M425281 101年01月10日修正替換頁 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係關於一種測試治具，其尤指一種可供各種 不同型號之電路板測試之用於測試一電路板之治具。 【先前技術】 [0002] 現今電子裝置（如筆記型電腦）之主機板在組配完成 之後，需要經過全功能測試以確定其是否為優良品，而 主機板測試主要是針對該主機板上之各種錯誤，例如， 開路、短路及非正確接觸之零件等狀況加以檢測，即結 合測試機台所產生之錯誤信號數據，以及待測主機板由 電腦輔助設計所產生之佈線數據，令檢修員迅速由屏幕 上找出被測電路板之不良原因所在，從而節省檢修不良 品之時間。 然*現有之電路板之測試載具均為固定式〗因為每 種電路板之外型、輸入/輸出埠及需要散熱的元件的位置 分佈都不相同，所以針對不同型號之主機板均需要各種 不同的測試載具，如此才能進行測試。習知技術在為了 將發熱元件的熱量散發出去，在設置散熱模組時要將載 具上空出一散熱開口，如此才能將該散熱模組接觸到該 發熱元件，所以散熱元件在不同位置的主機板都需要對 應一種載具。 再來，因為每種主機板之零件分佈位置不同，而在 操作個過程中避免主機板的零件受到物理損害，因此載 具上載板支撐柱的位置不能在該主機板有零件的位置， 針對不同主機板都要設計不同的支撐柱位置，所以每一 10021692^W A〇101 第3頁/共38頁 1013012387-0 M425281 _ 101年01月10日核正替換頁 種主機板都需要對應一種載具。 還有每種主機板都有輸入/輸出埠，每種主機板的輸 入/輸出埠分佈位置都不同，當要把一輸入/輸出測試接 頭接到該輸入/輸出埠上，因為每種主機板之該輸入/輸 出埠有不同的樣式，而且其位置一不固定，所以針對不 同h主機板都需要對應的一套輸入/輸出測試模組，如此 才能進行測試。 綜上所述，現有之某一型號電路板都須搭配一組測 試載具，所以在工廠大量生產時，需要買大量的主機板 測試載具，如此會消耗大量的成本，而且當要測試不同 型號的主機板時，又需要消耗大量的時間來更換載具， 造成生產線產能的損失。 本創作係針對提升測試電路板之速度、減少購買載 具之成本，透過本創作電路板之測試治具可以解決習知 技術未能達到的重複使用性、低成本與高效率的測試治 具。 【新型内容】 [0003] 本創作之目的，係提供一種用於測試一電路板之治 具，其係可提供不同型號之主機板使用。 本創作之次要目的，係提供一種用於測試一電路板 之治具，其係可降低載具的購買成本。 本創作之另一目的，係提供一種用於測試一電路板 之治具，其係可加快更換測試治具之速度以提升產出效 率。 為了達到上述之目的，本創作揭示一種用於測試一 電路板之治具，其係包括一載具、一載板、複數個支撐 10021692#單M AQ1Q1 ^ 4 1 / * 38 1 1013012387-0 M425281 101年.01月10日核正#頁 柱、至少一輸入/輸出單元調節裝置、至少一輸入/輸出 測試接頭、一抬升機構與一散熱模組，利用該些裝置組 合成一治具用以達到的重複使用性、低成本與高更換載 具效率的功用。 本創作之技術手段包括：一載具及一載板，該載板 設置於該載具，該載板具有至少一開口，該開口對應該 電路板之至少一發熱元件，該載板由複數個拼接塊組成 ，各該拼接塊係為一等腰直角三角形板體或為與該等腰 直角三角形相同直角邊尺寸的正方形板體或為該等腰直 角三角形直角邊成倍數遞增之長方形板體。 本創作之技術手段另包括：一載具、一載板裝置與 一輸入/輸出調節裝置，該載板裝置設置於該載具，該載 板具有至少一開口以對應該電路板之至少一發熱元件。 該輸入/輸出調節裝置，設置於該載具，該輸入/輸出調 節裝置係包括一第一方向調節裝置、一第二方向調節裝 置、一第三方向調節裝置與一輸入/輸出測試接頭，該第 二方向調節裝置設置於該第一方向調節裝置，該第三方 向調節裝置，設置於該第一方向調節裝置。該輸入/輸出 測試接頭，設置於該輸入/輸出調節裝置，該輸入/輸出 測試接頭係用以連接該電路板之該輸入/輸出埠已進行該 電路板之測試，其中該輸入/輸出調節裝置配合該電路板 之該輸入/輸出埠來調節該輸入/輸出測試接頭之位置。 本創作之技術手段又包括：一載具、一載板、一抬 升機構與一散熱模組，該載板設置於該載具，該載板設 有至少一開口以對應該電路板之至少一發熱元件。該抬 升機構設置於該載具，該散熱模組設置於該抬升機構， 10021692^單编號 A〇101 第5頁/共38頁 1013012387-0 叫njzes丄 101年01月10日俊正替換百 其中當該枱升機構抬升該散熱模組來接觸該電路板之該 發熱元件時，該散熱模組用以對該電路板之該至少一發 熱&件進行散熱，且該散熱模組係依該電路板之該發熱 元件的位置來做調整。 本創作之技術手段更包括：一載具、一载板裝置、 至少—輪入/輸出調節裝置、至少一輪入/輪出測試接頭 括升機構與至少一散熱模組，該載板裝置設置於該 載具’該載板具有至少一開口以對應該電路板之至少一 發熱元件，該至少一輸入/輸出調節裝置設置於該載具， 該至少一輸入/輸出測試接頭設置於該輸入/輸出調節裝 置’該抬升機構設置於該載具，該至少一散熱模組設置 於該抬升機構β其中該機構載板包括複數個拼接塊與複 數個連結件，該些拼接塊設置有複數個孔洞，該些連結 件連結該些拼接塊，該些拼接塊可以拼出不同的形狀， 使一開口空出，以利該散熱模組的通過，其中該載板裝 置包含複數支撐柱，該些支撐柱係用以支撐一待測電路 板0 【實施方式】 為使貝審查委員對本創作之結構特徵及所達成之 功效有更進-步之瞭解與認識，謹佐以較佳之實施例及 配合詳細之說明，說明如後： 首先，請參閱第一圖與第二圖，其係為本創作之一 實施例之立體圖、局部俯視圖與局部側視圖；如圖所示 ’本創作之電路板之測試治具包括一載具10與-載板20 。載板20包括複數個拼接塊22並設置於該載具^上拼 接塊22係為等腰直角三角形板體或為 10021692产單编號Α0101 第6頁/共38π …4腰直角一角 1013012387-0 M425281 -M425281 January 10, 2011 Revision Replacement Page 5, New Description: [New Technical Field] [0001] This creation is about a test fixture, especially one that can be used for testing various circuit boards. Test a fixture for a circuit board. [Prior Art] [0002] The motherboard of today's electronic devices (such as notebook computers) needs to undergo full-featured testing to determine whether it is a good product after the assembly is completed, and the motherboard test is mainly for the motherboard. Various errors, such as open circuit, short circuit and parts that are not in proper contact, are detected, that is, the error signal data generated by the test machine and the wiring data generated by the computer-aided design of the motherboard to be tested, so that the inspector can quickly Find out the cause of the badness of the board under test on the screen, thus saving time in troubleshooting defective products. However, the test boards of the existing circuit boards are fixed. Because the layout of each type of board, input/output port, and components that require heat dissipation are different, various boards are required for different models. Different test vehicles are available for testing. In order to dissipate the heat of the heating element, the conventional technology needs to leave a heat dissipation opening on the carrier when the heat dissipation module is disposed, so that the heat dissipation module can be in contact with the heating element, so the heat dissipation element is in a different position. The boards all need a corresponding carrier. Then, because the parts of each motherboard are distributed in different positions, and the parts of the motherboard are not physically damaged during the operation, the position of the support plate of the carrier uploading board cannot be in the position of the main board. The motherboard must be designed with different support column positions, so each 10021692^WA〇101 Page 3/38 page 1013012387-0 M425281 _ 101 January 101 nuclear replacement page motherboard requires a corresponding vehicle . There is also an input/output port for each motherboard, and the input/output ports of each motherboard are distributed differently. When an input/output test connector is connected to the input/output port, because each motherboard The input/output has different styles, and its position is not fixed. Therefore, a corresponding set of input/output test modules are required for different h motherboards, so that the test can be performed. In summary, a certain type of circuit board must be equipped with a set of test vehicles, so when the factory is mass-produced, it is necessary to buy a large number of motherboard test vehicles, which will consume a lot of cost, and when testing different When the model of the motherboard is used, it takes a lot of time to replace the carrier, resulting in loss of production line capacity. This creation is designed to improve the speed of test boards and reduce the cost of purchasing equipment. The test fixtures of this creation board can solve the reusability, low cost and high efficiency test fixtures that the conventional technology fails to achieve. [New Content] [0003] The purpose of this creation is to provide a tool for testing a circuit board, which can be used for different types of motherboards. A secondary purpose of this creation is to provide a fixture for testing a circuit board that reduces the cost of purchasing the carrier. Another object of the present invention is to provide a jig for testing a circuit board which speeds up the replacement of the test fixture to increase the efficiency of the output. In order to achieve the above object, the present invention discloses a jig for testing a circuit board, which comprises a carrier, a carrier, a plurality of supports 10021692# single M AQ1Q1 ^ 4 1 / * 38 1 1013012387-0 M425281 101.01月10日核正#page column, at least one input/output unit adjusting device, at least one input/output test connector, a lifting mechanism and a heat dissipating module, and the devices are combined into a jig to achieve Reusability, low cost and high replacement of vehicle efficiency. The technical means of the present invention comprises: a carrier and a carrier, the carrier is disposed on the carrier, the carrier has at least one opening corresponding to at least one heating component of the circuit board, the carrier is composed of a plurality of Each of the splicing blocks is an isosceles right-angled triangular plate body or a square plate body having the same right-angled side dimension as the isosceles right-angled triangle or a rectangular plate body which is multiplied by the right-angled sides of the isosceles right-angled triangle. The technical means of the present invention further includes: a carrier, a carrier device and an input/output adjustment device, wherein the carrier device is disposed on the carrier, the carrier has at least one opening to correspond to at least one heat of the circuit board element. The input/output adjustment device is disposed on the carrier, and the input/output adjustment device includes a first direction adjustment device, a second direction adjustment device, a third direction adjustment device, and an input/output test connector. The second direction adjusting device is disposed in the first direction adjusting device, and the third direction adjusting device is disposed in the first direction adjusting device. The input/output test connector is disposed on the input/output adjustment device, and the input/output test connector is used to connect the input/output port of the circuit board to perform testing of the circuit board, wherein the input/output adjustment device The position of the input/output test connector is adjusted in conjunction with the input/output port of the board. The technical means of the present invention further includes: a carrier, a carrier, a lifting mechanism and a heat dissipation module, the carrier is disposed on the carrier, the carrier is provided with at least one opening to correspond to at least one of the circuit boards Heating element. The lifting mechanism is disposed on the carrier, and the heat dissipation module is disposed on the lifting mechanism, 10021692^single number A〇101, page 5/38 pages, 1013012387-0, called njzes丄, January 10, 2011, the replacement of one hundred When the lifting mechanism lifts the heat dissipation module to contact the heat generating component of the circuit board, the heat dissipation module is configured to dissipate the at least one heat generating component of the circuit board, and the heat dissipation module is configured according to the heat dissipation module The position of the heating element of the board is adjusted. The technical means of the creation further comprises: a carrier, a carrier device, at least a wheel input/output adjustment device, at least one wheel/in test connector and a heat dissipation module, and the carrier device is disposed at The carrier has at least one opening corresponding to at least one heat generating component of the circuit board, the at least one input/output adjusting device is disposed on the carrier, and the at least one input/output test connector is disposed at the input/output The lifting device is disposed on the carrier, and the at least one heat dissipating module is disposed on the lifting mechanism β. The mechanism carrier includes a plurality of splicing blocks and a plurality of connecting members, and the splicing blocks are provided with a plurality of holes. The connecting pieces are connected to the splicing blocks, and the splicing blocks can be shaped into different shapes to make an opening vacant for the passage of the heat dissipation module, wherein the carrier device comprises a plurality of supporting columns, and the supporting columns It is used to support a circuit board to be tested. 0 [Embodiment] In order to enable the Beck Review Committee to have a more in-depth understanding and understanding of the structural features and achievements of this creation, I would like to The preferred embodiment and the detailed description are as follows: First, please refer to the first and second figures, which are perspective views, partial top views and partial side views of an embodiment of the present invention; The test fixture for the created circuit board includes a carrier 10 and a carrier 20 . The carrier 20 includes a plurality of splicing blocks 22 and is disposed on the carrier. The splicing block 22 is an isosceles right-angled triangular plate or is 10021692. The single number Α 0101 6th page / total 38π ... 4 waist right angle 1013012387-0 M425281 -
ιοί年.01月修正雜頁I 形相同直角邊尺寸的正方形板體或為該等腰直角三角形 直角邊成倍數遞增之類型長方形板體，用以拼接方式拼 出此載板20。載板20可承載一待測電路板2(參第三圖）。 每一拼接塊22設有複數個孔洞222 ’使拼接塊22形成如一 具蜂巢孔狀之塊體。另外。治具更包括數個連結件24與 數個支撐柱26,其中此些連結件24係可呈一 “8”字形鍵 • 接板，其更包括一連結本體242與至少二插銷244。連結 本體242具有一第一端2422及一第二端2424。第一端 2422及第二端2424分別包括一第一穿孔2423與一第二穿 孔2425。第二穿孔2425係可呈一橢形穿孔，用以便利調 節連結關係。 以下茲以載板22之二相鄰之第一、二拼接塊28、29 為相連結之實施說明。第一拼接塊28係為一等腰直角三 角形相同直角邊尺寸的正方形板體，第二拼接塊29係為 一等腰直角三角形直角邊成倍數遞增之類型長方形板體 。連結本體242之第一端2422設置於第一拼接塊28，第 一端2422之第一穿孔2423對應該第一拼接塊28之一第一 孔洞281，然後再將一第一插銷2442穿設於第一穿孔 2423與第一孔洞281使該連結本體242與第一拼接塊28固 定。連結本體242之第二端2424設置於第二拼接塊29， 第二端2424之第二穿孔2425對應第二拼接塊29之一第二 孔洞291，其中第二孔洞291與第一孔洞281相鄰，然後 再將一第二插銷2444穿設於第二穿孔2425與第二孔洞 291使連結本體242與第二拼接塊29固定。如此可將此些 拼接塊22連結成載板2〇，再將載板2〇設置於載具1〇上， 然後依照—待測電路板2之需求，設置支撐柱26於拼接塊 1013012387-0 10021692^^^511 A0101 S 7 頁 / 共 38 頁 M425281 _ 101年01月10日核正替換頁 22之孔洞222上，就可將該待測電路板2置於該支撐柱26 上進行測試（參第三圖）。 本實施例目的在於提供一種電路板之測試治具，係 利用數個拼接塊22，能組成不同形狀的載板20。此載板 20之形狀實質上可相同於待測電路板2之形狀，如第一圖 所示，載板20拼組時乃對應待測電路板2上之一發熱元件 6(參第九圖）空出一開口27，使一散熱模組70(參第十三 圖）能夠通過開口 27使待測電路板2進行散熱，根據不同 的待測電路板2所需散熱之位置，可以調整開口 27之位置 。另外藉由拼接塊22之孔洞222可以任意改變該些支撐柱 26之位置以符合待測電路板2之需求，避免該些支撐柱26 損害待測電路板2的零件。因此在測試不同的電路板時， 不須將整組載板20換掉，只需做一些調整就能放置不同 型號之電路板，節省了大量的成本與時間β 請參閱第三圖至第五圖，其係為本創作之另一實施 例之側視圖與局部惻視圖；如圖所示，本創作之電路板 之測試治具係提供一載具10、一載板20與一輸入/輸出調 節裝置30。載板20同樣至少設有一開口27(參第一圖）以 對應待測電路板2之發熱元件6(參第九圖）。載板20承載 一待測電路板2。待測電路板2具有至少一輸入/輸出埠4 。輸入/輸出調節裝置30包括一第一方向調節裝置32、一 第二方向調節裝置40、一第三方向調節裝置50與一輸入/ 輸出測試接頭53。第一方向調節裝置32係包括一模組固 定塊34、複數個第一滑塊36、一第一模組固定座38。模 組固定塊34設有複數孔洞342及第一固定孔344。模組固 定塊34—端可設有一把手部346。滑塊裝置36包括有一固 1002廳#單编號Α0101 第8頁/共38頁 1013012387-0 M425281 定塊362及滑設於固定塊362上之第一滑塊364。固定塊 362上設有第二固定孔366 ’第一滑塊364上設有複數第 三固定孔368。第一模組固定座38設有二第一凹槽382及 第四固定孔384，第一凹槽382内並設有複數第五固定孔 386。請參閱第四A圖與第七圖，第二方向調節裝置40係 包括一第二模組固定座42、複數個滑執固定座44與一第 二滑塊46。第二滑塊46包含二第六固定孔462，而此些滑 執固定座44包括複數個第二凹槽442。請參閱第八圖，第 二方向調節裝置50係包括一固定座51、複數個柱體512、 至少—導引柱52、一輸入/輸出固定模組54、一固定塊56 一彈性件58與一固定件59。 請參閱第五圖與第六圖，其係為前述實施例之該第 一方向調節裝置32之俯視圖與側視圖。如圖所示，固定 塊362之第二固定孔366固設於第一凹槽382之第五固定 孔386(以螺件固鎖），使第一滑塊364滑設於第一凹槽 382内’該第一滑塊364並以該第三固定孔368固設於該 才旲組固定塊34之該第一固定孔344(以螺件固鎖），本實施 ^ ~~~ 第 一凹槽382為線性凹槽，該第一模組固定座34 與該滑些滑塊36料該該些第 一凹槽382做第一方向（X軸 101年.01·月10日修Ιοί年.01 revise the square plate of the same right-angled side of the type I or the rectangular plate of the type of the right-angled triangle of the isosceles, which is used to splicing out the carrier 20. The carrier 20 can carry a circuit board 2 to be tested (refer to the third figure). Each of the splicing blocks 22 is provided with a plurality of holes 222' such that the splicing blocks 22 are formed as a block having a honeycomb hole shape. Also. The jig further includes a plurality of connecting members 24 and a plurality of supporting columns 26, wherein the connecting members 24 are formed by an "8" shaped key. The connecting plate further includes a connecting body 242 and at least two pins 244. The connecting body 242 has a first end 2422 and a second end 2424. The first end 2422 and the second end 2424 respectively include a first through hole 2423 and a second through hole 2425. The second perforations 2425 can be formed with an oval perforation to facilitate adjustment of the connection relationship. Hereinafter, the first and second splicing blocks 28 and 29 adjacent to each other of the carrier 22 will be described as being coupled. The first splicing block 28 is a square plate body having the same right-angled side dimension of the isosceles right-angled triangle, and the second splicing block 29 is a rectangular plate body of a type in which the right-angled sides of the isosceles right-angled triangle are multiplied. The first end 2422 of the connecting body 242 is disposed on the first splicing block 28, the first through hole 2423 of the first end 2422 corresponds to the first hole 281 of the first splicing block 28, and then a first pin 2442 is inserted through The first through hole 2423 and the first hole 281 fix the joint body 242 and the first splicing block 28. The second end 2424 of the connecting body 242 is disposed on the second splicing block 29, and the second through hole 2425 of the second end 2424 corresponds to the second hole 291 of the second splicing block 29, wherein the second hole 291 is adjacent to the first hole 281 Then, a second pin 2444 is inserted through the second through hole 2425 and the second hole 291 to fix the connecting body 242 and the second splicing block 29. In this way, the splicing blocks 22 can be joined into the carrier board 2, and then the carrier board 2 can be placed on the carrier 1 ,, and then the support column 26 is arranged on the splicing block 1013012387-0 according to the requirements of the circuit board 2 to be tested. 10021692^^^511 A0101 S 7 pages / Total 38 pages M425281 _ On January 10, 101, the hole 222 of the replacement page 22 is replaced, and the circuit board 2 to be tested can be placed on the support column 26 for testing ( See the third picture). The purpose of this embodiment is to provide a test fixture for a circuit board, which can utilize a plurality of splicing blocks 22 to form carrier plates 20 of different shapes. The shape of the carrier board 20 can be substantially the same as the shape of the circuit board 2 to be tested. As shown in the first figure, when the carrier board 20 is assembled, it corresponds to one of the heating elements 6 on the circuit board 2 to be tested (see the ninth diagram). An opening 27 is vacated, so that a heat dissipation module 70 (refer to FIG. 13) can dissipate the circuit board 2 to be tested through the opening 27, and the opening can be adjusted according to different heat dissipation positions of the circuit board 2 to be tested. 27 position. In addition, the positions of the support columns 26 can be arbitrarily changed by the holes 222 of the splicing block 22 to meet the requirements of the circuit board 2 to be tested, and the support columns 26 are prevented from damaging the components of the circuit board 2 to be tested. Therefore, when testing different boards, it is not necessary to replace the entire set of carrier boards 20, and only need to make some adjustments to place different types of circuit boards, saving a lot of cost and time. Please refer to the third to fifth figures. The figure is a side view and a partial view of another embodiment of the present invention; as shown in the figure, the test fixture of the circuit board of the present invention provides a carrier 10, a carrier 20 and an input/output. Adjustment device 30. The carrier 20 is also provided with at least one opening 27 (see the first figure) to correspond to the heat generating component 6 of the circuit board 2 to be tested (see Figure 9). The carrier 20 carries a circuit board 2 to be tested. The circuit board 2 to be tested has at least one input/output port 4 . The input/output adjusting device 30 includes a first direction adjusting device 32, a second direction adjusting device 40, a third direction adjusting device 50, and an input/output test connector 53. The first direction adjusting device 32 includes a module fixing block 34, a plurality of first sliders 36, and a first module fixing seat 38. The mold block fixing block 34 is provided with a plurality of holes 342 and a first fixing hole 344. A handle portion 34 can be provided at the end of the module fixing block 34. The slider device 36 includes a solid 1002 hall #单号Α0101 page 8/38 page 1013012387-0 M425281 block 362 and a first slider 364 slidably disposed on the fixed block 362. The fixing block 362 is provided with a second fixing hole 366'. The first slider 364 is provided with a plurality of third fixing holes 368. The first module fixing base 38 is provided with two first recesses 382 and a fourth fixing hole 384. The first recess 382 is provided with a plurality of fifth fixing holes 386. Referring to FIGS. 4A and 7 , the second direction adjusting device 40 includes a second module fixing seat 42 , a plurality of sliding brackets 44 and a second slider 46 . The second slider 46 includes two sixth fixing holes 462, and the sliding brackets 44 include a plurality of second grooves 442. Referring to FIG. 8 , the second direction adjusting device 50 includes a fixing base 51 , a plurality of columns 512 , at least a guiding column 52 , an input/output fixing module 54 , a fixing block 56 , and an elastic member 58 . A fixing member 59. Please refer to the fifth and sixth figures, which are a plan view and a side view of the first direction adjusting device 32 of the foregoing embodiment. As shown in the figure, the second fixing hole 366 of the fixing block 362 is fixed to the fifth fixing hole 386 of the first groove 382 (locked by a screw), so that the first sliding block 364 is slidably disposed on the first groove 382. The first sliding block 364 is fixed to the first fixing hole 344 of the locating block fixing block 34 by the third fixing hole 364 (locked by a screw), and the first recess The slot 382 is a linear groove, and the first module fixing seat 34 and the sliding slider 36 are configured to perform the first direction of the first grooves 382 (X-axis 101.01·10月日日修)
10021692^^^^ 方向）之移動（參閱第四B圖）。 β月參閱第七圖，其係為前述實施例之第二方向調節 " 之俯視圖與側視圖。如圖所示，第二方向調節裝 置40之第二滑塊46滑設該些滑執固定座44之複數個第二 凹槽442，分 ’孩些滑軌固定座44再固設於該第二模組固定座 4 2，使'^歹笛一 °Λ乐二滑塊4 6能沿著該些滑執固定座4 4做第二方 向（γ軸方向）之移動（參閱第四Β圖）。請一併參閱第五圖 Α0101 第9頁/共38頁 1013012387-0 M425281 _ 101年.01月10日梭正替换頁 ，第一模組固定座38之第四固定孔384固設於第二滑塊46 之第六固定孔462(以螺件固鎖），如此可連接第一方向調 節裝置與第二方向調節裝置。 請參閱第八圖，其係為前述實施例之第三方向調節 裝置50之側視圖。如圖所示，第三方向調節裝置50之固 定座51上設置導引柱52，然後再將導引柱52穿設於該具 有複數個第一孔洞542之輸入/輸出固定模組54，繼將固 定塊56固設於導引柱52之頂端，如圖所示，在該輸入/輸 出固定模組54與固定座51之間設置該彈性件58，如此可 以該輸入/輸出固定模組54可以有向上的支撐力，然後將 該固定件59穿設於固定塊56之一第二孔洞562使固定件 59接觸輸入/輸出固定模組54，如此可以頂住輸入/輸出 固定模組54以平衡彈性件58向上之彈性力。本實施例之 固定件59為一螺栓，其頂端具有一旋動件591，而第二孔 洞562内壁具有螺紋，可藉由旋動件591 (固定件59)向下 轉動來控制輸入/輸出固定模組54之位置，而輸入/輸出 固定模組54會隨著導引柱52來移動，如此可做第三方向 (Z轴方向）之移動（參閱第四B圖）。 複參閱第三圖與第四A、四B圖，其係為本創作之另 一實施例之側視圖、局部側視圖與局部立體圖；如圖所 示，本創作之電路板之測試治具之輸入/輸出測試接頭53 係設置於第三方向調節裝置50之輸入/輸出固定模組54， • 當待側電路板2要測試時，就可調整第一方向調節裝置32 、第二方向調節裝置40與第三方向調節裝置50，使輸入/ 輸出測試接頭53可以對準待測電路2板之輸入/輸出埠4以 進行測試，第一方向調節裝置32、第二方向調節裝置40 10021692^MSt A0101 第10頁/共38頁 1013012387-0 101年.01月10日 及第三方向調節裝置50之調節方向係彼此垂直，其中第 〜方向、第二方向、第三方向係可為X轴方向、γ轴方向 、2軸方向等適當之選擇設定’亦可以利用第一方向調節 裝置32之該些孔洞342 ’當第三方向調節裝置5〇之該些柱 體512設置於該些孔洞342可以再對該輸入/輸出固定模組 54進行調整。 本創作電路板之測試治具藉由該輸入/輸出調節裝置 來調整該該輸入/輪出測試接頭53之位置，如此不須將 整組輸入/輸出測試模組換掉，只需做一些調整就能測試 不同型號之電路板’節省了大量的成本與時間。 請參閱第九圖’其係為本創作之另一較佳實施例之 前視圖；如圖所示，本實施例之電路板之測試治具係提 供一載具10、一載板20、複數個支撐柱26、一抬升機構 60與一散熱模組7〇 ’其中待測電路板2具有至少一發熱元 件6(如CPU等）。載板20設置於載具1〇上’抬升機構60設 置於載具10，散熱模組70設置於抬升機構6〇，通過載板 2 0之一開口 2 7，並可接觸到一待側電路板2之一發熱元件 6，而支撐柱6設置於載板20上用以支撐待測電路板2。 請參閱第十A圖與第十B圖，其係為前述實施例之該 抬升機構60之局部前視圖與局部側視圖；如圖所示，該 抬升機構60包括一金屬板62、複數個導引機構64、一支 撐架66與一馬達68。抬升機構60之金屬板62上設置該些 導引機構64，該些導引機構64具有複數個凸出軸642 ,而 支撐架66下方包含有與導引機構64相對之導引板661，該 導引板661設有複數個斜槽狀轨道662，所以導引機構64 之凸出軸642係插設於支撐架66之斜槽狀軌道662，並利 10021692#單編號 A0101 第11頁/共38頁 1013012387-0 I 101年01月10日梭正替換百 用馬達68連動使導引板661與導引機構64產生相對位移， 用以控制金屬板62之升降，如圖所示，該些導引機構64 會隨著該些轨道662向-斜方向前進，如此金屬板62就能 上下移動》 明參閱第十一圖，其係為前述實施例之該散熱機構 70之前視圖；如圖所示，散熱模組7〇包括一底座71、複 數個中空柱體72，複數個柱體73 , 一金屬塊74、複數個 連接件75、複數個風扇支撐柱76與至少一個風扇？？。散 熱機構70之該些中空主體設置於底座71上，將該些柱 體73設置於該些中空主體72裡，再將一金屬塊74設置於 該些柱體73上’柱體73可在該些中空柱體72中移動，可 使金屬塊74可以上下移動調整位置，本實施例之該金屬 塊74包含一第一側面742與一第二側面744，其中該第一 側面742為接觸發熱元件6，而第二側面744設有複數散熱 鰭片7442。將風扇支撐柱76設置於底座71，再將風扇77 設置於風扇支撐柱76上，如此可加速該金屬塊74之散熱 〇 請再參閲第十一圖與十二圖，其係為本創作之上述 較佳實施例之局部前視圖與上視圖；如圖所示.，本創作 之電路板之測試治具之該散熱模組70設置有該些連接件 75，該些連接件75分別可為一磁性件（如磁鐵等），該些 連接件75可以吸附於該抬升機構60之該金屬板62上，並 且可以根據該待側主機板2之該發熱元件6之位置來做調 整0 1013012387-0 本實施例利用該散熱模組70之設計’可以配合不同 型號之電路板來更換位置，而抬升機構6〇亦可配合該發 10021692^單編號A0101 第12頁/共38頁 M425281 熱元件6之大小來調整上下位置 能測試不同型號之電路板，節省 |1〇1 年01月 10 日 ’所以只需做一些調整就 了大量的成本與時間》 請參閲第十三圖，係為本創作之整體組裝示意圖， ’其中，该些連結件24連接該些拼接塊22 ,使該些拼接 口 27，該載板20再設置 塊22組合成載板2〇，並空出一開 於載具10上’將該支撐柱26設置於載板22上用以支撐-待側電路板2。輪入/輸出調節裝置30之第一方向調節裝 置32設置於第二方向調節裝置4〇，第三方向調節裝置5〇 設置於第一方向調節裝置32，，輸入/輸出測試接頭53再 設置第二方向調節裝置5〇，最後再將該第二方向調節裝 置40設置於該載具1〇上，如此可以利用該輸入/缔出調節 裝置30來調整該該輸入/輸出測試接頭53之位置以配合待 測電路板2之輸入/輸出埠4之位置，其中，第一方向調節 裝置32、第二方向調節裝置4〇及第三方向調節裝置50之 調節方向係彼此垂直。再者，抬升機構6〇設置於載具1〇 ，散熱模組70再設置於該該抬升機構6〇上，該散熱模組 70可配合該待測電路板2之該發熱元件6之位置來設置， 同時可以改變載板20之開口 27之位置，抬升機構60用以 調整散熱模組70之上下位置。再者，本創作可應用於何 種型號之待測主機板2，都可以改變載板2〇、輸入/輸出 測試接頭53與散熱模組70之位置，以配合輸入/輸出埠4 與發熱元件6之位置。當更換待測電路板2時，不需更換 載具10之載板20、輸入/輸出測試接頭53與散熱模組70 ，如此可以節省大量之成本，而且因不需要更換整個載 具10，減少了更換產線之時間。 惟以上所述者，僅為本創作之較佳實施例而已，並 10021692^^ A〇101 第 13 頁 / 共 38 ! 1013012387-0 M425281 __ 101年01月10日梭正替換頁 非用來限定本創作實施之範圍，舉凡依本創作申請專利 範圍所述之形狀、構造、特徵及精神所為之均等變化與 修飾，均應包括於本創作之申請專利範圍内。 本創作係實為一具有新穎性、進步性及可供產業利 用者，應符合我國專利法所規定之專利申請要件無疑， 爰依法提出新型專利申請，祈鈞局早曰賜准專利，至 感為禱。 【圖式簡單說明】 [0005] 第一圖：其係為本創作之一較佳實施例之立體圖； 第二圖：其係為本創作之一較佳實施例之局部俯視圖與局 部侧視圖； 第三圖:其係為本創作之另一較佳實施例之側視圖； 第四A圖：其係為本創作之另一較佳實施例之局部側視圖 9 第四B圖：其係為本創作之另一較佳實施例之局部立體圖 第五圖：其係為本創作之另一較佳實施例之局部俯視圖； 第六圖：其係為本創作之另一較佳實施例之局部側視圖； 第七圖：其係為本創作之另一較佳實施例之局部俯視圖與 局部側視圖； 第八圖：其係為本創作之另一較佳實施例之局部側視圖； 第九圖：其係為本創作之另一較佳實施例之前視圖； 第十A圖：其係為本創作之另一較佳實施例之局部前視圖 > 第十B圖：其係為本創作之另一較佳實施例之局部側視圖 * 10021692#單编號删1 帛 14 頁 / 共 38 胃 1013012387-0 M425281 101年.01月10日俊正替換頁 第十一圖：其係為本創作之另一較佳實施例之局部前視圖 ;及 第十二圖：其係為本創作之另一較佳實施例之上視圖 第十三圖：其係為本創作之整體組裝示意圖。 【主要元件符號說明】 2 待測電路板 4 輸入/輸出璋 6 發熱元件 10 載具 20 載板 22 拼接塊 222 孔洞 24 連結件 242 連結本體 2422 第一端 2423 第一穿孔 2424 第二端 2425 第二穿孔 244 插銷 2442 第一插銷 2444 第二插銷 26 支撐柱 27 開口 28 第一拼接塊 29 第二拼接塊 30 輸入/輸出調節裝置 10021692^^'^^ A〇101 ^ 15 1 / ^ 38 1 1013012387-0 M425281 101年01月10日核正替换頁 32 第一方向調節裝置 34 模組固定塊 342 孔洞 344 第一固定孔 346 把手部 36 滑塊裝置 362 固定塊 364 第一滑塊 366 第二固定孔 368 第三固定孔 38 第一模組固定座 382 第一凹槽 384 第四固定孔 386 第五固定孔 40 第二方向調節裝置 42 第二模組固定座 44 滑軌固定座 442 第二凹槽 46 第二滑塊 462 第六固定孔 50 第三方向調節裝置 51 固定座 512 柱體 52 導引柱 53 輸入/輸出測試接頭 54 輸入/輸出固定模% 10021692^^^^ A〇101 ? 16 I / 38 I 1013012387-0 M425281 542 第一孔洞 56 固定塊 562 第二孔洞 58 彈性件· 59 固定件 591 旋動件 60 抬升機構 62 金屬板 64 導引機構 642 凸出轴 66 支撐架 661 導引板 662 斜槽狀執道 68 馬達 70 散熱模組 71 底座 72 中空柱體 73 柱體 74 金屬塊 742 第一侧面 744 第二側面 7442 鰭片狀結構 75 連接件 76 風扇支樓柱 77 風扇 10021692^^'^ A〇101 第17頁/共38頁 101年.01月10日梭正菁换頁 1013012387-0Movement of 10021692^^^^ direction) (Refer to Figure 4B). The seventh month refers to the seventh figure, which is a plan view and a side view of the second direction adjustment of the foregoing embodiment. As shown in the figure, the second slider 46 of the second direction adjusting device 40 slides a plurality of second grooves 442 of the sliding brackets 44, and the child slide rails 44 are fixed to the first portion. The second module fixing seat 4 2 enables the movement of the '^歹笛一°Λ乐2 slider 4 6 along the sliding brackets 4 4 in the second direction (γ axis direction) (refer to the fourth drawing) ). Please refer to the fifth figure Α0101, page 9 / total 38 pages 1013012387-0 M425281 _ 101 years. On January 10th, the shuttle is replacing the page, and the fourth fixing hole 384 of the first module fixing seat 38 is fixed at the second The sixth fixing hole 462 of the slider 46 is fixed by a screw, so that the first direction adjusting device and the second direction adjusting device can be connected. Referring to the eighth drawing, which is a side view of the third direction adjusting device 50 of the foregoing embodiment. As shown in the figure, the fixing post 51 of the third direction adjusting device 50 is provided with a guiding post 52, and then the guiding post 52 is inserted through the input/output fixing module 54 having a plurality of first holes 542, followed by The fixing block 56 is fixed to the top end of the guiding post 52. As shown in the figure, the elastic member 58 is disposed between the input/output fixing module 54 and the fixing base 51, so that the input/output fixing module 54 can be disposed. The fixing member 59 can be inserted into the second hole 562 of the fixing block 56 to make the fixing member 59 contact the input/output fixing module 54 so as to be able to withstand the input/output fixing module 54. The elastic force of the elastic member 58 is balanced upward. The fixing member 59 of the embodiment is a bolt having a rotating member 591 at the top end thereof, and the inner wall of the second hole 562 is threaded, and the input/output fixing can be controlled by the downward rotation of the rotating member 591 (fixing member 59). The position of the module 54 and the input/output fixed module 54 are moved along with the guide post 52, so that the movement in the third direction (Z-axis direction) can be performed (see FIG. 4B). Referring to the third and fourth A and B diagrams, which are side views, partial side views and partial perspective views of another embodiment of the present invention; as shown in the figure, the test fixture of the circuit board of the present invention is The input/output test connector 53 is disposed in the input/output fixed module 54 of the third direction adjusting device 50, and when the circuit board 2 to be tested is to be tested, the first direction adjusting device 32 and the second direction adjusting device can be adjusted. 40 and the third direction adjusting device 50, the input/output test connector 53 can be aligned with the input/output port 4 of the circuit 2 to be tested for testing, the first direction adjusting device 32, the second direction adjusting device 40 10021692^MSt A0101 Page 10 of 38 1013012387-0 101. The 10th and 10th direction adjustment devices 50 are oriented perpendicular to each other, wherein the first direction, the second direction, and the third direction may be the X-axis direction. The appropriate selection of the γ-axis direction, the 2-axis direction, and the like can also be utilized by the holes 342 of the first direction adjusting device 32. When the third direction adjusting device 5 is disposed, the pillars 512 can be disposed in the holes 342. Then the input/output is fixed Module 54 is adjusted. The test fixture of the creation circuit board adjusts the position of the input/round test connector 53 by the input/output adjustment device, so that the entire set of input/output test modules need not be replaced, only some adjustments are needed. The ability to test different types of boards can save a lot of cost and time. Please refer to the ninth drawing, which is a front view of another preferred embodiment of the present invention; as shown in the figure, the test fixture of the circuit board of the present embodiment provides a carrier 10, a carrier 20, and a plurality of The support column 26, a lifting mechanism 60 and a heat dissipation module 7' have a circuit board 2 to be tested having at least one heat generating component 6 (such as a CPU or the like). The carrier 20 is disposed on the carrier 1 'the lifting mechanism 60 is disposed on the carrier 10 , and the heat dissipation module 70 is disposed on the lifting mechanism 6 , passes through one opening 2 7 of the carrier 20 and can contact a standby circuit One of the plates 2 is a heating element 6, and a support column 6 is disposed on the carrier 20 for supporting the circuit board 2 to be tested. Please refer to FIG. 10A and FIG. 10B, which are partial front and partial side views of the lifting mechanism 60 of the foregoing embodiment; as shown, the lifting mechanism 60 includes a metal plate 62 and a plurality of guides. The guiding mechanism 64, a support frame 66 and a motor 68. The guiding mechanism 64 is disposed on the metal plate 62 of the lifting mechanism 60. The guiding mechanism 64 has a plurality of protruding shafts 642, and the guiding frame 66 includes a guiding plate 661 opposite to the guiding mechanism 64. The guiding plate 661 is provided with a plurality of chute-shaped rails 662, so that the protruding shafts 642 of the guiding mechanism 64 are inserted into the chute-shaped rails 662 of the support frame 66, and the number is 10021692#单号A0101第11页/ 38 pages 1013012387-0 I On January 10, 101, the shuttle is replacing the universal motor 68 to cause the guide plate 661 to be displaced relative to the guiding mechanism 64 for controlling the lifting and lowering of the metal plate 62, as shown in the figure. The guiding mechanism 64 will advance in the oblique direction with the rails 662, so that the metal plate 62 can move up and down. Referring to FIG. 11 , it is a front view of the heat dissipating mechanism 70 of the foregoing embodiment; The heat dissipation module 7A includes a base 71, a plurality of hollow cylinders 72, a plurality of cylinders 73, a metal block 74, a plurality of connectors 75, a plurality of fan support columns 76 and at least one fan. ? . The hollow bodies of the heat dissipating mechanism 70 are disposed on the base 71, the pillars 73 are disposed in the hollow bodies 72, and a metal block 74 is disposed on the pillars 73. The movement of the hollow cylinders 72 allows the metal block 74 to move up and down to adjust the position. The metal block 74 of the embodiment includes a first side 742 and a second side 744, wherein the first side 742 is a contact heating element. 6, the second side 744 is provided with a plurality of heat dissipation fins 7442. The fan support column 76 is disposed on the base 71, and the fan 77 is disposed on the fan support column 76. This can accelerate the heat dissipation of the metal block 74. Please refer to the eleventh and twelfth drawings. The front view and the top view of the preferred embodiment of the present invention; as shown in the figure, the heat dissipation module 70 of the test fixture of the circuit board of the present invention is provided with the connecting members 75, and the connecting members 75 are respectively For a magnetic member (such as a magnet), the connecting members 75 can be adsorbed on the metal plate 62 of the lifting mechanism 60, and can be adjusted according to the position of the heating element 6 of the to-side main board 2 0 1013012387 -0 In this embodiment, the design of the heat dissipation module 70 can be used to replace the position with a different type of circuit board, and the lifting mechanism 6 can also cooperate with the hair source 10021692^ single number A0101 page 12 / 38 page M425281 heat element The size of 6 can be adjusted to the upper and lower positions to test different types of circuit boards, saving |1〇1 January 10 'so only need to make some adjustments and a lot of cost and time. Please refer to the thirteenth picture, The overall assembly of this creation , wherein the connecting members 24 are connected to the splicing blocks 22, so that the splicing interfaces 27, the slabs 20 are further arranged into a block 22, and vacated one on the carrier 10' The support post 26 is disposed on the carrier 22 for supporting the to-side circuit board 2. The first direction adjusting device 32 of the wheel input/output adjusting device 30 is disposed in the second direction adjusting device 4, the third direction adjusting device 5 is disposed in the first direction adjusting device 32, and the input/output test connector 53 is further set. The two-direction adjusting device 5〇, and finally the second direction adjusting device 40 is disposed on the carrier 1〇, so that the input/output adjusting device 30 can be used to adjust the position of the input/output test connector 53 to The position of the input/output port 4 of the circuit board 2 to be tested is matched, wherein the adjustment directions of the first direction adjusting device 32, the second direction adjusting device 4, and the third direction adjusting device 50 are perpendicular to each other. In addition, the lifting mechanism 6 is disposed on the carrier 1 , and the heat dissipation module 70 is further disposed on the lifting mechanism 6 , and the heat dissipation module 70 can match the position of the heating element 6 of the circuit board 2 to be tested. The position of the opening 27 of the carrier 20 can be changed at the same time, and the lifting mechanism 60 is used to adjust the upper and lower positions of the heat dissipation module 70. Furthermore, the model can be applied to the motherboard 2 to be tested, and the position of the carrier 2 〇, the input/output test connector 53 and the heat dissipation module 70 can be changed to match the input/output 埠 4 and the heating element. 6 position. When the circuit board 2 to be tested is replaced, the carrier board 20 of the carrier 10, the input/output test connector 53 and the heat dissipation module 70 need not be replaced, so that a large amount of cost can be saved, and the entire carrier 10 is not required to be replaced, thereby reducing The time to replace the production line. However, the above is only the preferred embodiment of the present invention, and 10021692^^ A〇101 page 13 / total 38 ! 1013012387-0 M425281 __ 101 January 101 shuttle replacement page is not used to limit The scope of the creation and the equivalent changes and modifications of the shape, structure, characteristics and spirit described in the scope of the patent application shall be included in the scope of the patent application of this creation. This creative department is a novelty, progressive and available for industrial use. It should meet the requirements of patent applications stipulated in China's Patent Law. It is undoubtedly a new type of patent application, and the Prayer Council will grant patents as soon as possible. For prayer. BRIEF DESCRIPTION OF THE DRAWINGS [0005] The first drawing is a perspective view of a preferred embodiment of the present invention; the second drawing is a partial top view and a partial side view of a preferred embodiment of the present invention; Figure 3 is a side elevational view of another preferred embodiment of the present invention; Figure 4A is a partial side view of another preferred embodiment of the present invention. A partial perspective view of another preferred embodiment of the present invention: a partial top view of another preferred embodiment of the present invention; and a sixth view: a portion of another preferred embodiment of the present invention 7 is a partial plan view and a partial side view of another preferred embodiment of the present invention; FIG. 8 is a partial side view of another preferred embodiment of the present invention; Figure: is a front view of another preferred embodiment of the present invention; Figure 10A is a partial front view of another preferred embodiment of the present invention> Partial side view of another preferred embodiment * 10021692# single number deletion 1 帛 14 pages / total 38 Stomach 1013012387-0 M425281 101.01月10日正正换页11th image: a partial front view of another preferred embodiment of the present invention; and twelfth figure: it is another A top view of a preferred embodiment is a thirteenth view: it is a schematic view of the overall assembly of the present invention. [Main component symbol description] 2 Circuit board to be tested 4 Input/output 璋6 Heating element 10 Carrier 20 Carrier plate 22 splicing block 222 Hole 24 Link 242 Connecting body 2422 First end 2423 First perforation 2424 Second end 2425 Two perforations 244 pin 2442 first pin 2444 second pin 26 support post 27 opening 28 first splicing block 29 second splicing block 30 input/output adjusting device 10021692^^'^^ A〇101 ^ 15 1 / ^ 38 1 1013012387 -0 M425281 January 10, 101 Nuclear replacement page 32 First direction adjustment device 34 Module fixing block 342 Hole 344 First fixing hole 346 Handle portion 36 Slide device 362 Fixing block 364 First slider 366 Second fixing Hole 368 Third fixing hole 38 First module fixing seat 382 First groove 384 Fourth fixing hole 386 Fifth fixing hole 40 Second direction adjusting device 42 Second module fixing seat 44 Slide rail fixing seat 442 Second concave Slot 46 Second Slider 462 Sixth Fixing Hole 50 Third Direction Adjusting Device 51 Mounting Block 512 Column 52 Guide Post 53 Input/Output Test Connector 54 Input/Output Fixing % 10021692^^^^ A〇101 ? 16 I / 38 I 1013012387-0 M425281 542 First hole 56 Fixing block 562 Second hole 58 Elastic member · 59 Fixing piece 591 Rotating member 60 Lifting mechanism 62 Metal plate 64 Guide Mechanism 642 Projection shaft 66 Support frame 661 Guide plate 662 Oblique groove guide 68 Motor 70 Heat dissipation module 71 Base 72 Hollow cylinder 73 Column 74 Metal block 742 First side 744 Second side 7442 Fin-like structure 75 Connector 76 Fan branch column 77 Fan 10021692^^'^ A〇101 Page 17 of 38 Page 101. January 10th Shuttle Zhengjing Page 1013012387-0