M427600 101年01月20日梭正替換頁 五、新型說明： 【新型所屬之技術領域】 _本創作係與主機板有關，特別有關於内建有無線傳輸模 組的主機板。 【先前技術】 [_近年來電子產業蓬勃發展，其中電腦的成長速度尤其迅 速，現今電腦實已相當地普及化，幾乎任何事都離不開 電腦的使用範疇。 [0003]電腦主要用以儲存並處理各式的數位資料，並且，複數 電腦之間亦可互相傳遞資料，以增進使用之便利性。一 般來說，複數電腦可通過傳輪線來互相連接，或是通過 硬碟或隨身碟的使用，以將資料在多台電腦之間進行傳 •遞。然而，為了省卻實體傳輪線的使用、擴展資料的傳 輸距離，並增進資料及訊號的傳輪便利性，近來較為新 穎的電腦上也紛紛增設了無線傳輸功能。 如上所述，一般常見者，係使用獨立的無線傳輸模組， 例如無線射頻（Radio Frequency，RF)模組、藍牙 (Bluetooth)模組、無線相容認證（wireiess Fidelity，Wi-Fi)模組等，通過電腦上的通用序列匯流 排（Universal Serial Bus，USB)連接器來外接，或通 過主機板上的快捷外設互聯標準（peripheralM427600 On January 20th, 101st, the shuttle is replacing the page. 5. New description: [New technical field] _ This creation department is related to the motherboard, especially the motherboard with built-in wireless transmission module. [Prior Art] [In recent years, the electronics industry has flourished, and the growth rate of computers has been particularly rapid. Today's computers are quite popular, and almost everything cannot be separated from the use of computers. [0003] Computers are mainly used to store and process various types of digital data, and multiple computers can also transfer data to each other to enhance the convenience of use. In general, multiple computers can be connected to each other through a transmission line or through a hard disk or a flash drive to transfer data between multiple computers. However, in order to save the use of physical transmission lines, expand the transmission distance of data, and enhance the convenience of data and signal transmission, wireless transmission functions have also been added to more recent computers. As mentioned above, it is common to use independent wireless transmission modules, such as radio frequency (RF) modules, Bluetooth modules, and wireless compliant authentication (wires Fidelity, Wi-Fi) modules. Etc., externally connected via the Universal Serial Bus (USB) connector on the computer, or via the Fast Peripheral Interconnect standard on the motherboard (peripheral
Component Interconnect Express，pen)插槽直接 插接於主機板上。藉此，電腦所儲存的資料可通過無線 傳輸模組來對外無線傳輸’亦可通過該無線傳輸模組， 無線接收外部所傳來的資料或控制訊號。 1013031119-0 10021943#單编號Α01(Π 第3頁/共16頁 M427600 [0004] [Ϊ^Γ年 01 月 20 日 然而，通過上述方式來擴充無線傳輸模組，將會佔據主 機板上的週邊資源（例如佔據一個USB連接器或一條 PCI-E插槽），如此將對使用者造成極大的不便。 [00〇5]是以，部分電腦廠商於主機板製造時，即將傳輸天線及 傳輸積體電路（Integrated Circuit，1C)等元件直接設 置於該主機板上，藉以避免上述擴充方式所帶來之不便 。然而，現下電腦紛紛以小型化為主流’如筆記型電腦 或平板電腦等電子裝置盛行。以筆記型電腦為例，其主 機板係比一般桌上型電腦所使用的主機板來得小，是以 ，其上可用的配置空間即更為有限。 [⑻06] 若通過上述的設置方式，分別將傳輸天線及傳輸1C等元 件設置於筆記型電腦的主機板上，則將會佔據該主機板 上寶貴的配置空間。再者，於該主機板的製造過程中， 需要以兩道製程來分別設置該傳輸天線及該傳輸1C，因 此製程時間會被拉長，造成製造康商之困擾。更甚者， 因該傳輸天線及該傳輸〗(;係分開設置’因此該主機板上 還需拉線來連接該傳輸天線及該傳輸1C，實會令該主機 板上的電路配線更為複雜。 [0007]是以，市場上實應提供一種新穎的主機板，不但可内建 有無線傳輸功能’並且還可縮短主機板的製程時間，並 簡化主機板上的線路配置。 【新型内容】 [0008]本創作之主要目的，在於提供一種内建無線傳輸模組的 主機板’係於主機板上直接設置有一用來對資粹進行無 線傳輸的無線傳輸模組。 1013031119-0The Component Interconnect Express, pen) slot is directly plugged into the motherboard. Thereby, the data stored by the computer can be wirelessly transmitted through the wireless transmission module. The wireless transmission module can also wirelessly receive externally transmitted data or control signals. 1013031119-0 10021943#单号Α01(Π Page 3 of 16 M427600 [0004] [Ϊ^Γ年01月20 However, by expanding the wireless transmission module in the above way, it will occupy the motherboard. Peripheral resources (such as occupying a USB connector or a PCI-E slot), this will cause great inconvenience to the user. [00〇5] Yes, some computer manufacturers will transmit antennas and transmissions when the motherboard is manufactured. Components such as Integrated Circuit (1C) are directly placed on the motherboard to avoid the inconvenience caused by the above expansion methods. However, computers are now miniaturized as 'mainstreams such as notebook computers or tablet computers. The device is popular. In the case of a notebook computer, the motherboard is smaller than the motherboard used in a typical desktop computer, so that the available configuration space is more limited. [(8)06] If the above settings are adopted In this way, the transmission antenna and the transmission 1C component are respectively disposed on the motherboard of the notebook computer, which will occupy valuable configuration space on the motherboard. Furthermore, the motherboard has been manufactured. In the process, the transmission antenna and the transmission 1C need to be separately set up in two processes, so the process time will be lengthened, causing troubles in the manufacture of Kangshang. Moreover, because the transmission antenna and the transmission are separated Setting 'Therefore, the motherboard needs to pull the cable to connect the transmission antenna and the transmission 1C, which will make the circuit wiring on the motherboard more complicated. [0007] Therefore, the market should provide a novel host. The board can not only have built-in wireless transmission function' but also shorten the processing time of the motherboard and simplify the line configuration on the motherboard. [New content] [0008] The main purpose of this creation is to provide a built-in wireless transmission. The motherboard of the module is directly connected to the motherboard with a wireless transmission module for wireless transmission. 1013031119-0
100219^單域删1 $ 4 I / # 16 I M427600 101 年01 月 [0009] 為達上述目的，本創作主要係於主機板上直接設置一無 線傳輸模組，並且無線傳輸模組包括：電路板、傳輸天 線、及傳輸積體電路（Integrated Circuit, 1C)。無線 傳輸模組的電路板上具有焊接部，焊接部上具有焊接胸7 ，無線傳輸模組藉由焊接腳直接與主機板連接。 [0010] 本創作相較於先前技術所達成之功效在於，事先製成用 以無線傳輸資料的無線傳輸模組，再於製造主機板時， 將無線傳輸模組設置於其上，如此可有效縮短主機板的 製造時間並簡化主機板的製程。再者，主機板上不必設 置分開的傳輪天線及傳輸1C，因此更可簡化主機板上的 線路配置。 【實施方式】 [0011] 為能夠更加詳盡的了解本創作之特點與技術内容，請參 閱以下所述之說明及附圖，然而所附圖示僅供參考說明 之用，而非用來加以尽制者。 [0012]首請參閱第一圖，為本創作之一較佳具體實施例之主機 板架構圖。如圖所示’本創作主要係具有一主機板1，該 主機板上設置有中央處理單元2、記憶體3、快捷外設互 聯標準（Peripheral Component Interc〇nnect100219^ Single domain deletion 1 $ 4 I / # 16 I M427600 101 January [0009] In order to achieve the above objectives, the creation mainly consists of directly setting a wireless transmission module on the motherboard, and the wireless transmission module includes: a circuit Board, transmission antenna, and transmission integrated circuit (Integrated Circuit, 1C). The wireless transmission module has a soldering portion on the circuit board, and the soldering portion has a soldering chest 7 , and the wireless transmission module is directly connected to the motherboard through the soldering leg. [0010] The effect achieved by the present invention over the prior art is that a wireless transmission module for wirelessly transmitting data is prepared in advance, and when a motherboard is manufactured, a wireless transmission module is disposed thereon, which is effective Reduce the manufacturing time of the motherboard and simplify the process of the motherboard. Furthermore, there is no need to set separate transmission antennas and transmit 1C on the motherboard, which simplifies the line configuration on the motherboard. [Embodiment] [0011] In order to understand the characteristics and technical contents of the creation, please refer to the following description and the accompanying drawings. However, the attached drawings are for illustrative purposes only and are not intended to be exhaustive. Manufacturer. [0012] Referring first to the first figure, a host board architecture diagram of a preferred embodiment of the present invention is shown. As shown in the figure, 'this creation mainly has a motherboard 1, which is provided with a central processing unit 2, a memory 3, and a fast peripheral interconnection standard (Peripheral Component Interc〇nnect).
Express, PCI-E)插槽4等硬體週邊。並且，該主機板1 上還可設置有通用序列匯流排（Universal Serial Bus，USB)積體電路5 ’電性連接至少_usb連接器50，藉 以通過該USB連接器50來連接使用外部的υςβ設置。 [0013] 該主機板1上可規劃設置一資料傳輪區10，更具體而言， 該資料傳輸區10主要係設置於該主機板1的周緣地區，但 1(){)21943f單編號A0101 第5頁/共16頁 1013031119-0 M427600 101年01月20日修正替換百 不加以限定。該主機板1上係直接設置有一無線傳輸模組 6 ’更具體而言，該無線傳輸模組6係連接於該主機板1的 該資料傳輸區10上，但不加以限定◊將該無線傳輪模組6 設置於該資料傳輸區10，即，該主機板1的周緣地區，係 可減低訊號傳輸之阻礙，藉此提高該無線傳輸模組6的訊 號強度》 [0014] 本實施例中，該無線傳輸模組6主要係由前製程事先製成 ，再於該主機板1的製造過程中，直接設置至該主機板1 上。如此一來，該主機板1不必設置分開的傳輸天線及傳 _ 輸積體電路（Integrated Circuit, 1C)，亦不必為連接 該傳輪天線及該傳輸1C而在該主機板1上拉線，是以該主 機板1的製程時間可以被縮短，並且該主機板1上的線路 配置也可以被有效地簡化。本實施例中，該無線傳輸模 組6係可直接焊接於該主機板1上，或者該主機板1上可設 置複數排針插座（圖未標示）’該無線傳輸模組6插置該複 數排針插座，以與該主機板1電性連接，不可加以限定。 [0015] 如圖所示，該無線傳輸模組6主要具有一電路板61、一傳 纏 輸1C 62、及一傳輸天線63。該電路板61的一端具有一 焊接部64 ’該傳輸1C 62及該傳輪天線63電性連接於該 電路板61上’並且該傳輸天線63電性連接於該電路板61 上遠離該焊接部64之另一端。並且值得一提的是，該電 路板61上設置該傳輸天線63之一端，係靠近該主機板1的 周緣，藉此可提升訊號強度。本實施例中，該傳輸1C 62 主要可為無線相容認證（Wire less Fidelity, Wi-Fi) 晶片或藍牙（Bluetooth)晶片’藉以處理Wi-Fi訊號或 10021943#單编號 A〇101 第6頁/共16頁 1013031119-0 藍牙訊號，但不加以限定。 _ ^線傳輪模組6上還具有複數科祕，該複 65電性連接該電路細上的料接部64，藉以1聊 傳輸模組6通過該複數谭接祕連接該主機板卜本實施 例中’該複數焊接腳65主要係以排針（pin_header)來者 現，但不加以限定。 只 剛本實施例中’該無線傳輸模組6係可通過USB通道與該主 機板1互相傳輸資料，更具體而言，該無線傳輸模^係 可電ί生連接該主機板丨上的該USB積體電路5，藉以通過該 USB積體電路5來進行無線訊號之處理。 乂 [_如上所述，該主機板1可通過該_積體電路5將資料傳輪 至該無線傳輸模組6，藉以對外無線發送；而該無線傳輸 模組6可無線接收外部訊號，並傳輸至該USB積體電路5進 行處理後，再傳遞給該主機板丨上的其他單元，例如該中 央處理單元2使用。於本實施例中，該複數焊接腳65的數 量主要為四根，該無線傳輸模組6通過該四根焊接腳65連 接該主機板1，並與該USB積體電路5電性連接，但不加以 限定。 再者’該無線傳輸模組6還可通過PCI-E通道來與該主機 板1互相傳輸資料，更具體而言，該無線傳輸模組6係可 連接該主機板1上的該PCI-E插槽4。惟，本創作中的該無 線傳輸模組6係可選擇性地通過USB通道或pci-E通道來 進行無線訊號的傳遞，實可視實際所需而定，不應加以 限定。 [0019] 10021943昃單編號 續請參閱第二圖，為本創作之第一具體實施例之無線傳 A0101 第7頁/共16頁 1013031119-0 M427600 101年.01月20日按正替換頁 [0020] [0021] [0022] [0023] 10021943^^^^* 輸模組示意圖。如圖所示，該無線傳輸模組6上的該傳輸 天線63，主要係可為平面反F型天線（Planar Inverted -F Antenna，PIFA) 631。該PIFA天線631 係設置於該 電路板61上遠離該焊接部64之另一端，並且延該電路板 61的端面設置。更具體而言，該PIFA天線631可設置於 該電路板61之另一端之端面，為單向（1T1R)之傳輸；再 者，該PIFA天線631還可設置於該電路板61之另一端之 兩側面，為雙向（2T2R)之傳輸，不應加以限定。 續請參閱第三圖，為本創作之第二具體實施例之無線傳 輸模組示意圖。本實施例中，該無線傳輸模組6上的該傳 輸天線63，主要係可為薄膜天線632。該薄膜天線632電 性連接於該電路板61上，並通過該電路板61與該傳輸1C 62連接。 續請參閱第四圖，為本創作之第三具體實施例之無線傳 輸模組示意圖。本實施例中，該無線傳輸模組6上的該傳 輸天線63，主要係可為陶瓷天線633。該陶瓷天線633係 貼覆於該電路板61之一面上，並且該傳輸1C 62與該陶瓷 天線633電性連接。 接續參閱第五圖，為本創作之第四具體實施例之無線傳 輸模組示意圖。本實施例中，該無線傳輸模組6上的該傳 輸天線63，主要係可為晶片天線634。該晶片天線634電 性連接於該電路板61上，並通過該電路板61與該傳輸1C 62連接。 最後請參閱第六圖，為本創作之一較佳具體實施例之筆 記型電腦架構圖。本實施例中，該主機板1主要為一筆記 A0101 第8頁/共16頁 1013031119-0 M427600 101年01月20日梭正替换頁 型電腦7之主機板1，該筆記型電腦7為了符合輕、薄、短 、小之趨勢，其内部的該主機板1必須盡可能地壓缩大小 ，並減少線路的配置。是以，通過本創作的内建無線傳 輸模組的主機板，不但可加速該主機板1的製程時間，並 可簡化該主機板1上的線路配置，對筆記型電腦7的製造 業者而言，無疑是一大福音。 [0024] 以上所述者，僅為本創作之一較佳實施例之具體說明， 非用以侷限本創作之專利範圍，其他任何等效變換均應 倶屬後述之申請專利範圍内。 【圖式簡單說明】 [0025] 第一圖係為本創作之一較佳具體實施例之主機板架構圖 第二圖係為本創作之第一具體實施例之無線傳輸模組示 意圖。 第三圖係為本創作之第二具體實施例之無線傳輸模組示 意圖。 第四圖係為本創作之第三具體實施例之無線傳輸模組示 意圖。 第五圖係為本創作之第四具體實施例之無線傳輸模組示 意圖。 第六圖係為本創作之一較佳具體實施例之筆記型電腦架 構圖。 【主要元件符號說明】 [0026] 1…主機板 10…資料傳輸區 繼歷产單編號A_ 第9頁/共16頁 1013031119-0 M427600 2···中央處理單元 3 ···言己憶體 4···Ρ0Ι -E 插槽 5-USB積體電路 50-USB連接器 6···無線傳輸模組 61…電路板 62…傳輸積體電路 63…傳輸天線 631...PIFA 天線 6 3 2…薄膜天線 633···陶瓷天線 634···晶片天線 64…焊接部 65…焊接腳 7···筆記型電腦 101年.01月20日梭正替換頁 4 1002194#單编號 A〇101 第10頁/共16頁 1013031119-0Express, PCI-E) Slot 4 and other hardware peripherals. Moreover, the motherboard 1 can also be provided with a universal serial bus (USB) integrated circuit 5' electrically connected to at least the _usb connector 50, thereby connecting and using the external υςβ through the USB connector 50. Settings. [0013] The data board 10 can be planned to be disposed on the motherboard 1. More specifically, the data transmission area 10 is mainly disposed in the peripheral area of the motherboard 1, but 1 () {) 21943f single number A0101 Page 5 of 16 Page 1013031119-0 M427600 The correction of the replacement on January 20, 2011 is not limited. The motherboard 1 is directly provided with a wireless transmission module 6'. More specifically, the wireless transmission module 6 is connected to the data transmission area 10 of the motherboard 1, but is not limited thereto. The wheel module 6 is disposed in the data transmission area 10, that is, in the peripheral area of the motherboard 1, which can reduce the obstacle of signal transmission, thereby improving the signal strength of the wireless transmission module 6. [0014] In this embodiment The wireless transmission module 6 is mainly made in advance by the pre-process, and is directly disposed on the motherboard 1 during the manufacturing process of the motherboard 1. In this way, the motherboard 1 does not need to be provided with a separate transmission antenna and an integrated circuit (1C), and it is not necessary to connect the chassis and the transmission 1C on the motherboard 1 . Therefore, the processing time of the motherboard 1 can be shortened, and the line configuration on the motherboard 1 can also be effectively simplified. In this embodiment, the wireless transmission module 6 can be directly soldered to the motherboard 1 or a plurality of pin headers (not shown) can be disposed on the motherboard 1. The wireless transmission module 6 interposes the plurality The pin header is electrically connected to the motherboard 1 and cannot be limited. As shown in the figure, the wireless transmission module 6 mainly has a circuit board 61, a transmission 1C 62, and a transmission antenna 63. One end of the circuit board 61 has a soldering portion 64'. The transmitting 1C 62 and the transmitting antenna 63 are electrically connected to the circuit board 61. The transmitting antenna 63 is electrically connected to the circuit board 61 away from the soldering portion. The other end of 64. It is also worth mentioning that one end of the transmission antenna 63 is disposed on the circuit board 61, which is close to the periphery of the motherboard 1, thereby improving the signal strength. In this embodiment, the transmission 1C 62 can be mainly a wireless compatible authentication (Wireless Fidelity, Wi-Fi) chip or a Bluetooth chip to process a Wi-Fi signal or 10021943# single number A 〇 101 6th Page / Total 16 pages 1013031119-0 Bluetooth signal, but not limited. The _ ^ line transmission module 6 also has a plurality of secrets, the complex 65 is electrically connected to the material connection portion 64 of the circuit, and the 1 Talk transmission module 6 is connected to the motherboard through the plurality of tangs. In the embodiment, the plurality of soldering legs 65 are mainly made by pin_headers, but are not limited. In the present embodiment, only the wireless transmission module 6 can transmit data to and from the motherboard through the USB channel. More specifically, the wireless transmission module can electrically connect the motherboard to the motherboard. The USB integrated circuit 5 is used to process the wireless signal through the USB integrated circuit 5.乂[_ As described above, the motherboard 1 can transmit data to the wireless transmission module 6 through the _ integrated circuit 5 for external wireless transmission; and the wireless transmission module 6 can wirelessly receive external signals, and After being transferred to the USB integrated circuit 5 for processing, it is transferred to other units on the motherboard, for example, the central processing unit 2. In this embodiment, the number of the plurality of soldering legs 65 is mainly four, and the wireless transmission module 6 is connected to the motherboard 1 through the four soldering legs 65, and is electrically connected to the USB integrated circuit 5, but Not limited. Furthermore, the wireless transmission module 6 can also transmit data to and from the motherboard 1 through a PCI-E channel. More specifically, the wireless transmission module 6 can be connected to the PCI-E on the motherboard 1. Slot 4. However, the wireless transmission module 6 in the present invention can selectively transmit wireless signals through a USB channel or a pci-E channel, which can be determined according to actual needs and should not be limited. [0019] 10021943 昃 编号 Continuation Please refer to the second figure for the first embodiment of the present invention, wireless transmission A0101, page 7 / total 16 pages 1013031119-0 M427600 101. January 20, according to the replacement page [ [0022] [0023] 10021943^^^^* A schematic diagram of the transmission module. As shown in the figure, the transmission antenna 63 on the wireless transmission module 6 can be mainly a Planar Inverted-F Antenna (PIFA) 631. The PIFA antenna 631 is disposed on the circuit board 61 away from the other end of the soldering portion 64, and is disposed on an end surface of the circuit board 61. More specifically, the PIFA antenna 631 can be disposed on the end surface of the other end of the circuit board 61 for one-way (1T1R) transmission; further, the PIFA antenna 631 can also be disposed at the other end of the circuit board 61. Both sides are two-way (2T2R) transmission and should not be limited. Please refer to the third figure for a schematic diagram of the wireless transmission module of the second embodiment of the present invention. In this embodiment, the transmission antenna 63 on the wireless transmission module 6 is mainly a film antenna 632. The film antenna 632 is electrically connected to the circuit board 61 and connected to the transmission 1C 62 through the circuit board 61. Please refer to the fourth figure for a schematic diagram of the wireless transmission module of the third embodiment of the present invention. In this embodiment, the transmission antenna 63 on the wireless transmission module 6 can be mainly a ceramic antenna 633. The ceramic antenna 633 is attached to one surface of the circuit board 61, and the transmission 1C 62 is electrically connected to the ceramic antenna 633. Referring to the fifth figure, a schematic diagram of a wireless transmission module according to a fourth embodiment of the present invention is shown. In this embodiment, the transmission antenna 63 on the wireless transmission module 6 is mainly a chip antenna 634. The chip antenna 634 is electrically connected to the circuit board 61 and is connected to the transmission 1C 62 through the circuit board 61. Finally, please refer to the sixth figure, which is a diagram of a computer architecture of a preferred embodiment of the present invention. In this embodiment, the motherboard 1 is mainly a note A0101 page 8 / a total of 16 pages 1013031119-0 M427600 on January 20, 2011, the shuttle is replacing the motherboard 1 of the page type computer 7, the notebook computer 7 is in order to comply Light, thin, short, and small, the internal motherboard 1 must be compressed as much as possible and reduce the configuration of the line. Therefore, the motherboard of the built-in wireless transmission module of the present invention can not only accelerate the processing time of the motherboard 1 but also simplify the line configuration on the motherboard 1 for the manufacturer of the notebook computer 7 Is undoubtedly a great gospel. The above description is only a specific description of a preferred embodiment of the present invention, and is not intended to limit the scope of the patents of the present invention, and any other equivalent transformations are within the scope of the patent application described later. BRIEF DESCRIPTION OF THE DRAWINGS [0025] The first drawing is a schematic diagram of a motherboard structure of a preferred embodiment of the present invention. The second drawing is a schematic diagram of a wireless transmission module of the first specific embodiment of the present invention. The third figure is a schematic diagram of a wireless transmission module of a second embodiment of the present invention. The fourth figure is a schematic diagram of the wireless transmission module of the third embodiment of the present invention. The fifth drawing is a schematic diagram of the wireless transmission module of the fourth specific embodiment of the present invention. The sixth drawing is a composition of a notebook computer frame according to a preferred embodiment of the present invention. [Description of main component symbols] [0026] 1... Motherboard 10... Data transfer area succession order number A_ Page 9/16 pages 1013031119-0 M427600 2···Central processing unit 3··· 4···Ρ0Ι -E slot 5-USB integrated circuit 50-USB connector 6···wireless transmission module 61...circuit board 62...transport integrated circuit 63...transmission antenna 631...PIFA antenna 6 3 2...Thin film antenna 633···Ceramic antenna 634···Watt antenna 64...welding part 65...welding foot 7···Notebook 101 years. January 20th shuttle replacement page 4 1002194#single number A〇 101 Page 10 of 16 1013031119-0