TWM454702U - The third material is formed by molding waterproof device - Google Patents

The third material is formed by molding waterproof device Download PDF

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Publication number
TWM454702U
TWM454702U TW101224361U TW101224361U TWM454702U TW M454702 U TWM454702 U TW M454702U TW 101224361 U TW101224361 U TW 101224361U TW 101224361 U TW101224361 U TW 101224361U TW M454702 U TWM454702 U TW M454702U
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Taiwan
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waterproof
waterproof member
injection
material molding
rubber
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TW101224361U
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Chinese (zh)
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Xu-Zhang Liu
Ming-Song Ye
yu-jun Sun
Ming-Zhi Ye
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Unitel High Technology Corp
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Priority to TW101224361U priority Critical patent/TWM454702U/en
Publication of TWM454702U publication Critical patent/TWM454702U/en

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  • Injection Moulding Of Plastics Or The Like (AREA)

Description

利用三料模接成型之防水元件 Waterproof component formed by three-die molding

本創作係有關於一種防水元件,特別是指透過模接成型而達到異材接合之利用三料模接成型之防水元件。 The present invention relates to a waterproof component, in particular to a waterproof component formed by three-die molding by means of die-bonding to achieve dissimilar material bonding.

按,隨著通訊科技及電子技術的進步,具備各種功能的電子裝置,如行動電話、多媒體播放器、筆記型電腦等,均已成為現代人們不可或缺的工具,且不同種類的電子裝置如今已能相互整合成一體,使得利用手機聆聽音樂、上網、編輯文件,或利用個人電腦撥打電話等功能,已不再是遙不可及的夢想。該等電子裝置係由眾多不同精密電子元件所組合而成,該等精密電子元件雖大幅地提昇了各該電子裝置之前述性能,但在使用上卻最怕接觸到水而造成短路,或受潮而發生腐蝕損壞。 With the advancement of communication technology and electronic technology, electronic devices with various functions, such as mobile phones, multimedia players, notebook computers, etc., have become indispensable tools for modern people, and different kinds of electronic devices are nowadays. It has been integrated into one, making it impossible to use the mobile phone to listen to music, surf the Internet, edit files, or use a personal computer to make calls. The electronic devices are composed of a plurality of different precision electronic components, which greatly improve the aforementioned performance of each of the electronic devices, but are most afraid of contact with water to cause short circuit or moisture in use. Corrosion damage occurs.

在一般的設計中,通常電子裝置內會設置有一電路板,而這些連接器及電子元件則分別被焊接固定在電路板上,以彼此電性連接並進行資訊傳遞及運算,大多數的電子裝置雖均包覆有設計精美的外殼,以避免外界之灰塵及水氣接觸到內部之該等精密電子元件,惟,該等電子裝置為了能接收外界傳來的電子訊號及電源,通常其對外接口處係配置有一相 關收發或對接之電子元件,如天線、連接器等,由於該電子元件並非封閉式地組裝在該等電子裝置上,因此使用者若是在天氣潮濕的情況下使用該電子裝置,或者不慎打翻位於該電子裝置週邊之盛水物件(如水杯),則外界之水分及濕氣將能經由該連接器中之縫隙,侵入各該電子裝置之內部,導致電子裝置內之該等精密電子元件因觸到水或受潮,而發生短路或侵蝕損壞之問題,造成使用者極大的不方便。 In a general design, usually a circuit board is disposed in the electronic device, and the connectors and electronic components are respectively soldered and fixed on the circuit board to be electrically connected to each other and perform information transmission and calculation, and most of the electronic devices Although they are covered with a beautifully designed outer casing to prevent external dust and moisture from coming into contact with the internal precision electronic components, the electronic devices usually have external interfaces in order to receive external electronic signals and power sources. Department configuration Electronic components that are transceived or docked, such as antennas, connectors, etc., because the electronic components are not closedly assembled on the electronic devices, so if the user uses the electronic device in a wet weather, or accidentally hits When the water-containing object (such as a water cup) is turned around the electronic device, moisture and moisture from the outside can penetrate into the interior of each electronic device through the gap in the connector, resulting in the precision electronic components in the electronic device. The problem of short circuit or erosion damage due to contact with water or moisture causes great inconvenience to the user.

以電子裝置為例,如手機、平板電腦或數位相機等等,這類電子裝置會設置有用以接設傳輸線之傳輸埠,該傳輸埠之一接口於非使用狀態下時,會以一蓋體遮蓋於傳輸埠之接口,或再於該蓋體之一側設置一塞體,使該蓋體遮蓋傳輸埠之接口的同時,該塞體能填塞於該傳輸埠之接槽,使該傳輸埠達到對外封閉的效果,而具有基本的防水功能。 Taking an electronic device as an example, such as a mobile phone, a tablet computer or a digital camera, etc., such an electronic device is provided with a transmission port for connecting a transmission line, and when one of the transmission ports is in a non-use state, a cover body is used. Covering the interface of the transfer port, or further providing a plug body on one side of the cover body, so that the cover body covers the interface of the transfer port, and the plug body can be stuffed in the joint groove of the transfer port, so that the transfer port can be reached. The effect of external closure, but with basic waterproof function.

一般用於電子裝置之防水蓋體係以塑料進行雙料射出成型,以一次性的工法成型該防水蓋體,並透過不同塑料之特性,使成型後之防水蓋體具有軟硬不同之部位,通常,軟塑部分係用與機體連結之可旋動部位,而硬塑部分係用於封罩之蓋體部位,而能用於密閉電子裝置之傳輸埠接口。然,不同塑料在射出接合時,由於其具有不同的化學性質,相容性會影響接合面的結合強度與結合效果,故雙料射出都會選擇相容性較佳的塑料,使塑料之間能達到良好的接合。若防水蓋體欲接合相容性不佳的第三塑料(異材相接),則必須先將第三塑料成型,再以黏著劑將成型後之防水蓋體與第三塑料接著,防止防水蓋體與第三塑料之接合面不穩固,如此在防 水蓋體的工序上則需要再增加多道步驟,無法一次性成型。 Generally, the waterproof cover system for electronic devices is formed by double injection molding of plastic, and the waterproof cover body is formed by a one-time construction method, and the waterproof cover body after molding has different soft and hard parts through the characteristics of different plastics. The soft plastic part is a rotatable part that is connected to the body, and the hard plastic part is used for the cover part of the enclosure, and can be used for the transmission port of the electronic device. However, when different plastics are injected and joined, because of their different chemical properties, the compatibility will affect the bonding strength and bonding effect of the joint surface. Therefore, the two materials will select plastics with better compatibility, so that plastics can be achieved. Good joint. If the waterproof cover is to be joined to a third plastic that is not compatible (the different materials are connected), the third plastic must be formed first, and then the formed waterproof cover and the third plastic are adhered with an adhesive to prevent the waterproof cover. The joint between the body and the third plastic is not stable, so it is against In the process of the water cover body, it is necessary to add a plurality of steps, and it is impossible to form it at one time.

由於現有技術尚無法完善處理此類問題,所以有加以突破、解決之必要。因此,如何提升方便性、實用性與經濟效益,此為業界應努力解決、克服之重點項目。 Since the prior art is still unable to perfect such problems, it is necessary to break through and solve them. Therefore, how to improve convenience, practicability and economic benefits is a key project that the industry should strive to solve and overcome.

緣此,本創作人有鑑於習知防水元件未臻理想之事實,本案創作人即著手研發其解決方案,希望能開發出一種更具便利性、實用性與高經濟效益之利用三料模接成型之防水元件,以促進此業之發展,遂經多時之構思而有本創作之產生。 Therefore, the creator of this case has started to develop its solution in view of the fact that the waterproof components are not ideal, and hopes to develop a more convenient, practical and economical use of three materials. The molded waterproof components are used to promote the development of this industry.

本創作之目的在於提供一種利用低溫架橋劑混合一與其它塑料之間相容性不佳之橡膠材料,使橡膠材料能在與其它塑料相近的熱固溫度下,穩定的與欲接合之塑料模接,以提昇橡膠材料與其它塑料之相容性,再以三料射出之方式,一次性射出形成一成品,由於該橡膠材料係混合該低溫架橋劑,使得該橡膠材料與其它塑料之相容性提昇,故橡膠材料與塑料之間能緊密接合,而達到異材接合之目的,並減少元件射出成型所需要執行的工法次數。 The purpose of the present invention is to provide a rubber material which is poorly compatible with other plastics by using a low temperature bridging agent, so that the rubber material can be stably bonded to the plastic to be joined at a thermosetting temperature similar to that of other plastics. In order to improve the compatibility of the rubber material with other plastics, a three-shot injection method is used to form a finished product in one shot, and the rubber material is mixed with the low temperature bridging agent to make the rubber material compatible with other plastics. Ascending, the rubber material and the plastic can be tightly joined to achieve the purpose of the dissimilar material joining, and the number of times of execution of the component injection molding is reduced.

為達上述之目的,本創作係提供一種利用三料模接成型之防水元件,其包含一第一射出件;一第二射出件,其模接於該第一射出件;及一橡膠防水件,其模接於該第一射出件一側。 For the purpose of the above, the present invention provides a waterproof component formed by three-die molding, which comprises a first injection member, a second injection member molded to the first injection member, and a rubber waterproof member. The mold is connected to one side of the first injection member.

1‧‧‧防水元件 1‧‧‧Waterproof components

10‧‧‧蓋件 10‧‧‧Cleaning pieces

20‧‧‧連接件 20‧‧‧Connecting parts

22‧‧‧定位件 22‧‧‧ Positioning parts

30‧‧‧防水塞件 30‧‧‧Waterproof plugs

32‧‧‧矽橡膠材料 32‧‧‧矽Rubber material

34‧‧‧低溫架橋劑 34‧‧‧Low temperature bridging agent

36‧‧‧凸環部 36‧‧‧ convex ring

40‧‧‧界面活性劑 40‧‧‧Interactive surfactant

50‧‧‧電子裝置 50‧‧‧Electronic devices

52‧‧‧接槽 52‧‧‧ slots

54‧‧‧接口 54‧‧‧ interface

56‧‧‧插接孔 56‧‧‧ Sockets

第一圖為本創作之第一較佳實施例之結構示意圖(一);第二圖為本創作之第一較佳實施例之結構示意圖(二);第三圖為本創作之第一較佳實施例之實施示意圖;及第四圖為本創作之第二較佳實施例之結構示意圖。 The first drawing is a schematic structural view (1) of the first preferred embodiment of the present invention; the second drawing is a schematic structural view of the first preferred embodiment of the present invention (2); A schematic diagram of the implementation of the preferred embodiment; and a fourth diagram is a schematic structural view of the second preferred embodiment of the present invention.

茲為使 貴審查委員對本創作之結構特徵及所達成之功效更有進一步之瞭解與認識,謹佐以較佳之實施例圖及配合詳細之說明,說明如後:由於習知的防水元件係利用射出之方式成型,其必須選擇相容性較佳的塑料,若欲與接合相容性不佳的塑料時,受限於塑料之間化學性質不同(如熱塑溫度),直接射出成型會導致接合面的不穩定,故通常會利用黏著劑黏合成型後之塑料,才能使接合面穩固,達到異材接合的目的,不過,卻也因此需要增加多道工序。 In order to give your reviewers a better understanding and understanding of the structural features and the efficacies achieved, please refer to the preferred embodiment diagrams and detailed descriptions to illustrate the following: due to the use of conventional waterproof components In the case of injection molding, it is necessary to select a plastic with better compatibility. If the plastic is not compatible with the joint, it is limited by the chemical properties of the plastic (such as the thermoplastic temperature), and direct injection molding may result in Since the joint surface is unstable, it is usually made of an adhesive-bonded plastic to stabilize the joint surface and achieve the purpose of joining the different materials. However, it is necessary to add a plurality of processes.

有鑑於此,本創作即提出得以改善習知缺點之技術,利用三料模接一次性成型之防水元件,並解決材料之間相容性的問題,其主要包含一第一射出件、一第二射出件及一橡膠防水件,該第二射出件以射出成形方式模接於該第一射出件,該橡膠防水件以熱壓或射出成形方式模接於該第一射出件一側或周邊,其係相繼以射出、熱壓/射出之方式相互模接,而本創作更進一步以防水元件為例進行說明如下:首先,請參閱第一圖及第二圖,其為本創作之第一較佳實施例之結構示意圖(一)及結構示意圖(二),乃以一電子裝 置(如筆電、手機、平板等)之防水蓋罩為例進行說明;如圖所示,本實施例之防水元件1包含一蓋件10、一連接件20及一防水塞件30,該蓋件10係以射出成型製成,該連接件20係以射出成型而模接於該蓋件10該防水塞件30係以熱壓或射出成型而模設於該蓋件10內側;亦即,本創作係於一模具(未圖示)中第一次射出成型該蓋件10,繼於該模具中以第二次射出成型該連接件20,使該連接件20模接於該蓋件10,繼以熱壓或第三次射出成型該防水塞件30,使該防水塞件30模接於該蓋件10;其中該第一次射出成型之蓋件10及第二次射出成形之連接件20其順序亦可對換。 In view of this, this creation proposes a technique for improving the shortcomings of the prior art, using a three-material molded one-time molded waterproof component, and solving the problem of compatibility between materials, which mainly includes a first shot, a first a second injection member and a rubber waterproof member, wherein the second injection member is molded to the first injection member in an injection molding manner, and the rubber waterproof member is molded on one side or the periphery of the first injection member by hot pressing or injection molding. The series are successively molded by injection, hot pressing/ejection, and the creation is further illustrated by taking waterproof components as an example: First, please refer to the first figure and the second figure, which is the first of the creation. The schematic diagram (1) of the preferred embodiment and the schematic diagram (2) of the structure are in an electronic device. For example, the waterproof cover 1 of the present embodiment includes a cover member 10, a connector member 20 and a waterproof plug member 30. The cover member 10 is formed by injection molding, and the connector member 20 is molded and molded to the cover member 10. The waterproof plug member 30 is molded on the inner side of the cover member 10 by hot pressing or injection molding; that is, The creation is performed in a mold (not shown) for the first time to form the cover member 10, and the connector member 20 is secondarily injection molded in the mold, so that the connector member 20 is molded to the cover member. 10, after the hot plug or the third injection molding the waterproof plug 30, the waterproof plug 30 is molded to the cover member 10; wherein the first injection molded cover member 10 and the second injection molding The connectors 20 can also be reversed in sequence.

請一併參閱第三圖,該蓋件10、連接件20及防水塞件30係透過三料模接一次性成型,該蓋件10為一硬質塑件,其用以遮蓋一電子裝置50之接口54,使電子裝置50具有基本防水之功能性,該連接件20為一軟質塑件,其插設連結於該電子裝置50之插接孔56,以構成一可旋扭變形之防水擋件,該防水塞件30透過熱壓或射出成型模接於該蓋件10內側,用以填塞於該電子裝置50之接槽52,以提昇該電子裝置50之防水性。而在其他構成需求之實施方式中,該防水塞件30係可熱壓或射出成型於該蓋件10之周邊,或者該防水塞件30之周邊更環設有一凸環部36。 Referring to the third figure, the cover member 10, the connecting member 20 and the waterproof plug member 30 are formed in one piece through a three-material mold. The cover member 10 is a rigid plastic member for covering an electronic device 50. The connector 54 is configured to provide a basic waterproof function. The connector 20 is a soft plastic member that is inserted into the insertion hole 56 of the electronic device 50 to form a torque-proof member. The waterproof plug 30 is connected to the inside of the cover member 10 through a hot press or injection molding die for filling the slot 52 of the electronic device 50 to improve the waterproofness of the electronic device 50. In other embodiments, the waterproof plug 30 can be heat-pressed or injection molded on the periphery of the cover member 10, or a peripheral portion of the waterproof plug member 30 can be further provided with a convex ring portion 36.

其中,該防水塞件30包括一矽橡膠材料32及一低溫架橋劑34,該低溫架橋劑34係揉設並混合於該矽橡膠材料32,該低溫架橋劑34為一鉑金架橋劑,在該蓋件10與防水塞件30兩者接合時,若橡膠的溫度過高會破壞塑料的結構,故矽橡膠 材料32與低溫架橋劑34混合後,能在與該連接件20及蓋件10相近的溫度下穩定的接合(模接),經熱壓或射出成型的接合面具有良好的穩固性。 The waterproof plug member 30 includes a rubber material 32 and a low temperature bridging agent 34. The low temperature bridging agent 34 is disposed and mixed with the rubber material 32. The low temperature bridging agent 34 is a platinum bridging agent. When the cover member 10 and the waterproof plug member 30 are joined, if the temperature of the rubber is too high, the structure of the plastic is broken, so the rubber After the material 32 is mixed with the low temperature bridging agent 34, it can be stably joined (molded) at a temperature close to the connecting member 20 and the cover member 10, and the joint surface formed by hot pressing or injection molding has good stability.

前述該電子裝置50之接槽52之槽形與該防水塞件30之外形、尺寸近似或相同,以使該防水塞件30能填塞於該接槽52,並藉該凸環部36之壓制迫緊,而更提昇其防水性,而該接口54之形狀、尺寸與該蓋件10及凸伸出插接孔56外之連接件20所構成之防水擋件近似或相同,使該防水擋件能夠遮蓋該接口54,而達到密閉該接槽52及防水之功能性,此外,該連接件20末端更設有一定位件22,該定位件22係插入接合於該電子裝置50之插接孔56內,使該防水擋件固定於該接口54而不會脫落,並藉由該連接件20之軟質塑料特性,而能活動該蓋件10,當然,該連接件20與電子裝置50之連結構成亦可以其他方式實施,不受此限。 The slot shape of the slot 52 of the electronic device 50 is similar to or different from the shape and size of the waterproof plug 30, so that the waterproof plug 30 can be stuffed into the slot 52 and pressed by the collar portion 36. The watertightness is increased, and the shape and size of the interface 54 are similar to or the same as the waterproof member formed by the cover member 10 and the connecting member 20 protruding from the insertion hole 56. The connector can cover the interface 54 to achieve the function of sealing the socket 52 and waterproofing. In addition, the connector 20 is further provided with a positioning member 22, and the positioning member 22 is inserted into the insertion hole of the electronic device 50. In the 56, the waterproof member is fixed to the interface 54 without falling off, and the cover member 10 can be moved by the soft plastic property of the connecting member 20. Of course, the connecting member 20 is connected to the electronic device 50. The composition may also be implemented in other ways, without being limited thereto.

請參閱第四圖,其為本創作之第二較佳實施例之結構示意圖,乃基於第一較佳實施例之結構基礎上加以變化設置;如圖所示,為了提昇該蓋件10與該防水塞件30接合之穩固性,該蓋件10一側更設有一界面活性劑40與該防水塞件30連接,該界面活性劑40能使該蓋件10熔接成型前之塑料與該防水塞件30成型前之含低溫架橋劑34之矽橡膠材料32於熱壓或射出熔結時達到良好的鍵結,使鍵結之結構穩定,該界面活性劑僅係為了進一步提昇蓋件10與該防水塞件30接合之穩固性。 Please refer to the fourth figure, which is a structural schematic diagram of a second preferred embodiment of the present invention, which is based on the structure of the first preferred embodiment; as shown, in order to lift the cover member 10 and the The sealing member 30 is further provided with a stabilizer. The side of the cover member 10 is further provided with a surfactant 40 connected to the waterproof plug member 30. The surfactant 40 can weld the cover member 10 to the plastic before the molding and the waterproof plug. The rubber material 32 containing the low temperature bridging agent 34 before the forming of the member 30 achieves good bonding during hot pressing or injection sintering, and the structure of the bonding is stabilized. The surfactant is only for further lifting the cover member 10 and the The sealing of the waterproof plug 30 is stable.

此外,該防水塞件30不僅可為一塊狀填塞於該接槽52, 其亦可進一步設一凹口(未圖示),該凹口係對應該接槽52內之元件外形設置,使該防水塞件30設於該接槽52後,能與接槽52內之各元件充分緊密貼合,減少縫隙的產生,使防水性更為提昇。 In addition, the waterproof plug 30 can be not only padded in the joint groove 52, Further, a notch (not shown) may be further disposed, and the notch is disposed corresponding to the shape of the component in the slot 52, so that the waterproof plug 30 is disposed in the slot 52 and can be connected to the slot 52. The components are closely attached to each other to reduce the occurrence of gaps and improve water repellency.

綜上所述,本創作係將相容性不佳之塑料與橡膠材料,藉由於橡膠材料混合架橋劑,使橡膠材料能在與塑料相近的熱固溫度下,穩定的與塑料模接,並透過三料射出一次性成型,使塑料與橡膠材料能夠穩定接合,並改善習知利用接著劑將異材黏接之方式,進而省略製造過程所需要之工序及成本之消耗。 In summary, the creation of the plastic and rubber materials with poor compatibility, by the rubber material mixed bridging agent, the rubber material can be stably connected to the plastic at a thermosetting temperature similar to that of the plastic, and through The three-material injection molding is one-time molding, so that the plastic and the rubber material can be stably joined, and the conventional method of bonding the dissimilar materials by the adhesive is improved, thereby omitting the process and cost required for the manufacturing process.

雖然本創作已以較佳實施例揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作些許之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

1‧‧‧防水元件 1‧‧‧Waterproof components

10‧‧‧蓋件 10‧‧‧Cleaning pieces

20‧‧‧連接件 20‧‧‧Connecting parts

22‧‧‧定位件 22‧‧‧ Positioning parts

30‧‧‧防水塞件 30‧‧‧Waterproof plugs

Claims (14)

一種利用三料模接成型之防水元件,其包含:一第一射出件;一第二射出件,其模接於該第一射出件;及一橡膠防水件,其模接於該第一射出件一側或周邊。 A waterproof member formed by three-material molding, comprising: a first injection member; a second injection member coupled to the first injection member; and a rubber waterproof member molded to the first injection member One side or the periphery. 如申請專利範圍第1項所述之利用三料模接成型之防水元件,其中該第一射出件為一蓋件。 The waterproof member formed by the three-material molding as described in claim 1, wherein the first injection member is a cover member. 如申請專利範圍第2項所述之利用三料模接成型之防水元件,其中該蓋件為一硬質塑件。 A waterproof member formed by three-die molding as described in claim 2, wherein the cover member is a rigid plastic member. 如申請專利範圍第3項所述之利用三料模接成型之防水元件,其中該第二射出件為一連接件。 The waterproof member formed by the three-material molding as described in claim 3, wherein the second injection member is a connecting member. 如申請專利範圍第4項所述之利用三料模接成型之防水元件,其中該連接件為一軟質塑件。 The waterproof member formed by the three-material molding as described in claim 4, wherein the connecting member is a soft plastic member. 如申請專利範圍第5項所述之利用三料模接成型之防水元件,其中該橡膠防水件為一防水塞件。 The waterproof member formed by the three-material molding as described in claim 5, wherein the rubber waterproof member is a waterproof plug. 如申請專利範圍第1項所述之利用三料模接成型之防水元件,其中該第一射出件一側設有一界面活性劑,該橡膠防水件模接於該界面活性劑。 The waterproof member formed by the three-material molding as described in claim 1, wherein one side of the first injection member is provided with a surfactant, and the rubber waterproof member is molded to the surfactant. 如申請專利範圍第1項所述之利用三料模接成型之防水元件,其中該橡膠防水件更包括一低溫架橋劑,該低溫架橋劑係揉設並混合於該橡膠防水件。 The waterproof member formed by the three-material molding as described in claim 1, wherein the rubber waterproof member further comprises a low temperature bridging agent, and the low temperature bridging agent is disposed and mixed with the rubber waterproof member. 如申請專利範圍第8項所述之利用三料模接成型之防水元件 ,其中該橡膠防水件為一矽橡膠防水件。 Waterproof component formed by three-die molding as described in claim 8 The rubber waterproof member is a rubber waterproof member. 如申請專利範圍第8項所述之利用三料模接成型之防水元件,其中該低溫架橋劑為一鉑金架橋劑。 The waterproof member formed by the three-material molding as described in claim 8 wherein the low temperature bridging agent is a platinum bridging agent. 如申請專利範圍第6項所述之利用三料模接成型之防水元件,其中該防水塞件之週邊更環設有一凸環部。 The water-repellent component formed by the three-material molding as described in claim 6 , wherein a periphery of the waterproof plug is further provided with a convex ring portion. 如申請專利範圍第1項所述之利用三料模接成型之防水元件,其中該橡膠防水件係以熱壓或射出模接於該第一射出件。 The waterproof member formed by the three-material molding as described in claim 1, wherein the rubber waterproof member is molded to the first injection member by hot pressing or injection molding. 如申請專利範圍第1項所述之利用三料模接成型之防水元件,其中該橡膠防水件之周邊係設有一凸環部。 The waterproof member formed by the three-material molding as described in claim 1, wherein the rubber waterproof member is provided with a convex ring portion around the periphery. 如申請專利範圍第1項所述之利用三料模接成型之防水元件,其中該橡膠防水件係設有一凹口。 The waterproof member formed by the three-material molding as described in claim 1, wherein the rubber waterproof member is provided with a notch.
TW101224361U 2012-12-14 2012-12-14 The third material is formed by molding waterproof device TWM454702U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9326403B2 (en) 2014-02-26 2016-04-26 Ambit Microsystems (Shanghai) Ltd. Waterproof cap for ports in electronic devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9326403B2 (en) 2014-02-26 2016-04-26 Ambit Microsystems (Shanghai) Ltd. Waterproof cap for ports in electronic devices
TWI554180B (en) * 2014-02-26 2016-10-11 鴻海精密工業股份有限公司 Waterproof structure for electronic devices

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