TWM447018U - Electrical connector - Google Patents

Electrical connector Download PDF

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Publication number
TWM447018U
TWM447018U TW101213179U TW101213179U TWM447018U TW M447018 U TWM447018 U TW M447018U TW 101213179 U TW101213179 U TW 101213179U TW 101213179 U TW101213179 U TW 101213179U TW M447018 U TWM447018 U TW M447018U
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TW
Taiwan
Prior art keywords
electrical connector
insulating body
conductive terminal
soldering
soldering portion
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Application number
TW101213179U
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Chinese (zh)
Inventor
Fang-Jwu Liao
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101213179U priority Critical patent/TWM447018U/en
Publication of TWM447018U publication Critical patent/TWM447018U/en

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Abstract

An electrical connector for electrically connecting a chip module to a circuit board includes an insulating housing, a number of terminals received in the insulating housing and a number of solder balls. The insulating housing includes an upper surface, a lower surface and a number of receiving holes passing through the upper surface and the lower surface. Each of the terminals includes an outer surface coated with a metal coating. Each of the terminals includes a soldering portion. The soldering portion includes a bottom surface located on the lower surface of the insulating housing. The bottom surface is formed by the removal of the terminal carrier. The bottom surface exposes the material that the terminals made of. The soldering portion matches with the solder ball.

Description

電連接器Electrical connector

本創作涉及一種電連接器,尤其涉及一種電性連接晶片模組至電路板之電連接器。The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a chip module to a circuit board.

先前技術如中國大陸專利公告第201937059號揭露了一種與本創作相關之電連接器,其用於電性連接晶片模組至電路板上,該電連接器包括絕緣本體、複數固持於絕緣本體中之導電端子以及複數錫球。該導電端子包括主體部以及自主體部向下延伸之用以焊接至電路板之焊接部,所述焊接部包括夾持所述錫球之夾持臂。該導電端子還設有與料帶相連接之部分,即料帶係連接於導電端子之主體部上端兩側。藉由料帶去除後,加熱熔化錫球將導電端子之焊接部焊接至電路板從而實現電連接器與電路板之連接。A prior art, such as the Chinese Patent Publication No. 201937059, discloses an electrical connector related to the present invention for electrically connecting a chip module to a circuit board, the electrical connector comprising an insulating body and a plurality of holdings in the insulating body Conductive terminals and a plurality of solder balls. The conductive terminal includes a body portion and a solder portion extending downward from the body portion for soldering to the circuit board, the solder portion including a clamping arm that holds the solder ball. The conductive terminal is further provided with a portion connected to the strip, that is, the strip is connected to both sides of the upper end of the main body portion of the conductive terminal. After the strip is removed, the solder ball is heated to solder the soldered portion of the conductive terminal to the circuit board to connect the electrical connector to the circuit board.

然,在先前技術中,由於導電端子之焊接部設有夾持錫球之夾持臂,焊接部之結構較複雜,與料帶相連接之部分係另設於導電端子之其他部分,因此導電端子之結構相對複雜,佔用較大之空間,不利於電連接器小型化之發展趨勢。However, in the prior art, since the soldering portion of the conductive terminal is provided with the clamping arm for holding the solder ball, the structure of the soldering portion is complicated, and the portion connected to the strip is separately disposed in other portions of the conductive terminal, thereby conducting The structure of the terminal is relatively complicated and takes up a large space, which is not conducive to the development trend of miniaturization of the electrical connector.

鑒於此,確有必要提供一種改進之電連接器,以克服先前技術存在之缺陷。In view of this, it is indeed necessary to provide an improved electrical connector to overcome the deficiencies of the prior art.

本創作之目的係提供一種具有結構簡單之導電端子之電連接器。The purpose of this creation is to provide an electrical connector having a structurally simple conductive terminal.

本創作之電連接器可藉以下技術方案實現:一種電連接器,用於電性連接晶片模組至電路板,所述電連接器包括絕緣本體和複數固持於絕緣本體中之導電端子及複數錫球,所述絕緣本體包括上表面、下表面以及複數貫穿上、下表面之端子收容孔,所述導電端子之外表面鍍有金屬鍍層,所述導電端子包括用以將電連接器焊接至電路板上之焊接部,所述焊接部包括位於絕緣本體之下表面之底面,所述底面為料帶折去後形成,其顯露出製造導電端子所用之材料,所述焊接部與所述錫球相配合。The electrical connector of the present invention can be realized by the following technical solutions: an electrical connector for electrically connecting a chip module to a circuit board, the electrical connector comprising an insulating body and a plurality of conductive terminals and a plurality of conductive terminals held in the insulating body a solder ball, the insulating body includes an upper surface, a lower surface, and a plurality of terminal receiving holes penetrating the upper and lower surfaces, the outer surface of the conductive terminal is plated with a metal plating layer, and the conductive terminal includes a soldering terminal for soldering the electrical connector a soldering portion on the circuit board, the soldering portion including a bottom surface of the lower surface of the insulating body, the bottom surface being formed after the tape is folded away, which exposes a material used for manufacturing the conductive terminal, the soldering portion and the tin The ball matches.

作為本創作進一步改進之技術方案,其中所述焊接部與所述絕緣本體共同夾持所述錫球。As a further improvement of the present invention, the soldering portion and the insulating body jointly hold the solder ball.

作為本創作進一步改進之技術方案,其中所述焊接部於料帶去除後用以機械夾持所述錫球。As a further improvement of the present invention, the soldering portion is used to mechanically clamp the solder ball after the strip is removed.

作為本創作進一步改進之技術方案,其中所述料帶與所述焊接部之間設有預斷線,所述底面係所述料帶沿所述預斷線折斷後形成。As a further improvement of the present invention, a pre-break line is disposed between the strip and the welded portion, and the bottom surface is formed after the strip is broken along the pre-break line.

作為本創作進一步改進之技術方案,其中所述預斷線為V型切口。As a further improvement of the present invention, the pre-break line is a V-shaped slit.

作為本創作進一步改進之技術方案,其中所述焊接部包括面向所述端子收容孔之側面,所述側面設有凹坑。As a further improvement of the present invention, the soldering portion includes a side surface facing the terminal receiving hole, and the side surface is provided with a dimple.

作為本創作進一步改進之技術方案,其中所述電連接器對應每一導電端子設有錫球,所述錫球與所述凹坑接觸而固持於所述絕緣本體中。As a further improvement of the present invention, the electrical connector is provided with a solder ball corresponding to each of the conductive terminals, and the solder ball is in contact with the recess and is retained in the insulating body.

作為本創作進一步改進之技術方案,其中所述金屬鍍層為鍍金層,所述製造導電端子所用之材料為銅。As a further improvement of the present invention, the metal plating layer is a gold plating layer, and the material used for manufacturing the conductive terminal is copper.

作為本創作進一步改進之技術方案,其中所述導電端子還包括自焊接部向上延伸設置之固持部,所述焊接部與所述固持部位於同一平面。As a further improvement of the present invention, the conductive terminal further includes a holding portion extending upward from the soldering portion, and the soldering portion is in the same plane as the holding portion.

作為本創作進一步改進之技術方案,其中所述導電端子還包括自固持部向上延伸設置之連接部以及自連接部向上傾斜彎折延伸設置之接觸部。As a further improvement of the present invention, the conductive terminal further includes a connecting portion extending upward from the holding portion and a contact portion extending obliquely upward from the connecting portion.

作為本創作進一步改進之技術方案,其中所述固持部設有複數倒刺,所述倒刺與絕緣本體干涉配合以將導電端子固持於所述絕緣本體中。As a further improvement of the present invention, the holding portion is provided with a plurality of barbs, and the barbs cooperate with the insulating body to hold the conductive terminals in the insulating body.

作為本創作進一步改進之技術方案,其中所述接觸部延伸出所述絕緣本體之上表面。As a further improvement of the present invention, the contact portion extends out of the upper surface of the insulating body.

作為本創作進一步改進之技術方案,其中所述端子收容孔於絕緣本體之下表面處設有傾斜之導引面。As a further improvement of the present invention, the terminal receiving hole is provided with an inclined guiding surface at a lower surface of the insulating body.

作為本創作進一步改進之技術方案,其中所述端子收容孔於導電端子之焊接部處設有凹槽,凹槽之設置使得焊接部與絕緣本體間具有一間隙。As a further improvement of the present invention, the terminal receiving hole is provided with a groove at the welding portion of the conductive terminal, and the groove is disposed so as to have a gap between the welded portion and the insulating body.

相較於先前技術,本創作電連接器之導電端子包括用以將電連接器焊接至電路板上之焊接部,料帶係連接於所述焊接部之下端,料帶去除後之斷面即為焊接部之底面,而後塞入錫球,焊接部機械夾持所述錫球於絕緣本體中。由於導電端子之料帶係與焊接部下端相連,料帶去除後直接進行植球,因而夾持錫球之焊接部結構簡單且導電端子無需另設與料帶相連之部分,故,導電端子結構簡單,利於電連接器小型化之發展趨勢。Compared with the prior art, the conductive terminal of the present electrical connector includes a soldering portion for soldering the electrical connector to the circuit board, and the tape is connected to the lower end of the soldering portion, and the section after the strip is removed is The bottom surface of the welded portion is inserted into the solder ball, and the soldering portion mechanically clamps the solder ball into the insulating body. Since the strip of the conductive terminal is connected to the lower end of the soldering portion, the ball is directly transferred after the strip is removed, so that the soldering portion of the solder ball is simple in structure and the conductive terminal does not need to be separately connected with the strip, so the conductive terminal structure Simple, it is conducive to the development trend of miniaturization of electrical connectors.

請參照第一圖至第六圖所示,本創作電連接器100用於電性連接晶片模組至電路板。所述電連接器100包括絕緣本體1和複數固持於絕緣本體1中之導電端子2及複數錫球3。Referring to the first to sixth figures, the present electrical connector 100 is used to electrically connect the chip module to the circuit board. The electrical connector 100 includes an insulative housing 1 and a plurality of conductive terminals 2 and a plurality of solder balls 3 held in the insulative housing 1 .

請參閱第一圖、第二圖所示,所述絕緣本體1具有上表面10、下表面12以及複數貫穿上、下表面10、12之端子收容孔11。所述端子收容孔11於絕緣本體1之下表面12處設有傾斜之導引面110,該導引面110可於將導電端子2及錫球3組裝至端子收容孔11中時起導引作用。端子收容孔11還包括凹槽111,該凹槽111可於將錫球3組裝至導電端子2之焊接部22時,為焊接部22之變形提供變形空間。Referring to the first and second figures, the insulative housing 1 has an upper surface 10, a lower surface 12, and a plurality of terminal receiving holes 11 extending through the upper and lower surfaces 10, 12. The terminal receiving hole 11 is provided with an inclined guiding surface 110 at the lower surface 12 of the insulative housing 1 , and the guiding surface 110 can guide when the conductive terminal 2 and the solder ball 3 are assembled into the terminal receiving hole 11 . effect. The terminal receiving hole 11 further includes a groove 111 for providing a deformation space for deformation of the welded portion 22 when the solder ball 3 is assembled to the welded portion 22 of the conductive terminal 2.

請參閱第三圖、第四圖所示,導電端子2包括固持部21、由固持部21向下延伸設置之焊接部22、由固持部21向上延伸設置之連接部23以及由連接部23向上傾斜彎折延伸設置之接觸部24。固持部21與焊接部22位於同一豎直平面內,該平面垂直絕緣本體1之上、下表面10、12。所述固持部21兩側設有複數倒刺211,用以與絕緣本體1干涉配合以將導電端子2固持於端子收容孔11中。所述焊接部22具有側面221和底面222。側面221面向端子收容孔11,用以與錫球3接觸。端子收容孔11之凹槽111位於與側面221相對之另一面處,凹槽111之設置使得焊接部22與絕緣本體1間具有一間隙,可為焊接部22之彈性變形提供變形空間。所述側面221設有球形之凹坑2210,該凹坑2210用以固持和定位所述錫球3。底面222係為料帶4折去後形成。Referring to the third and fourth figures, the conductive terminal 2 includes a holding portion 21, a welded portion 22 extending downward from the holding portion 21, a connecting portion 23 extending upward from the holding portion 21, and being upwardly connected by the connecting portion 23. The contact portion 24 extending and extending is obliquely bent. The holding portion 21 is located in the same vertical plane as the welded portion 22, which is perpendicular to the upper and lower surfaces 10, 12 of the insulating body 1. A plurality of barbs 211 are disposed on both sides of the holding portion 21 for interference fit with the insulative housing 1 to hold the conductive terminals 2 in the terminal receiving holes 11 . The welded portion 22 has a side surface 221 and a bottom surface 222. The side surface 221 faces the terminal receiving hole 11 for contacting the solder ball 3. The groove 111 of the terminal receiving hole 11 is located at the other side opposite to the side surface 221, and the groove 111 is disposed such that the gap between the welded portion 22 and the insulating body 1 provides a deformation space for the elastic deformation of the welded portion 22. The side surface 221 is provided with a spherical recess 2210 for holding and positioning the solder ball 3. The bottom surface 222 is formed by folding the tape 4 away.

請參閱第四圖所示,在將導電端子2插入絕緣本體1之端子收容孔11之前,所述料帶4連接於所述導電端子2之焊接部22。所述料帶4與焊接部22相連接之部分設有預斷線40,該預斷線40為V型切口。所述導電端子2之外表面鍍有金屬鍍層,所述金屬鍍層通常為鍍金層,其用於提高導電端子2之耐磨耐腐蝕性能保證良好之訊號傳輸。Referring to the fourth figure, before the conductive terminal 2 is inserted into the terminal receiving hole 11 of the insulative housing 1, the tape 4 is connected to the soldering portion 22 of the conductive terminal 2. The portion of the strip 4 that is connected to the welded portion 22 is provided with a pre-break line 40, which is a V-shaped slit. The outer surface of the conductive terminal 2 is plated with a metal plating layer, which is usually a gold plating layer, which is used for improving the wear resistance and corrosion resistance of the conductive terminal 2 to ensure good signal transmission.

請參閱第五圖所示,藉由料帶4將導電端子2插入絕緣本體1,沿預斷線40折去料帶4後形成導電端子2之焊接部22之底面222。由於底面222為料帶4折斷後直接形成,故底面222未有金屬鍍層,其顯露出製造導電端子2所用之材料,該材料通常為銅材。Referring to the fifth figure, the conductive terminal 2 is inserted into the insulative housing 1 by the tape 4, and the bottom surface 222 of the soldering portion 22 of the conductive terminal 2 is formed after the strip 4 is folded along the pre-break line 40. Since the bottom surface 222 is formed directly after the tape 4 is broken, the bottom surface 222 has no metal plating, which reveals the material used to make the conductive terminals 2, which is usually copper.

請重點參閱第二圖至第五圖所示,組裝時,首先將連接有料帶4之導電端子2從絕緣本體1之下表面12組裝至端子收容孔11中,藉由倒刺211之干涉配合而固定,導電端子2之接觸部24延伸出絕緣本體1之上表面10,然後將料帶4沿預斷線40折斷去除形成焊接部22之底面222,底面222位於絕緣本體1之下表面12處,最後將錫球3自絕緣本體1之下表面12組裝入端子收容孔11中,此時錫球3與焊接部22之側面221上之凹坑2210接觸,由焊接部22和絕緣本體1相配合機械夾持錫球3於端子收容孔11中。端子收容孔11之導引面110之設置可方便導電端子2及錫球3組裝至端子收容孔11中。由於本創作之導電端子2直接以料帶4折去後之焊接部22進行夾球,導電端子2之結構簡單。Please refer to the second to fifth figures. When assembling, firstly, the conductive terminals 2 connected to the strip 4 are assembled from the lower surface 12 of the insulative housing 1 into the terminal receiving holes 11 by interference fit of the barbs 211. The fixed contact portion 24 of the conductive terminal 2 extends out of the upper surface 10 of the insulating body 1, and then the strip 4 is broken along the pre-break line 40 to form the bottom surface 222 of the soldering portion 22, and the bottom surface 222 is located on the lower surface 12 of the insulating body 1. Finally, the solder ball 3 is assembled from the lower surface 12 of the insulative housing 1 into the terminal receiving hole 11, and the solder ball 3 is in contact with the recess 2210 on the side surface 221 of the soldering portion 22, and the soldering portion 22 and the insulating body 1 are The solder ball 3 is mechanically held in the terminal receiving hole 11. The guiding surface 110 of the terminal receiving hole 11 is arranged to facilitate the assembly of the conductive terminal 2 and the solder ball 3 into the terminal receiving hole 11. Since the conductive terminal 2 of the present invention directly clips the ball 22 after the strip 4 is folded, the structure of the conductive terminal 2 is simple.

綜上所述,本創作符合新型專利要件,爰依法提出專利申請。惟,以上所述者僅為本創作之較佳實施例,本創作之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本創作之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, this creation is in line with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application.

100‧‧‧電連接器100‧‧‧Electrical connector

1‧‧‧絕緣本體1‧‧‧Insulating body

10‧‧‧上表面10‧‧‧ upper surface

12‧‧‧下表面12‧‧‧ Lower surface

11‧‧‧端子收容孔11‧‧‧Terminal receiving hole

110‧‧‧導引面110‧‧‧ Guide surface

111‧‧‧凹槽111‧‧‧ Groove

2‧‧‧導電端子2‧‧‧Electrical terminals

21‧‧‧固持部21‧‧‧ Holding Department

211‧‧‧倒刺211‧‧‧ barbed

22‧‧‧焊接部22‧‧‧Weld Department

221‧‧‧側面221‧‧‧ side

2210‧‧‧凹坑2210‧‧‧ pit

222‧‧‧底面222‧‧‧ bottom

23‧‧‧連接部23‧‧‧Connecting Department

24‧‧‧接觸部24‧‧‧Contacts

3‧‧‧錫球3‧‧‧ solder balls

4‧‧‧料帶4‧‧‧Material

40‧‧‧預斷線40‧‧‧Pre-broken line

第一圖係本創作電連接器之立體組合圖;The first figure is a three-dimensional combination diagram of the present electrical connector;

第二圖係本創作電連接器之另一角度之立體組合圖;The second figure is a three-dimensional combination diagram of another angle of the present electrical connector;

第三圖係本創作電連接器之立體分解圖;The third figure is an exploded view of the original electrical connector;

第四圖係本創作電連接器之導電端子組裝入絕緣本體前連有料帶之立體圖;The fourth figure is a perspective view of the conductive terminal set of the present invention being connected to the insulating body before being inserted into the insulating body;

第五圖係本創作電連接器之導電端子組裝入絕緣本體後料帶去除之立體圖;及The fifth figure is a perspective view of the strip removed after the conductive terminal set of the present electrical connector is inserted into the insulating body;

第六圖係本創作電連接器沿第一圖之VI-VI線之剖視圖。Figure 6 is a cross-sectional view of the present electrical connector taken along line VI-VI of the first figure.

1‧‧‧絕緣本體 1‧‧‧Insulating body

10‧‧‧上表面 10‧‧‧ upper surface

11‧‧‧端子收容孔 11‧‧‧Terminal receiving hole

110‧‧‧導引面 110‧‧‧ Guide surface

111‧‧‧凹槽 111‧‧‧ Groove

12‧‧‧下表面 12‧‧‧ Lower surface

2‧‧‧導電端子 2‧‧‧Electrical terminals

22‧‧‧焊接部 22‧‧‧Weld Department

221‧‧‧側面 221‧‧‧ side

2210‧‧‧凹坑 2210‧‧‧ pit

4‧‧‧料帶 4‧‧‧Material

40‧‧‧預斷線 40‧‧‧Pre-broken line

Claims (14)

一種電連接器,用於電性連接晶片模組至電路板,所述電連接器包括:
絕緣本體,所述絕緣本體設有上表面、下表面以及複數貫穿上、下表面之端子收容孔;
複數導電端子,係固持於所述端子收容孔中,所述導電端子之外表面鍍有金屬鍍層,所述導電端子包括用以將電連接器焊接至電路板之焊接部;及
複數錫球,係與導電端子相配合;
其中,所述焊接部包括位於所述絕緣本體之下表面之底面,所述底面為料帶折去後形成,其顯露出製造導電端子所用之材料,所述焊接部與所述錫球相配合。
An electrical connector for electrically connecting a chip module to a circuit board, the electrical connector comprising:
An insulating body, wherein the insulating body is provided with an upper surface, a lower surface, and a plurality of terminal receiving holes penetrating the upper and lower surfaces;
a plurality of conductive terminals are fixed in the terminal receiving hole, the outer surface of the conductive terminal is plated with a metal plating layer, the conductive terminal includes a soldering portion for soldering the electrical connector to the circuit board; and a plurality of solder balls, Cooperating with the conductive terminals;
Wherein the soldering portion includes a bottom surface of the lower surface of the insulative housing, the bottom surface is formed after the strip is folded, and the material used for manufacturing the conductive terminal is exposed, and the soldering portion cooperates with the solder ball .
如申請專利範圍第1項所述之電連接器,其中所述焊接部與所述絕緣本體共同夾持所述錫球。The electrical connector of claim 1, wherein the soldering portion and the insulating body together clamp the solder ball. 如申請專利範圍第1項所述之電連接器,其中所述焊接部於料帶去除後用以機械夾持所述錫球。The electrical connector of claim 1, wherein the soldering portion is used to mechanically clamp the solder ball after the strip is removed. 如申請專利範圍第1項所述之電連接器,其中所述料帶與所述焊接部之間設有預斷線,所述底面係所述料帶沿所述預斷線折斷後形成。The electrical connector of claim 1, wherein a pre-break line is provided between the strip and the welded portion, and the bottom surface is formed after the strip is broken along the pre-break line. 如申請專利範圍第4項所述之電連接器,其中所述預斷線為V型切口。The electrical connector of claim 4, wherein the pre-break line is a V-shaped slit. 如申請專利範圍第1項所述之電連接器,其中所述焊接部包括面向所述端子收容孔之側面,所述側面設有凹坑。The electrical connector of claim 1, wherein the soldering portion includes a side surface facing the terminal receiving hole, and the side surface is provided with a recess. 如申請專利範圍第6項所述之電連接器,其中所述錫球與所述凹坑接觸而固持於所述絕緣本體中。The electrical connector of claim 6, wherein the solder ball is in contact with the dimple and is retained in the insulative body. 如申請專利範圍第1項所述之電連接器,其中所述金屬鍍層為鍍金層,所述製造導電端子所用之材料為銅。The electrical connector of claim 1, wherein the metal plating layer is a gold plating layer, and the material used for manufacturing the conductive terminal is copper. 如申請專利範圍第1項所述之電連接器,其中所述導電端子包括自焊接部向上延伸設置之固持部,所述焊接部與所述固持部位於同一豎直平面內。The electrical connector of claim 1, wherein the conductive terminal comprises a retaining portion extending upward from the soldering portion, the soldering portion being in the same vertical plane as the retaining portion. 如申請專利範圍第9項所述之電連接器,其中所述導電端子還包括自固持部向上延伸設置之連接部以及自連接部向上傾斜彎折延伸設置之接觸部。The electrical connector of claim 9, wherein the conductive terminal further comprises a connecting portion extending upward from the retaining portion and a contact portion extending obliquely upward from the connecting portion. 如申請專利範圍第9項所述之電連接器,其中所述固持部設有複數倒刺,所述倒刺與絕緣本體干涉配合以將導電端子固持於所述絕緣本體中。The electrical connector of claim 9, wherein the holding portion is provided with a plurality of barbs, and the barbs cooperate with the insulating body to hold the conductive terminals in the insulating body. 如申請專利範圍第10項所述之電連接器,其中所述接觸部延伸出所述絕緣本體之上表面。The electrical connector of claim 10, wherein the contact portion extends beyond an upper surface of the insulative body. 如申請專利範圍第1項所述之電連接器,其中所述端子收容孔於絕緣本體之下表面處設有傾斜之導引面。The electrical connector of claim 1, wherein the terminal receiving hole is provided with an inclined guiding surface at a lower surface of the insulating body. 如申請專利範圍第1項所述之電連接器,其中所述端子收容孔於導電端子之焊接部處設有凹槽,凹槽之設置使得焊接部與絕緣本體間具有一間隙。The electrical connector of claim 1, wherein the terminal receiving hole is provided with a groove at a welded portion of the conductive terminal, and the groove is disposed such that a gap exists between the welded portion and the insulating body.
TW101213179U 2012-07-09 2012-07-09 Electrical connector TWM447018U (en)

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