TWM448843U - Structure of preventing electromagnetic interference for wireless power transmission device - Google Patents

Structure of preventing electromagnetic interference for wireless power transmission device Download PDF

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Publication number
TWM448843U
TWM448843U TW101214927U TW101214927U TWM448843U TW M448843 U TWM448843 U TW M448843U TW 101214927 U TW101214927 U TW 101214927U TW 101214927 U TW101214927 U TW 101214927U TW M448843 U TWM448843 U TW M448843U
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Taiwan
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wireless power
power transmission
transmission device
circuit substrate
electromagnetic interference
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TW101214927U
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Chinese (zh)
Inventor
Chien-Hung Lin
Mao-Chun Chen
Takahiro Oishi
Chi-Fu Wu
Feng-Lung Chien
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Tdk Taiwan Corp
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Priority to TW101214927U priority Critical patent/TWM448843U/en
Publication of TWM448843U publication Critical patent/TWM448843U/en

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Description

無線電力傳輸裝置之防電磁干擾結構Anti-electromagnetic interference structure of wireless power transmission device

本創作係為一種無線電力傳輸裝置之防電磁干擾結構,特別是關於一種在無線電力傳輸裝置的接收端,設計有防止發送端發出電磁干擾電子元件的結構。The present invention is an anti-electromagnetic interference structure of a wireless power transmission device, and particularly relates to a structure at the receiving end of the wireless power transmission device, which is designed to prevent the transmitting end from emitting electromagnetic interference electronic components.

可攜式裝置(portable device),如手機(mobile phone)、個人數位助理器(PDA)、筆記型電腦(Notebook)或平板電腦(Tablet PC)...等,都可使用電池供應電力,方便使用者隨身攜帶使用,一般可攜式裝置都會附帶電源線以插接市電對電池充電,因此需要實質上地與市電連接(plugged)。Portable devices, such as mobile phones, personal digital assistants (PDAs), notebooks (notebooks) or tablets (Tablet PCs), etc., can be powered by batteries. The user can carry it with him or her. Generally, the portable device is equipped with a power cord to plug in the mains to charge the battery, so it needs to be plugged with the mains.

無線電力(Wireless Electricity)是一種利用無線的電磁感應方式傳送電力的技術,目前已被應用在智慧型手機的無線充電設備中,如圖一所示即為無線電力裝置之電力傳輸示意圖,該種無線電力裝置具有發送端10以及接收端20,發送端10可將外部電力轉換為共振的電磁場信號,當接收端20近距離感應到共振的電磁場信號時,會將其轉換為電力,透過此方式轉出的電力可用於對可攜式裝置的電池充電,因此可攜式裝置不需要實質上與外部電力連接(unplugged)。Wireless Electricity (Wireless Electricity) is a technology that uses wireless electromagnetic induction to transmit power. It has been applied to wireless charging devices of smart phones. Figure 1 shows the power transmission of wireless power devices. The wireless power device has a transmitting end 10 and a receiving end 20, and the transmitting end 10 can convert external power into a resonant electromagnetic field signal, and when the receiving end 20 senses the resonant electromagnetic field signal at a short distance, it converts the electric power into electric power. The transferred power can be used to charge the battery of the portable device, so the portable device does not need to be substantially unplugged with external power.

在圖一的無線電力裝置中,發送端10及接收端20皆具有線圈及鐵心板,做為產生電磁場信號或接收電磁場信號的主要元件,而接收端20是輸出電力的一端,因此通常會有其他的電子元件來產生穩定的直流電源輸出,一般包括穩壓IC、電晶體、二極體等主動元件或其它電感、電容、電阻等被動元件被設置在電路基板上。In the wireless power device of FIG. 1, both the transmitting end 10 and the receiving end 20 have a coil and a core plate as main components for generating an electromagnetic field signal or receiving an electromagnetic field signal, and the receiving end 20 is one end of the output power, so usually there is Other electronic components to generate a stable DC power output, generally including active components such as a voltage regulator IC, a transistor, a diode, or other passive components such as an inductor, a capacitor, and a resistor are disposed on a circuit substrate.

然而在電路基板上的電子元件可能會因共振的電磁場信號干擾,而影響到電子元件的正常運作,因此在高級的電子電路中大都會有防電磁干擾(EMI)的元件或電路設計,如在電路上覆蓋一層金屬罩,但在無線電力裝置中,電磁場信號是傳輸電力的重要媒介,磁場會受到金屬影響而改變,因此在無線電力傳輸裝置附近的防EMI設計可能會影響電力傳輸。However, the electronic components on the circuit board may interfere with the electromagnetic field signals of the resonance, which affects the normal operation of the electronic components. Therefore, in advanced electronic circuits, there are components or circuit designs that prevent electromagnetic interference (EMI), such as The circuit is covered with a metal cover, but in wireless power devices, the electromagnetic field signal is an important medium for transmitting power, and the magnetic field is affected by the metal. Therefore, the anti-EMI design near the wireless power transmission device may affect the power transmission.

本創作的目的在於提出一種無線電力裝置之防電磁干擾結構,能夠不影響無線電力傳輸的情況下,降低共振電磁場對電子元件干擾的結構。The purpose of the present invention is to propose an anti-electromagnetic interference structure of a wireless power device, which can reduce the structure of the resonance electromagnetic field to interfere with electronic components without affecting the wireless power transmission.

本創作之主要技術特徵在於提供一種無線電力傳輸裝置之防電磁干擾結構,包括電路基板及防磁片,電路基板電連接接收端的線圈,電路基板上配置有電子元件,防磁片平貼於電路基板朝向發送端之一表面上,以隔絕電磁場信號影響電子元件。The main technical feature of the present invention is to provide an anti-electromagnetic interference structure of a wireless power transmission device, comprising a circuit substrate and an anti-magnetic piece, the circuit substrate is electrically connected to the coil of the receiving end, the electronic component is arranged on the circuit substrate, and the anti-magnetic piece is flatly attached to the circuit substrate and sent to the circuit substrate. On one of the ends, the electronic component is affected by an electromagnetic field signal.

本創作之次一技術特徵係在於提供一種無線電力傳輸裝置之防電磁干擾結構,包括電路基板,電路基板電性連接接收端之線圈,電路基板更包括第一介電層、圖案化接地層及第二介電層,其中圖案化接地層配置於第一介電層與第二介電層之間,電路基板之表面上配置有電子元件,圖案化接地層用以導引電磁場信號至接地端。The second technical feature of the present invention is to provide an anti-electromagnetic interference structure of a wireless power transmission device, comprising a circuit substrate, the circuit substrate is electrically connected to the coil of the receiving end, and the circuit substrate further comprises a first dielectric layer, a patterned ground layer and a second dielectric layer, wherein the patterned ground layer is disposed between the first dielectric layer and the second dielectric layer, the surface of the circuit substrate is provided with electronic components, and the patterned ground layer is used to guide the electromagnetic field signal to the ground .

請參閱以下有關本創作之詳細說明與附圖,然而所附圖式僅為本創作實施例之參考與說明,並非用來對本創作 加以限制者。Please refer to the following for a detailed description and drawings of the present invention. However, the drawings are only for reference and description of the present embodiment, and are not intended to be used for this creation. Limit the person.

請參閱圖二所示,係為本創作無線電力傳輸裝置之接收端實施例立體分解示意圖,無線電力傳輸裝置包括發送端及接收端,在如圖二的實施例中,本創作無線電力傳輸裝置的接收端20更包括有線圈21、鐵心板22及一電路基板30,線圈21藉由雙面膠帶23或黏膠平貼於鐵心板22上,電路基板30電性連接至接收端20之線圈21,電路基板30上配置有電子元件31,其中該電路基板30可以是單獨的專用電路基板,如穩壓電路專用的電路基板,或者是結合於可攜式裝置中的任一電路基板。Please refer to FIG. 2 , which is a perspective exploded view of a receiving end embodiment of the present wireless power transmission device. The wireless power transmission device includes a transmitting end and a receiving end. In the embodiment shown in FIG. 2 , the present wireless power transmitting device is created. The receiving end 20 further includes a coil 21, a core plate 22 and a circuit substrate 30. The coil 21 is flatly attached to the core plate 22 by a double-sided tape 23 or adhesive, and the circuit substrate 30 is electrically connected to the coil of the receiving end 20. 21, the circuit board 30 is provided with an electronic component 31, wherein the circuit substrate 30 can be a separate dedicated circuit substrate, such as a circuit board dedicated to a voltage regulator circuit, or any circuit substrate incorporated in a portable device.

本創作的防電磁干擾結構的其中一實施例是在電路基板30上配設至少一片的防磁片40,該防磁片40可以為磁性材料、抗磁性材料或金屬材料所製成,如含鐵材料,防磁片40可藉由雙面膠帶35或黏膠平貼於電路基板30朝向發送端10之一表面32上,以隔絕電子元件附件的電磁場信號。如圖二之實施例,發送端10是位於接收端20的上方,因此防磁片40則平貼於接收端20的上方表面32上。In one embodiment of the anti-electromagnetic interference structure of the present invention, at least one piece of anti-magnetic piece 40 is disposed on the circuit substrate 30, and the anti-magnetic piece 40 can be made of a magnetic material, a diamagnetic material or a metal material, such as a ferrous material. The anti-magnetic sheet 40 can be flatly attached to the circuit substrate 30 toward the surface 32 of the transmitting end 10 by a double-sided tape 35 or adhesive to isolate the electromagnetic field signal of the electronic component accessory. As shown in the embodiment of FIG. 2, the transmitting end 10 is located above the receiving end 20, so that the anti-magnetic sheet 40 is flat on the upper surface 32 of the receiving end 20.

而圖三至圖七所示,係為本創作防磁片的各種形狀的實施例示意圖,如圖三A之實施例所示,該防磁片40為矩形,其輪廓形狀及大小與電路基板30相近,覆蓋在整個電路基板30的表面32上。或者如圖三B之實施例所示,該防磁片40僅覆蓋在電子元件31朝向發送端10的位置上。FIG. 3 to FIG. 7 are schematic diagrams showing embodiments of various shapes of the anti-magnetic sheet. As shown in the embodiment of FIG. 3A, the anti-magnetic sheet 40 is rectangular, and its contour shape and size are similar to the circuit substrate 30. Covered on the surface 32 of the entire circuit substrate 30. Alternatively, as shown in the embodiment of FIG. 3B, the anti-magnetic sheet 40 covers only the position of the electronic component 31 toward the transmitting end 10.

如圖四A之實施例所示,該防磁片40為條狀,環繞在電子元件31的周圍。或者如圖四B之實施例所示,該防磁片40環繞在電路基板30表面32的側邊緣處。As shown in the embodiment of FIG. 4A, the anti-magnetic sheet 40 has a strip shape and surrounds the electronic component 31. Alternatively, as shown in the embodiment of FIG. 4B, the anti-magnetic sheet 40 is wound around the side edges of the surface 32 of the circuit substrate 30.

如圖五A之實施例所示,該防磁片40環繞在電路基 板30表面32的側邊緣處,但具有一斷開處41呈C字形,或如圖五B之實施例所示呈ㄈ字形,在該斷開處41的電路基板30表面32上配設有電接點33,用以電性連接至接收端20的線圈21。As shown in the embodiment of FIG. 5A, the anti-magnetic piece 40 is wrapped around the circuit base. At the side edge of the surface 32 of the panel 30, but having a break 41 in a C-shape, or in the shape of a U-shape as shown in the embodiment of FIG. 5B, the surface 32 of the circuit substrate 30 of the break 41 is disposed. The electrical contact 33 is electrically connected to the coil 21 of the receiving end 20 .

如圖六A之實施例所示,該電路基板30為矩形,而該防磁片40僅平貼在電路基板30表面32的其中一側邊緣處,如遠離接收端20鐵心板22的一側邊緣處。或者如圖六B之之實施例所示,該防磁片40為相互分離的二條,分別平貼於電路基板30表面32隔離相對的二側邊緣處。As shown in the embodiment of FIG. 6A, the circuit substrate 30 is rectangular, and the anti-magnetic sheet 40 is only flatly attached to one side edge of the surface 32 of the circuit substrate 30, such as a side edge away from the receiving end 20 of the core plate 22. At the office. Or, as shown in the embodiment of FIG. 6B, the anti-magnetic sheets 40 are two separated from each other, and are respectively affixed to the opposite side edges of the surface 32 of the circuit substrate 30.

如圖七之實施例所示,該防磁片40為前述平板狀與條狀的任意二組結合,如覆蓋在電路基板30上第一防磁片42,及環繞電路基板30側邊緣處的第二防磁片43,兩者一併使用。As shown in the embodiment of FIG. 7, the anti-magnetic piece 40 is combined with any two groups of the flat plate and the strip, such as the first anti-magnetic piece 42 covering the circuit substrate 30, and the second side at the side edge of the circuit substrate 30. The anti-magnetic sheet 43 is used together.

請參閱圖八所示,係為本創作接收端防電磁干擾結構之另一實施例分解示意圖,在本實施例中電路基板50包括有第一介電層51、圖案化接地層(GND patterned layer)52及第二介電層53,除此外,當然更包括有至少一圖案化導電層(圖中未示)做為連接電子元件31的導電線路。Referring to FIG. 8 , it is an exploded view of another embodiment of the anti-electromagnetic interference structure of the present invention. In the embodiment, the circuit substrate 50 includes a first dielectric layer 51 and a patterned ground plane (GND patterned layer). The 52 and the second dielectric layer 53 include, of course, at least one patterned conductive layer (not shown) as a conductive line connecting the electronic components 31.

本實施例是利用電路基板50上的接地層吸收電子元件31附件的電磁場信號,導引電磁場信號至接地端(圖中未示),因此圖案化接地層52可為金屬導電層電性連接至接地端,且圖案化接地層52配置於第一介電層51及第二介電層53之間,以避免影響導電層的電路佈局。如圖八之實施例所示,該圖案化接地層52形成在對應電子元件31所在區域。In this embodiment, the grounding layer on the circuit substrate 50 absorbs the electromagnetic field signal of the accessory of the electronic component 31, and the electromagnetic field signal is guided to the ground end (not shown). Therefore, the patterned ground layer 52 can be electrically connected to the metal conductive layer. The grounding end and the patterned ground layer 52 are disposed between the first dielectric layer 51 and the second dielectric layer 53 to avoid affecting the circuit layout of the conductive layer. As shown in the embodiment of FIG. 8, the patterned ground layer 52 is formed in a region where the corresponding electronic component 31 is located.

請再參閱圖九至圖十所示,係為本創作圖案化接地層之各種實施例示意圖,如圖九之實施例所示,該圖案化接地層52形成在環繞電子元件31所在區域的周圍。Referring to FIG. 9 to FIG. 10 again, it is a schematic diagram of various embodiments of the patterned grounding layer. As shown in the embodiment of FIG. 9, the patterned ground layer 52 is formed around the area surrounding the electronic component 31. .

如圖十A之實施例所示,該圖案化接地層52形成在環繞該電路基板50之外側邊緣處。或者如圖十B之實施例所示,該電路基板50為矩形,而圖案化接地層52形成在電路基板50之其中一側邊緣處。又或者如圖十C之實施例所示,該圖案化接地層52形成在電路基板50之其中相對的二側邊緣處。再或者如圖十D之實施例所示,該圖案化接地層52形成在電路基板50之其中三側邊緣處。As shown in the embodiment of FIG. 10A, the patterned ground layer 52 is formed at an outer side edge surrounding the circuit substrate 50. Alternatively, as shown in the embodiment of FIG. 10B, the circuit substrate 50 is rectangular, and the patterned ground layer 52 is formed at one of the side edges of the circuit substrate 50. Alternatively, as shown in the embodiment of FIG. 10C, the patterned ground layer 52 is formed at opposite side edges of the circuit substrate 50. Or, as shown in the embodiment of FIG. 10D, the patterned ground layer 52 is formed at three side edges of the circuit substrate 50.

另外,本創作更可以將圖案化接地層之任一實施例與防磁片的任一實施加以任意組合,或者多種實施例的任意組合。In addition, the present invention can arbitrarily combine any of the embodiments of the patterned ground layer with any implementation of the anti-magnetic sheet, or any combination of the various embodiments.

職是,本創作確能藉上述所揭露之技術,提供一種迥然不同於習知者的設計,堪能提高整體之使用價值,又其申請前未見於刊物或公開使用,誠已符合新型專利之要件,爰依法提出新型專利申請。The job is to create a design that is different from the well-known ones by the above-mentioned techniques, which can improve the overall use value, and it has not been seen in the publication or public use before the application, and has already met the requirements of the new patent. , 提出 file a new type of patent application.

10‧‧‧發送端10‧‧‧Send

20‧‧‧接收端20‧‧‧ receiving end

21‧‧‧線圈21‧‧‧ coil

22‧‧‧鐵心板22‧‧‧iron core board

23‧‧‧雙面膠帶23‧‧‧Double-sided tape

30‧‧‧電路基板30‧‧‧ circuit board

31‧‧‧電子元件31‧‧‧Electronic components

32‧‧‧表面32‧‧‧ Surface

33‧‧‧電接點33‧‧‧Electrical contacts

35‧‧‧雙面膠帶35‧‧‧Double-sided tape

40‧‧‧防磁片40‧‧‧Antimagnetic sheet

41‧‧‧斷開處41‧‧‧Disconnection

42‧‧‧第一防磁片42‧‧‧First anti-magnetic film

43‧‧‧第二防磁片43‧‧‧Second anti-magnetic sheet

50‧‧‧電路基板50‧‧‧ circuit substrate

51‧‧‧第一介電層51‧‧‧First dielectric layer

52‧‧‧圖案化接地層52‧‧‧ patterned ground plane

53‧‧‧第二介電層53‧‧‧Second dielectric layer

圖一為傳統無線電力裝置之電力傳輸示意圖。FIG. 1 is a schematic diagram of power transmission of a conventional wireless power device.

圖二為本創作無線電力傳輸裝置之接收端實施例立體分解示意圖。FIG. 2 is a perspective exploded view of the receiving end embodiment of the wireless power transmission device.

圖三A至圖七係為本創作防磁片的各種形狀的實施例示意圖。FIG. 3A to FIG. 7 are schematic views of embodiments of various shapes of the artificial magnetic sheet.

圖八係為本創作接收端防電磁干擾結構之另一實施例分解示意圖。FIG. 8 is an exploded perspective view of another embodiment of the anti-electromagnetic interference structure of the creation receiving end.

圖九至圖十D為本創作圖案化接地層之各種實施例示意圖。9 through 10D are schematic views of various embodiments of the patterned patterned ground layer.

20‧‧‧接收端20‧‧‧ receiving end

21‧‧‧線圈21‧‧‧ coil

22‧‧‧鐵心板22‧‧‧iron core board

23‧‧‧雙面膠帶23‧‧‧Double-sided tape

30‧‧‧電路基板30‧‧‧ circuit board

31‧‧‧電子元件31‧‧‧Electronic components

32‧‧‧表面32‧‧‧ Surface

35‧‧‧雙面膠帶35‧‧‧Double-sided tape

40‧‧‧防磁片40‧‧‧Antimagnetic sheet

Claims (16)

一種無線電力傳輸裝置之防電磁干擾結構,該無線電力傳輸裝置至少包括至少一發送端及至少一接收端,該防電磁干擾結構包括:一電路基板,電性連接該接收端之一線圈,該電路基板上配置有至少一電子元件;及至少一防磁片,平貼於該電路基板朝向該發送端之一表面上,以隔絕電磁場信號影響該電子元件。An anti-electromagnetic interference structure of a wireless power transmission device, the wireless power transmission device comprising at least one transmitting end and at least one receiving end, the anti-electromagnetic interference structure comprises: a circuit substrate electrically connected to one coil of the receiving end, At least one electronic component is disposed on the circuit substrate; and at least one anti-magnetic film is disposed on the surface of the circuit substrate facing the transmitting end to isolate the electronic component from the electromagnetic field signal. 如申請專利範圍第1項所述之無線電力傳輸裝置之防電磁干擾結構,其中該防磁片係藉由至少一雙面膠帶或黏膠平貼於該表面。The anti-electromagnetic interference structure of the wireless power transmission device according to claim 1, wherein the anti-magnetic film is flatly attached to the surface by at least one double-sided tape or adhesive. 如申請專利範圍第1項所述之無線電力傳輸裝置之防電磁干擾結構,其中該防磁片為平板狀,其輪廓形狀及大小與該電路基板相近,覆蓋在整個該電路基板之該表面上。The anti-electromagnetic interference structure of the wireless power transmission device according to claim 1, wherein the anti-magnetic piece has a flat shape, and has a contour shape and a size similar to the circuit substrate, and covers the entire surface of the circuit substrate. 如申請專利範圍第1項所述之無線電力傳輸裝置之防電磁干擾結構,其中該防磁片僅覆蓋該電子元件。The anti-electromagnetic interference structure of the wireless power transmission device of claim 1, wherein the anti-magnetic sheet covers only the electronic component. 如申請專利範圍第1項所述之無線電力傳輸裝置之防電磁干擾結構,其中該防磁片為條狀,環繞在該電子元件的周圍。The anti-electromagnetic interference structure of the wireless power transmission device according to claim 1, wherein the anti-magnetic piece is strip-shaped and surrounds the electronic component. 如申請專利範圍第1項所述之無線電力傳輸裝置之防電磁干擾結構,其中該防磁片為條狀,環繞在該表面的側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 1, wherein the anti-magnetic sheet is strip-shaped and surrounds a side edge of the surface. 如申請專利範圍第6項所述之無線電力傳輸裝置之防電磁干 擾結構,其中該防磁片具有一斷開處,呈C字形或ㄈ字形,在該斷開處的該表面上配設有至少一電接點,用以電性連接該線圈。Anti-electromagnetic dryness of the wireless power transmission device as described in claim 6 The disturbing structure, wherein the anti-magnetic piece has a break, in a C-shape or a U-shape, and at least one electrical contact is disposed on the surface of the break to electrically connect the coil. 如申請專利範圍第6項所述之無線電力傳輸裝置之防電磁干擾結構,其中該電路基板為矩形,而該防磁片僅平貼在該表面的其中一側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 6, wherein the circuit substrate is rectangular, and the anti-magnetic sheet is only flat on one of the side edges of the surface. 如申請專利範圍第6項所述之無線電力傳輸裝置之防電磁干擾結構,其中該電路基板為矩形,而該防磁片為相互分離的二條,分別平貼於該表面隔離相對的二側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 6, wherein the circuit substrate is rectangular, and the anti-magnetic film is two separated from each other, and is respectively affixed to the opposite side edges of the surface. . 一種無線電力傳輸裝置之防電磁干擾結構,該無線電力傳輸裝置至少包括至少一發送端及至少一接收端,該防電磁干擾結構包括:一電路基板,電性連接該接收端之一線圈,該電路基板包括:一第一介電層、一圖案化接地層(GND patterned layer)及一第二介電層,該圖案化接地層配置於該第一及第二介電層之間,該電路基板之一表面上配置有至少一電子元件,其中該圖案化接地層用以導引一電磁場信號至一接地端。An anti-electromagnetic interference structure of a wireless power transmission device, the wireless power transmission device comprising at least one transmitting end and at least one receiving end, the anti-electromagnetic interference structure comprises: a circuit substrate electrically connected to one coil of the receiving end, The circuit substrate includes: a first dielectric layer, a GND patterned layer, and a second dielectric layer, the patterned ground layer is disposed between the first and second dielectric layers, the circuit At least one electronic component is disposed on a surface of the substrate, wherein the patterned ground layer is used to guide an electromagnetic field signal to a ground. 如申請專利範圍第10項所述之無線電力傳輸裝置之防電磁干擾結構,其中該圖案化接地層形成在對應該電子元件所在區域。The anti-electromagnetic interference structure of the wireless power transmission device of claim 10, wherein the patterned ground layer is formed in a region corresponding to the electronic component. 如申請專利範圍第10項所述之無線電力傳輸裝置之防電磁干擾結構,其中該圖案化接地層形成在環繞該電子元件所在區域的周圍。The anti-electromagnetic interference structure of the wireless power transmission device of claim 10, wherein the patterned ground layer is formed around a region surrounding the electronic component. 如申請專利範圍第10項所述之無線電力傳輸裝置之防電磁干擾結構,其中該圖案化接地層形成在環繞該電路基板之外側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 10, wherein the patterned ground layer is formed at an outer side edge surrounding the circuit substrate. 如申請專利範圍第10項所述之無線電力傳輸裝置之防電磁干擾結構,其中該電路基板為矩形,而該圖案化接地層形成在該電路基板之其中一側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 10, wherein the circuit substrate is rectangular, and the patterned ground layer is formed at one of edges of the circuit substrate. 如申請專利範圍第10項所述之無線電力傳輸裝置之防電磁干擾結構,其中該電路基板為矩形,而該圖案化接地層形成在該電路基板之其中相對的二側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 10, wherein the circuit substrate is rectangular, and the patterned ground layer is formed at opposite side edges of the circuit substrate. 如申請專利範圍第10項所述之無線電力傳輸裝置之防電磁干擾結構,其中該電路基板為矩形,而該圖案化接地層形成在該電路基板之其中三側邊緣處。The anti-electromagnetic interference structure of the wireless power transmission device of claim 10, wherein the circuit substrate is rectangular, and the patterned ground layer is formed at three side edges of the circuit substrate.
TW101214927U 2012-08-03 2012-08-03 Structure of preventing electromagnetic interference for wireless power transmission device TWM448843U (en)

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