M430696 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種分離設備，且特別是有關於一種 將黏貼在一起的多個平板分離的分離設備。 【先前技術】 冑著資訊產業的進步，兼具有顯示功能、觸控功能以 春及立體顯示功能等多重功能的電子產品因具有更高的便利 性而大受歡迎。目前這些多功能的電子產品大都是以外掛 的方式來達成。舉例而言，當電子裝置被要求同時具備顯 不功能以及觸控功能時，可以將觸控面板與顯示面板黏貼 在-起以構成所需的電子裝置。另外，為了保護電子裝置， 面板^卜側往往需要_保護鏡片（eoverlens)。 ^當上述之間具有觸控及顯示功能的電子裝置需要進 行重工(rework)或是解析時，通常需將觸控面板與顯示面 板之間或疋面板與保護鏡片之間的封膠破壞以使觸控面板 與顯不面板分離開來或是使面板與保護鏡片分離開來。在 已知的技術令，會將黏合在_起的多層板材放置於加熱板 上，^板材之間的封膠間接地被加熱。當加熱至一定程度 使封膠炫化時’隨即切割封膠來分離這些板材以獲得獨立 的觸控面板與顯示面板。然而，加熱板無法直接對封膠進 打加熱/因而加熱板的溫度必須足夠高才可以使分離作業 順利進行。此時，觸控面板或顯示面板上的構件將可能因 為加熱板的馬溫而受到損壞。因此，多功能電子襄置的重 3 M430696 工不易，可能造成資源的浪費及成本的增加。 【新型内容】 本創作提供-種分離設備，可以有效率地分離黏合在 -起的多個平板同時不會對平板上的構件造成損壞。 作溫度，且 本創作提出-種分離設備包括―底座以及—加埶式 切割件。敍適於㈣-Μ板，且多層板包括多舒板 =將平板黏貼在-起的至少—賴。加熱式切割件裝設 於底座上。加熱切割件適於被加熱以具有一工 工作溫度實質上不小於膠體的熔點。 在本創作之一實施例中，上述分 接至加熱式切割件’且力，件 雷；綠口工作溫度。在—實施方式中，力口執件包括-熱式t割^源線適於提供電源至加熱式切割件以加熱加 在本創作之一實施例中 高阻抗的金屬。 在本創作之一實施例中 括錄、。 在本創作之一實施例中 括高導熱性材料。 在本創作之一實施例中 熱式切割件。 在本創作之一實施例中 上述加熱式切割件的材質為 上述加熱式切割件的材質包 上述加熱式切割件的材質包 上述加熱知_為線性加 上述加熱式切割件為片狀加 4 M430696 熱式切割件。具體而言，片狀加熱式切割件可以具有多4 孔洞。另外，片狀加熱式切割件選擇性地具有楔形剖=固 在本創作之一實施例中，上述工作溫度實 20(TC 至 300。〇 在本創作之一實施例中，上述分離設備更包括一滑浐 機構’其安裝於該底座上。多層板可以設置於滑移機構上^ 並且滑移機構適於使多層板在底座上平移。 ，M430696 V. New description: [New technical field] This creation is about a separation device, and in particular, a separation device for separating a plurality of plates that are glued together. [Prior Art] With the advancement of the information industry, electronic products with multiple functions such as display function and touch function for spring and stereo display functions are popular because of their higher convenience. At present, these versatile electronic products are mostly achieved by means of external connections. For example, when an electronic device is required to have both a display function and a touch function, the touch panel and the display panel can be attached to form a desired electronic device. In addition, in order to protect the electronic device, the panel side often requires _protective lenses (eoverlens). ^ When the electronic device with touch and display functions between the above needs to be reworked or parsed, it is usually necessary to destroy the seal between the touch panel and the display panel or between the panel and the protective lens. The touch panel is separated from the display panel or separates the panel from the protective lens. In the known technical order, the multi-layer sheets bonded to the sheet are placed on the heating plate, and the sealant between the sheets is indirectly heated. When heated to a certain extent to make the sealant sleek, the sealant is then cut to separate the sheets to obtain a separate touch panel and display panel. However, the heating plate cannot directly heat the sealant/the temperature of the heater plate must be high enough for the separation to proceed smoothly. At this time, the components on the touch panel or display panel may be damaged due to the horse temperature of the heater board. Therefore, the weight of the multi-function electronic device is not easy, which may result in waste of resources and increase in cost. [New content] This creation provides a separation device that can efficiently separate and bond multiple flat plates without causing damage to components on the flat plate. As a temperature, and the creation of this type of separation device includes a "base" and a twisted cutting piece. It is suitable for (4) - seesaw, and the multi-layer board includes multi-slip board = stick the flat on at least -. The heated cutting member is mounted on the base. The heated cutting member is adapted to be heated to have a working temperature substantially no less than the melting point of the colloid. In one embodiment of the present invention, the above is divided into a heated cutting member' and a force, a piece of lightning; a green port operating temperature. In an embodiment, the force port includes a -thermal t-cut source wire adapted to provide a power source to the heated cutting member to heat the metal that is added to the high impedance in one embodiment of the present invention. In one embodiment of the present creation, it is included. In one embodiment of the present invention, a highly thermally conductive material is included. In one embodiment of the present invention, a thermal cutting member. In one embodiment of the present invention, the material of the heating type cutting member is the material of the heating type cutting material, and the heating material of the heating type cutting material is covered by the heating. The heating is performed by adding the heating type cutting piece to the sheet shape and adding 4 M430696. Hot cutting parts. In particular, the sheet-shaped heated cutting member can have up to 4 holes. In addition, the sheet-shaped heated cutting member selectively has a wedge-shaped cross-section. In one embodiment of the present invention, the above-mentioned working temperature is 20 (TC to 300.) In one embodiment of the present invention, the above separating apparatus further includes A sliding mechanism is mounted on the base. The multi-layer plate can be disposed on the sliding mechanism and the sliding mechanism is adapted to translate the multi-layer plate on the base.
基於上述，本創作利用加熱式切割件來進行多層平板 的分離，使得黏合平㈣师體被_件直接加熱二 分離作業的進行。 ' 為讓本創作之上述特徵和優點能更明顯易懂，下文 舉實施例，並配合所附圖式作詳細說明如下。 、 【實施方式】 圖1為本創作第一實施例的分離設備示意圖。請參照 圖卜加熱t置100包括底座110、加熱式切割件12卜|骨 移機構130、加熱件140、承載台15〇、抽風扇16〇、以^ 安全遮罩170。加熱式切割件120、滑移機構13〇、加熱件 140、承載台150、抽風扇160、以及安全遮罩17〇皆安襞 於底座110上。 加熱式切割件120可以是線性加熱元件，其材質可以 是高導熱㈣或是高阻抗的金屬’其中高阻抗的金屬例如 有鎳、絡。同時，加熱件14〇連接於加熱式切割件120以 將其加熱。在本實施例中，加熱式切割件120的材質例如 5 M430696 2可利用通電的方式進行加熱。所以， 加熱件140可以包括有電源線142、導電支架 簧M6，其中導電支㈣4在本實施例以導電螺絲為例， 但本創作不以此為限。加熱切割件12〇可過導電 =及彈菁M6連接至電源線142,而電源線二^ 供電源至加賦_们2G錢加熱式㈣件被加軌。上 f熱件140的糾並非用以岐本創作，其他可以將加 熱式切割件120加熱的設計都可應用於本創作中。 滑移機構130例如是安餘底座UG上的執道，並且 承載台150安裝於滑移機構13〇上。如此一來承載台MO 可以在滑移機構13G上平移，但本創作不以此為限。〇在其 他的實施方式中，可以將加熱式切割件12G安裝於滑移機 構130上，使得加熱式切割件12〇可在滑移機構13〇上平 移。抽風扇160可選擇性地安裝於底座n〇上以在分離設 備10〇進行分離作業時提供通風作用。安全遮罩170安裝 在加熱件140前方以避免操作者在進行分離作業時不慎碰 觸加熱件140而受傷。另外，分離設備1〇〇可以更包括有 熱纜線(thermal cable)180 ’其用以監控加熱式切割件12〇 的溫度。 在進行分離作業時’加熱件140例如對加熱式切割件 120進行加熱使得加熱切割件120被加熱至一工作溫度， 其可以介於200。(：至300°C。同時，預備要分離的多層板 10例如放置於安裝在滑移機構13〇的承載台150上，以沿 作業方向D平移。多層板1〇包括有多個平板12以及將多 = 純在—起的至少—膠體14。加熱式切割件120 沿作j如對齊於膠體14的高度。如此—來，多層板ι〇 以银^向D平移可使得加熱式切割件12(3接觸膠體14 声^體u施加壓力。當加熱式切割件12Q具有的工作溫 120 大於賴14的魅，職觸於加熱式切割件 2〇的、^ 14會雜錄兩平板12分離開來。 1古Γ言之，加熱件140的加熱可使加熱式切割件150所 i f Ϊ工作溫度不小於膠體14的炫點。因此，接觸於加熱 ^刀^牛120的膠體14會炫化，同時遭受到加熱式切割件 、堅力所以’膠體14可以輕易地被切㈣來以使兩 板12彼此分離。在這樣的過財，平板12並未受到加 ^所以設置在平板上的任何元件都*相為分離作業中 的向溫而受到損傷。如此一來，多層板 經過重工之後仍可以保有原有的性質與功能 值得-提的是，本實施例的加熱式切割件12〇雖採用 電熱式的加熱設計，在其他實施例巾加熱式蝴件12〇可 以利用其它方式來加熱。 圖2為本創作第二實施例的分離設備示意圖。請參昭 圖2，本實施例的分離設備與前述第—實施例的分^ 設備100相似’因此兩實施例中相同的構件將以相同的元 件符號標示’且這些構件可參照第—實施_描述而 此贅述。具體來說’本實施例不同於第—實補之處主要 在於本實施例的加熱式切割件220例如為片狀加熱式切 件。片狀設計的加熱式切割件220相較於第—實施例的^ #430696 性設計而言’可以具有較高的機械強度。所以’在進行多 層板的分離作業時，本實施例的分離設備200相對地不容 易有斷裂、變形等現象，有助於使分離後的平板具有較均 勻的表面。 圖3為本創作第三實施例的分離設備示意圖。請參照 圖3 ’本實施例的分離設備300與前述第二實施例的分離 設備200相似，這兩者的差異主要在於本實施例的加熱式 切割件320為片狀加熱式切割件，且具有多個孔洞322。 當使用本實施例的分離設備300分離第一實施例中所描述 的多層板10時，這些孔洞322可以作為膠體14熔化後的 排出通道而有利於分離作業之進行。 圖4為本創作第四實施例的分離設備示意圖。請參照 圖4，本實施例的分離設備4〇〇與前述第一實施例的分離 設備100相似，這兩者的差異主要在於本實施例的加熱式 切割件420例如為片狀加熱式切割件且具有楔形剖面（沿 A-A剖線繪示）。也就是說，加熱式切割件42〇具有不岣勻 的厚度。當分離設備用以分離圖丨所繪示的多層板1〇時， 加熱式切割件420中相對較尖銳的一側(也就是厚度較薄 的一側)會面向多層板10。如此一來，多層板1〇持續^向 加熱式切割件420平移的過程中，平板12可以因為加熱^ 切割件侧之厚度越來越厚而輕易地分離， 二1 離作業之糊進行。 綜上所述，本創作利用加熱式切割件來進行多層才、 刀離’、中利用加熱式切割件的溫度直接加熱黏著於多個 8 M430696 平板之間的膠體以方便分離作業之進行。由於本創作使得 加熱式切割件直接接觸黏著於平板之間的膠體，平板上的 構件不會受到加熱，所以本創作可避免平板上的構件因加 熱而受損。如此一來，分離後的平板可以具有原有的功^ 及品質以利於重工或是解析。 雖然本創作已以實施例揭露如上，然其並非用以限定 本創作’任何所屬技術領域中具有通常知識者，在不脫離 本創作之精神和範圍内，當可作些許之更動與潤飾，故本 創作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本創作第一實施例的分離設備示意圖。 圖2為本創作第二實施例的分離設備示意圖。 圖3為本創作第三實施例的分離設備示意圖。 圖4為本創作第四實施例的分離設備示意圖。 【主要元件符號說明】 10 :多層板 12 .平板 14 :膠體 100、200、300、400 :分離設備 110 :底座 120、220、320、420 :加熱式切割件 130 :滑移機構 9 140 :加熱件 142 :電源線 144 :導電支架 146 :彈簧 150 :承載台 160 :風扇 170 :安全遮罩 180 :熱纟覽線 322 :孔洞 A-A :剖線 D :作業方向Based on the above, the creation uses a heated cutting member to separate the multi-layer plates, so that the bonding flat (four) body is directly heated by the two parts to separate the work. In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings. [Embodiment] FIG. 1 is a schematic diagram of a separation device according to a first embodiment of the present invention. Referring to Fig. 2, the heating unit 100 includes a base 110, a heated cutting member 12, a bone moving mechanism 130, a heating member 140, a carrying table 15A, a drawing fan 16A, and a safety shield 170. The heated cutting member 120, the sliding mechanism 13A, the heating member 140, the carrying table 150, the extracting fan 160, and the safety shield 17 are all mounted on the base 110. The heated cutting member 120 may be a linear heating element which may be made of a high thermal conductivity (four) or a high-impedance metal. The high-impedance metal is, for example, nickel or a metal. At the same time, the heating member 14 is attached to the heated cutting member 120 to heat it. In the present embodiment, the material of the heated cutting member 120, for example, 5 M430696 2, can be heated by energization. Therefore, the heating member 140 may include a power cord 142 and a conductive bracket spring M6. The conductive branch (4) 4 is exemplified by a conductive screw in this embodiment, but the present invention is not limited thereto. The heating cutting member 12 〇 can be over-conducted = and the elastic cyanine M6 is connected to the power supply line 142, and the power supply line 2 is supplied with power to the additional _ 2G money heating type (four) pieces are added. The correction of the upper heat member 140 is not intended to be used for the present invention, and other designs that can heat the heated cutting member 120 can be applied to the present creation. The slip mechanism 130 is, for example, an obedience on the rest base UG, and the carrier 150 is mounted on the slip mechanism 13A. In this way, the carrier MO can be translated on the sliding mechanism 13G, but the creation is not limited thereto. In other embodiments, the heated cutting member 12G can be mounted to the glide mechanism 130 such that the heated cutting member 12 can be displaced over the glide mechanism 13A. The extractor fan 160 is selectively attachable to the base n to provide ventilation when the separating apparatus 10 is subjected to the separation operation. The safety shield 170 is mounted in front of the heating member 140 to prevent the operator from inadvertently touching the heating member 140 while performing the separation work. Additionally, the separation device 1A may further include a thermal cable 180' for monitoring the temperature of the heated cutting member 12A. The heating element 140, for example, heats the heated cutting member 120 during the separation operation such that the heating cutting member 120 is heated to an operating temperature, which may be between 200. (: to 300 ° C. Meanwhile, the multi-layer board 10 to be separated is placed, for example, on a stage 150 mounted on the slip mechanism 13 平移 to translate in the working direction D. The multi-layer board 1 〇 includes a plurality of flat sheets 12 and More than = pure at least - colloid 14. The heated cutting member 120 is positioned as j as aligned with the height of the colloid 14. Thus, the multi-layer panel ι is translated in silver to D to enable the heated cutting member 12 (3 contact colloid 14 sound ^ body u apply pressure. When the heating cutter 12Q has a working temperature of 120 is greater than the charm of the Lai 14, the job touches the heated cutting member 2〇, ^ 14 will be recorded two tablets 12 separated 1 In other words, the heating of the heating member 140 can make the working temperature of the heating cutter 150 not less than the sleek point of the colloid 14. Therefore, the colloid 14 contacting the heating knife 120 will be dazzled, and at the same time Suffering from the heated cutting member and the strength, the 'colloid 14 can be easily cut (four) to separate the two plates 12 from each other. In this case, the plate 12 is not subjected to any addition, so any component placed on the plate is *The phase is damaged by the temperature in the separation operation. As a result, more After the layer is reworked, the original properties and functions can still be retained. It is noted that the heating type cutting member 12 of the embodiment adopts an electrothermal heating design, and in other embodiments, the heating type butterfly 12 can be used. Figure 2 is a schematic view of the separation apparatus of the second embodiment of the present invention. Referring to Figure 2, the separation apparatus of the present embodiment is similar to the apparatus 100 of the foregoing first embodiment. The same components will be denoted by the same reference numerals and the components may be described with reference to the first embodiment. Specifically, the present embodiment differs from the first embodiment in that it is mainly the heating cutting member of the present embodiment. 220 is, for example, a sheet-shaped heated cutting member. The sheet-shaped heated cutting member 220 can have a higher mechanical strength than the first embodiment of the design. Therefore, 'in the multi-layer board During the separation operation, the separation apparatus 200 of the present embodiment is relatively less prone to breakage, deformation, etc., and helps to make the separated flat plate have a relatively uniform surface. Referring to FIG. 3, the separation apparatus 300 of the present embodiment is similar to the separation apparatus 200 of the foregoing second embodiment, and the difference between the two is mainly that the heating type cutting member 320 of the present embodiment is sheet heating. a cutting member having a plurality of holes 322. When the separating apparatus 300 of the present embodiment is used to separate the multilayer board 10 described in the first embodiment, the holes 322 can serve as a discharge passage for the melted body of the colloid 14 to facilitate separation. Figure 4 is a schematic view of a separation device according to a fourth embodiment of the present invention. Referring to Figure 4, the separation device 4 of the present embodiment is similar to the separation device 100 of the first embodiment described above, and the difference between the two is mainly The heated cutting member 420 of the present embodiment is, for example, a sheet-shaped heated cutting member and has a wedge-shaped cross section (shown along the line AA). That is, the heated cutting member 42 has a thickness that is not uniform. When the separating apparatus is used to separate the multilayer board 1 shown in the figure, the relatively sharp side (i.e., the thinner side) of the heated cutting member 420 faces the multilayer board 10. As a result, during the translation of the multi-layer panel 1 to the heated cutting member 420, the flat panel 12 can be easily separated by the thickness of the heating member on the side of the cutting member, and the two sheets are separated from the working paste. In summary, the creation uses a heated cutting member to perform multi-layer, knife-off, and the temperature of the heated cutting member is directly heated and adhered to the colloid between the plurality of 8 M430696 plates to facilitate the separation operation. Since this creation allows the heated cutting member to directly contact the glue adhered between the plates, the members on the plate are not heated, so this creation can prevent the members on the plate from being damaged by heating. In this way, the separated plate can have the original work and quality to facilitate rework or analysis. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention to anyone having ordinary knowledge in the art, and may make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a separating apparatus of a first embodiment of the present invention. Figure 2 is a schematic view of the separation apparatus of the second embodiment of the present invention. FIG. 3 is a schematic diagram of a separation device according to a third embodiment of the present invention. 4 is a schematic view of a separation device of a fourth embodiment of the present invention. [Main component symbol description] 10: Multilayer board 12. Flat plate 14: Colloid 100, 200, 300, 400: Separation device 110: Base 120, 220, 320, 420: Heated cutting member 130: Sliding mechanism 9 140: Heating 142: Power cord 144: Conductive bracket 146: Spring 150: Carrier 160: Fan 170: Safety mask 180: Hot line 322: Hole AA: Section D: Working direction