TWM445114U - Integrated multi-layer lighting device and multiple combinated integrated multi-layer illumination device - Google Patents

Integrated multi-layer lighting device and multiple combinated integrated multi-layer illumination device Download PDF

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TWM445114U
TWM445114U TW101212374U TW101212374U TWM445114U TW M445114 U TWM445114 U TW M445114U TW 101212374 U TW101212374 U TW 101212374U TW 101212374 U TW101212374 U TW 101212374U TW M445114 U TWM445114 U TW M445114U
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Taiwan
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integrated multi
heat dissipation
layer
light
heat
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TW101212374U
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Chinese (zh)
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zhong-fu Hu
Yong-Fu Wu
kui-jiang Liu
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Gem Weltronics Twn Corp
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Publication of TWM445114U publication Critical patent/TWM445114U/en

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Description

一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置Integrated multi-layer lighting device and integrated multi-layer lighting device with multiple combinations

一種照明裝置,尤其是關於一種可倍數組合之一體化多層式照明裝置。A lighting device, in particular, relates to an integrated multi-layer lighting device that can be combined in multiples.

照明裝置為日常生活中不可或缺的生活用品,改變了人們的生活方式,現今於一般家庭中或公眾的室內場合,皆可看到使用各式各樣的照明設備,例如:日光燈、照明燈、檯燈、吊燈、電虹燈等等,對於昏暗所帶來的不便可以透過照明設備加以改善。Illumination devices are indispensable daily necessities in daily life, changing people's lifestyles. Nowadays, in a general family or in public indoors, you can see the use of a variety of lighting equipment, such as: fluorescent lamps, lighting , table lamps, chandeliers, electric lights, etc., the inconvenience caused by dim can be improved through lighting equipment.

對於不同的照明設備而言,其應用的用途也具有差異,例如:一般日光燈、照明燈、檯燈…等,其為一般照明的使用,而也有一些特殊用途的照明設備例如:夜燈,即為應用於人們入睡時所提供的照明,其發光功率較低,僅為輔助之用。傳統式之燈管或燈泡具有升溫快及耗電量高之缺點,且燈具在廢棄後會導致環保的問題,因此,近年來便發展出以發光二極體(Light Emitting Diode,LED)作為發光源的技術。For different lighting equipment, the application uses are also different, for example: general fluorescent lamps, lighting lamps, table lamps, etc., which are used for general lighting, and some special-purpose lighting devices such as night lights, It is applied to the illumination provided by people when they fall asleep, and its luminous power is low, which is only for auxiliary use. Conventional lamps or bulbs have the disadvantages of rapid heating and high power consumption, and the lamps will cause environmental problems after being discarded. Therefore, in recent years, Light Emitting Diodes (LEDs) have been developed as light-emitting diodes. Source technology.

雖然發光二極體具有耗電量低、元件壽命長、無須暖燈時間及反應速度快等優點,但一般的發光二極體其所發出的亮度較傳統式燈泡或燈管為低,因此是採用高功率的發光二極體來作為照明光源。高功率的發光二極體雖可提供較為更高的亮度,但其在持續使用的狀態下,會因溫度升高而影響發光的效率,因此,如何使LED照明具有更佳的照明效果,有效提升其散熱效果,實為業界技術再提升之重要課題。Although the light-emitting diode has the advantages of low power consumption, long component life, no need for warm-up time, and fast response speed, the general light-emitting diode emits lower brightness than a conventional light bulb or a lamp tube, so A high power light emitting diode is used as the illumination source. Although high-power LEDs can provide higher brightness, they will affect the efficiency of illumination due to temperature increase during continuous use. Therefore, how to make LED illumination have better illumination effect, effectively Enhancing the heat dissipation effect is an important issue for the industry to improve its technology.

本創作的主要目的在於提供一種一體化多層式照明裝置,係包含有一散熱基座,係包含有一第一正面及一第二正面,該第一正面上開設出至少一個以上之槽室,而該第二正面上係形成有複數個散熱鰭片,其中一槽室具有一底面及一內環壁面,該底面上設置有複數個發光元件,該等發光元件彼此之間相互打線接合,該槽室的該底面及該第二正面之間貫設有兩孔道;兩導線桿,係以打線接合與該等發光元件構成電性連接,其中該兩導線架係分別穿設於該兩孔道之間,該兩孔道之兩端係以一封合材料而封閉,且該兩孔道內的空間中係填注有一耐熱塑質化合物。The main purpose of the present invention is to provide an integrated multi-layer lighting device, comprising a heat dissipation base, comprising a first front surface and a second front surface, wherein the first front surface defines at least one or more slot chambers, and the first front surface The second front surface is formed with a plurality of heat dissipating fins, wherein one of the groove chambers has a bottom surface and an inner ring wall surface, and the bottom surface is provided with a plurality of light emitting elements, and the light emitting elements are mutually wire-bonded to each other. Two wires are disposed between the bottom surface and the second front surface; the two lead wires are electrically connected to the light-emitting elements by wire bonding, wherein the two lead frames are respectively disposed between the two holes. The two ends of the two channels are closed by a bonding material, and the space in the two holes is filled with a heat-resistant plastic compound.

本創作之另一目的在於提供一種可倍數組合之一體化多層式照明裝置,係包含有:複數個散熱基座,其中為該等散熱基座之任兩相鄰之散熱基座可透過複數個連接件而連結固定,其中一散熱基座係包含有一第一正面及一第二正面,該第一正面上開設出至少一個以上之槽室,而該第二正面上係形成有複數個散熱鰭片,其中一槽室具有一底面及一內環壁面,該底面上設置有複數個發光元件,該等發光元件彼此之間相互打線接合,該槽室的該底面及該第二正面之間貫設有兩通道;兩導線桿,係以打線接合與該等發光元件構成電性連接,其中該兩導線架係分別穿設於該兩孔道之間,該兩孔道之兩端係以一封合材料而封閉,且該兩孔道內的空間中係填注有一耐熱塑質化合物。Another object of the present invention is to provide an integrated multi-layer lighting device capable of multiple combinations, comprising: a plurality of heat dissipation bases, wherein any two adjacent heat dissipation bases of the heat dissipation bases are permeable to a plurality of The heat sink base includes a first front surface and a second front surface, the first front surface defines at least one or more groove chambers, and the second front surface is formed with a plurality of heat dissipation fins And a groove chamber having a bottom surface and an inner ring wall surface, wherein the bottom surface is provided with a plurality of light-emitting elements, wherein the light-emitting elements are wire-bonded to each other, and the bottom surface of the groove chamber and the second front surface are connected to each other There are two channels; the two wire rods are electrically connected to the light-emitting elements by wire bonding, wherein the two wire frames are respectively disposed between the two holes, and the two ends of the two holes are connected The material is closed, and the space in the two channels is filled with a heat-resistant plastic compound.

本創作的優點在於可根據使用場所及使用目的的不同,而決定照明裝置中散熱基座的使用數量及組裝方式,且多個散熱基座組裝上透過藉由連接件做組裝固定,連接件1的組裝及拆卸相當簡易可迅速完成組裝拆卸,在製造及維修上非常省時省力,本創作的照明裝置可根據不同的應用目的而組裝成適當型態使用,以提供各種的照射範圍及照射強度。The advantage of the present invention is that the number of the heat sink bases in the lighting device and the assembly method can be determined according to the place of use and the purpose of use, and the plurality of heat sink bases are assembled and fixed by the connecting member, and the connecting member 1 is assembled. The assembly and disassembly are quite simple and can be quickly assembled and disassembled. It is very time-saving and labor-saving in manufacturing and maintenance. The lighting device of this creation can be assembled into an appropriate type according to different application purposes to provide various irradiation ranges and irradiation intensity. .

以下配合圖式及元件符號對本創作之實施方式做更詳細的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。The implementation of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement the present specification after studying the present specification.

參閱第一圖,本創作之可倍數組合之一體化多層式照明裝置之立體示意圖,參閱第二圖,本創作之可倍數組合之一體化多層式照明裝置之剖面示意圖。本創作係有關一種一體化多層式照明裝置,本創作一體化多層式照明裝置可根據不同的使用目的及使用場所,而進行倍數組合之一體化多層式照明裝置,以提升照明範圍及照明強度。Referring to the first figure, a schematic diagram of the integrated multi-layer lighting device of the multiple combination of the present invention, referring to the second figure, is a cross-sectional view of the integrated multi-layer lighting device of the multiple combination of the present invention. This creation is about an integrated multi-layer lighting device. The integrated multi-layer lighting device can be integrated into multiple layers of lighting devices according to different purposes and places of use to enhance the illumination range and illumination intensity.

本創作之一體化多層式照明裝置主要包含有散熱基座1及兩導線桿3。The integrated multi-layer lighting device of the present invention mainly comprises a heat dissipation base 1 and two wire rods 3.

散熱基座1係包含有第一正面11及第二正面13,第二正面13位於散熱基座1之第一正面11的相反面,第一正面11上開設置有至少一個以上之槽室111,請參閱第一圖的實施例,也可開設出為兩兩相對的四個槽室111,而第二正面13上係形成有散熱鰭片131,散熱鰭片131彼此之間相距有一間隔。The heat dissipation base 1 includes a first front surface 11 and a second front surface 13. The second front surface 13 is located on the opposite side of the first front surface 11 of the heat dissipation base 1. The first front surface 11 is provided with at least one or more chambers 111. Referring to the embodiment of the first figure, four slot chambers 111 opposite to each other may be opened, and the second front surface 13 is formed with heat dissipation fins 131, and the heat dissipation fins 131 are spaced apart from each other.

要注意的是,上述槽室111的數目與配置方式,以及散熱基座1的形狀視實際需要而定,在此僅是說明用的實例而已,並非用以限制本創作的範圍,也可使用長型的散熱基座1,令槽室111呈直線狀的間隔排列方式,如第三圖所示。It should be noted that the number and arrangement of the above-mentioned chambers 111 and the shape of the heat-dissipating base 1 are determined according to actual needs, and are merely illustrative examples, and are not intended to limit the scope of the present invention. The long heat-dissipating susceptor 1 is arranged such that the groove chambers 111 are arranged in a linear manner as shown in the third figure.

參閱第一圖及第二圖,散熱基座1的槽室111具有底面1111及內環壁面1113,底面1111上設置有個發光元件5,發光元件5彼此之間須相互打線接合,槽室111的底面1111及第二正面13之間貫設有兩孔道15。其中發光元件5排列成陣列狀,發光元件5可以是發光二極體(Lighting Emitting Devices,LED)或其他具發光功能之元件。Referring to the first and second figures, the chamber 111 of the heat dissipation base 1 has a bottom surface 1111 and an inner ring wall surface 1113. The bottom surface 1111 is provided with a light-emitting element 5, and the light-emitting elements 5 are required to be wire-bonded to each other. Two holes 15 are disposed between the bottom surface 1111 and the second front surface 13. The light-emitting elements 5 are arranged in an array, and the light-emitting elements 5 may be Light Emitting Devices (LEDs) or other components having a light-emitting function.

內環壁面1113為具有斜度之斜面,因此發光元件5所發出的光線可經由內環壁面1113而反射出槽室111之外,其中內環壁面1113上還可設置有反射罩(圖面未顯示),更有助於發 光元件5的光線反射率,提升發光元件5的發光亮度及出光均勻度。The inner ring wall surface 1113 is a slope having a slope, so that the light emitted by the light-emitting element 5 can be reflected out of the groove chamber 111 via the inner ring wall surface 1113. The inner ring wall surface 1113 can also be provided with a reflection cover (the surface is not provided). Display), more helpful to send The light reflectance of the light element 5 enhances the light-emitting luminance and the light-emitting uniformity of the light-emitting element 5.

參閱第二圖,兩導線桿3以打線接合與發光元件5構成電性連接,其中兩導線架3係分別穿設於兩孔道15之中,兩孔道15之較靠近於槽室111一側的孔道以封合材料6予以封合,兩孔道15之較遠離於槽室111一側的孔道15則以塞體4予以封合,封合材料6及塞體4除具有隔絕水氣及微塵侵入作用外,同時可將兩導線架3固定,該封合材料6可以是具有高接合性及高耐溫性的矽膠或環氧樹脂,較佳的該矽膠為非具透光性的矽膠,如此發光元件5所射出的光線入射於矽膠時,非具透光性的矽還可將發光元件5發出過來的光線反射出槽室111外,有助於光線取出率。Referring to the second figure, the two wire rods 3 are electrically connected to the light-emitting elements 5 by wire bonding. The two lead frames 3 are respectively disposed in the two holes 15, and the two holes 15 are closer to the side of the groove 111. The pores are sealed by the sealing material 6. The pores 15 of the two pores 15 which are farther away from the side of the chamber 111 are sealed by the plug body 4. The sealing material 6 and the plug body 4 are separated from moisture and dust. In addition, the two lead frames 3 can be fixed at the same time. The sealing material 6 can be a silicone rubber or an epoxy resin having high bonding property and high temperature resistance. Preferably, the silicone rubber is a non-transparent silicone rubber. When the light emitted from the light-emitting element 5 is incident on the silicone, the non-transparent light can also reflect the light emitted from the light-emitting element 5 out of the chamber 111, contributing to the light extraction rate.

且兩孔道15內的空間中還可填注有導熱性能優異的塑質化合物7,塑質化合物7可將兩導線架3包埋於內,並快速將熱能傳導至散熱基座1。Moreover, the space in the two channels 15 can be filled with a plastic compound 7 excellent in thermal conductivity, and the plastic compound 7 can embed the two lead frames 3 and rapidly transfer thermal energy to the heat dissipation base 1.

散熱基座1上可設置有無線傳輸單元10及電力供應單元20,其中無線傳輸單元10可以是標準IEEE 802.11無線傳輸模組及藍芽傳輸模組之至少其中之一。The heat dissipation base 1 may be provided with a wireless transmission unit 10 and a power supply unit 20, wherein the wireless transmission unit 10 may be at least one of a standard IEEE 802.11 wireless transmission module and a Bluetooth transmission module.

參閱第四圖,本創作之可倍數組合之一體化多層式照明裝置之第一實施例示意圖。承上所述,本創作可進一步包含有光學罩8及擴光罩9,光學罩8係位於發光元件5之上,且光學罩8與槽室111相接合,以使槽室111內成為密閉空間,防止水氣及異物進入,而擴光罩9位於散熱基座1之上方,並與散熱基座1相接合,光學罩8及擴光罩9用以擴散發光元件5的光線,藉以提出投射光線的均勻度。Referring to the fourth figure, a schematic diagram of a first embodiment of the integrated multi-layer lighting device of the multiple combination of the present invention is shown. As described above, the present invention may further include an optical cover 8 and a diffuser 9 disposed on the light-emitting element 5, and the optical cover 8 is engaged with the chamber 111 to seal the inside of the chamber 111. The space prevents moisture and foreign matter from entering, and the diffuser 9 is located above the heat dissipation base 1 and is engaged with the heat dissipation base 1. The optical cover 8 and the diffuser 9 are used to diffuse the light of the light-emitting element 5, thereby The uniformity of the projected light.

參閱第五圖,本創作之可倍數組合之一體化多層式照明裝置之使用示意圖。散熱基座1可裝設於牆面200上,且散熱基座1與牆面200之間裝設有隔熱塊300,透過隔熱塊300的設置,使散熱基座1與牆面200之間產生可供空氣流通的空間,因此散熱基座1的熱能可馬上散逸至上述之可供空氣流通的 空間,並透過空氣的自然對流作用,迅速將散熱基座1的熱能導散出去。Referring to the fifth figure, a schematic diagram of the use of the integrated multi-layer lighting device of the multiple combination of the present invention. The heat dissipation base 1 and the wall surface 200 are disposed between the heat dissipation base 1 and the wall surface 200, and the heat insulation block 300 is disposed through the heat insulation block 300. The space for air circulation is generated, so that the heat energy of the heat dissipation base 1 can be immediately dissipated to the above-mentioned air circulation. The space, and through the natural convection of the air, quickly dissipates the heat energy of the heat sink base 1.

本創作可使用複數個散熱基座1,其中為該等散熱基座1之任兩相鄰之散熱基座1可透過裝設連接件100而組合成不同型態的照明裝置,參閱第六圖。其中散熱基座1的結構及與發光元件5、導線桿3的組裝關係請參閱前文所述,在此不予贅述。The present invention can use a plurality of heat dissipation pedestals 1 , wherein any two adjacent heat dissipation pedestals 1 of the heat dissipation pedestals 1 can be combined into different types of illuminating devices by installing the connecting members 100, see the sixth figure. . For the structure of the heat dissipation base 1 and the assembly relationship between the light-emitting element 5 and the wire rod 3, please refer to the foregoing, and no further details are provided herein.

請參閱第六圖,本創作之可倍數組合之一體化多層式照明裝置之第二實施例示意圖。其中可使用兩個散熱基座1,兩散熱基座1係為相對應的配置,並透過兩連接件100連結該兩散熱基座1之兩相對側,其中連接件100包含有連接柄100a及兩螺絲100b,兩個散熱基座1的連結方式為,將連接柄100a的兩端分別置於兩個散熱基座1的相同側,再分別藉由兩螺絲100b穿過連接柄100a兩端鎖入於散熱基座1中即可完成。Please refer to the sixth figure, a schematic diagram of a second embodiment of the integrated multi-layer lighting device of the multiple combination of the present invention. Two heat-dissipating pedestals 1 are used, and the two heat-dissipating pedestals 1 are correspondingly arranged, and the two opposite sides of the two heat-dissipating susceptors 1 are connected through the two connecting members 100, wherein the connecting member 100 includes a connecting handle 100a and The two screws 100b and the two heat dissipation bases 1 are connected in such a manner that the two ends of the connection handle 100a are respectively placed on the same side of the two heat dissipation bases 1, and are respectively locked by the two screws 100b through the two ends of the connection handle 100a. It can be completed by entering the heat sink base 1.

在本實施例中的兩連接件100係分別固定於兩散熱基座1的上下側,其中兩散熱基座1之第二正面13係面向彼此,也就是讓兩散熱基座1的散熱鰭片131相互對應,因此設有發光元件5的槽室111皆須面向外側而設置,因此透過對兩個散熱基座1作如此的配置組裝,可使組裝後的照明裝置具有兩道從不同方向投射的照明光束,使照明裝置的可照射範圍擴大。The two connecting members 100 in the embodiment are respectively fixed on the upper and lower sides of the two heat dissipation bases 1, wherein the second front faces 13 of the two heat dissipation bases 1 face each other, that is, the heat dissipation fins of the two heat dissipation bases 1 The 131s correspond to each other, and therefore the groove chambers 111 provided with the light-emitting elements 5 are all disposed facing outwards. Therefore, by arranging the two heat-dissipating bases 1 in such a configuration, the assembled lighting device can be projected from two different directions. The illumination beam expands the illuminable range of the illumination device.

再者,位於第二正面13的散熱鰭片131及位於第一正面11的發光元件5之間的厚度非常薄,因此發光元件5所產生的熱能馬上即可直接傳導至另一側的散熱鰭片131,而對流於散熱鰭片131之間的空氣又可把熱能帶走,因此熱能無法蓄積,因此發光元件5能恆於適當工作溫度下,而保持最佳發光效能。Furthermore, the thickness between the heat dissipation fins 131 on the second front surface 13 and the light-emitting elements 5 on the first front surface 11 is very thin, so that the heat generated by the light-emitting elements 5 can be directly transmitted to the heat-dissipating fins on the other side. The sheet 131, while the air flowing between the fins 131 can carry away the heat energy, so that the heat energy cannot be accumulated, so that the light-emitting element 5 can maintain the optimum light-emitting efficiency at a constant operating temperature.

參閱第七圖至第九圖,該等散熱基座1可依據實際使用數量,而排列並組裝成三角形、四邊形、多邊形及其他型式的照明裝置,其中散熱基座1之側面可設置成斜切面,因此多個散熱基座1組裝時,位於相鄰的散熱基座1的配置可更為緊密且具有一體性。Referring to the seventh to ninth drawings, the heat dissipation pedestals 1 can be arranged and assembled into triangular, quadrangular, polygonal and other types of illumination devices according to the actual number of uses, wherein the side of the heat dissipation base 1 can be arranged as a chamfered surface. Therefore, when a plurality of heat dissipation bases 1 are assembled, the arrangement of the adjacent heat dissipation bases 1 can be more compact and integrated.

同樣的,具有發光元件5的槽室111皆須面向外側而設置,以第七圖的實施例所示,若照明裝置使用有三個散熱基座1,透過適當的配置組裝,照明裝置會成為具有三個出光方向的三角型式照明裝置,當三個散熱基座1中的發光元件5都發光時,在視覺上三角型式照明裝置會形成360度的照明效果,因此在照射範圍及發光亮度上可倍數提升。Similarly, the chamber 111 having the light-emitting elements 5 must be disposed facing outward. As shown in the embodiment of the seventh embodiment, if the lighting device uses three heat-dissipating pedestals 1 and assembled through appropriate arrangements, the lighting device will have In the triangular illumination device with three light-emitting directions, when the light-emitting elements 5 in the three heat-dissipating susceptors 1 are all illuminated, the visual triangular-shaped illumination device can form a 360-degree illumination effect, so that the illumination range and the illumination brightness can be The multiple is increased.

參閱第十圖,本創作之可倍數組合之一體化多層式照明裝置之第三實施例示意圖。該等散熱基座1可設置於燈體400上,燈體上400可罩蓋擴光罩9,燈體400的底部並設有接頭410,其中燈體400內部具有容置空間(圖面未顯示),容置空間內可配置有無線傳輸單元10及電力供應單元20。在此實施例中係以球泡燈的燈體400舉例說明,但不以此為限,亦即只要具照明功能的燈具的燈體都落在本創作的範圍中。Referring to the tenth figure, a schematic diagram of a third embodiment of the integrated multi-layer lighting device of the multiple combination of the present invention is shown. The heat dissipation base 1 can be disposed on the lamp body 400. The lamp body 400 can cover the diffuser cover 9. The bottom of the lamp body 400 is provided with a joint 410. The lamp body 400 has an accommodation space inside. Displayed, the wireless transmission unit 10 and the power supply unit 20 may be disposed in the accommodation space. In this embodiment, the lamp body 400 of the bulb lamp is exemplified, but not limited thereto, that is, as long as the lamp body of the lamp having the illumination function falls within the scope of the present invention.

如第十圖所示,可使用四個散熱基座1,四個散熱基座1的第一正面11係面向於燈體400的外側,且四個散熱基座1係以兩兩相對做配置,較佳的使四個散熱基座1形成四邊形,因此1當四個散熱基座的發光元件5同時發光時,在視覺上會形成全向性投射的照明效果,因此在照射範圍及發光亮度上可倍數提升。As shown in the tenth figure, four heat dissipation pedestals 1 can be used. The first front surface 11 of the four heat dissipation pedestals 1 face the outer side of the lamp body 400, and the four heat dissipation pedestals 1 are arranged in opposite directions. Preferably, the four heat dissipation pedestals 1 are formed in a quadrangular shape. Therefore, when the illuminating elements 5 of the four heat dissipation pedestals simultaneously emit light, an omnidirectional projection illumination effect is visually formed, and thus the illumination range and the illuminance brightness are formed. Can be multiplied.

本創作的優點在於可根據使用場所及使用目的的不同,而決定照明裝置中散熱基座1的使用數量,甚至組裝方式,且多個散熱基座1組裝上因僅藉由連接件100做組裝固定,實際上連接件100的拆組方便且迅速容易,在製造及維修上非常省時省力,因此本創作的照明裝置可根據不同的應用目的而組裝成適當型態使用,以提供適當的照射範圍及照射強度。The advantage of the present invention is that the number of the heat sink bases 1 in the lighting device can be determined according to the place of use and the purpose of use, and even the assembly method, and the plurality of heat sink bases 1 are assembled by the connector 100 only. Fixing, in fact, the disassembly of the connecting member 100 is convenient and quick and easy, and it is very time-saving and labor-saving in manufacturing and maintenance. Therefore, the lighting device of the present invention can be assembled into an appropriate type according to different application purposes to provide appropriate illumination. Range and intensity of illumination.

以上所述者僅為用以解釋本創作之較佳實施例,並非企圖據以對本創作做任何形式上之限制,是以,凡有在相同之創作精神下所作有關本創作之任何修飾或變更,皆仍應包括在本創作意圖保護之範疇。The above description is only for the purpose of explaining the preferred embodiment of the present invention, and is not intended to impose any form of limitation on the creation, so that any modification or alteration of the creation made in the same creative spirit is provided. , should still be included in the scope of protection of this creative intent.

以上所述者僅為用以解釋本創作之較佳實施例,並非企圖 據以對本創作做任何形式上之限制,是以,凡有在相同之創作精神下所作有關本創作之任何修飾或變更,皆仍應包括在本創作意圖保護之範疇。The above is only a preferred embodiment for explaining the present creation, and is not an attempt. Any form of restriction on the creation of this creation is based on the fact that any modification or alteration of the creation made under the same creative spirit should still be included in the scope of protection of this creation.

1‧‧‧散熱基座1‧‧‧heating base

11‧‧‧第一正面11‧‧‧ first positive

111‧‧‧槽室111‧‧‧Slot room

1111‧‧‧底面1111‧‧‧ bottom

1113‧‧‧內環壁面1113‧‧‧ inner ring wall

13‧‧‧第二正面13‧‧‧Second positive

131‧‧‧散熱鰭片131‧‧‧heat fins

15‧‧‧孔道15‧‧‧ Holes

3‧‧‧導線桿3‧‧‧Wire rod

4‧‧‧塞體4‧‧‧ body

5‧‧‧發光元件5‧‧‧Lighting elements

6‧‧‧封合材料6‧‧‧ Sealing materials

7‧‧‧塑質化合物7‧‧‧Plastic compounds

8‧‧‧光學罩8‧‧‧Optical cover

9‧‧‧擴光罩9‧‧‧Expanding hood

10‧‧‧無線傳輸單元10‧‧‧Wireless transmission unit

20‧‧‧電力供應單元20‧‧‧Power supply unit

100‧‧‧連接件100‧‧‧Connecting parts

100a‧‧‧連接柄100a‧‧‧Connection handle

100b‧‧‧螺絲100b‧‧‧screw

200‧‧‧牆面200‧‧‧ wall

300‧‧‧隔熱塊300‧‧‧insulation block

400‧‧‧燈體400‧‧‧light body

410‧‧‧接頭410‧‧‧Connector

第一圖為本創作之可倍數組合之一體化多層式照明裝置之立體示意圖。The first figure is a three-dimensional schematic diagram of the integrated multi-layer lighting device of the multiple combinations of the creation.

第二圖為本創作之可倍數組合之一體化多層式照明裝置之剖面示意圖。The second figure is a schematic cross-sectional view of the integrated multi-layer lighting device of the multiple combinations of the creation.

第三圖為本創作之散熱基座之一實施例示意圖。The third figure is a schematic diagram of one embodiment of the heat sink of the present invention.

第四圖為本創作之可倍數組合之一體化多層式照明裝置之第一實施例示意圖。The fourth figure is a schematic diagram of the first embodiment of the integrated multi-layer lighting device of the multiple combinations of the creation.

第五圖為本創作之可倍數組合之一體化多層式照明裝置之使用示意圖。The fifth picture is a schematic diagram of the use of the integrated multi-layer lighting device of the multiple combination of the creation.

第六圖為本創作之可倍數組合之一體化多層式照明裝置之第二實施例示意圖。The sixth figure is a schematic diagram of a second embodiment of the integrated multi-layer lighting device of the multiple combination of the creation.

第七圖為本創作之可倍數組合之一體化多層式照明裝置之一組合型態之示意圖。The seventh figure is a schematic diagram of one combination type of the integrated multi-layer lighting device of the multiple combination of the creation.

第八圖為本創作之可倍數組合之一體化多層式照明裝置之另一組合型態之示意圖。The eighth figure is a schematic diagram of another combination of the integrated multi-layer lighting devices of the multiple combinations of the creation.

第九圖為本創作之可倍數組合之一體化多層式照明裝置之又一組合型態之示意圖。The ninth figure is a schematic diagram of another combined type of the integrated multi-layer lighting device of the multiple combinations of the creation.

第十圖為本創作之可倍數組合之一體化多層式照明裝置之第三實施例示意圖。The tenth figure is a schematic diagram of a third embodiment of the integrated multi-layer lighting device of the multiple combination of the creation.

1‧‧‧散熱基座1‧‧‧heating base

3‧‧‧導線架3‧‧‧ lead frame

11‧‧‧第一正面11‧‧‧ first positive

111‧‧‧槽室111‧‧‧Slot room

1111‧‧‧底面1111‧‧‧ bottom

1113‧‧‧內環壁面1113‧‧‧ inner ring wall

13‧‧‧第二正面13‧‧‧Second positive

131‧‧‧散熱鰭片131‧‧‧heat fins

5‧‧‧發光元件5‧‧‧Lighting elements

10‧‧‧無線傳輸單元10‧‧‧Wireless transmission unit

20‧‧‧電力供應單元20‧‧‧Power supply unit

Claims (14)

一種一體化多層式照明裝置,係包含有:一散熱基座,係包含有一第一正面及一第二正面,該第一正面上開設出至少一個以上之槽室,而該第二正面上係形成有複數個散熱鰭片,其中一槽室具有一底面及一內環壁面,該底面上設置有複數個發光元件,該等發光元件彼此之間相互打線接合,該槽室的該底面及該第二正面之間貫設有兩孔道;以及兩導線桿,係以打線接合與該等發光元件構成電性連接,其中該兩導線架係分別穿設於該兩孔道之中,該兩孔道之靠近於該槽室一端係以一封合材料而封閉,而該兩孔道之遠離於該槽室一端係以一塞體封合固定,且該兩孔道內的空間中係填注有一塑質化合物。An integrated multi-layer illumination device includes: a heat dissipation base comprising a first front surface and a second front surface, wherein the first front surface defines at least one or more groove chambers, and the second front surface is Forming a plurality of heat dissipating fins, wherein a groove chamber has a bottom surface and an inner ring wall surface, the bottom surface is provided with a plurality of light emitting elements, the light emitting elements are mutually wire-bonded to each other, the bottom surface of the groove chamber and the bottom surface Two holes are disposed between the second front surface; and the two wire rods are electrically connected to the light-emitting elements by wire bonding, wherein the two lead frames are respectively disposed in the two holes, and the two holes are respectively One end of the chamber is closed with a composite material, and one end of the two channels is sealed and fixed by a plug body away from the end of the chamber, and a space in the two channels is filled with a plastic compound. . 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中該內環壁面為具有斜度之一斜面。The integrated multi-layer illuminating device according to claim 1, wherein the inner ring wall surface has a slope of one of the slopes. 依據申請專利範圍第2項所述之一體化多層式照明裝置,其中進一步包含有一反射罩,該反射罩設於該內環壁面之上。The integrated multi-layer illuminating device of claim 2, further comprising a reflector disposed over the inner ring wall. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中該封合材料可以是一矽膠及一環氧樹脂之至少其中之一。The integrated multi-layer illuminating device of claim 1, wherein the sealing material is at least one of a silicone and an epoxy resin. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中該散熱基座上可設置有一無線傳輸單元及一電力供應單元。The integrated multi-layer lighting device of claim 1, wherein the heat dissipation base is provided with a wireless transmission unit and a power supply unit. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中無線傳輸單元係為一標準IEEE 802.11無線傳輸模組及一藍芽傳輸模組之至少其中之一。The integrated multi-layer lighting device according to claim 1, wherein the wireless transmission unit is at least one of a standard IEEE 802.11 wireless transmission module and a Bluetooth transmission module. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中該等發光元件排列成陣列狀。The integrated multi-layer illuminating device according to claim 1, wherein the illuminating elements are arranged in an array. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中該等發光元件可以是一發光二極體。The integrated multi-layer illumination device of claim 1, wherein the light-emitting elements are a light-emitting diode. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中可進一步包含有一光學罩及一擴光罩,該光學罩係位於該發光元 件之上並與該槽室相接合,以使該槽室成為密閉空間,該擴光罩係位於該散熱基座之上方並與該散熱基座相接合。The integrated multi-layer illuminating device of claim 1, further comprising an optical cover and a diffuser, the optical cover being located at the illuminating element The chamber is coupled to the chamber so that the chamber becomes a closed space, and the diffuser is positioned above the heat sink base and engages the heat sink base. 依據申請專利範圍第1項所述之一體化多層式照明裝置,其中該散熱基座可固定於一牆面上,其中該散熱基座及該牆面之間設置有至少一隔熱塊。The integrated multi-layer illuminating device of claim 1, wherein the heat dissipation base is fixed to a wall surface, wherein at least one heat insulating block is disposed between the heat dissipation base and the wall surface. 一種可倍數組合之一體化多層式照明裝置,係包含有:複數個散熱基座,其中為該等散熱基座之任兩相鄰之散熱基座可透過複數個連接件而連結固定,其中一散熱基座係包含有一第一正面及一第二正面,該第一正面上開設出至少一個以上之槽室,而該第二正面上係形成有複數個散熱鰭片,其中一槽室具有一底面及一內環壁面,該底面上設置有複數個發光元件,該等發光元件彼此之間相互打線接合,該槽室的該底面及該第二正面之間貫設有兩通道;以及兩導線桿,係以打線接合與該等發光元件構成電性連接,其中該兩導線架係分別穿設於該兩孔道之中,該兩孔道之兩端係以一封合材料而封閉,且該兩孔道內的空間中係填注有一耐熱塑質化合物。An integrated multi-layer lighting device capable of multiple combinations, comprising: a plurality of heat dissipation bases, wherein any two adjacent heat dissipation bases of the heat dissipation bases are connected and fixed through a plurality of connecting members, one of which The heat dissipation base includes a first front surface and a second front surface. The first front surface defines at least one or more groove chambers, and the second front surface is formed with a plurality of heat dissipation fins, wherein one of the groove chambers has a a bottom surface and an inner ring wall surface, wherein the bottom surface is provided with a plurality of light-emitting elements, the light-emitting elements are mutually wire-bonded to each other, and two channels are disposed between the bottom surface of the groove chamber and the second front surface; and two wires The rods are electrically connected to the light-emitting elements by wire bonding, wherein the two lead frames are respectively disposed in the two holes, and the two ends of the two holes are closed by a joint material, and the two The space in the tunnel is filled with a heat-resistant plastic compound. 依據申請專利範圍第11項所述之可倍數組合之一體化多層式照明裝置,其中可使用兩散熱基座,該兩散熱基座為相對應的配置,並透過兩連接件連結該兩散熱基座之兩相對側,其中該兩散熱基座之該第二正面係面向彼此。An integrated multi-layer illuminating device according to the multiple-combination combination described in claim 11 , wherein two heat-dissipating pedestals are used, and the two heat-dissipating pedestals are correspondingly arranged, and the two heat-dissipating bases are connected through two connecting members Two opposite sides of the seat, wherein the second front faces of the two heat dissipation bases face each other. 依據申請專利範圍第11項所述之可倍數組合之一體化多層式照明裝置,其中該連接件包含有一連接柄及兩螺絲,該兩螺絲穿過該兩連接炳的兩端而鎖固於該兩散熱基座。The integrated multi-layer illuminating device according to the multiple combination of claim 11 , wherein the connecting member comprises a connecting handle and two screws, and the two screws are locked at the two ends of the connecting Two cooling bases. 依據申請專利範圍第11項所述之可倍數組合之一體化多層式照明裝置,其中該等散熱基座可排列組合成三角形、四邊形及多邊形的至少之一的型式,其中該等散熱基座之側面可設置成一斜切面。The integrated multi-layer illuminating device according to claim 11, wherein the heat dissipation pedestals are arranged in a combination of at least one of a triangle, a quadrangle and a polygon, wherein the heat dissipation pedestals The side can be arranged as a chamfered surface.
TW101212374U 2012-06-27 2012-06-27 Integrated multi-layer lighting device and multiple combinated integrated multi-layer illumination device TWM445114U (en)

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