of this creation is improved, the traditional single suction head is improved, and its efficacy is not achieved by the prior art. Therefore, this creation is a progressive and excellent creation, in order to meet the requirements of the new patent application. 提出 Submit an application in accordance with the law, and hope that the trial committee will grant this creation as soon as possible to protect the creators' hard work and feel good.

1‧‧‧ Ontology

11‧‧‧ Vacuum suction groove

1A‧‧‧Micro-convex suction cup surface

2‧‧‧Non-vacuum vortex adsorption holes

21‧‧‧ semicircular concave arc

211‧‧‧Air supply passage

Claims (2)

An ultra-thin wafer suction tray comprises: a central vacuum adsorption groove, and a groove corresponding to the surface of the suction disk body protruding outwardly extending the micro convex suction cup, wherein the rear air supply passage is connected to form a first adsorption structure And a plurality of outer non-vacuum vortex adsorption holes, wherein concave arcs are arranged around the central micro-convex suction cups, and arc walls of each concave arc are also connected with the connected air supply channels to form a second adsorption structure. The ultra-thin wafer pick-up disc of claim 1, wherein the air supply passage and the semicircular concave arc center are not in a straight line.