TWM455905U - High power density power supply - Google Patents

Description

High power density power supply

This creation is a power supply, especially a high power density power supply.

Please refer to FIG. 8 , which is a circuit diagram of an existing power supply, wherein the power supply includes: a primary side circuit 70 connected to an AC power supply and the AC power supply is provided. a step-down output; a transformer 71 having a primary side connected to the primary side circuit 70 and outputting an inductive AC power source on a secondary side thereof; and a secondary side circuit 72 connected to the transformer 71 twice On the side, the inductive alternating current power outputted by the secondary side is converted into a direct current power supply and output; wherein the main component used in the secondary side circuit is a metal oxide half field effect transistor 73 (MOSFET), and the inductor 74 is used together. A passive filter component such as a capacitor 75 is used, and an ORing MOS transistor 76 is connected at the same time as an output.

Referring to FIG. 9 at the same time, in the actual implementation, the above-mentioned existing power supply is matched with a trace-layout on a circuit board 80, and various electronic components used in the secondary circuit are used ( For example, a gold-oxygen half field effect transistor 73) is soldered thereon; wherein the gold-oxygen half-field transistor 73 of the secondary side circuit 72 uses a pin-shaped package component. Since the above-mentioned gold-oxygen half-field effect transistor 73 is used as a power transistor, and after long-term use, The temperature will rise, so that a heat sink 82 is generally screwed onto the back plate of each of the MOS field-effect transistors 73 to help the metal oxide half-field transistor 73 to dissipate heat rapidly.

However, since the pin-shaped MOS field effect transistor 73 is relatively bulky, it takes up a large area of the circuit board 80; in particular, it is necessary to use a secondary side circuit of a plurality of MOS field-effect transistors 73 on the board. The space configuration of 80 is even more inadequate.

Therefore, some power supply manufacturers have adopted a sub-board to solder the components of the secondary circuit to it, and use a surface-adhesive gold-oxygen half-field transistor 73 having a small volume, as shown in FIG. 10 and FIG. As shown in FIG. 11, the sub-board 83 is vertically inserted and soldered to the circuit board 80.

It can be seen from the above structure that since the sub-circuit board 83 is interposed on the circuit board in an upright manner with the surface-adhesive gold-oxygen half-field transistor 73', it is possible to effectively reduce the gold-oxygen half-field effect transistor soldering. In the area of the circuit board 80, thereby shortening the distance between the two short sides of the circuit board 80, that is, the length of the power supply is reduced, and the surface-adhesive gold-oxygen half-field effect crystal is used together, thereby reducing the secondary side circuit. There is a reduction in the size of the power supply.

Although the above-mentioned erect sub-circuit board can reduce the volume of the existing power supply, the surface-adhesive gold-oxygen half-field transistor 73 which is used in a small volume has the same function as the pin-shaped gold gas half-field effect transistor 73, and operates for a long time. The high temperature is also generated. As can be seen from FIG. 11, the surface-adhesive gold-oxygen half-field effect transistor 73 cannot be cooled by the heat sink of the pin-shaped MOS field-effect transistor 73, and has a technical problem of poor heat dissipation; It is necessary to further propose a better solution for this situation.

In view of the fact that the sub-circuit board formed with the secondary side circuit has the disadvantage of poor heat dissipation, the main purpose of the present invention is to provide a power supply with high power density, which uses a sub-board with both heat dissipation and electrical conduction effects.

The main technical means used to achieve the above purpose is to provide the high power density power supply, comprising: a main circuit board, at least one transformer formed on the main printed circuit and provided with a power supply circuit The electronic components of the primary circuit and the inductance of the at least one secondary circuit are soldered thereto and electrically connected to the main printed circuit; at least one of the sub-boards are vertically inserted and soldered to the main circuit board And a sub-printed circuit is formed on one side thereof to electrically connect with the main printed circuit of the main circuit board, and the surface-adhesive electronic switch of the secondary circuit is soldered thereon; and the top of each sub-board a side surface is formed with a drain contact connected to the upper surface of the upper surface of the electronic switch, and at least one heat sink is laterally soldered to the bottom contact of the top side of the corresponding sub-board, and is secondarily connected to the transformer Side wire joints and inductor wire joints are welded.

The present invention is characterized in that a heat sink is laterally soldered to the top end of each sub-board, and the heat sink is connected to the sub-printed circuit, so that the thermal energy of the surface-adhesive electronic switch on the sub-circuit is transmitted to the heat through the sub-printed line. On the chip, the heat dissipation problem is further solved; further, since the heat sink can be electrically conductive, the secondary winding connector and the inductor winding connector of the transformer can be soldered together on the heat sink to be electrically connected with the corresponding electronic switch, without the main circuit Main print on the board The brush line is electrically connected to it to further increase the wiring space on the main circuit board.

The general power supply circuit includes a primary side circuit 10, at least one transformer 20, and at least one secondary side circuit 30. First, please refer to FIG. 1 and FIG. 2, which are two kinds of secondary side circuits 30, 30' which are common in the power supply circuit. In FIG. 1, the secondary side circuit 30 is a double current circuit, which includes Two electronic switches 31, two inductors 32, an output capacitor 33 and an ORing MOS transistor 34; wherein the drains of the two electronic switches 31 are respectively connected to the joints of the secondary side windings of the corresponding transformer 20, and the corresponding inductors 32 windings One of the joints. As shown in FIG. 2, the secondary side circuit 30' is matched with a middle tap voltage device 20', that is, the secondary side circuit 30' also includes two electronic switches 31, an inductor 32, an output capacitor 33, and An ORing MOS transistor 34, except that the center tap connector of the intermediate tap transformer 20' is connected to one end of the output capacitor 33, and the remaining electrical connections are the same as in FIG.

It can be seen from the above description of the secondary circuit that each of the electronic switches is connected to the secondary winding of the transformer and one of the terminals of the inductor winding. The specific implementation structure of the present power supply is further described below.

Referring to FIG. 3, the present power supply circuit mainly includes: a main circuit board 40, on which a main printed circuit (not shown) is formed, and at least one transformer 20 for a power supply circuit is provided. The electronic components of the set of primary side circuits 10 and the inductances 32 of at least one set of secondary side circuits 30 are soldered thereto and electrically connected to the main printed circuit; at least one of the sub-circuit boards 50 are vertically inserted and soldered to The main power a sub-printed line 51 is formed on the side of the circuit board 40 to be electrically connected to the main printed circuit of the main circuit board 40, and the surface-adhesive electronic switch of the secondary side circuit is soldered thereto; One side of the top end of each sub-board 50 is formed with a drain contact 52 connected to the top surface of the upper surface-adhesive electronic switch 31; at least one heat sink 60 is laterally soldered to the top side of the corresponding sub-board 50. The pole contact 42 is soldered to the transformer 20 secondary side winding joint and the inductor 32 winding joint.

Referring to FIG. 3 and FIG. 4 simultaneously, in the first preferred embodiment of the present invention, the two sub-boards 50 and the two heat sinks 60 are used to implement the single-group secondary circuit shown in FIG. 1 or FIG. 2, wherein Figure 3 shows two sets of secondary side circuits. Each of the sub-circuit boards 50 is a single-panel, that is, a sub-printed circuit 51 is formed on one side thereof, and at least one surface-adhesive electronic switch 31 is soldered to the side, and the drain is connected to the top of the drain through the sub-printing line 51. The point 52 is electrically connected, and the heat sink 60 is soldered to the top side of the sub-board 50. In this embodiment, each of the fins 60 is formed with a through hole 61 for the secondary winding of the transformer 20 and one of the contacts of the inductor 32 to be welded after being penetrated.

In addition, in order to improve the heat dissipation effect, the sub-circuit board 50 is provided with a plurality of conductive through holes 53 in the soldering portion of the heat sink 60, so that the soldering holes can fill the conductive through holes 53, in addition to increasing the fixing force of the soldering. In this embodiment, the heat sink 60 is L-shaped, and one side of the heat sink 60 is flat and soldered to the sub-circuit board 50. on. Furthermore, as shown in FIG. 5, the surface-adhesive electronic switch 31 is further attached to its electrically insulating surface by a metal piece 62. Screw or heat-dissipating glue is fixed on the heat sink 60, and the waste heat generated by the surface-adhesive electronic switch 31 is directly transmitted to the heat sink 60 to accelerate the heat dissipation.

Referring to FIG. 6 and FIG. 7, in the second preferred embodiment of the present invention, a sub-board 50' and two heat sinks 60' are used to implement the single set of FIG. 1 or FIG. The side circuit, in which Fig. 6 discloses two sets of secondary side circuits. The sub-board 50' is a double-panel, that is, a sub-printing circuit 51 is formed on opposite sides of the sub-board 50', and at least one surface-adhesive electronic switch 31 is soldered to each side of the sub-board 50'. The drain is electrically connected to the drain contact 52 of the top side through the sub-printing line 51, and the heat sink 60' is soldered to the side of the top end of the sub-board 50'. In the present embodiment, each of the fins 60' is formed with a through hole 61 for soldering the secondary winding of the transformer 20 and one of the contacts of the inductor 32.

As shown in FIG. 1 and FIG. 2, the polarities of one end of the transformer 20 connected to the two electronic switches 31 are not the same; therefore, in the present embodiment, FIG. 7 implements a single sub-circuit 50' used in a single set of secondary side circuits. The board must be soldered with two electrically insulating fins 60', i.e., the two fins 60' are soldered to their respective sides. In this embodiment, each of the heat sinks 60' has a shape of a single shape, and at least one of the tabs 601 is formed on one side of the sub-board 50', and the sub-board 50 corresponding to at least one of the tabs 601 is formed. The top side is formed with a card slot 501 for the tab 601 to be inserted into the clip. As shown in FIG. 7 , a fin 601 is formed on one side of one of the heat dissipation fins 60 ′, and two tabs are formed on one side of the other heat sink 60 ′, and the sub-circuit board 50 ′ is formed with three The card slot 501 is inserted and fixed correspondingly to the three tabs 601 of the two fins 60', and is respectively soldered to the sub-printing lines 51 of the corresponding surfaces thereof to be electrically connected to the electronic switch 31.

Similarly, in order to improve the heat dissipation effect, the electrically insulating surface of the electronic switch on the two sides of the sub-board is connected to its corresponding heat sink by a metal piece.

In summary, since the present invention solders some components of each secondary circuit (such as an electronic switch) to the sub-board, and since the sub-board is soldered upright on the main circuit board, it is effective. The reduction is originally for the electronic switch to be soldered to the main circuit board area, thereby shortening the distance between the two short sides of the main circuit board, that is, the length of the power supply is reduced; and most importantly, the present invention is based on the sub-circuit The top end of the board is provided with a heat sink in the lateral direction, and the heat sink is electrically connected to the sub-printing line; since most of the sub-printing lines are metal lines having both conductive and heat conducting functions, the above-mentioned electronic opening relationship can be The heat energy is transmitted to the heat sink through the sub-printed circuit on the sub-board to solve the heat dissipation problem; and at the same time, the purpose of reducing the volume and increasing the power density is achieved.

10‧‧‧primary circuit

20‧‧‧Transformers

20’‧‧‧Intermediate tapped transformer

30, 30'‧‧‧ secondary circuit

31‧‧‧Electronic switch

32‧‧‧Inductance

33‧‧‧ Capacitance

34‧‧‧ORing MOS transistor

40‧‧‧Main board

50, 50’‧‧‧sub-board

501‧‧‧ card slot

51‧‧‧Sub-printed lines

52‧‧‧汲pole contacts

53‧‧‧ Conductive through holes

60, 60'‧‧ ‧ heat sink

601‧‧‧1 piece

61‧‧‧through holes

70‧‧‧primary circuit

71‧‧‧Transformers

72‧‧‧secondary circuit

73‧‧‧Gold oxygen half-field effect transistor

73'‧‧‧Gold oxygen half-field effect transistor

74‧‧‧Inductance

75‧‧‧ Capacitance

76‧‧‧ORing MOS transistor

80‧‧‧ boards

81‧‧‧Printed circuit

82‧‧‧ radiator

83‧‧‧Sub Board

Figure 1: This is the circuit diagram of the secondary power supply circuit using the current doubler circuit.

Figure 2: The circuit diagram of the secondary side circuit of the central power supply circuit with the central tapped transformer.

Figure 3 is a perspective view of a first preferred embodiment of the present power supply.

Figure 4: is a perspective view of the sub-board of Figure 3.

Figure 5: A side view of the sub-board of Figure 4.

Figure 6 is a perspective view of a second preferred embodiment of the present power supply.

Figure 7 is a perspective view of the sub-board of Figure 6.

Figure 8: A circuit wiring diagram of an existing power supply.

Figure 9 is a perspective view of an existing power supply.

Figure 10 is a perspective view of another power supply that uses a surface mount type MOS field effect transistor.

Figure 11 is a perspective view of the sub-board of Figure 10.

20‧‧‧Transformers

31‧‧‧Electronic switch

32‧‧‧Inductance

40‧‧‧Main board

50‧‧‧Sub Board

51‧‧‧Sub-printed lines

60‧‧‧ Heat sink

Claims (11)

A high power density power supply comprising: a main circuit board, a main printed circuit formed thereon, and at least one transformer for a power supply circuit, an electronic component of a set of primary side circuits, and at least one The inductor of the secondary circuit is soldered thereto and electrically connected to the main printed circuit; at least one of the sub-boards is vertically inserted and soldered to the main circuit board, and a sub-print is formed on one side thereof. The circuit is electrically connected to the main printed circuit of the main circuit board, and the surface-adhesive electronic switch of the secondary circuit is soldered thereto; and a side of the top end of each sub-board is formed with a bonding type with the upper surface thereof. The electrode contact of the electronic switch drain is connected; at least one heat sink is transversely soldered to the electrode contact of the top side of the corresponding sub-board, and is soldered to the secondary winding connector and the inductor winding connector of the transformer. A high power density power supply as claimed in claim 1, wherein each of the sub-boards is a single layer board and a single heat sink is soldered. The high power density power supply device of claim 1, wherein each of the sub-circuit boards is a double-layer board, wherein the two-layer board is formed with a sub-printed circuit on the opposite surfaces, and the top two sides of the two sides are respectively soldered. The heat sink, wherein the two heat sinks are electrically insulated and isolated. The high-density power supply of claim 2 or 3, wherein the electrically insulating surface of each of the surface-adhesive electronic switches is flat on a metal piece, and the metal piece is fixed to the heat sink. The power supply of the high power density according to claim 2 or 3, wherein each of the heat sinks has an L shape, wherein one side is flatly soldered to the corresponding sub-board Top side. In the power supply of the high power density according to claim 4, each of the heat sinks has an L shape, and one side of the heat sink is flatly soldered to the top side of the corresponding sub-circuit board. The power supply of the high power density according to claim 2 or 3, wherein at least one tab is formed on one side of each of the heat sinks, and a through slot is formed on a side of the top end of the sub-board corresponding to the heat sink for the tab Insert is fixed. The high power density power supply device of claim 4, wherein at least one tab is formed on each side of the heat sink, and a slot is formed on a side of the top end of the sub-board corresponding to the heat sink for inserting and fixing the tab . The power supply of the high power density according to claim 1 includes two transformers and two sets of secondary side circuits, each of which is a current doubler circuit and includes at least two surface-adhesive electronic switches and Two inductors. The power supply of the high power density according to claim 1 includes two intermediate tap transformers and two sets of secondary side circuits, and each set of secondary side circuits includes at least two surface-adhesive electronic switches and two inductors. The high-density power supply device according to claim 9 or 10, wherein the surface-adhesive electronic opening relationship is a gold-oxygen half-field effect transistor, and the electrode contacts of each sub-circuit board are bungee contacts, so that the gold-oxygen half field The drain of the effect transistor is electrically connected to the heat sink.