M419240 五、新型說明： 【新型所屬之技術領域】 結構 本創作係有關一種天線結構，特別沿 種複合式天線 【先前技術】 接收亡通訊技術的發展，電子通訊產品對於訊號的 上來越重視;而消費者對於電子通訊產品要 Μ二 Ά、便於攜帶及收訊良好等特點，加上高 二IT求以達成小型化的目的。而天線的效能為 :曰^質重要的—環；各種無線通訊系統的天 =應用而有不同的特性需求，例如，無線通 露=:=!露型及内建型，其令外露型係將天線外 ，，、、、’· 機體外，而内建型天㈣是將平板天線 裝設於殼體上，再將Μ触φ正4』 败天綠 訊產品中，提供產二板式天線—同裝設於無線通 如U專Γ的晶片型天線，在製作上會有許多缺點，例 線製程係以印刷的方式將天線線路製作在陶 轉角連接處的精確度非常f因此天線線路在 線路不連接的情況;在轉角處會產生 , _ 再 方面’由於上述的印刷作堂/5M419240 V. New description: [New technology field] Structure This creation is related to an antenna structure, especially along a kind of composite antenna. [Prior Art] The development of receiving communication technology, electronic communication products pay more attention to the signal; Consumers are second to none in terms of electronic communication products, easy to carry and good reception, and high-tech IT seeks to achieve miniaturization. The performance of the antenna is: 重要^ quality--ring; the days of various wireless communication systems = application and different characteristics, for example, wireless communication ===! exposed and built-in type, which makes the exposed type The outside of the antenna,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, - The same type of chip antenna installed in the wireless communication system, there are many disadvantages in the production. The accuracy of the method of making the antenna line at the joint of the ceramic corner is very f, so the antenna line is When the line is not connected; it will be generated at the corner, _ again] due to the above print hall/5
工的多個表面上印刷天線線路，因此，必須利用I 製配:f新r等程序，故在 品質上無法有效掌握，且相當耗時先的印刷製私在印刷的 3/14 Μ19240 本案創作人有鑑於上述習㈣結财置於實 時的缺失’且積累個人從事相關產業開發實務上多^之叙 研究’終於提出-㈣計合理且有效改善上述^ 【新型内容】 本創作的目的之一，在於提供一種複合式天線 所提，複合式天線結構可有效地提高天線製作 、：月又，以仔到較佳天線品質及接收訊號的特性。 並且j作的目的之―，在於提供_種複合式天線結構， 其具有縮小天線尺寸的功效。 本創作係提供一種複合式天線結構，包含： 本體：其介電常數介W之間；一批覆層；； 於5玄南介電本體，且該批覆層的表面上S有-個預定線= =路=金屬化線路層’其成型於該批覆層上的該預 本=係提供—種複合式天線結構，包含：—高介電 於二二電常數介於之間；—批覆層，其包覆 綠= ;ι’電本體，且雜覆層上設有_個雷射成型之預定 料L區戈，以及一金屬化線路層，其成型於該預定線路區 如费Ϊ上述構造，該複合式天線結構可利用高介電本體與 i a而製作出相當精密的天線線路結構 ’並利用批覆層 數等的==呆護效果;另外’高介電本體之高介電常 刃符性了達到縮小天線整體尺寸及提高天線特性的 4/14 效果，進而符合小型化電子產品的需求。 閱以ΐϊ能更進—步瞭解本創作之特徵及技術内容’請參 佯m關本創作之詳細說明與附圖，然而所附圖式僅提 供，考與說日㈣，並非时對本創作加錄制者。 【實施方式】 料勺舜^作係提供一種複合式天線結構’其系利用塑膠材 到=南介電本體’再於塑膠材料上製作天線線路， 到縮小天線整體尺寸之功效。 疋 叫麥考圖！；本創作所提出的複合式天線結構1包括 體1 〇、批覆層1 1及成型於批覆層1 1的表面 體i 匕線路層12。在本具體實施例中，該高介電本 ^减崎質，但不以此為限；該高介電本體工 創作之複合式天線結構工的主體’以利用高介電 本肢10之高電氣特性，其介電常數介於約i i 2〇〇之 :線小天線尺寸’且可具有高天線特性的複合式 1 η另、f面’本創作利用批覆層1 1包覆於高介電本體 X服傳統製程中較難在高介電本體丄Q直接成型 ”題，其中高介電本體1 ◦可為介電常數為10 :、…'之陶究本體’而批覆層1 1可為-塑膠層。以下將 詳細說明本創作的多種具體實施態#: 、The antenna line is printed on a plurality of surfaces of the work. Therefore, it is necessary to use the I system: f new r, etc., so the quality cannot be effectively grasped, and the time-consuming printing system is printed in the 3/14 Μ 19240 case. In view of the above-mentioned Xi (4), the wealth is placed in the real-time lack of 'and the accumulation of individuals engaged in the development of related industries, and the research on it's finally finished' - (4) Reasonable and effective improvement of the above ^ [New content] One of the purposes of this creation In the case of providing a composite antenna, the composite antenna structure can effectively improve the antenna fabrication, and the characteristics of the antenna and the received signal are better. And the purpose of j is to provide a composite antenna structure, which has the effect of reducing the size of the antenna. The present invention provides a composite antenna structure comprising: a body: a dielectric constant between W; a plurality of cladding layers;; a 5 Xuannan dielectric body, and the surface of the batch of coatings has a predetermined line = = road = metallized circuit layer 'the pre-form formed on the batch of cladding = provides a composite antenna structure, comprising: - high dielectric between the two electrical constants; - batch coating, Covering green = ; ι 'electric body, and the impurity coating is provided with _ a laser-formed predetermined material L-zone, and a metallized circuit layer formed in the predetermined line region, such as the above-mentioned configuration, The composite antenna structure can make a relatively precise antenna circuit structure by using a high dielectric body and ia, and utilize the == dodging effect of the number of layers of the coating; in addition, the high dielectric constant edge of the high dielectric body is It achieves the 4/14 effect of reducing the overall size of the antenna and improving the antenna characteristics, thus meeting the needs of miniaturized electronic products. Read more to understand the characteristics and technical content of this creation. Please refer to the detailed description and drawings of the creation. However, the drawings are only provided, and the test and the day (4) are not added to the creation. Recorder. [Embodiment] The material scooping system provides a composite antenna structure, which uses a plastic material to the south dielectric body to fabricate an antenna line on the plastic material to reduce the overall size of the antenna.疋 Called McCaw! The composite antenna structure 1 proposed by the present invention comprises a body 1 批, a cladding layer 1 1 and a surface body i 匕 circuit layer 12 formed on the cladding layer 1 1 . In the present embodiment, the high dielectric material is reduced, but not limited thereto; the body of the composite antenna structure created by the high dielectric body is used to utilize the high dielectric body 10 Electrical characteristics, the dielectric constant is about ii 2 :: small antenna size 'and can have high antenna characteristics of the composite 1 η another, f-face' This creation uses the cladding layer 1 1 to coat the high dielectric The ontology X is more difficult to form directly in the high dielectric body 丄Q in the traditional process. The high dielectric body 1 ◦ can be a ceramic body with a dielectric constant of 10:,...' and the cladding layer 1 1 can be - Plastic layer. The following will describe in detail the various implementations of this creation #: ,
田^ΐ考圖2及圖2A ’第一種具體實施態樣主要係利 用给射直接成型方法（la—et咖etuHng methG 據hod)將批覆層“包覆於高介電本體1〇，再將金屬 5/14 M419240 化線路層12成型於批覆層1 ^上，用以作為行動通訊裝置 之天線線路，以接收/傳送訊號。更具體地說明，該高介電 本體1 0係被放置於一模具中，再利用自動化設備以模内 射出方法將填有有機金屬複合物粒子（如pd2+、Cu2+之有 機複5物）之塑膠材料，如聚丙烯（，pp ) 或 t 對本一曱 g夂丁 一醇自旨（p〇lybutyiene terephthalate， PBT)等固定、包覆於該高介電本體丄〇以形成該批覆層 ^ 1，接著，利用雷射（如）將批覆層丄丄的一預定線路 區域1 1 1改質形成一雷射活化區域，再利用一金屬沈積 方法，例如無電鍍（化學鍍）方法，將導電金屬材料，如銅 層、鎳層或金層直接附著於該批覆層2丄的預定線路區域工 11上，以形成可接收無線訊號之金屬化線路層丄2。 t請配合圖1、圖2所示，該高介電本體1 〇係為一長方 形立體結構’其具有H —底面及四個位於該頂面盘 該底面之間的側面’而射出成型之批覆層工丄至少包覆該 ^方形立體結構的三個表面，例如頂面及兩個側面，而在 刖述LDSf程之後’金屬化線路層i 2則成型於批覆層工 1 :預定線路區域i丄工上。值得說明的是，高介電本體 是二結構101，例如圖2所示之柱體或 ，其係用以在射出製程中提蚊位中心位置的 立體，ί® 2A戶斤示，該批覆層1 1係包覆該長方祀 ，構之南介電本體10的頂面、兩個側面以及部分的 體二=此實施例中，金屬化線路層12可由高介電本 的頂面延伸至高介電本體1〇的側面以至於高介 6/14 M419240 :本體1 0的底面，而位於該底面的金屬化 2義為一焊接點121，該烊接點121即可用:焊接: —基板，如電路板等等（圖未 绊接於 接端子，因此可簡化後續製程^雜而度:必在另外褒設谭 另外，本創作可利用另一種具 的複合式天線結構i。請參考圖2B :樣末達成相同 施態樣主要係利用雙料射出 射體實 =之_料包覆所述之高介電:體 式為在第-次射出成型時，使用;'電= 方 萝作，阵义日丄- 驭生蚪使用不可電鍍的塑料 金屬錢二㈣行飼刻活化與金屬化，使 法的製程方式為在第而弟-種做 料，隨後蝕刻第一-欠射出J出成㈣使用可電錢的塑 將第-塌成型之塑並且⑽⑽ 具内，並執行第-接者’將元件置於模 射_之塑化之 與第二塑膠部件即被第一塑膠部件11A 本實施例中，第一p f成之批覆層11所包覆，而在 屬材料沈積於苴/膠部件11乂係為一種無法直接將金 第二塑谬物二：(如無摻雜金屬觸媒的塑料)， 其上的材w如㈣種/直接料屬_沈積於 塑料），而第二屬觸媒的塑料或含有機物的 夕牛11β的表面即可自然地界定出 7/14 M419240 預定線路區域1 1 1，以利金屬化線路層i 2的成型；換 言之，本實施例中所使用之雙料射出的模具必須事先設 計’使第二塑膠部件11B的位置恰好構成天線線路的^ 樣，故在雙料射出之後，即可利用化學鍍法沉積化學銅或 化學鎳的金屬化線路層1 2。 一 綜上所述，本創作可利用塑膠材料披覆於高介電本體 1 0上，以形成尺寸小、特性佳的晶片型天線。另外，請 參考圖3，其為本創作之複合式天線結構1進行天線特性 測試之Smith-Chart圖形；而圖4則為本創作之晶片型天 線1進行特性測試之S11曲線圖，其中a點的量測數據為 -10.01 dB (頻率為2.39GHz) ; B點的量測數據為_1〇 〇7犯 (頻率為2.51 GHz );而圖5則為本創作之晶片型天線1所 羞測出的電壓駐波比（Voltage Standing Wave Ratio; VSWR) 對頻率變化的曲線圖。 再一方面，請參考下表一，其顯示本創作之複合式天 線結構1與傳統天線在特性上的比較：其中，由增益部分 了以發現，本創作之複合式天線結構1的增益特性雖.然小 於傳統天線，但兩者的差異性不大，換言之，本創作之複 合式天線結構1在特性上均可滿足接收訊號的要求。 表一Tian ^ΐ考图2 and Fig. 2A' The first specific embodiment mainly uses the direct injection molding method (la-et coffee etuHng methG according to hod) to coat the coating layer on the high dielectric body 1〇, and then A metal 5/14 M419240 circuit layer 12 is formed on the cladding layer 1^ for use as an antenna line for the mobile communication device to receive/transmit signals. More specifically, the high dielectric body 10 is placed In a mold, a plastic material filled with an organometallic composite particle (such as an organic compound of pd2+ or Cu2+), such as polypropylene (, pp) or t, is injected into the mold by an in-mold injection method. Fixing and coating the high dielectric body 丄〇 to form the batch of coatings, and then using a laser (for example) to make a predetermined coating of the coating layer by means of a laser (eg, p〇lybutyiene terephthalate, PBT) The line region 1 1 1 is modified to form a laser activation region, and a conductive metal material such as a copper layer, a nickel layer or a gold layer is directly attached to the batch layer by a metal deposition method such as electroless plating (electroless plating). 2丄 of the scheduled line area on the work 11, Forming a metallized circuit layer 可2 capable of receiving a wireless signal. t. As shown in FIG. 1 and FIG. 2, the high dielectric body 1 is a rectangular solid structure having a H-bottom and four on the top surface. The side of the disk between the bottom faces and the injection molding process comprises at least covering the three surfaces of the three-dimensional structure, such as the top surface and the two sides, and after the LDSf process, the metallization circuit layer i 2 is formed in the cladding layer 1: the predetermined line area i is completed. It is worth noting that the high dielectric body is a two structure 101, such as the cylinder shown in Fig. 2, which is used for lifting in the injection process. The three-dimensional position of the mosquito bit center, ί® 2A, shows that the cover layer 11 covers the rectangular ridge, and the top surface, the two sides and the partial body 2 of the south dielectric body 10 are configured. The metallized circuit layer 12 may extend from the top surface of the high dielectric body to the side of the high dielectric body 1〇 such that the high dielectric 6/14 M419240: the bottom surface of the body 10, and the metallization on the bottom surface is a Solder joint 121, the joint point 121 can be used: welding: - substrate, such as circuit board, etc. The figure is not connected to the terminal, so it can simplify the subsequent process. It must be set up separately. This creation can use another compound antenna structure i. Please refer to Figure 2B: The pattern mainly uses the double-ejected emitter to cover the high dielectric: the volume is used during the first injection molding; 'Electric = Fangluo, Array Dayi - 驭生蚪Using non-electroplatable plastic metal money two (four) line engraving activation and metallization, the process of the method is to do the material in the first brother, then etch the first - undershoot J out (four) use the electric money plastic The first pf is molded and (10) (10) is carried out, and the first connector is used to place the component in the molding process and the second plastic component is the first plastic component 11A. In this embodiment, the first pf is formed. The coating 11 is coated, and the genus material is deposited on the bismuth/rubber component 11 as a metal that cannot directly directly bond the gold to the second plastic: (such as a plastic without an undoped metal catalyst) w such as (four) species / direct material _ deposited in plastic), and the second genus of plastic or organic matter containing animal 11-11 The surface can naturally define the 7/14 M419240 predetermined line area 11 1 to facilitate the formation of the metallized circuit layer i 2; in other words, the two-shot mold used in this embodiment must be designed in advance to make the second plastic The position of the component 11B is exactly the same as that of the antenna circuit, so that after the two materials are ejected, the metallized wiring layer 12 of chemical copper or chemical nickel can be deposited by electroless plating. In summary, the present invention can be coated on the high dielectric body 10 with a plastic material to form a wafer type antenna having a small size and excellent characteristics. In addition, please refer to FIG. 3, which is a Smith-Chart pattern of the antenna characteristic test of the composite antenna structure 1 of the present invention; and FIG. 4 is a S11 graph of the characteristic test of the wafer antenna 1 of the present invention, wherein a point The measurement data is -10.01 dB (frequency is 2.39 GHz); the measurement data at point B is _1 〇〇 7 (frequency is 2.51 GHz); and Figure 5 is the shame of the wafer antenna 1 of the creation. A plot of the voltage standing wave ratio (VSWR) versus frequency. On the other hand, please refer to the following table 1. It shows the comparison between the characteristics of the composite antenna structure 1 and the conventional antenna of the present invention. Among them, the gain portion is found, and the gain characteristics of the composite antenna structure 1 of the present invention are However, it is smaller than the conventional antenna, but the difference between the two is not large. In other words, the composite antenna structure 1 of the present invention can satisfy the requirements of receiving signals in characteristics. Table I
中心頻率 頻寬 增益 傳統天線 2455 MHz 2390〜2520 MHz 3.06 dB 本創作之天 2450 MHz 2390〜2510 2.46 dB 8/14Center frequency Bandwidth Gain Traditional antenna 2455 MHz 2390~2520 MHz 3.06 dB The day of creation 2450 MHz 2390~2510 2.46 dB 8/14
另外’凊參考圖2C，本創作可將批覆層^包覆於高 ;i私本把1 〇，再以雷射方式去除具有特定圖樣之大部分 ，批覆1，再以關等方式去除殘留部分之批覆層工 合而使二”電本體工〇裸露出來，裸露之高介電本體工〇 =成前述之預定線路區域1丄的圖樣，再利用前處理及 積方法例如揲電鍍（化學鍍）方法，將導電金屬材 :線路=〜層附著於高介電本體10的預定 m 以形成可接收無線訊號之金屬化線路 '。換言之，該預定線路區域11係由批覆層11的 至：介電本體10上’而使金屬化線路層12成 ^預疋線路區域1 1 1進以構成可接收無線訊號之線 姓構請參考圖6至圖6B’本創作之複合式天線 種"形式的天線。相較於前述之晶片型 6入射1所不之背盍形式天線之批覆層11的外型並不 :全=高介電本體10的形狀。以前文所述之LDS= c Γ 本創作同樣將含有機金屬複合物粒子（如扯+、 u之有機複合物)之塑膠材料，如 ;J:_本體10被7:部 圖所不，預定線路區域1 1 1係為—蛇 9/14 M419240 狀環繞的態樣。而在本具體實施例中’批覆層i丄可形成 具有容置空間之外殼部件，該容置空間主要係用於容置電 子產。。之基板、電路元件（圖未示）等，而被批覆層1 1 所包覆之南介電本體1 〇亦設置於該容置空間中。另一方 面’金屬化線路層1 2上方更可設有—保護元件（圖未示）， 例如利用塗佈方法'喷漆方法在金屬化線路層丄2上形 層，或是利用貼合、卡扣等方法蓋設於金屬化線 θ 1 2上之保護蓋，以避免該金屬化線路 磨耗，但不以上料限。 Η的到傷 綜上所述，本創作至少具有以下優點： 1、^有“化生產的功效。由於本創作利用塑膠材料披 :於而介電本體上，再將金屬化線路層成型於該塑膠 料上以形成天線線路，而上述的製程均可以應 動化的生產道次，故不需以人王的方式In addition, 'Refer to Figure 2C, this creation can cover the overlay layer ^ high; i privately put 1 〇, then remove most of the specific pattern by laser, batch 1 and then remove the residual part by means of off The batch coating works to expose the second "electrical body work", and the exposed high dielectric body work = the pattern of the predetermined line area 1 ,, and the pre-processing and product method such as ruthenium plating (electroless plating) The conductive metal material: the line = ~ layer is attached to the predetermined m of the high dielectric body 10 to form a metallization line that can receive the wireless signal. In other words, the predetermined line area 11 is from the layer 11 to: the dielectric body 10"', and the metallized circuit layer 12 is formed into a pre-wired line area 1 1 1 to form a line that can receive wireless signals. Please refer to FIG. 6 to FIG. 6B for the antenna of the present invention. The appearance of the cladding layer 11 which is incident on the wafer type 6 with respect to the backside antenna of the above-mentioned wafer type 6 is not: the shape of the full = high dielectric body 10. The LDS = c 以前 previously described is the same Will contain organic metal composite particles (such as pull +, u The plastic material of the organic composite, such as; J: _ body 10 is 7: part of the map, the predetermined line area 1 1 1 is a snake 9 / 14 M419240-like surrounding. In this embodiment 'The coating layer i 丄 can form a housing part having a accommodating space, which is mainly used for accommodating electronic substrates, substrates, circuit components (not shown), etc., and is covered by the cladding layer 1 1 The south dielectric body 1 〇 is also disposed in the accommodating space. On the other hand, the 'metallized circuit layer 1 2 can be further provided with a protective component (not shown), for example, by a coating method 'painting method in metal The upper layer of the circuit layer 丄2, or the protective cover which is covered on the metallization line θ 1 2 by means of lamination, snapping, etc., to avoid the wear of the metallized line, but not the above material limit. In summary, the creation has at least the following advantages: 1. There is a "productive effect". Since the creation uses a plastic material to cover: on the dielectric body, a metallized circuit layer is formed on the plastic material to form an antenna line, and the above processes can all be driven by the production process, so it is not necessary to Way of the king
;勢因此在製程時間、成本的管控上均具有相當S 2 ::方面’本創作使用塑膠材料包覆高介電本體’因 1在相_天線產生較 該塑膠材料可以有效減輕天線本身的重量;二； :材料可視為-種吸震材料，故可降低二； 預先在㈣ 二有籍偏疋的線路結構、圖樣，該線路結構可以 ς ^雜的結構，例如轉角或是彎折等等，故〜 作業時’即可以達成具有巍精度的天 10/14 線結構，進而解決傳統印刷製程的缺點。 4 士創作可應用於多種態樣之天線’如晶片型天線或背 盍型天線等，故可滿足多樣化的產品需求。 以上所述僅為本創作之較佳可行實施例，非因此侷限 才創作之專利範圍，故舉凡運用本創作說明書及圖示内容 所為之等效技術變化，均包含於本創作之範圍内。 【圖式簡單說明】 圖1係顯示本創作之複合式天線結構的立體分解圖。 圖2係顯示本創作之複合式天線結構的第一實施例側視 圖0 圖2A係顯示本創作之複合式天線結構的第二實施例側視 圖。 圖2B係顯示本創作之複合式天線結構的第三實施例側視 圖。 圖2C係顯示本創作之複合式天線結構的第四實施例側視 圖 、 圖3係顯示本創作之複合式天線結構之Smith-Chart圖形。 圖4係顯示本創作之複合式天線結構的S11曲線圖。 圖5係顯示本創作之複合式天線結構的電壓駐波比對頻率 變化的曲線圖。 圖6係顯示本創作之複合式天線結構的第四實施例立體 圖。 圖6A係顯示本創作之複合式天線結構的第四實施例俯視 圖0 M419240 圖6B係顯示本創作之複合式天線結構的第四實施例侧視 圖。 【主要元件符號說明】 0 複合式天線結構 高介電本體 101 定位結構 1 批覆層 1 A 第一塑膠部件 1 B 第二塑膠部件 111 預定線路區域 2 金屬化線路層 121 焊接點 12/14Therefore, the process has considerable S 2 :: aspects in the control of process time and cost. This creation uses a plastic material to coat the high dielectric body. Because the phase is generated in the phase _ antenna, the weight of the antenna itself can be effectively reduced. ; 2; : The material can be regarded as a kind of shock absorbing material, so it can be reduced by two; in advance (4) two line structure and pattern with partiality, the line structure can be complicated structure, such as corner or bend, etc. Therefore, when working, it can achieve a day 10/14 line structure with 巍 precision, which solves the shortcomings of the traditional printing process. The 4th creation can be applied to a variety of antennas such as wafer antennas or back-type antennas, so it can meet a variety of product needs. The above description is only a preferred embodiment of the present invention, and the scope of the patents created by the present specification and the illustrated contents is included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing the composite antenna structure of the present invention. Fig. 2 is a side elevational view showing a first embodiment of the composite antenna structure of the present invention. Fig. 2 Fig. 2A is a side elevational view showing a second embodiment of the composite antenna structure of the present invention. Fig. 2B is a side elevational view showing a third embodiment of the composite antenna structure of the present invention. Fig. 2C is a side view showing a fourth embodiment of the composite antenna structure of the present invention, and Fig. 3 is a view showing a Smith-Chart pattern of the composite antenna structure of the present invention. Figure 4 is a graph showing the S11 of the composite antenna structure of the present invention. Fig. 5 is a graph showing the voltage standing wave ratio versus frequency variation of the composite antenna structure of the present invention. Fig. 6 is a perspective view showing a fourth embodiment of the composite antenna structure of the present invention. Fig. 6A is a plan view showing a fourth embodiment of the composite antenna structure of the present invention. Fig. 0 M419240 Fig. 6B is a side elevational view showing a fourth embodiment of the composite antenna structure of the present invention. [Main component symbol description] 0 Composite antenna structure High dielectric body 101 Positioning structure 1 Batch coating 1 A First plastic part 1 B Second plastic part 111 Prescribed wiring area 2 Metallized wiring layer 121 Soldering point 12/14