TWM450850U - Electrical connector - Google Patents
Electrical connector Download PDFInfo
- Publication number
- TWM450850U TWM450850U TW101217894U TW101217894U TWM450850U TW M450850 U TWM450850 U TW M450850U TW 101217894 U TW101217894 U TW 101217894U TW 101217894 U TW101217894 U TW 101217894U TW M450850 U TWM450850 U TW M450850U
- Authority
- TW
- Taiwan
- Prior art keywords
- electrical connector
- main body
- solder ball
- body portion
- extending
- Prior art date
Links
Abstract
Description
本創作涉及一種電連接器,尤其涉及一種用以電性連接晶片模組與電路板之電連接器。The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a chip module to a circuit board.
與本創作相關之電連接器,用以電性連接晶片模組與電路板,如中國專利公告第2872630Y號專利所揭示。該電連接器包括絕緣本體及複數收容於絕緣本體內之導電端子。導電端子包括主體部、自主體部竪直向下延伸之擋止部及自主體部向上延伸之接觸部。絕緣本體上設有複數端子收容孔及複數與端子收容孔連通之錫球容納部,端子末端的擋止部與錫球容納部之側壁形成可活動收容錫球於其中之收容空間。The electrical connector associated with the present invention is used to electrically connect the chip module and the circuit board, as disclosed in Chinese Patent Publication No. 2872630Y. The electrical connector includes an insulative housing and a plurality of conductive terminals received in the insulative housing. The conductive terminal includes a main body portion, a stopper portion extending vertically downward from the main body portion, and a contact portion extending upward from the main body portion. The insulative housing is provided with a plurality of terminal receiving holes and a plurality of solder ball receiving portions that communicate with the terminal receiving holes. The blocking portions of the terminal ends and the side walls of the solder ball receiving portion form a receiving space in which the solder balls are movably received.
擋止部封住錫球容納槽之部分開口且錫球與擋止部接觸,故,在焊接錫球時,錫球變為液態之錫液,且導電端子與端子收容孔之間具有間隙,錫液會隨著導電端子與端子收容孔之間的間隙沿著擋止部向主體部爬升,容易產生虹吸現象,進而影響電連接器與電路板之間的電性連接。The stopper portion seals a part of the opening of the solder ball receiving groove, and the solder ball is in contact with the stopper portion. Therefore, when the solder ball is soldered, the solder ball becomes a liquid tin liquid, and a gap is formed between the conductive terminal and the terminal receiving hole. The tin liquid climbs along the stop portion along the stopper portion along the gap between the conductive terminal and the terminal receiving hole, and is likely to cause a siphon phenomenon, thereby affecting the electrical connection between the electrical connector and the circuit board.
鑒於此,確有必要提供一改進之電連接器,以克服先前技術存在之缺陷。In view of this, it is indeed necessary to provide an improved electrical connector to overcome the deficiencies of the prior art.
本創作之目的係提供一種可防止虹吸現象之電連接器。The purpose of this creation is to provide an electrical connector that prevents siphoning.
本創作之電連接器可藉以下技術方案實現:一種電連接器,用以電性連接晶片模組與電路板,該電連接器包括:絕緣本體,其具有相對設置之頂面與底面及複數貫穿頂面與底面之端子收容槽;複數導電端子,收容於絕緣本體之端子收容槽中,其包括主體部、自主體部向上彎折延伸之彈性臂及自主體部向下彎折延伸之連接部;複數錫球,收容於端子收容槽中;所述連接部具有抵接錫球之自由末端,所述錫球整體位於自由末端之一側且自由末端位於主體部與錫球之間。The electrical connector of the present invention can be realized by the following technical solution: an electrical connector for electrically connecting a chip module and a circuit board, the electrical connector comprising: an insulating body having oppositely disposed top and bottom surfaces and a plurality of a terminal receiving groove extending through the top surface and the bottom surface; the plurality of conductive terminals are received in the terminal receiving groove of the insulating body, and include a main body portion, an elastic arm bent upward from the main body portion, and a connection extending downward from the main body portion The plurality of solder balls are received in the terminal receiving groove; the connecting portion has a free end that abuts the solder ball, the solder ball is entirely located on one side of the free end and the free end is located between the main body portion and the solder ball.
本創作之電連接器亦可藉以下技術方案實現:一種電連接器,用以電性連接晶片模組與電路板,該電連接器包括:絕緣本體,其具有相對設置之頂面與底面及複數貫穿頂面與底面之端子收容槽;複數導電端子,收容於絕緣本體之端子收容槽中,其包括主體部、自主體部向上彎折延伸之彈性臂及自主體部向下彎折延伸之連接部;複數錫球,收容於端子收容槽中;所述連接部呈弧形設置,所述連接部具有抵接錫球之自由末端且弧形最底端外切線相對錫球之球心更靠近絕緣本體之底面。The electrical connector of the present invention can also be implemented by the following technical solutions: an electrical connector for electrically connecting the chip module and the circuit board, the electrical connector comprising: an insulating body having oppositely disposed top and bottom surfaces and a plurality of terminal receiving slots extending through the top surface and the bottom surface; the plurality of conductive terminals are received in the terminal receiving slots of the insulative housing, and include a main body portion, an elastic arm that is bent upwardly from the main body portion, and is bent downwardly from the main body portion a connecting portion; the plurality of solder balls are received in the terminal receiving groove; the connecting portion is arranged in an arc shape, and the connecting portion has a free end that abuts the solder ball and the curved outermost end tangential line is more opposite to the center of the solder ball Near the bottom surface of the insulative body.
相較於先前技術,本創作之電連接器之連接部的自由末端抵接錫球,錫球之整體位於自由末端之一側且自由末端位於主體部與錫球之間,藉此使錫球遠離主體部且可防止錫球溶化成錫液後隨著連接部向主體部爬升,進而可防止產生虹吸現象。Compared with the prior art, the free end of the connecting portion of the electrical connector of the present invention abuts the solder ball, the whole of the solder ball is located on one side of the free end and the free end is located between the main body and the solder ball, thereby making the solder ball Keeping away from the main body portion and preventing the solder ball from melting into tin liquid, the joint portion climbs toward the main body portion, thereby preventing the siphon phenomenon.
第一圖至第六圖所示為本創作之電連接器100,用以電性連接晶片模組(未圖示)與電路板(未圖示),該電連接器100包括絕緣本體1、複數收容於絕緣本體1中之導電端子2及複數機械固持於絕緣本體1中之錫球3。The first to sixth embodiments show the electrical connector 100 of the present invention for electrically connecting a chip module (not shown) and a circuit board (not shown). The electrical connector 100 includes an insulative body 1. The plurality of conductive terminals 2 housed in the insulative housing 1 and a plurality of solder balls 3 mechanically held in the insulative housing 1 .
請重點參閱第三圖及第四圖,絕緣本體1大致呈矩型,其具有相對設置之頂面10與底面11及複數貫穿頂面10與底面11之端子收容槽12。導電端子2收容於端子收容槽12中,端子收容槽12包括容置槽13及與容置槽13相連通之固持槽14。絕緣本體1還包括貫穿底面11且與底面11呈階梯狀之複數錫球容納槽15及貫穿頂面10且與頂面10呈階梯狀之通槽16,通槽16係相互連通。Referring to the third and fourth figures, the insulative housing 1 is substantially rectangular, and has a top surface 10 and a bottom surface 11 opposite to each other, and a plurality of terminal receiving slots 12 penetrating the top surface 10 and the bottom surface 11. The conductive terminal 2 is received in the terminal receiving groove 12 , and the terminal receiving groove 12 includes a receiving groove 13 and a holding groove 14 communicating with the receiving groove 13 . The insulative housing 1 further includes a plurality of solder ball receiving grooves 15 penetrating through the bottom surface 11 and having a stepped shape with the bottom surface 11, and a through groove 16 penetrating the top surface 10 and forming a stepped shape with the top surface 10. The through grooves 16 communicate with each other.
導電端子2包括平板狀之主體部20、自主體部20向上彎折延伸設置之彈性臂21、自主體部20向下彎折延伸設置之連接部22及自主體部20之相對一側向上延伸設置之固持部23。主體部20收容於容置槽13中且導電端子2藉固持部23固定於固持槽14中。彈性臂21包括自主體部20向主體部20之一側彎折延伸設置之折彎部210、自折彎部210向主體部20之另一側彎折延伸設置之按壓部211及自按壓部211向上彎折延伸設置之接觸部212。接觸部212上設有凹槽213,可提高晶片模組接觸到接觸部212時之穩定性。連接部22具有一自由末端222,連接部22具有一定之厚度且呈半圓環狀設置,錫球3整體位於自由末端222之一側且自由末端222位於主體部20與錫球3之間。連接部22包括自主體部20向下彎折延伸之延伸部223及自延伸部223向上彎折延伸之抵持部224。延伸部223及抵持部224均具有所述之內側220及外側221。自由末端222設於抵持部224上。連接部22之自由末端222與主體部20之間具有一間隙225,以使錫球3遠離主體部20。The conductive terminal 2 includes a flat body portion 20, an elastic arm 21 bent upward from the main body portion 20, a connecting portion 22 bent downward from the main body portion 20, and an upward extending from the opposite side of the main body portion 20. The holding portion 23 is provided. The main body portion 20 is received in the accommodating groove 13 and the conductive terminal 2 is fixed in the holding groove 14 by the holding portion 23 . The elastic arm 21 includes a bent portion 210 that is bent and extended from one side of the main body portion 20 toward the main body portion 20, and a pressing portion 211 that is bent and extended from the other side of the main body portion 20 from the bent portion 210 and the self-pressing portion. The 211 bends the extended contact portion 212 upward. The contact portion 212 is provided with a recess 213 to improve the stability of the wafer module when it contacts the contact portion 212. The connecting portion 22 has a free end 222. The connecting portion 22 has a certain thickness and is disposed in a semi-annular shape. The solder ball 3 is entirely located on one side of the free end 222 and the free end 222 is located between the main body portion 20 and the solder ball 3. The connecting portion 22 includes an extending portion 223 that is bent downward from the main body portion 20 and a resisting portion 224 that is bent upwardly from the extending portion 223 . Both the extension portion 223 and the abutting portion 224 have the inner side 220 and the outer side 221 described above. The free end 222 is provided on the abutting portion 224. There is a gap 225 between the free end 222 of the connecting portion 22 and the main body portion 20 to move the solder ball 3 away from the main body portion 20.
請參閱第五圖所示,組裝時,導電端子2自絕緣本體1之頂面10組裝入絕緣本體1之端子收容槽12,錫球3自絕緣本體1之底面11組裝入絕緣本體1之錫球容納槽15。組裝完成後,固持部23固持於固持槽14中且主體部20收容於容置槽13中,抵持部224之自由末端222的外側221與錫球3接觸且抵持錫球3,並藉階梯狀之錫球容納槽15夾持錫球3,以將錫球3固定於絕緣本體1上。連接部22具有抵接錫球3之自由末端222,且連接部22之弧形最底端外切線相對錫球3之球心更靠近絕緣本體1之底面11。連接部22具有彈性且當錫球3組裝入錫球容納槽15時,所述抵持部224相對於錫球3發生彈性變形。將錫球3焊接至電路板上時,錫球3焊接變為液態的錫液4,所述錫液4沿抵持部224爬升且於抵持部224與延伸部223之交界處停止爬升,藉此,錫液4不會爬升至導電端子2之主體部20且可避免虹吸現象之發生。Referring to FIG. 5, during assembly, the conductive terminals 2 are assembled from the top surface 10 of the insulative housing 1 into the terminal receiving slots 12 of the insulative housing 1. The solder balls 3 are assembled from the bottom surface 11 of the insulative housing 1 into the tin of the insulative housing 1. The ball accommodates the groove 15. After the assembly is completed, the holding portion 23 is retained in the holding groove 14 and the main body portion 20 is received in the receiving groove 13 . The outer side 221 of the free end 222 of the resisting portion 224 is in contact with the solder ball 3 and resists the solder ball 3 , and borrows The stepped solder ball receiving groove 15 holds the solder ball 3 to fix the solder ball 3 to the insulative housing 1. The connecting portion 22 has a free end 222 that abuts the solder ball 3, and the curved bottom end tangential line of the connecting portion 22 is closer to the bottom surface 11 of the insulating body 1 with respect to the center of the solder ball 3. The connecting portion 22 has elasticity and the resisting portion 224 is elastically deformed with respect to the solder ball 3 when the solder ball 3 is placed in the solder ball receiving groove 15. When the solder ball 3 is soldered to the circuit board, the solder ball 3 is soldered to a liquid tin liquid 4, and the tin liquid 4 climbs along the abutting portion 224 and stops climbing at the boundary between the resisting portion 224 and the extending portion 223. Thereby, the tin liquid 4 does not climb up to the main body portion 20 of the conductive terminal 2 and the occurrence of siphoning can be avoided.
綜上所述,本創作符合新型專利要件,爰依法提出專利申請。惟,以上所述者僅為本創作之較佳實施例,本創作之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本創作之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, this creation is in line with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application.
100‧‧‧電連接器100‧‧‧Electrical connector
1‧‧‧絕緣本體1‧‧‧Insulating body
10‧‧‧頂面10‧‧‧ top surface
11‧‧‧底面11‧‧‧ bottom
12‧‧‧端子收容槽12‧‧‧Terminal receiving slot
13‧‧‧容置槽13‧‧‧ accommodating slots
14‧‧‧固持槽14‧‧‧ holding slot
15‧‧‧錫球容納槽15‧‧‧ solder ball receiving slot
16‧‧‧通槽16‧‧‧through slot
2‧‧‧導電端子2‧‧‧Electrical terminals
20‧‧‧主體部20‧‧‧ Main body
21‧‧‧彈性臂21‧‧‧Flexible arm
210‧‧‧折彎部210‧‧‧Bends
211‧‧‧按壓部211‧‧‧ Pressing Department
212‧‧‧接觸部212‧‧‧Contacts
213‧‧‧凹槽213‧‧‧ Groove
22‧‧‧連接部22‧‧‧Connecting Department
220‧‧‧內側220‧‧‧ inside
221‧‧‧外側221‧‧‧ outside
222‧‧‧自由末端222‧‧‧Free end
223‧‧‧延伸部223‧‧‧Extension
224‧‧‧抵持部224‧‧‧Resistance Department
225‧‧‧間隙225‧‧‧ gap
23‧‧‧固持部23‧‧‧Retention Department
3‧‧‧錫球3‧‧‧ solder balls
4‧‧‧錫液4‧‧‧ tin liquid
第一圖係本創作電連接器之立體組合圖。The first figure is a three-dimensional combination of the original electrical connector.
第二圖係本創作電連接器之另一角度之立體組合圖。The second figure is a perspective assembled view of another angle of the present electrical connector.
第三圖係本創作電連接器之立體分解圖。The third figure is an exploded perspective view of the present electrical connector.
第四圖係本創作電連接器之另一角度之立體分解圖。The fourth figure is an exploded perspective view of another angle of the present electrical connector.
第五圖係本創作電連接器沿第一圖中V-V方向之剖視圖。The fifth figure is a cross-sectional view of the present electrical connector along the V-V direction in the first figure.
第六圖係本創作電連接器之錫球溶化後沿第一圖中V-V方向之剖視圖。The sixth figure is a cross-sectional view of the solder ball of the present invention, which is melted in the V-V direction in the first figure.
100‧‧‧電連接器 100‧‧‧Electrical connector
1‧‧‧絕緣本體 1‧‧‧Insulating body
12‧‧‧端子收容槽 12‧‧‧Terminal receiving slot
15‧‧‧錫球容納槽 15‧‧‧ solder ball receiving slot
16‧‧‧通槽 16‧‧‧through slot
2‧‧‧導電端子 2‧‧‧Electrical terminals
20‧‧‧主體部 20‧‧‧ Main body
21‧‧‧彈性臂 21‧‧‧Flexible arm
210‧‧‧折彎部 210‧‧‧Bends
211‧‧‧按壓部 211‧‧‧ Pressing Department
212‧‧‧接觸部 212‧‧‧Contacts
213‧‧‧凹槽 213‧‧‧ Groove
22‧‧‧連接部 22‧‧‧Connecting Department
220‧‧‧內側 220‧‧‧ inside
221‧‧‧外側 221‧‧‧ outside
222‧‧‧自由末端 222‧‧‧Free end
223‧‧‧延伸部 223‧‧‧Extension
224‧‧‧抵持部 224‧‧‧Resistance Department
225‧‧‧間隙 225‧‧‧ gap
23‧‧‧固持部 23‧‧‧Retention Department
3‧‧‧錫球 3‧‧‧ solder balls
Claims (26)
絕緣本體,其具有相對設置之頂面與底面及複數貫穿頂面與底面之端子收容槽;
複數導電端子,收容於絕緣本體之端子收容槽中,其包括主體部、自主體部向上彎折延伸之彈性臂及自主體部向下彎折延伸之連接部;及
複數錫球,收容於端子收容槽中;
其中,所述連接部具有抵接錫球之自由末端,所述錫球整體位於自由末端之一側且自由末端位於主體部與錫球之間。An electrical connector comprising:
An insulating body having a top surface and a bottom surface disposed opposite to each other and a plurality of terminal receiving grooves penetrating the top surface and the bottom surface;
The plurality of conductive terminals are received in the terminal receiving groove of the insulative housing, and include a main body portion, an elastic arm bent upward from the main body portion, and a connecting portion bent downward from the main body portion; and a plurality of solder balls received in the terminal In the receiving trough;
Wherein, the connecting portion has a free end that abuts the solder ball, the solder ball is entirely located on one side of the free end and the free end is located between the main body portion and the solder ball.
絕緣本體,其具有相對設置之頂面與底面及複數貫穿頂面與底面之端子收容槽;
複數導電端子,收容於絕緣本體之端子收容槽中,其包括主體部、自主體部向上彎折延伸之彈性臂及自主體部向下彎折延伸之連接部;及
複數錫球,收容於端子收容槽中;
其中,所述連接部呈弧形設置,所述連接部具有抵接錫球之自由末端且弧形最底端外切線相對錫球之球心更靠近絕緣本體之底面。An electrical connector comprising:
An insulating body having a top surface and a bottom surface disposed opposite to each other and a plurality of terminal receiving grooves penetrating the top surface and the bottom surface;
The plurality of conductive terminals are received in the terminal receiving groove of the insulative housing, and include a main body portion, an elastic arm bent upward from the main body portion, and a connecting portion bent downward from the main body portion; and a plurality of solder balls received in the terminal In the receiving trough;
Wherein, the connecting portion is arranged in an arc shape, and the connecting portion has a free end that abuts the solder ball and the curved outermost end tangential line is closer to the bottom surface of the insulating body than the center of the solder ball.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101217894U TWM450850U (en) | 2012-09-17 | 2012-09-17 | Electrical connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101217894U TWM450850U (en) | 2012-09-17 | 2012-09-17 | Electrical connector |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM450850U true TWM450850U (en) | 2013-04-11 |
Family
ID=48801185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101217894U TWM450850U (en) | 2012-09-17 | 2012-09-17 | Electrical connector |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM450850U (en) |
-
2012
- 2012-09-17 TW TW101217894U patent/TWM450850U/en not_active IP Right Cessation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FI126231B (en) | Electrical Connector | |
US8172591B2 (en) | Electrical connector assembly having electrical connector with low profile and processor with cone pins | |
CN109103646B (en) | Electrical connector | |
TW201421820A (en) | Low-profile mezzanine connector | |
TWM397045U (en) | Electrical connector | |
JP2011029111A (en) | Connector | |
TWI827885B (en) | Electrical connector | |
CN107026337B (en) | Electric connector and conductive terminal thereof | |
US8052433B2 (en) | Electrical connector having retention means arranged adjacent to passageway for holding fusible member thereto | |
US9130321B2 (en) | Electrical connector having contact for either BGA or LGA package | |
US20120045946A1 (en) | Socket connector having suitable receiving solder lead from ic package | |
TW201935784A (en) | Card edge connector | |
TWM456605U (en) | Electrical connector | |
TWM497359U (en) | Card edge connector | |
TWM471038U (en) | Battery connector | |
TWM450850U (en) | Electrical connector | |
TWI543451B (en) | Electrical connector and assembly thereof | |
TWM539719U (en) | Electrical connector | |
US20100124828A1 (en) | Socket connector having improved arrangement ensuring reliable and robust alignment between conductive contacts | |
TWM561341U (en) | Card edge connector | |
JP5953343B2 (en) | Connector and connector manufacturing method | |
TWM461211U (en) | A terminal and electrical connector with the terminal | |
JP5144714B2 (en) | Connector device | |
TW201807904A (en) | Electrical connector | |
TWM446989U (en) | Electrical connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |