五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種散熱模組，特別係有關於一種具有 複數個風扇之散熱模組。 【先前技術】 [0002] 首先請參閱第1圖’一般使用在伺服器上的散熱模組主要 包含有一基板S以及複數個風扇F，其中前述風扇F係沿著 X轴方向排列’而每個風扇F則可分別透過螺絲鎖固於基 板S的表面上。應了解的是，由於風扇F本身的重量往往 容易使基板S沿箭頭A所示方向產生翹曲變形，所以當欲 將散熱模組設置於一伺服器内部時，往往會造成組裝上 的困難’嚴重時更可能因為基板S過度變形而導致線路故 障等不良後果。 【新型内容】 [0003] 為了提升散熱模組的結構強度以避免其產生紐曲變形， 本創作之一實施例提供一種散熱模組，包括複數個風扇 以及一長條形之連接件，前述風扇以並聯方式排列，彼 此於側向臨接，其中每一風扇分別具有至少一凹槽。前 述長條形之連接件的兩端分別連接兩個相鄰之風扇，且 連接件係嵌設於兩個相鄰之風扇的凹槽内。 [0004] 於一實施例中’前述散熱模組更包括一基板以及複數個 鎖固件’前述鎖固件穿過基板以及連接件，藉以將前述 風扇固定於基板上。 [0005] 於一實施例中’前述風扇更分別具有一開孔，前述開孔 表單编號A0101 第3頁/共19頁 M414604 與凹槽相通，且鎖固件係穿過基板並延伸進入前述風扇 之開孔内。 [0006] 於一實施例中，前述連接件具有兩個開口，分別對應於 兩個相鄰風扇的凹槽，且前述鎖固件分別穿過前述開口 [0007] [0008] [0009] [0010] [0011] [0012] [0013] [0014] [0015] 於一實施例中，前述凹槽分別位於前述風扇之邊緣。 於一實施例中，前述連接件含有金屬材質或為一剛性材 質。 於一實施例中，前述連接件係由一冷軋鋼板（SPCC)或冷 軋鍍鋅板（SGCC)所製成。 於一實施例中，前述連接件卡合於相鄰風扇之凹槽内。 於一實施例中，前述風扇更分別具有一凸塊，前述凸塊 形成於凹槽内，且連接件與凸塊相互卡合。 於一實施例中 開口相互卡合 於一實施例中 於一實施例中 前述連接件具有至少一開口，且凸塊與 前述風扇係沿一直線方向排列。 前述風扇係以矩陣方式排列。 為使本創作之上述目的、特徵、和優點能更明顯易懂， 下文特舉較佳實施例並配合所附圖式做詳細說明。 【實施方式1 [0016] 請一併參閱第2至3圖，本創作一實施例之散熱模組主要 包括複數個風扇10、至少一連接件20以及一基板30，前 表單編號A0101 第4頁/共19頁 M41.4604 述風扇ίο以並聯方式排列，彼此於側向鄰接，大致沿一 直線方向（X轴方向）延伸，此外前述風扇10另可透過鎖固 件40(例如螺絲）而分別結合於基板30上（如第3圖所示） 。舉例而言，前述基板30可為一印刷電路板，前述連接 件20則可包含金屬或其他剛性材質，例如可由冷軋鋼板 (SPCC)或冷軋鍍鋅板（SGCC)所製成。需特別說明的是 ，每個連接件20係嵌設於相鄰的兩個風扇10之中，如此 一來不僅能使風扇10沿著X軸方向穩固地相互連接，同時 更可藉此提高散熱模組的整體結構強度，以避免基板30 受到風扇10的重量影響而產生翹曲。V. New description: [New technology field] [0001] This creation department is about a heat dissipation module, especially related to a heat dissipation module with a plurality of fans. [Prior Art] [0002] First, please refer to FIG. 1 'The heat dissipation module generally used on the server mainly includes a substrate S and a plurality of fans F, wherein the fan F is arranged along the X-axis direction and each The fan F can be respectively fixed to the surface of the substrate S by screws. It should be understood that since the weight of the fan F itself tends to cause the substrate S to warp and deform in the direction indicated by the arrow A, when the heat dissipation module is to be disposed inside a server, the assembly difficulty is often caused. In severe cases, it is more likely to cause adverse consequences such as line failure due to excessive deformation of the substrate S. [New Content] [0003] In order to improve the structural strength of the heat dissipation module to avoid the deformation of the heat distortion, an embodiment of the present invention provides a heat dissipation module including a plurality of fans and a long connecting piece, the fan Arranged in parallel, adjacent to each other laterally, wherein each fan has at least one groove. The two ends of the connecting member are connected to two adjacent fans, and the connecting members are embedded in the grooves of two adjacent fans. In one embodiment, the heat dissipation module further includes a substrate and a plurality of fasteners. The fastener passes through the substrate and the connector to fix the fan to the substrate. [0005] In an embodiment, the fan has an opening, and the opening form number A0101 3/19 M414604 communicates with the groove, and the fastener passes through the substrate and extends into the fan. Inside the opening. [0006] In an embodiment, the connecting member has two openings respectively corresponding to the grooves of two adjacent fans, and the foregoing fasteners respectively pass through the opening [0007] [0008] [0009] [0012] [0014] In an embodiment, the grooves are respectively located at edges of the fan. In one embodiment, the connector is made of a metal material or a rigid material. In one embodiment, the connector is made of a cold rolled steel plate (SPCC) or a cold rolled galvanized sheet (SGCC). In an embodiment, the connecting member is engaged in a recess of an adjacent fan. In an embodiment, the fan further has a protrusion, the protrusion is formed in the groove, and the connecting member and the protrusion are engaged with each other. In one embodiment, the openings are engaged with each other. In one embodiment, the connector has at least one opening, and the bumps are aligned with the fan system in a straight line direction. The aforementioned fans are arranged in a matrix. The above described objects, features, and advantages of the present invention will become more apparent from the written description. [Embodiment 1] Referring to Figures 2 to 3, the heat dissipation module of the present embodiment mainly includes a plurality of fans 10, at least one connector 20, and a substrate 30. The front form number A0101 is page 4. / 19 pages of M41.4604 The fans are arranged in parallel, adjacent to each other in the lateral direction, extending substantially in the direction of the line (X-axis direction), and the fan 10 can be separately coupled to the lock 40 (for example, a screw). On the substrate 30 (as shown in Figure 3). For example, the substrate 30 may be a printed circuit board, and the connector 20 may comprise a metal or other rigid material, such as a cold rolled steel sheet (SPCC) or a cold rolled galvanized sheet (SGCC). It should be particularly noted that each of the connecting members 20 is embedded in the two adjacent fans 10, so that the fan 10 can be stably connected to each other along the X-axis direction, and the heat can be further improved. The overall structural strength of the module prevents the substrate 30 from being warped by the weight of the fan 10.
[0017] 由第3圖中可以看出，前述連接件20係嵌設於相鄰兩個風 扇10的凹槽R内，組裝時可將鎖固件40由下往上穿過基板 30表面之穿孔31，同時使鎖固件40延伸進入風扇10的開 孔11内，並使其穿過前述連接件20，藉以將風扇10固定 於基板30上。由於本實施例之散熱模組主要係藉由在相 鄰的風扇10之間設置連接件20，故可提高散熱模組的剛 性，進而防止基板30受到風扇10的重量影響而產生翹曲 。此外，由第3圖中可以看出本實施例之散熱模組另設有 數個螺帽201，其分別設置於散熱模組前、後兩側風扇10 的凹槽R内，組裝時同樣可將鎖固件40穿過基板30表面之 穿孔31，並使鎖固件40延伸進入風扇10的開孔11内，其 中藉由使鎖固件40穿過前述螺帽201，可以使風扇10與基 板30之間的結合更加穩固。 [0018] 再請參閱第4、5、6圖，本實施例中的風扇10大致呈一矩 形結構，在矩形結構的四個邊緣處分別設有開孔11與凹 表單編號A0101 第5頁/共19頁 M414604 槽R(如第4圖所示），其中前述凹槽R與開孔11相通。另一 方面，由第5圖中則可以看出本實施例之連接件20係大致 呈長條形，其主要係用以連接相鄰的兩個風扇10 ;應了 解的是’在連接件20上形成有兩個開口 21，分別對應於 相鄰風扇10上之凹槽R，組裝時可將連接件20的兩端預先 鼓入兩個相鄰風扇10的凹槽R内（如第6圖所示），接著再 將兩個鎖固件40分別穿過基板30並伸入風扇1〇的開孔Η 中，使得鎖固件40可穿過連接件20上的開口 21，進而可 將風扇10穩固地結合於基板30上；另一方面，前述相鄰 的兩個風扇10更可透過連接件20而沿X轴方向緊密接合， 藉此能大幅提升散熱模組的整體結構強度。 [0019] 請參閱第7、8圊’本創作另一實施例中的散熱模組主要 係將複數個風扇10以矩陣方式排列，其中相鄰的風扇1〇 之間可透過連接件2 0相互結合，組裝時例如可利用前述 鎖固件40直接伸入風扇10的開孔11内並與連接件2〇上的 開口 21結合；或者’亦可不需要鎖固件4〇而直接使連接 件2 0和風扇1 0中的凹槽R相互卡合χ»需特別說明的是，因 為連接件20本身已可提供足夠之剛性，因此可不需要使 用前述基板30作為支標’至於電路部分則可利用導線連 接前述風扇10，用以驅動並控制各個風扇1〇的開關與轉 速。 [0020] 请參閱第9、10圖，前述連接件20可直接和風扇1〇的凹槽 相互卡合’而不需要使用鎖固件40。在本實施例中，風 扇10的凹槽R内部形成有一凸塊R1，當連接件2〇伸入凹槽 R内時’前述凸塊R1會與連接件20之開口 21相互卡合（如 表單编號A0101 第6頁/共19頁 M414604 第10圖所示），藉此可使連接件20和風扇10緊密結合，因 此可不需使用鎖固件40。 [0021] 綜上所述，本創作所提供之一種散熱模組主要包括複數 個風扇以及至少一連接件，前述連接件主要係用以連接 兩個相鄰之風扇，由於前述連接件可由金屬或其他剛性 材質所製成，且連接件係嵌設於相鄰的兩個風扇之中， . 如此一來可增加散熱模組的結構強度，以避免基板受到 風扇的重量影響而產生翹曲，進而能大幅提升使用及組 ^ 裝時的便利性。 [0022] 雖然本創作已以具體之較佳實施例揭露如上，然其並非 用以限定本創作，任何熟習此項技藝者，在不脫離本創 作之精神和範圍内，仍可作些許的更動與潤飾，因此本 創作之保護範圍當視後附之申請專利範圍所界定者為準 〇 【圖式簡單說明】 [0023] 第1圖為習知散熱模組之示意圖； [0024] 第2圖為本創作一實施例之散熱模組示意圖； [0025] 第3圖為第2圖所示之散熱模組爆炸圖； . [0026] 第4圖為本創作一實施例之風扇示意圖； [0027] 第5圖為本創作一實施例之連接件示意圖； [0028] 第6圖為本創作一實施例之鎖固件與基板、風扇以及連接 件結合之示意圖； [0029] 第7圖為本創作另一實施例之散熱模組示意圖； 表單編號A010】 第7頁/共19頁 M414604 [0030] 第8圖為第7圖所示之散熱模組俯視圖； [0031] 第9圊為連接件與風扇結合前之示意圖；以及 [0032] 第10圖為連接件與凹槽内部之凸塊相互卡合之示意圖 【主要元件符號說明】[0017] As can be seen from FIG. 3, the connecting member 20 is embedded in the recess R of the adjacent two fans 10, and the locking member 40 can be pierced through the surface of the substrate 30 from bottom to top during assembly. 31. At the same time, the fastener 40 is extended into the opening 11 of the fan 10 and passed through the aforementioned connector 20 to fix the fan 10 to the substrate 30. Since the heat dissipating module of the present embodiment mainly provides the connecting member 20 between the adjacent fans 10, the rigidity of the heat dissipating module can be improved, thereby preventing the substrate 30 from being warped by the weight of the fan 10. In addition, it can be seen from FIG. 3 that the heat dissipation module of the embodiment is further provided with a plurality of nuts 201 respectively disposed in the grooves R of the front and rear sides of the heat dissipation module 10, and can also be assembled during assembly. The locking member 40 passes through the through hole 31 of the surface of the substrate 30 and extends the locking member 40 into the opening 11 of the fan 10, wherein the fan 10 and the substrate 30 can be made between the fan 10 and the substrate 30 by passing the locking member 40 through the nut 201. The combination is more stable. [0018] Referring again to FIGS. 4, 5, and 6, the fan 10 in this embodiment has a substantially rectangular structure, and is provided with openings 11 and concave form numbers A0101 at the four edges of the rectangular structure. A total of 19 pages M414604 slot R (as shown in Figure 4), wherein the aforementioned groove R is in communication with the opening 11. On the other hand, it can be seen from FIG. 5 that the connecting member 20 of the present embodiment is substantially elongated, and is mainly used to connect two adjacent fans 10; it should be understood that 'in the connecting member 20 Two openings 21 are formed on the two sides, respectively corresponding to the grooves R on the adjacent fan 10. When assembled, the two ends of the connecting member 20 can be pre-inflated into the grooves R of two adjacent fans 10 (as shown in FIG. 6). As shown, the two fasteners 40 are then passed through the substrate 30 and into the opening Η of the fan 1 , so that the locking member 40 can pass through the opening 21 in the connector 20, thereby stabilizing the fan 10. The two adjacent fans 10 are more closely coupled to each other in the X-axis direction through the connecting member 20, thereby greatly improving the overall structural strength of the heat dissipating module. [0019] Please refer to the seventh embodiment, the heat dissipation module in another embodiment of the present invention mainly arranges a plurality of fans 10 in a matrix manner, wherein adjacent fans 1 through each other through the connecting member 20 In combination, for example, the aforementioned fastener 40 can be directly inserted into the opening 11 of the fan 10 and combined with the opening 21 on the connecting member 2; or 'the connecting member 20 can be directly used without the locking member 4 The grooves R in the fan 10 are engaged with each other. 需Specially, since the connecting member 20 itself can provide sufficient rigidity, it is not necessary to use the aforementioned substrate 30 as a standard. As for the circuit portion, the wire can be connected. The fan 10 is used to drive and control the switch and the rotational speed of each fan 1〇. [0020] Referring to Figures 9 and 10, the aforementioned connector 20 can be directly engaged with the groove of the fan 1' without the use of the lock 40. In the embodiment, the inside of the groove R of the fan 10 is formed with a protrusion R1. When the connecting piece 2 is inserted into the groove R, the aforementioned protrusion R1 will engage with the opening 21 of the connecting member 20 (such as a form). No. A0101, page 6/19, M414604, Fig. 10), whereby the connector 20 and the fan 10 can be tightly coupled, so that the lock 40 need not be used. [0021] In summary, the heat dissipation module provided by the present invention mainly includes a plurality of fans and at least one connecting member, wherein the connecting members are mainly used to connect two adjacent fans, since the connecting members may be metal or Made of other rigid materials, and the connectors are embedded in two adjacent fans. This increases the structural strength of the heat dissipation module to prevent the substrate from being warped by the weight of the fan. It can greatly improve the convenience of use and assembly. [0022] Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make some changes without departing from the spirit and scope of the present invention. And the retouching, therefore, the scope of protection of this creation is subject to the definition of the patent application scope attached to the following [Simplified illustration] [0023] Figure 1 is a schematic diagram of a conventional heat dissipation module; [0024] A schematic diagram of a heat dissipation module according to an embodiment of the present invention; [0025] FIG. 3 is an exploded view of the heat dissipation module shown in FIG. 2; [0026] FIG. 4 is a schematic diagram of a fan according to an embodiment of the present invention; [0027] 5 is a schematic view of a connecting member according to an embodiment of the present invention; [0028] FIG. 6 is a schematic view showing a combination of a locking device and a substrate, a fan and a connecting member according to an embodiment of the present invention; [0029] FIG. Schematic diagram of a heat dissipation module of another embodiment; Form No. A010] Page 7 of 19 M414604 [0030] Figure 8 is a top view of the heat dissipation module shown in Figure 7; [0031] Section 9 is a connector and Schematic diagram of the front of the fan; and [0032] Figure 10 is the connector The inner recess of the protrusion are engaged with each a schematic view of principal elements [REFERENCE SIGNS
[0033] 風扇1 0 [0034] 開孔11 [0035] 連接件20 [0036] 開口 21 [0037] 基板30 [0038] 穿孔31 [0039] 鎖固件40 [0040] 螺帽201 [0041] 風扇F [0042] 凹槽R [0043] 凸塊R1 [0044] 基板S 表單編號A0101 第8頁/共19頁Fan 1 0 [0034] Opening 11 [0035] Connector 20 [0036] Opening 21 [0037] Substrate 30 [0038] Perforation 31 [0039] Locking 40 [0040] Nut 201 [0041] Fan F [0042] Groove R [0043] Bump R1 [0044] Substrate S Form No. A0101 Page 8 of 19