TWM437839U - Container for storage of semiconductor device - Google Patents
Container for storage of semiconductor device Download PDFInfo
- Publication number
- TWM437839U TWM437839U TW101205229U TW101205229U TWM437839U TW M437839 U TWM437839 U TW M437839U TW 101205229 U TW101205229 U TW 101205229U TW 101205229 U TW101205229 U TW 101205229U TW M437839 U TWM437839 U TW M437839U
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- Prior art keywords
- container
- driving
- locking
- storing
- disposed
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 238000003860 storage Methods 0.000 title description 3
- 238000005096 rolling process Methods 0.000 claims abstract description 47
- 238000007789 sealing Methods 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 239000000356 contaminant Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 description 10
- 238000011109 contamination Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
M437839 五、新型說明： 【新型所屬之技術領域】 [0001] 本新型係有關於一種容器，特別是指一種用於存放 半導體元件之容器。 【先前技術】 [0002] 現代的先進晶圓代工廠或半導體製造廠，在晶圓製 造技術上不斷地突破，現已達到90奈米以下的製程，隨 著製程線寬的的縮小與元件積集度的提高，單位晶圓内 可製造的元件數目增加。但是這些高積集度的半導體元 件對於污染物的容忍度下降，即便是極微量的污染物（微 粒、粉塵、有機物、氣體或揮發物等）都會導致半導體元 件的缺陷，甚至使半導體元件受靜電千擾而短路，造成 損失。 在一般的半導體製程中，都提供無塵室）的環境以避 免空氣中的微粒污染。而半導體元件運送的過程也必須 避免污染，因此需要一個一個提供保護的容器，避免污 染半導體元件的承載裝置。 為了有效降低半導體元件在運送或儲存時可能會造 成的傷害，目前有許多技術針對容器中的結構以及用於 容器内之鎖固機構進行改良，希望可以提高對承載半導 體元件的保護。在標準機械界面的作業系統中，機台的 插銷會插入容器内之鎖固機構中的驅動件，用以進行容 器開闔的操作。 而習知用於容器之鎖固機構的各構件間容易產生摩 擦，不但使鎖固機構運作時不穩定，進而使容器無法順 HH20522#單編號 A〇101 第3頁/共29頁 1012017013-0 M437839 暢地進行開闔操作，甚至產生污染顆粒於容器中，進而 汙染存放於容器中之半導體元件。 為了解決上述之問題，本新型提供一種用於存放半 導體元件之容器，容器内之鎖固機構係具有至少一鎖固 件一驅動件，並於鎖固件上嵌設一滾動件，如此減少鎖 固件與驅動件接觸之面積，可減少鎖固件與驅動件產生 摩擦，避免於容器中產生污染顆粒而使存放於容器内之 半導體元件遭受汙染，進而使容器内達到高潔度。M437839 V. New description: [New technical field] [0001] The present invention relates to a container, and more particularly to a container for storing a semiconductor component. [Prior Art] [0002] Modern advanced foundry or semiconductor manufacturing plants have continuously made breakthroughs in wafer fabrication technology, and have now reached the process of 90 nm or less, with the reduction of process line width and component product. As the concentration increases, the number of components that can be fabricated in a unit wafer increases. However, the tolerance of these highly integrated semiconductor components to contaminants is reduced, even a very small amount of contaminants (fine particles, dust, organic matter, gases or volatiles) can cause defects in semiconductor components, and even cause semiconductor components to be electrostatically charged. Sudden and short circuit, causing losses. In a typical semiconductor process, a clean room environment is provided to avoid particulate contamination in the air. The process of transporting the semiconductor components must also avoid contamination, and therefore a container for protection is required to avoid the carrier of the semiconductor component. In order to effectively reduce the damage that semiconductor components may cause during transportation or storage, many techniques are currently being developed for the structure in the container and the locking mechanism for the container, and it is desirable to improve the protection of the load-bearing semiconductor component. In a standard mechanical interface operating system, the machine's pins are inserted into the drive members in the locking mechanism in the container for container opening operations. However, it is known that friction between the components of the locking mechanism for the container is easy to occur, which not only makes the locking mechanism unstable during operation, but also makes the container unobstructed. HH20522#单号A〇101 Page 3 / 29 pages 1012017013-0 M437839 smoothly performs the opening operation and even produces contaminating particles in the container, thereby contaminating the semiconductor components stored in the container. In order to solve the above problems, the present invention provides a container for storing a semiconductor component. The locking mechanism in the container has at least one fastener-driving member, and a rolling member is embedded in the locking member, thereby reducing the locking function and the like. The contact area of the driving member can reduce friction between the locking member and the driving member, avoiding contamination particles in the container and contaminating the semiconductor components stored in the container, thereby achieving high purity in the container.
【新型内容】 [0003] 本新型之目的，在於提供一種用於存放半導體元件[New content] [0003] The purpose of the present invention is to provide a semiconductor component for storage
之容器，其包含一鎖固機構，鎖固機構具有至少一鎖固 件及一驅動件，鎖固件嵌設一滾動件，滾動件與驅動件 接觸，如此減少鎖固件與驅動件接觸之面積，可減少鎖 固件與驅動件產生摩擦，避免於容器中產生污染顆粒而 使存放於容器内之半導體元件遭受汙染，進而使容器内 達到高潔度。另滾動件隨者驅動件轉動而滾動，有效減 少與驅動件間之摩擦力，使鎖固機構可順暢地運作，進 而使容器可順暢地進行開闔操作。 本新型提供一種用於存放半導體元件之容器，係包 含：一承載本體，其側壁具有至少一穿孔，其係包含； 至少一鎖固件，其設置於該承載本體内，該鎖固件包含 一鎖固本體、至少一固定部、一驅動部及一滚動件，該 固定部設置於該鎖固本體之一側，且對應該鎖固部，該 驅動部設置於該鎖固本體之另一側，該滾動件嵌設於該 驅動部；以及一驅動件，其設置於該承載本體内，並抵 接於該驅動部，且與該鎖固件之該滾動件接觸；以及一 1012017013-0 10120522^^^^ A〇101 ^ 4 1 ^ 29 1 M437839 罩體，罩設於該承載本體之外側，該罩體之側壁具有至 少一鎖固部，該鎖固部對應該穿孔；其中，當該驅動件 旋轉時，該驅動件帶動該鎖固件於該承載本體内位移， 該鎖固件之該固定部穿過該承載本體之該穿孔並設置於 該鎖固部，以固定該罩體於該承載本體。 【實施方式】 [0004] 茲為使對本新型之結構特徵及所達成之功效有更進 一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之 說明，說明如後： 習知用於容器之鎖固機構的各構件間容易產生摩擦 ，不但使鎖固機構運作時不穩定，進而使容器無法順暢 地進行開闔操作，甚至產生污染顆粒於容器中，進而汙 染存放於容器中之半導體元件。有鑒於上述問題，本新 型提供一種用.於存放半導體元件之容器，並可改善上述 問題。 請參閱第一圖、第二圖及第三圖，係本新型之第一 實施例之容器的分解圖及部分分解圖。如圖所示，本實 施例係提供一種用於存放半導體元件之容器1，容器1包 含一罩體10、一承載本體111及一封板112(請參閱第二 圖及第三圖），承載本體111之外側表面承載至少一半導 體元件，罩體10罩設於承載本體111承載半導體元件之外 側表面上。且承載本體111内設有一鎖固機構，封板11 2 抵住鎖固機構，以固定鎖固機構於承載本體111内。罩體 10透過鎖固機構固定於承載本體111上，使容器1完全密 封，進而防止外部之汙染物進入容器1内，以避免存放於 容器1内之至少一半導體元件（例如：光罩、晶圓或其他 1()12()522f單編號A0101 第5頁/共29頁 1012017013-0 M437839 半導體元件）受到汙染。然後，為了增加容器1之密封性 ’更於罩體10與承載本體111間設置一密封件14，更能防 止外部之汗染物進入容器1内，使容器1内部達到高潔度 〇 承載本體111具.有一内表面1111及一側壁111 2，側 壁111 2環繞内表面1111之周緣，並形成一容置空間。而 本實施例之鎖固機構容置於容置空間内，並包含二鎖固 件121及一驅動件122。二鎖固件121相互對稱地設置於 承載本體111之内表面1111上，每一鎖固件121具有一鎖 固本體1211，鎖固本體1211之一側設有二固定部1212， 而承載本體111之側壁1112具有四穿孔111〇，並分別對 應二鎖固件121之四固定部1212，然，罩體1〇之側壁亦 設有四鎖固部102(請參閲第一圖），四鎖固部1〇2對應承 載本體111之四穿孔1110，所以二鎖固件121之四固定部 1212可分別穿過承載本體111之二穿孔mo，並設置於 對應之鎖固部102 ’以鎖固罩體1〇於承載本體U1上。本 實施例之固定部121 2為凸件，對應固定部121 2之鎖固部 102為一凹槽’此僅為本新型之一實施例，固定部1212與 鎖固部102可為其他結構並達到相互卡合即可，於此不再 贅述。 請一併參閱第四圖，係本新型之第一實施例之驅動 件的立體圖。如圖所示，驅動件122設置於承載本體111 之内表面1111上，並位於二鎖固件121之間。承載本體 111之内表面1111具有一柩接部1113(請參閱第三圖）， 驅動件122具有一驅動本體1221，驅動本體1221具有一 第一表面12211及一第二表面12212，驅動本體1221之第 10120522^^^^ A〇101 第6頁/共29頁 1012017013-0 M437839 一表面12211上設有—旋轉細1222(請參閲第 轉轴1 222㈣純接部⑴3(請參閱第三圖） 122轉動於㈣本體111上。❹卜，承載本體⑴更設有 -軸承1114 ’並設置於樞接邹1113，㈣㈣22柜接於 轴承1114 ’以與枢接部1113樞接，轴承1114係可減少框 接部1113與旋轉軸1222間之摩擦，使驅動件122可順暢 地旋轉於承載本體111上。 再一併參閱第五圖，係本新型之第一實施例之鎖固 件與驅動件的立體圖。如圖所示，驅動件122具有二導引The container comprises a locking mechanism, the locking mechanism has at least one locking member and a driving member, the locking member is embedded with a rolling member, and the rolling member is in contact with the driving member, thereby reducing the contact area between the locking member and the driving member, The friction between the lock and the driving member is reduced, and the contamination of the container is prevented to cause contamination of the semiconductor component stored in the container, thereby achieving high purity in the container. The rolling member is rotated by the driving member to effectively reduce the friction between the driving member and the driving member, so that the locking mechanism can smoothly operate, so that the container can be smoothly opened. The present invention provides a container for storing a semiconductor component, comprising: a carrier body having a sidewall having at least one through hole, the system comprising: at least one fastener disposed in the carrier body, the fastener comprising a lock a body, at least one fixing portion, a driving portion and a rolling member, the fixing portion is disposed on one side of the locking body, and corresponding to the locking portion, the driving portion is disposed on the other side of the locking body The rolling member is embedded in the driving portion; and a driving member is disposed in the carrying body and abuts the driving portion and is in contact with the rolling member of the locking member; and a 1012017013-0 10120522^^ ^^ A〇101 ^ 4 1 ^ 29 1 M437839 The cover body is disposed on the outer side of the carrying body, the side wall of the cover body has at least one locking portion, and the locking portion corresponds to the perforation; wherein, the driving member The rotating member drives the locking member to be displaced in the carrying body. The fixing portion of the locking member passes through the through hole of the carrying body and is disposed on the locking portion to fix the cover body to the carrying body. [Embodiment] [0004] For a better understanding and understanding of the structural features and the effects of the present invention, the preferred embodiments and the detailed description are described as follows: The friction between the components of the locking mechanism is easy to generate, which not only makes the locking mechanism unstable during operation, but also prevents the container from smoothly opening and even polluting particles in the container, thereby contaminating the semiconductor component stored in the container. . In view of the above problems, the new type provides a container for storing semiconductor components and can improve the above problems. Referring to the first, second and third figures, there is shown an exploded view and a partially exploded view of the container of the first embodiment of the present invention. As shown in the figure, the present embodiment provides a container 1 for storing a semiconductor component. The container 1 includes a cover 10, a carrier body 111, and a board 112 (refer to the second and third figures). The outer surface of the body 111 carries at least one semiconductor component, and the cover 10 is disposed on the outer surface of the carrier body 111 carrying the semiconductor component. A locking mechanism is disposed in the carrying body 111, and the sealing plate 11 2 is pressed against the locking mechanism to fix the locking mechanism in the carrying body 111. The cover body 10 is fixed to the carrier body 111 through the locking mechanism, so that the container 1 is completely sealed, thereby preventing external contaminants from entering the container 1 to avoid at least one semiconductor component stored in the container 1 (for example, a mask, a crystal Circle or other 1 () 12 () 522f single number A0101 page 5 / 29 pages 1012017013-0 M437839 semiconductor components) are contaminated. Then, in order to increase the sealing property of the container 1 , a sealing member 14 is disposed between the cover body 10 and the carrying body 111 to prevent the external sweat from entering the container 1 and the interior of the container 1 to achieve a high degree of purity. There is an inner surface 1111 and a side wall 111 2 , and the side wall 111 2 surrounds the periphery of the inner surface 1111 and forms an accommodating space. The locking mechanism of the embodiment is accommodated in the accommodating space and includes two locking members 121 and a driving member 122. The two locking members 121 are symmetrically disposed on the inner surface 1111 of the carrying body 111. Each of the locking members 121 has a locking body 1211. One side of the locking body 1211 is provided with two fixing portions 1212, and the side walls of the supporting body 111 are disposed. The 1112 has four through holes 111 〇 and corresponding to the four fixing portions 1212 of the two locking pieces 121 respectively. However, the side wall of the cover body 1 亦 is also provided with four locking portions 102 (please refer to the first figure), and the four locking portions 1 The 〇2 corresponds to the four through holes 1110 of the carrying body 111. Therefore, the four fixing portions 1212 of the two locking members 121 can respectively pass through the two through holes mo of the carrying body 111 and are disposed on the corresponding locking portions 102 ′ to lock the cover 1 〇 On the carrying body U1. The fixing portion 121 2 of the embodiment is a convex member, and the locking portion 102 corresponding to the fixing portion 121 2 is a groove. This is only one embodiment of the present invention, and the fixing portion 1212 and the locking portion 102 can be other structures. It is sufficient to achieve mutual engagement, and will not be described here. Referring to the fourth figure, a perspective view of the driving member of the first embodiment of the present invention is shown. As shown, the driving member 122 is disposed on the inner surface 1111 of the carrier body 111 and located between the two locking members 121. The inner surface 1111 of the carrier body 111 has a splicing portion 1113 (see the third figure). The driving member 122 has a driving body 1221. The driving body 1221 has a first surface 12211 and a second surface 12212. 10120522^^^^ A〇101 Page 6 of 29 1012017013-0 M437839 One surface 12211 is provided with a rotating fine 1222 (please refer to the first shaft 1 222 (four) pure joint (1) 3 (please refer to the third figure) 122 is rotated on the (four) body 111. The carrier body (1) is further provided with a bearing 1114' and is disposed at the pivoting connection 1113. The (4) (4) 22 cabinet is connected to the bearing 1114' to pivotally connect with the pivoting portion 1113, and the bearing 1114 can be reduced. The friction between the frame portion 1113 and the rotating shaft 1222 allows the driving member 122 to smoothly rotate on the carrier body 111. Referring back to the fifth figure, a perspective view of the fastener and the driving member of the first embodiment of the present invention is shown. As shown, the drive member 122 has two guides.
結構1 223(參閱第二圖），本實施例之二導引結構1223分 別為一凸柱’二導引結構1 223凸設於驅動本體1221之第 一表面12211，並分別從旋轉軸1222向驅動本體1221之 周緣延伸，而每一鎖固件121之鎖固本體1211的另一側更 設有一驅動部1213，二鎖固件121之二驅動部1213分別 位於驅動件122之二導引結構1223之間，二導引結構 1223分別抵接於對應之驅動部1213。The structure 1 223 (see the second figure), the two guiding structures 1223 of the embodiment are respectively a protruding column 'two guiding structures 1 223 protruding from the first surface 12211 of the driving body 1221, and respectively from the rotating shaft 1222 A driving portion 1213 is further disposed on the other side of the locking body 1211 of each of the locking members 121. The two driving portions 1213 of the two locking members 121 are respectively located at the guiding structure 1223 of the driving member 122. The two guiding structures 1223 are respectively abutted on the corresponding driving portions 1213.
一"圖）’旋 ，使驅動件 封板112固鎖於承載本體111下方，並抵住驅動件 122之驅動本體1221的第二表面12212，使驅動件122被 固定於承載本體111之内表面1111與封板112之間’以固 定鎖固機構於承載本體111内。本實施例之驅動件122的 旋轉軸1222非利用鎖固方式固定於承載本體I11上’如此 避免驅動件122之外周緣產生與旋轉軸1222相反之作用力 ，進而避免此作用力讓驅動件122於旋轉時不穩定° 復參閱第三圖，封板112具有二插入孔1丨21 ’本實 施例之二插入扎1121分別呈弧狀，而驅動件122之驅動本 體1221更設有二驅動孔1224，本實施例二驅動孔1224分 101205 單編號A0 101 第7頁/共29頁 1012017013-0 M437839 別貫穿驅動本體122至對應之導引結構1223内，但未貫穿 導引結構1223，所以驅動孔1224即為一盲孔，而封板 112之二插入孔1121對應驅動件122之二驅動孔1224。欲 旋轉驅動件122時，一插銷2從插入孔1121插入，並插入 一驅動孔1224，且於插入孔1121内移動，以帶動驅動件 122旋轉。 當驅動件122旋轉時，驅動件122之二導引結構1223 推動二鎖固件121之二驅動部1213，使二鎖固件121橫向 位移於承載本體111内。當驅動件122作逆時針旋轉時， 二導引結構1223推動二鎖固件121之二驅動部1213，二 鎖固件121分別往承載本體111之兩側移動，使每一鎖固 件121之固定部1212往罩體10之鎖固部1〇2移動，並卡設 於鎖固部102内，以鎖固承載本體111於罩體1〇上。當驅 動件122作順時針旋轉時，二導引結構1223推動二鎖固件 121之二驅動部1213向承載本體111中心移動，使每一鎖 固件121之固定部1212脫離罩體10之鎖固部1〇2，進而使 罩體10與承載本體111分離。 再參閱第三圖，為了使鎖固件121作線性位移，承載 本體111更設有二第一限位件1115，二第一限位件1115 分別位於二鎖固件121之兩側，使二鎖固件121橫向移動 於二第一限位件1115之間，即二第一限位件1115平行於 二鎖固件121之移動方向。然，承載本體ill更設有二第 二限位件1116 ’並位於驅動件122之兩側，而驅動件122 之驅動本體1221的周緣更設有二限位件1225，二限位件 1225分別位於二第二限位件1116之間《«請一併參閱第六 圖，當驅動件122旋轉時，驅動件122之二限位件1225分 10120522^^^^ Α〇101 第8頁/共29頁 1012017013-0 M437839 別活動於二第二限位件1116之間，以限制驅動件122之旋 轉角度。此外，承載本體111之内表面1111更設有二第三 限位件1117，而每一鎖固件121之鎖固本體1211更設有 一定位礼1214，二第三限位件1117分別位於對應之鎖固 件121的定位孔1214内，如此限制二鎖固件121於承載本 體111内之位置。 然，承載本體111内更設有複數支撐件1118，該些 支撐件1118設置於二第一限位件1115之間，並位於二鎖 固件121下方，以支撐二鎖固件121，且使二鎖固件121 ® 遠離承載本體111之内表面1111，減少二鎖固件121與承 ,, 載本體111之内表面1111接觸之面積，進而減少二鎖固件 121於移動時與承載本體111之内表面1111間之摩擦力， 使二鎖固件121可順暢地位移於承載本體111之内表面 1111 上。 復參閱第二至五圖，本實施例之驅動件122更包含二 抵壓部1226，每一抵壓部1226為一凸塊，抵壓部1 226係 從驅動本體1221之第一表面12211凸起，二抵壓部1226 ® 分別位於二導引結構1 223之間。而抵壓部1226具有一導 引面1 22 61，當驅動件122作逆時針旋轉時，每一鎖固件 121具有驅動部121 3之一側抵接於對應之抵壓部1226的 導引面1 2261，隨著驅動件122轉動，導引面12261抵接 於驅動部1213之表面，並沿著驅動部1213之表面前進， 使鎖固件121具有驅動部1213之一側沿著導引面12261降 低，而鎖固件121具有固定部1212之一側抬升，以使固定 部1212卡設於罩體10之鎖固部102，進而使容器1具有良 好的氣密性。而每一鎖固件121之驅動部1213抵接於抵壓 10120522#單編號 A_1 ^ 9 1 / ^ 29 I 1012017013-0 M437839 部1226之一側具有一斜面12111，斜面12111位於驅動部 121 3之一侧。抵壓部1226容易沿著鎖固本體1211之斜面 12111移至驅動部1213之表面上並沿著驅動部121 3之表 面前進（請參閱第五圖）。 驅動件122之驅動本體1221更設有二滾動件1227，A "illustration" is rotated so that the driver member sealing plate 112 is fixed under the carrier body 111 and abuts against the second surface 12212 of the driving body 1221 of the driving member 122, so that the driving member 122 is fixed within the carrier body 111. The surface 1111 and the sealing plate 112 are fixed in the carrier body 111 by a fixing mechanism. The rotating shaft 1222 of the driving member 122 of the embodiment is not fixed to the carrying body I11 by using a locking method. Thus, the outer peripheral edge of the driving member 122 is prevented from generating a force opposite to the rotating shaft 1222, thereby preventing the force from acting on the driving member 122. Unstable at the time of rotation. Referring to the third figure, the sealing plate 112 has two insertion holes 1丨21'. The two insertion wires 1121 of the embodiment are respectively arcuate, and the driving body 1221 of the driving member 122 is further provided with two driving holes. 1224, the second driving hole 1224 is divided into 101205 single number A0 101 page 7 / 29 pages 1012017013-0 M437839 does not penetrate the driving body 122 into the corresponding guiding structure 1223, but does not penetrate the guiding structure 1223, so drive The hole 1224 is a blind hole, and the two insertion holes 1121 of the sealing plate 112 correspond to the two driving holes 1224 of the driving member 122. When the driving member 122 is to be rotated, a latch 2 is inserted from the insertion hole 1121, inserted into a driving hole 1224, and moved in the insertion hole 1121 to drive the driving member 122 to rotate. When the driving member 122 rotates, the two guiding structures 1223 of the driving member 122 push the two driving portions 1213 of the two locking members 121 to laterally displace the two locking members 121 in the carrying body 111. When the driving member 122 rotates counterclockwise, the two guiding structures 1223 push the two driving portions 1213 of the two locking members 121, and the two locking members 121 respectively move to the two sides of the carrying body 111, so that the fixing portion 1212 of each locking member 121 The locking portion 1 〇 2 of the cover body 10 is moved and is locked in the locking portion 102 to lock the carrier body 111 on the cover body 1 . When the driving member 122 rotates clockwise, the two guiding structures 1223 push the two driving portions 1213 of the two locking members 121 to move toward the center of the carrying body 111, so that the fixing portion 1212 of each locking member 121 is disengaged from the locking portion of the cover body 10. 1〇2, the cover 10 is separated from the carrier body 111. Referring to the third figure, in order to linearly displace the locking member 121, the carrying body 111 is further provided with two first limiting members 1115, and the two first limiting members 1115 are respectively located at two sides of the two locking members 121, so that the two locking members are respectively 121 is laterally moved between the two first limiting members 1115, that is, the two first limiting members 1115 are parallel to the moving direction of the two locking members 121. The carrier body ill is further provided with two second limiting members 1116' and is located at two sides of the driving member 122. The peripheral edge of the driving body 1221 of the driving member 122 is further provided with two limiting members 1225, and the second limiting members 1225 respectively Between the second and second limiting members 1116 "Please refer to the sixth figure together. When the driving member 122 rotates, the second limiting member of the driving member 122 is 1225 points 10120522^^^^ Α〇101 page 8 / total 29 pages 1012017013-0 M437839 Do not move between the second and second limiting members 1116 to limit the rotation angle of the driving member 122. In addition, the inner surface 1111 of the carrying body 111 is further provided with two third limiting members 1117, and the locking body 1211 of each locking member 121 is further provided with a positioning ceremony 1214, and the second third limiting members 1117 are respectively located at the corresponding locks. The positioning hole 1214 of the firmware 121 limits the position of the two locking members 121 in the carrying body 111. The support body 111 is further provided with a plurality of support members 1118. The support members 1118 are disposed between the two first limiting members 1115 and are located under the two locking members 121 to support the two locking members 121 and the two locks. The firmware 121 ® is away from the inner surface 1111 of the carrier body 111, reducing the area of contact between the two fasteners 121 and the inner surface 1111 of the carrier body 111, thereby reducing the space between the two fasteners 121 and the inner surface 1111 of the carrier body 111 when moving. The frictional force allows the two locking members 121 to be smoothly displaced on the inner surface 1111 of the carrier body 111. Referring to the second to fifth figures, the driving member 122 of the embodiment further includes two pressing portions 1226. Each pressing portion 1226 is a convex portion, and the pressing portion 1 226 is convex from the first surface 12211 of the driving body 1221. The two pressing portions 1226 ® are respectively located between the two guiding structures 1 223 . The pressing portion 1226 has a guiding surface 1 22 61. When the driving member 122 rotates counterclockwise, each of the locking members 121 has a guiding surface on one side of the driving portion 121 3 abutting against the corresponding pressing portion 1226. 1 2261, as the driving member 122 rotates, the guiding surface 12261 abuts against the surface of the driving portion 1213 and advances along the surface of the driving portion 1213, so that the locking member 121 has one side of the driving portion 1213 along the guiding surface 12261. When the lock member 121 has one side of the fixing portion 1212, the fixing portion 1212 is hooked on the locking portion 102 of the cover body 10, thereby making the container 1 have good airtightness. The driving portion 1213 of each of the locking members 121 abuts against the pressing 10120522# single number A_1 ^ 9 1 / ^ 29 I 1012017013-0 M437839 One side of the portion 1226 has a slope 12111, and the inclined surface 12111 is located at one of the driving portions 121 3 side. The pressing portion 1226 easily moves along the slope 12111 of the locking body 1211 onto the surface of the driving portion 1213 and advances along the surface of the driving portion 121 3 (refer to Fig. 5). The driving body 1221 of the driving member 122 is further provided with two rolling members 1227.
二滾動件1227係嵌設於驅動本體1221，並位於抵壓部 1226之下方。當驅動件122旋轉時，二滾動件1227係使 驅動件122不與封板112直接接觸，即減少驅動件122與 封板112接觸之面積，以減少驅動件122與封板112間之 摩擦力，且二滾動件1227隨著驅動件122旋轉而滾動，使 驅動件122可穩定地旋轉，如此減少因驅動件122與封板 112摩擦而產生汙染顆粒之機會，以避免存放於容器1内 之半導體元件2受到汙染的問題產生。本實施例之滾動件 1227為一轴承，亦可為其他元件，於此不再贅述。The two rolling elements 1227 are embedded in the driving body 1221 and are located below the pressing portion 1226. When the driving member 122 rotates, the two rolling members 1227 prevent the driving member 122 from directly contacting the sealing plate 112, that is, reduce the contact area between the driving member 122 and the sealing plate 112, so as to reduce the friction between the driving member 122 and the sealing plate 112. And the two rolling elements 1227 roll as the driving member 122 rotates, so that the driving member 122 can be stably rotated, thereby reducing the chance of contamination particles caused by the friction between the driving member 122 and the sealing plate 112, so as to avoid being stored in the container 1. The problem that the semiconductor element 2 is contaminated arises. The rolling member 1227 of this embodiment is a bearing, and may be other components, and details are not described herein again.
二滾動件1227可使驅動件122作穩定地旋轉，可是 會與封板112產生摩擦，亦有可能地於容器1内產生汙染 顆粒而汙染容器1内之半導體元件2。因此本實施例係於 封板112上貼附用於減少摩擦之一耐磨件1122，此耐磨件 1122位於封板112與二滾動件1227產生摩擦的位置，減 少二滾動件1227與封板112間之摩擦，並能減少二滾動件 1227磨損封板112之機會，更能減少汙染顆粒之產生而避 免汙染容器1内之半導體元件2。 然，復參閱第六圖，承載本體111内更設有二連接部 1119，二連接部1119分別位於對應之鎖固件121之一側 ，而每一鎖固件121之鎖固本體1211更設有一連接部 1215，每一連接部1119透過一彈性元件13連接對應之鎖 10120522^^^^ A〇101 第10頁/共29頁 1012017013-0 M437839 固件121的連接部1215。而承載本體111之二第一限位件 1115分別具有一缺口 11151 ’該些缺口 11151係供對應之 彈性元件13穿過’使彈性元件13之高度小於承載本體U1 之厚度，以讓容器1之封板112可密封承載本體111。於此 限定二鎖固件121鎖固於罩體10之鎖固部1〇2時，二鎖固 件121之位置為原始位置，當二鎖固件121往承載本體 111中心移動時，彈性元件13隨著鎖固件121往承載本體 111中心移動，亦受缺口 111 51之側邊抵擋，以限制鎖固 件121往承載本體111中心移動。彈性元件13因本身材質 具有彈性，當彈性元件13接觸缺口 11151之側邊時，彈性 元件13受缺口 11151抵撞而產生一回復力，此回復力使鎖 固件121回復原始位置，如此，當驅動件122未正常運作 時，彈性元件13可使鎖固件121回復原始位置，即鎖固件 121鎖固於罩體10之鎖固部1〇2，以防止承載本體111與 罩體10脫離。 請一併參閱第七圖，係本新型之第一實施例之彈性 元件的示意圖。如圖所示，彈性元件13具有一第一部131 及與第一部131連接之一第二部132，彈性元件13之第二 部132相對彈性元件13之第一部131向下傾斜。然，彈性 元件13之第一部131的一端設置於承載本體111之連接部 1119，彈性元件13之第二部132的一端設置於鎖固件121 之連接部1215 »而彈性元件13之第二部132相對彈性元 件13之第一部131向下傾斜，以抵壓於鎖固件121之鎖固 本體1211。 當鎖固件121之驅動部121 3受驅動件122之抵壓部 1226抵壓時，使鎖固件121之固定部1212抬升並鎖固於 1012017013-0 10120522^單編號A0101 第11頁/共29頁 M437839 罩體10之鎖固部102 ’而彈性元件13之第二部132相對彈 性元件13之第一部131向下傾斜，以抵壓於鎖固件121之 鎖固本體1211 ’使鎖固件121之固定部1212維持抬升狀 態並鎖固於罩體10之鎖固部1〇2，進而使容器1具有良好 的氣密性。 請參閱第八圖及第九圖，係本新型之第二實施例之 容器的部分分解圖及立體圖。如圖所示，上述實施例中 ’當驅動件122旋轉時，驅動件122與鎖固件121之驅動 部1213的部分表面接觸，使驅動件122之抵壓部1226與 驅動部1213的表面之間產生摩擦。為了減少驅動件122與 驅動部1213之間所產生之摩擦，因此於每一鎖固件121之 驅動部121 3與驅動件122的抵壓部1226產生摩擦之位置 嵌設一滾動件12110，如此驅動件122之抵壓部1226的導 引面12261與位於鎖固件121之驅動部1213的滾動件 12110接觸，以減少驅動部1213與抵壓部1226接觸之面 積，進而減少槳動部1213與抵壓部1226之間所產生之摩 擦，並避免產生汙染顆粒於容器内而汙染存放於容器内 之半導體元件。 當驅動件122旋轉時，驅動件122之抵壓部1226的導 引面12261與位於鎖固件121之驅動部1213的滾動件 12110接觸，驅動件122帶動滾動件12110滾動，滾動件 12110係沿著導引面1 2261滾動並移動，而導引面12261 之末端具有一定位凹槽12262，當滾動件12110沿著導引 面1 2261移動至定位凹槽12262時，定位凹槽12262係阻 擋滾動件12110移動並定位滾動件12110，使鎖固件121 之固定部1212鎖固於罩體之鎖固部。本實施例之滚動件 10120522^^^^ A〇101 第12頁/共29頁 1012017013-0 rM437839 12110可滾動於導引面12261，以減少滾動件12110與導 引面1 2261間之摩擦力，使驅動件丨22可順暢地帶動鎖固 件121位移於承載本體Hi内，並使鎖固機構可順暢地運 作，進而使容器可順暢地進行開闓操作。本實施例之滾 動件12110為一軸承，亦可為其他元件，於此不再贅述。 本實施例之該些滾動件12110亦可用於驅動件122鎖固於 承載本體111之結構，於此不再贅述。 綜上所述，本新型提供一種用於存放半導體元件之 令器’其罩體透過設置於承載本體内之鎖固機構固定於 承載本體，以密封容器並防止外部之汙染物進入容器内 而本新型之鎖固機構係由至少一鎖固件與驅動件搭配 鎖固件與驅動件設置於承載本體，然利用封板抵住驅 動件之方式固定驅動件於承载本體内，而非利用螺絲鎖 固方式固定’如此使驅動件可穩定地旋轉。然驅動件設 有二滾動件’二滾動件減少驅動件與封板接觸之面積， 避免驅動件與封板磨擦而產生汙染顆粒於容器内，以防 止存放於容器内之半導體元件受到汙染；而更於封板與 一;袞動件接觸之位置貼附耐磨件，如此減少二滾動件與 封板摩擦而產生汙染顆粒’更能降低於容器内產生汙染 顆粒之機會。 另外’本新型之鎖固機構的每一鎖固件設有一滾動 牛；袞動件與驅動件接觸，如此減少驅動件與鎖固件接 觸之面積’避免驅動件與鎖固件產生磨擦而產生汙染顆 粒於今器内’以防止存放於容器内之半導體元件受到汙 染’而滾動件係隨著驅動件轉動而滾動，並減少與驅動 件接觸所產生之摩擦力，使驅動件可順暢地帶動鎖固件 10120522#單編號 A0101 第13頁/共29頁 1012017013-0 M437839 位移於承載本體内，以使鎖固機構可順暢地運作，進而 使容器可順暢地進行開闔操作。 【圖式簡單說明】 [0005] 第一圖係為本新型之第一實施例之容器的分解圖； 第二圖係為本新型之第一實施例之容器的部分分解圖； 第三圖係為本新型之第一實施例之容器的另一部分分解 圖；The two rolling members 1227 can stably rotate the driving member 122, but may cause friction with the sealing plate 112, and may also contaminate the inside of the container 1 to contaminate the semiconductor element 2 in the container 1. Therefore, in this embodiment, a wear-resistant member 1122 for reducing friction is attached to the sealing plate 112. The wear-resistant member 1122 is located at a position where the sealing plate 112 and the two rolling members 1227 are rubbed, and the two rolling members 1227 and the sealing plate are reduced. The friction between 112 and the second rolling member 1227 can reduce the chance of wearing the sealing plate 112, and can reduce the generation of contaminating particles to avoid contamination of the semiconductor component 2 in the container 1. The second mounting portion 1119 is further provided with two connecting portions 1119. The two connecting portions 1119 are respectively located on one side of the corresponding locking member 121, and the locking body 1211 of each locking member 121 is further provided with a connection. In the portion 1215, each connecting portion 1119 is connected to a corresponding portion of the lock 12120522^^^^A〇101 page 10/29 page 1012017013-0 M437839 firmware 121 through a resilient member 13. The first limiting members 1115 of the carrying body 111 respectively have a notch 11151. The notches 11151 are for the corresponding elastic members 13 to pass through. The height of the elastic members 13 is smaller than the thickness of the supporting body U1 to allow the container 1 to The sealing plate 112 can seal the carrier body 111. When the two locking pieces 121 are locked to the locking portion 1〇2 of the cover body 10, the position of the two locking pieces 121 is the original position. When the two locking pieces 121 move toward the center of the carrying body 111, the elastic element 13 follows. The locking member 121 moves toward the center of the carrying body 111 and is also resisted by the side of the notch 111 51 to restrict the movement of the locking member 121 toward the center of the carrying body 111. The elastic member 13 has elasticity due to its own material. When the elastic member 13 contacts the side of the notch 11151, the elastic member 13 is abutted by the notch 11151 to generate a restoring force, and the restoring force returns the locking member 121 to the original position, thus, when driving When the member 122 is not operating normally, the elastic member 13 can return the lock member 121 to the original position, that is, the lock member 121 is locked to the locking portion 1〇2 of the cover body 10 to prevent the carrier body 111 from being detached from the cover body 10. Referring to the seventh drawing, a schematic view of the elastic member of the first embodiment of the present invention is shown. As shown, the resilient member 13 has a first portion 131 and a second portion 132 coupled to the first portion 131. The second portion 132 of the resilient member 13 slopes downwardly relative to the first portion 131 of the resilient member 13. One end of the first portion 131 of the elastic member 13 is disposed on the connecting portion 1119 of the carrying body 111, and one end of the second portion 132 of the elastic member 13 is disposed at the connecting portion 1215 of the locking member 121 and the second portion of the elastic member 13. The first portion 131 of the opposing elastic member 13 is inclined downward to abut against the locking body 1211 of the locking member 121. When the driving portion 121 3 of the locking member 121 is pressed by the pressing portion 1226 of the driving member 122, the fixing portion 1212 of the locking member 121 is lifted and locked at 1012017013-0 10120522^Single number A0101 Page 11 of 29 M437839 The locking portion 102' of the cover 10 and the second portion 132 of the elastic member 13 is inclined downward with respect to the first portion 131 of the elastic member 13 to press against the locking body 1211' of the locking member 121 to make the locking member 121 The fixing portion 1212 maintains the raised state and is locked to the locking portion 1〇2 of the cover 10, thereby providing the container 1 with good airtightness. Referring to the eighth and ninth drawings, a partially exploded view and a perspective view of a container according to a second embodiment of the present invention. As shown in the figure, in the above embodiment, when the driving member 122 rotates, the driving member 122 is in contact with a part of the surface of the driving portion 1213 of the locking member 121, between the pressing portion 1226 of the driving member 122 and the surface of the driving portion 1213. Produce friction. In order to reduce the friction generated between the driving member 122 and the driving portion 1213, a rolling member 12110 is embedded in a position where the driving portion 121 3 of each of the locking members 121 and the pressing portion 1226 of the driving member 122 are frictioned. The guiding surface 12261 of the pressing portion 1226 of the member 122 is in contact with the rolling member 12110 of the driving portion 1213 of the locking member 121 to reduce the contact area between the driving portion 1213 and the pressing portion 1226, thereby reducing the padding portion 1213 and the pressing portion. The friction generated between the portions 1226 avoids the generation of contaminating particles in the container and contaminates the semiconductor components stored in the container. When the driving member 122 rotates, the guiding surface 12261 of the pressing portion 1226 of the driving member 122 contacts the rolling member 12110 of the driving portion 1213 of the locking member 121, and the driving member 122 drives the rolling member 12110 to roll, and the rolling member 12110 is along the rolling member 12110. The guiding surface 1 2261 rolls and moves, and the end of the guiding surface 12261 has a positioning groove 12262. When the rolling element 12110 moves along the guiding surface 1 2261 to the positioning groove 12262, the positioning groove 12262 blocks the rolling piece. The 12110 moves and positions the rolling member 12110 to lock the fixing portion 1212 of the locking member 121 to the locking portion of the cover. The rolling element 10120522^^^^ A〇101 of the embodiment 12th page/total 29 pages 1012017013-0 rM437839 12110 can be rolled on the guiding surface 12261 to reduce the friction between the rolling element 12110 and the guiding surface 1 2261 The driving member 22 can smoothly move the locking member 121 into the carrying body Hi, and the locking mechanism can smoothly operate, thereby enabling the container to smoothly perform the opening operation. The rolling element 12110 of this embodiment is a bearing, and may be other components, and details are not described herein. The rolling elements 12110 of the present embodiment can also be used for the structure in which the driving member 122 is locked to the carrying body 111, and details are not described herein. In summary, the present invention provides a device for storing semiconductor components. The cover body is fixed to the carrier body through a locking mechanism disposed in the carrier body to seal the container and prevent external contaminants from entering the container. The new type of locking mechanism is provided with the at least one locking member and the driving member, and the driving member is disposed on the carrying body, and the driving member is fixed in the carrying body by means of the sealing plate against the driving member instead of using the screw locking method. Fixed 'so that the drive member can rotate stably. The driving member is provided with two rolling members' two rolling members to reduce the contact area between the driving member and the sealing plate, so as to prevent the driving member and the sealing plate from rubbing to generate pollution particles in the container, so as to prevent contamination of the semiconductor components stored in the container; Moreover, the wear plate is attached to the sealing plate at a position where the rocking member contacts, so that the friction between the two rolling members and the sealing plate is reduced to generate contaminated particles, which can reduce the chance of generating contaminating particles in the container. In addition, each lock of the locking mechanism of the present invention is provided with a rolling cow; the movable member is in contact with the driving member, so that the contact area between the driving member and the locking member is reduced, so that the friction between the driving member and the locking member is generated to generate pollution particles. 'In order to prevent the semiconductor component stored in the container from being contaminated', the rolling member rolls with the rotation of the driving member, and reduces the friction generated by the contact with the driving member, so that the driving member can smoothly move the locking device 10120522# Single No. A0101 Page 13 of 29 1012017013-0 M437839 Displacement in the carrying body, so that the locking mechanism can operate smoothly, so that the container can be smoothly opened. BRIEF DESCRIPTION OF THE DRAWINGS [0005] The first drawing is an exploded view of the container of the first embodiment of the present invention; the second drawing is a partially exploded view of the container of the first embodiment of the present invention; Another partial exploded view of the container of the first embodiment of the present invention;
第四圖係為本新型之第一實施例之驅動件的立體圖； 第五圖係為本新型之第一實施例之鎖固件與驅動件的立 體圖； 第六圖係為本新型之第一實施例之承載本體的立體圖； 第七圖係為本新型之第一實施例之彈性元件的示意圖； 第八圖係為本新型之第二實施例之容器的部分分解圖； 以及 第九圖係為本新型之第二實施例之鎖固件與驅動件的立 體圖。The fourth drawing is a perspective view of the driving member of the first embodiment of the present invention; the fifth drawing is a perspective view of the locking member and the driving member of the first embodiment of the present invention; and the sixth drawing is the first embodiment of the present invention. FIG. 7 is a perspective view of the elastic member of the first embodiment of the present invention; FIG. 8 is a partially exploded view of the container of the second embodiment of the present invention; A perspective view of the fastener and the drive member of the second embodiment of the present invention.
【主要元件符號說明】 [0006] 1 容器 10 罩體 102 鎖固部 111 承載本體 1110 穿扎 1111 内表面 1112 側壁 1113 樞接部 A0101 第14頁/共29頁 10120522^^^^ 1012017013-0 M437839 1114 軸承 1115 第一限位件 11151 缺口 1116 第二限位件 1117 第三限位件 1118 支撐件 1119 連接部 112 封板 1121 插入孔 鲁 1122 耐磨件 121 鎖固件 1211 鎖固本體 12110 滾動件 12111 斜面 1212 固定部 1213 驅動部 1214 定位孔 籲 1215 連接部 122 驅動件 1221 驅動本體 12211 第一表面 12212 第二表面 1222 旋轉轴 1223 導引結構 1224 驅動孔 1225 限位件 10120522#單編號 A_1 ^ 15 I / * 29 I 1012017013-0 M437839 1226 抵壓部 12261 導引面 12262 定位凹槽 1227 滾動件 13 彈性元件 131 第一部 132 第二部 14 密封件 2 插銷[Main component symbol description] [0006] 1 container 10 cover 102 lock portion 111 carrier body 1110 piercing 1111 inner surface 1112 side wall 1113 pivot portion A0101 page 14 / total 29 page 10120522 ^ ^ ^ ^ 1012017013-0 M437839 1114 bearing 1115 first limiting member 11151 notch 1116 second limiting member 1117 third limiting member 1118 supporting member 1119 connecting portion 112 sealing plate 1121 insertion hole 1122 wear-resistant member 121 locking member 1211 locking body 12110 rolling member 12111 Bevel 1212 fixing portion 1213 driving portion 1214 positioning hole 1215 connecting portion 122 driving member 1221 driving body 12211 first surface 12212 second surface 1222 rotating shaft 1223 guiding structure 1224 driving hole 1225 limiting member 10120522# single number A_1 ^ 15 I / * 29 I 1012017013-0 M437839 1226 Pressing part 12261 Guide surface 12262 Positioning groove 1227 Rolling element 13 Elastic element 131 First part 132 Second part 14 Seal 2 Pin
10120522#單编號 A〇101 第16頁/共29頁 1012017013-010120522#单号 A〇101 Page 16 of 29 1012017013-0
Claims (1)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101205229U TWM437839U (en) | 2012-03-22 | 2012-03-22 | Container for storage of semiconductor device |
| JP2012002760U JP3177145U (en) | 2012-03-22 | 2012-05-10 | Container for semiconductor devices |
| US13/537,661 US20130248400A1 (en) | 2012-03-22 | 2012-06-29 | Container for storing semiconductor device |
| KR2020120006745U KR20130005748U (en) | 2012-03-22 | 2012-07-27 | Container for storing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101205229U TWM437839U (en) | 2012-03-22 | 2012-03-22 | Container for storage of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM437839U true TWM437839U (en) | 2012-09-21 |
Family
ID=47224892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101205229U TWM437839U (en) | 2012-03-22 | 2012-03-22 | Container for storage of semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130248400A1 (en) |
| JP (1) | JP3177145U (en) |
| KR (1) | KR20130005748U (en) |
| TW (1) | TWM437839U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102131473B1 (en) * | 2012-11-28 | 2020-07-07 | 신에츠 폴리머 가부시키가이샤 | Substrate storage container |
| US10153187B2 (en) * | 2014-11-11 | 2018-12-11 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate |
| TWI634615B (en) * | 2016-05-26 | 2018-09-01 | 恩特葛瑞斯股份有限公司 | Latching mechanism for a substrate container |
-
2012
- 2012-03-22 TW TW101205229U patent/TWM437839U/en not_active IP Right Cessation
- 2012-05-10 JP JP2012002760U patent/JP3177145U/en not_active Expired - Lifetime
- 2012-06-29 US US13/537,661 patent/US20130248400A1/en not_active Abandoned
- 2012-07-27 KR KR2020120006745U patent/KR20130005748U/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130005748U (en) | 2013-10-02 |
| US20130248400A1 (en) | 2013-09-26 |
| JP3177145U (en) | 2012-07-19 |
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