TWM417648U - Bump structure - Google Patents

Bump structure Download PDF

Info

Publication number
TWM417648U
TWM417648U TW100212243U TW100212243U TWM417648U TW M417648 U TWM417648 U TW M417648U TW 100212243 U TW100212243 U TW 100212243U TW 100212243 U TW100212243 U TW 100212243U TW M417648 U TWM417648 U TW M417648U
Authority
TW
Taiwan
Prior art keywords
bump structure
bump
Prior art date
Application number
TW100212243U
Other languages
Chinese (zh)
Inventor
Chin-Tang Hsieh
Chih-Ming Kuo
Original Assignee
Chipbond Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipbond Technology Corp filed Critical Chipbond Technology Corp
Priority to TW100212243U priority Critical patent/TWM417648U/en
Publication of TWM417648U publication Critical patent/TWM417648U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
TW100212243U 2011-07-05 2011-07-05 Bump structure TWM417648U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100212243U TWM417648U (en) 2011-07-05 2011-07-05 Bump structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100212243U TWM417648U (en) 2011-07-05 2011-07-05 Bump structure

Publications (1)

Publication Number Publication Date
TWM417648U true TWM417648U (en) 2011-12-01

Family

ID=46449879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100212243U TWM417648U (en) 2011-07-05 2011-07-05 Bump structure

Country Status (1)

Country Link
TW (1) TWM417648U (en)

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees