100年oi 13日核正雜頁1 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種電連接器，尤其涉及一種用以電性連接 晶片模組與電路板之電連接器。 【先前技術】 [0002] 與本創作相關之電連接器，用以連接設有針腳之晶片模 組與電路板，如美國專利公告第7137841號所揭示，該電 連接器包括絕緣本體及收容於絕緣本體中之複數導電端 子。絕緣本體具有相對設置之支撙面與安裝面，其貫穿 支撑面與安裝面設有複數相互連通之端子收容槽與針腳 導引槽。針腳導引槽可引導晶片模組之針腳插入絕緣本 體之端子收容槽中。導電端子包括基部、由基部兩侧彎 折延伸設置之一對臂部、設於臂部末端之接觸部、設於 基部兩側之固持部及由基部向下彎折延伸設置之焊接部 。導電端子之固持部可與絕緣本體之端子收容槽之側壁 干涉配合，以將導電端子固持於絕緣本體中。電連接器 可藉植於導電端子之焊接部下方之錫球與電路板焊接， 並藉導電端子之接觸部夾持插入絕緣本體之端子收容槽 中之晶片模組之針腳，實現電路板與晶片模組間之電性 連接。 [0003] 上述電連接器雖可藉導電端子之接觸部夾持晶片模組之 針腳，藉設於焊接部下方之錫球與電路板焊接，實現晶 片模組與電路板間之電性連接。惟，當晶片模組之針腳 組入絕緣本體中發生偏斜，不能與導電端子之接觸部正 常接觸時，會損壞晶片模組之針腳或損壞導電端子。 表單編號A0101 第5頁/共22頁 M409607 [0004] [0005] [0006] [0007] [0008] 100年04月13日修正替. 鑒於此，確有必要提供一改進之電連接器，以克服先前 技術存在之缺陷。【新型内容】 本創作之目的係提供一種可保證晶片模組之針腳與導電 端子間具有良好正位度，防止損壞晶片模組之針腳與導 電端子之電連接器》 本創作之電連接器藉以下技術方案實現：一種電連接器 . ，用以電性連接設有針腳之晶片模組與電路板，其包括 - 絕緣本體及複數導電端子。導電端子包括基部、由基部 鲁 兩側彎折延伸設置並固持於絕緣本體中之一對彈性臂及 由基部向下彎折延伸設置之焊接部。絕緣本體可相對於 導電知子上下運動以於第一位置與第二位置間轉換，並 驅動導電端子之彈性臂於閉合狀態與張開狀態間轉換。 本創作之電連接器藉以下技術方案實現：一種電連接器 ，用以電性連接晶片模組與電路板，其包括絕緣本體及 組設於絕緣本體上之複數導電端子。導電端子包括基部 ·_ 、由基部兩側彎折延伸設置之一對彈性臂及由基部向下 彎折延伸設置之焊接部。絕緣本體可相對於導電端子上 下運動以於第一位置與第二位置間轉換，並驅動導電端 子之彈性臂於閉合狀態與張開狀態間轉換。 相較於先前技術，本創作之電連接器之絕緣本體可相對 於導電端子運動以驅動導電端子之彈性臂張開、閉合， 使彈性臂夾持晶片模組之針腳，可防止因晶片模組之針 腳與導電端子之正位度問題而於晶X模組組入絕緣本體 表單编號A0101 第6頁/共22頁 M409607 100年04月13日修正替換頁 上時損壞晶片模組之針腳或損壞導電端子。 【實施方式】 [0009] 請參閱第一圖至第五圖所示，本創作為一種電連接器1〇〇 ，用以電性連接設有針腳40之晶片模組4與電路板5，其 包括絕緣本體1、收容於絕緣本體1中之複數導電端子2及 組設於導電端子2下方之錫球3。 [0010] 請重點參閱第二圖、第四圖及第五圖所示，導電端子2由 金屬料帶製成，其包括一板狀基部2〇、由基部2〇兩側彎 折並向上延伸設置之一對彈性臂21及由基部2〇底端向下 彎折延伸設置之水平板狀焊接部23。彈性臂21末端設有 夾持部2 2，可夾持晶片模組4之針腳4 〇，以實現電連接器 100與晶片模組4間電性導通。夾持部22之間距略小於晶 片模組4之針腳4 0之直棱。基部2 〇之兩侧彎折並沿水平方 向延伸設有一對連接部24。連接部24與基部20大致呈「ϋ 」型設置。彈性臂21係由連接部2 4向上彎折延伸設置， 其包括由連接部24頂端向上並相向延伸設置之第一臂部 210、由第一臂部210向上彎折並呈擴張狀態設置之掌部 211及由掌部211之頂端豎直向上延伸設置之第二臂部 212。第一臂部210係由連接部24頂端以漸縮方式傾斜向 上延伸設置。第一臂部21〇之間間距小於掌部21丨之間間 距。掌部211之間間距小於第二臂部2丨2之間間距。所述 爽持部22係由第二臂部212末端以漸縮方式傾斜向上延伸 設置β ]請重點參閱第二圖至第五圖所示，絕緣本體1係由絕緣材 料製成，其具有支撐晶片模組4之支撐面1〇與連接電路板100 years oi 13th nuclear correction page 1 5, new description: [New technology field] [0001] The present invention relates to an electrical connector, in particular to an electrical connection between the chip module and the circuit board Device. [Previous Art] [0002] An electrical connector related to the present invention is used to connect a chip module and a circuit board provided with a pin. As disclosed in U.S. Patent No. 7,713,841, the electrical connector includes an insulative body and is housed in a plurality of conductive terminals in the insulative body. The insulating body has oppositely disposed supporting surfaces and mounting surfaces, and the connecting surface and the mounting surface are provided with a plurality of terminal receiving grooves and pin guiding grooves communicating with each other. The pin guiding groove guides the pins of the wafer module into the terminal receiving slots of the insulating body. The conductive terminal includes a base portion, a pair of arm portions extending from both sides of the base portion, a contact portion provided at an end portion of the arm portion, a holding portion provided on both sides of the base portion, and a welded portion extending downward from the base portion. The holding portion of the conductive terminal can interfere with the sidewall of the terminal receiving groove of the insulating body to hold the conductive terminal in the insulating body. The electrical connector can be soldered to the circuit board by the solder ball implanted under the soldering portion of the conductive terminal, and the pin of the wafer module inserted in the terminal receiving groove of the insulating body is clamped by the contact portion of the conductive terminal to realize the circuit board and the chip. Electrical connection between modules. [0003] The electrical connector can hold the pins of the chip module by the contact portion of the conductive terminal, and the solder ball under the soldering portion is soldered to the circuit board to realize electrical connection between the wafer module and the circuit board. However, when the pins of the wafer module are deflected into the insulating body and cannot be properly contacted with the contact portions of the conductive terminals, the pins of the wafer module may be damaged or the conductive terminals may be damaged. Form No. A0101 Page 5 of 22 M409607 [0004] [0005] [0007] [0008] Correction of April 13, 100. In view of this, it is necessary to provide an improved electrical connector to Overcome the shortcomings of the prior art. [New content] The purpose of this creation is to provide an electrical connector that can ensure a good positive position between the pins of the chip module and the conductive terminals, and prevent damage to the pins and conductive terminals of the wafer module. The following technical solutions are implemented: an electrical connector. The device is electrically connected to a chip module and a circuit board provided with a pin, and includes an insulating body and a plurality of conductive terminals. The conductive terminal comprises a base portion, a pair of elastic arms extending from the base portion and extending from the two sides of the insulating body, and a welded portion extending from the base portion and extending downward. The insulative housing is movable up and down with respect to the conductive proton to switch between the first position and the second position, and drive the elastic arm of the conductive terminal to switch between the closed state and the open state. The electrical connector of the present invention is realized by the following technical solution: an electrical connector for electrically connecting the chip module and the circuit board, comprising an insulating body and a plurality of conductive terminals disposed on the insulating body. The conductive terminal includes a base portion, a pair of elastic arms and a welded portion extending downward from the base portion, which are bent and extended from both sides of the base portion. The insulative housing is movable up and down relative to the conductive terminals to switch between the first position and the second position and to drive the resilient arms of the conductive terminals to switch between the closed state and the open state. Compared with the prior art, the insulative housing of the electrical connector of the present invention can be moved relative to the conductive terminal to drive the elastic arm of the conductive terminal to open and close, so that the elastic arm holds the pin of the chip module, thereby preventing the wafer module from being damaged. The problem of the positive position of the pins and the conductive terminals is in the form of the crystal X module. Insulation body form No. A0101 Page 6 of 22 M409607 On April 13, 2014, when the replacement page is corrected, the pins of the wafer module are damaged or Damage to the conductive terminals. [Embodiment] [0009] Referring to the first to fifth figures, the present invention is an electrical connector 1A for electrically connecting a chip module 4 having a pin 40 and a circuit board 5, The insulating body 1 includes a plurality of conductive terminals 2 housed in the insulative housing 1 and a solder ball 3 disposed under the conductive terminals 2 . [0010] Please refer to the second, fourth and fifth figures. The conductive terminal 2 is made of a metal strip, which comprises a plate-like base 2〇, which is bent from both sides of the base 2 and extends upward. One of the pair of elastic arms 21 and a horizontal plate-shaped welded portion 23 which is bent downward from the bottom end of the base portion 2 is provided. The end of the elastic arm 21 is provided with a clamping portion 22 for clamping the pins 4 of the chip module 4 to electrically connect the electrical connector 100 and the wafer module 4. The distance between the clamping portions 22 is slightly smaller than the straight edge of the stitch 40 of the wafer module 4. Both sides of the base 2 are bent and extended in the horizontal direction to provide a pair of connecting portions 24. The connecting portion 24 and the base portion 20 are arranged substantially in a "ϋ" shape. The elastic arm 21 is extended and extended by the connecting portion 24, and includes a first arm portion 210 which is extended upward and oppositely from the top end of the connecting portion 24, and is bent upward by the first arm portion 210 and is in an expanded state. The portion 211 and the second arm portion 212 extending vertically upward from the top end of the palm portion 211. The first arm portion 210 is obliquely extended upward from the top end of the connecting portion 24 in a tapered manner. The spacing between the first arm portions 21〇 is smaller than the distance between the palm portions 21丨. The spacing between the palm portions 211 is smaller than the spacing between the second arm portions 2丨2. The holding portion 22 is inclined and extended upward by the end of the second arm portion 212 in a tapered manner. Referring to the second to fifth figures, the insulating body 1 is made of an insulating material and has support. Support surface 1 of chip module 4 and connecting circuit board
表單編號_丨 ® 7 I/* 22 I M409607 100年04月13日按正替换頁 5之安裝面11及複數貫穿支撐面10與安裝面11設置之端子 收容槽12。端子收容槽12用以收容導電端子2，其包括位 於上方之第一收容槽120及位於下方並與第一收容槽120 連通之第二收容槽121。所述第一收容槽120之寬度大於 第二收容槽121之寬度，其與第二收容槽121之連接處形 成有台階122。所述台階122可在絕緣本體1受外力相對導 電端子2向上運動時用於承接導電端子2之彈性臂21之掌 部211，以將導電端子2固持於絕緣本體1中。絕緣本體1 還設有位於端子收容槽12上方並與端子收容槽12連通之 針腳導引槽13。針腳導引槽13大致呈漏斗狀設置，其具 有一傾斜導引面130，可引導晶片模組4之針腳40組入絕 緣本體1之端子收容槽12中，進而使導電端子2之夾持部 22準確夾持針腳40，實現晶片模組4與電連接器100間之 電性導通，可防止晶片模組4之針腳40於組入絕緣本體1 中發生偏斜未與導電端子2正常接觸，而損壞晶片模組4 之針腳40或損壞導電端子2。 [0012] 請重點參閱第三圖至第五圖所示，絕緣本體1還包括設於 端子收容槽12内並連接端子收容槽12之相對侧壁之擋止 塊14。擋止塊14具有低於絕緣本體1之支撐面10之頂面 143與高於絕緣本體1之安裝面11之底面144。擋止塊14 將端子收容槽12分成對稱之兩部分，其包括位於第二收 容槽121中之較寬部140、由較寬部140以漸縮方式傾斜 向上延伸設置之過渡部141及由過渡部141之頂端豎直向 上延伸設置之較窄部142。所述較寬部140之寬度與導電 端子2之連接部24之寬度大致相同，並大於導電端子2之 表單編號A0101 第8頁/共22頁 M409607 100年04月13日修正替換頁 第一臂部210間之距離，可在絕緣本體1受外力向上運動 時抵推導電端子2之第一臂部210使導電端子2之彈性臂21 處於張開狀態。所述過渡部141具有光滑之斜面（未標號）Form No. _ 丨 ® 7 I/* 22 I M409607 On April 13, 100, the mounting surface 11 and the plurality of terminal receiving grooves 12 which are provided through the supporting surface 10 and the mounting surface 11 are replaced. The terminal receiving slot 12 is configured to receive the conductive terminal 2, and includes a first receiving slot 120 located above and a second receiving slot 121 located below and communicating with the first receiving slot 120. The width of the first receiving slot 120 is greater than the width of the second receiving slot 121, and the connecting portion with the second receiving slot 121 forms a step 122. The step 122 can be used to receive the palm portion 211 of the elastic arm 21 of the conductive terminal 2 when the insulating body 1 is moved upward by the external force relative to the conductive terminal 2 to hold the conductive terminal 2 in the insulating body 1. The insulative housing 1 is further provided with a pin guiding groove 13 which is located above the terminal receiving groove 12 and communicates with the terminal receiving groove 12. The pin guiding groove 13 is disposed in a funnel shape, and has an inclined guiding surface 130 for guiding the pins 40 of the wafer module 4 into the terminal receiving slots 12 of the insulative housing 1 to further clamp the conductive terminals 2 The pin 40 is accurately clamped to realize electrical conduction between the die module 4 and the electrical connector 100, and the pin 40 of the die module 4 is prevented from being deflected in the assembled insulating body 1 and is not normally in contact with the conductive terminal 2. The pins 40 of the wafer module 4 are damaged or the conductive terminals 2 are damaged. [0012] Please refer to the third to fifth figures. The insulative housing 1 further includes a blocking block 14 disposed in the terminal receiving slot 12 and connected to opposite sidewalls of the terminal receiving slot 12. The stop block 14 has a top surface 143 lower than the support surface 10 of the insulative housing 1 and a bottom surface 144 above the mounting surface 11 of the insulative housing 1. The stopper block 14 divides the terminal receiving groove 12 into two symmetrical parts, and includes a wider portion 140 located in the second receiving groove 121, a transition portion 141 extending obliquely upward from the wide portion 140 in a tapered manner, and a transition portion The top end of the portion 141 extends vertically upwardly from the narrower portion 142. The width of the wider portion 140 is substantially the same as the width of the connecting portion 24 of the conductive terminal 2, and is larger than the form number of the conductive terminal 2 A0101. Page 8 / Total 22 pages M409607 100 April 13, revised replacement page first arm The distance between the portions 210 can push the first arm portion 210 of the conductive terminal 2 to cause the elastic arm 21 of the conductive terminal 2 to be in an open state when the insulating body 1 is moved upward by an external force. The transition portion 141 has a smooth bevel (not labeled)
。所述過渡部141於豎直方向之高度與導電端子2之第一 臂部210於豎直方向上之高度大致相同。所述較寬部140 於豎直方向上之高度與導電端子2之連接部24於豎直方向 上之高度大致相同。所述較寬部140與絕緣本體1之第二 收容槽121間形成有凹槽（未標號），可於導電端子2組入 絕緣本體1時收容導電端子2之焊接部23。所述過渡部141 與較窄部142均位於絕緣本體1之第一收容槽120中。. The height of the transition portion 141 in the vertical direction is substantially the same as the height of the first arm portion 210 of the conductive terminal 2 in the vertical direction. The height of the wider portion 140 in the vertical direction is substantially the same as the height of the connecting portion 24 of the conductive terminal 2 in the vertical direction. A groove (not labeled) is formed between the wide portion 140 and the second receiving groove 121 of the insulative housing 1. The soldering portion 23 of the conductive terminal 2 can be received when the conductive terminal 2 is assembled into the insulative housing 1. The transition portion 141 and the narrow portion 142 are both located in the first receiving groove 120 of the insulative housing 1 .
[0013] 組裝時，首先將導電端子2之彈性臂21分別收容於絕緣本 體1之端子收容槽12由擋止塊14分成之兩對稱部分中，並 沿絕緣本體1之擋止塊14外側自下而上組入絕緣本體1之 端子收容槽12中，直至導電端子2之焊接部23抵接於絕緣 本體1之擋止塊14底端。此時，絕緣本體1與導電端子2位 於第二位置處，導電端子2之彈性臂21處於閉合狀態（請 參第五圖所示）。導電端子2之彈性臂21位於絕緣本體1之 端子收容槽12之第一收容槽120中，連接部24位於端子收 容槽12之第二收容槽121中。導電端子2之連接部24位於 絕緣本體1之擋止塊14之較寬部140之兩側，第一臂部 210位於擋止塊14之過渡部141之兩側。焊接部23部分位 於絕緣本體1之擋止塊14與第二收容槽121形成之凹槽（未 標號）中，其底面位於絕緣本體1之安裝面11下方。 [0014] 組裝好後，電連接器100可藉位於絕緣本體1之安裝面11 下方之導電端子2之焊接部23與錫球3焊接，並藉錫球3與 表單編號A0101 第9頁/共22頁 M409607 100年04月13日修正替換頁 電路板5焊接，實現電連接器100與電路板5間之電性導通 。此時即可施力向上提拉絕緣本體1使絕緣本體1向上運 動，直至導電端子2之彈性臂21之掌部211承接於絕緣本 體1之端子收容槽12之台階122上。此時，絕緣本體1與導 電端子2位於第一位置處，導電端子2之彈性臂21處於張 開狀態（請參第四圖所示）。導電端子2之連接部24伸出絕 緣本體1之底端。第一臂部210位於絕緣本體1之第二收容 槽121中，並抵接於絕緣本體1之擋止塊14之較寬部140 兩側，且於較寬部140之抵推下使導電端子2之彈性臂21 張開。導電端子2之第二臂部212位於絕緣本體1之第一收 容槽120中，並抵靠於第一收容槽120之内壁上。此時， 可將晶片模組4組設於絕緣本體1上。 [0015] 當將晶片模組4組設於絕緣本體1上時，晶片模組4會下壓 絕緣本體1，使絕緣本體1向下運動。絕緣本體1之擋止塊 14之較寬部140會沿著導電端子2之第一臂部210内側向 下移動，直至擋止塊14抵接於導電端子2之焊接部23之頂 端。此時，絕緣本體1與導電端子2位於第一位置處，導 電端子2之彈性臂21處於閉合狀態，並夾持晶片模組4之 針腳40。導電端子2之連接部24位於絕緣本體1之第二收 容槽121中，且位於擋止塊14之較寬部140兩側。導電端 子2之第一臂部210、第二臂部211均位於絕緣本體1之第 一收容槽120中，且第一臂部210位於擋止塊14之過渡部 141兩側。導電端子2之第一臂部210不再受擋止塊14之 較寬部140之抵推而使彈性臂21自張開狀態向閉合狀態轉 換。導電端子2之夾持部22伸入絕緣本體1之針腳導引槽 表單編號A0101 第10頁/共22頁 M409607 [0016] [0017][0013] When assembling, the elastic arms 21 of the conductive terminal 2 are respectively received in the two symmetrical portions of the terminal receiving groove 12 of the insulative housing 1 which are divided by the blocking block 14 and are located outside the blocking block 14 of the insulating body 1. The bottom portion is assembled into the terminal receiving groove 12 of the insulative housing 1 until the soldering portion 23 of the conductive terminal 2 abuts against the bottom end of the blocking block 14 of the insulative housing 1. At this time, the insulative housing 1 and the conductive terminal 2 are located at the second position, and the elastic arm 21 of the conductive terminal 2 is in a closed state (refer to FIG. 5). The elastic arm 21 of the conductive terminal 2 is located in the first receiving slot 120 of the terminal receiving slot 12 of the insulative housing 1, and the connecting portion 24 is located in the second receiving slot 121 of the terminal receiving slot 12. The connecting portion 24 of the conductive terminal 2 is located on both sides of the wider portion 140 of the blocking block 14 of the insulative housing 1, and the first arm portion 210 is located on both sides of the transition portion 141 of the blocking block 14. The soldering portion 23 is located in a recess (not shown) formed by the blocking block 14 of the insulative housing 1 and the second receiving slot 121, and the bottom surface thereof is located below the mounting surface 11 of the insulative housing 1. [0014] After assembly, the electrical connector 100 can be soldered to the solder ball 3 by the soldering portion 23 of the conductive terminal 2 located below the mounting surface 11 of the insulative housing 1, and the solder ball 3 is combined with the form number A0101. Page 22 M409607 On April 13, 100, the replacement page board 5 was modified to electrically connect the electrical connector 100 to the circuit board 5. At this time, the insulating body 1 can be pulled up to move the insulating body 1 upward until the palm portion 211 of the elastic arm 21 of the conductive terminal 2 is received on the step 122 of the terminal receiving groove 12 of the insulating body 1. At this time, the insulative housing 1 and the conductive terminal 2 are located at the first position, and the elastic arm 21 of the conductive terminal 2 is in the open state (refer to the fourth figure). The connecting portion 24 of the conductive terminal 2 extends beyond the bottom end of the insulating body 1. The first arm portion 210 is located in the second receiving slot 121 of the insulative housing 1 and abuts on both sides of the wider portion 140 of the blocking block 14 of the insulative housing 1 and is pushed against the wider portion 140 to make the conductive terminal. The elastic arm 21 of 2 is opened. The second arm portion 212 of the conductive terminal 2 is located in the first receiving groove 120 of the insulative housing 1 and abuts against the inner wall of the first receiving slot 120. At this time, the wafer module 4 can be assembled on the insulative housing 1. [0015] When the wafer module 4 is assembled on the insulative housing 1, the wafer module 4 presses down the insulative housing 1 to move the insulative housing 1 downward. The wider portion 140 of the stopper block 14 of the insulative housing 1 moves downward along the inner side of the first arm portion 210 of the conductive terminal 2 until the stopper block 14 abuts against the top end of the welded portion 23 of the conductive terminal 2. At this time, the insulative housing 1 and the conductive terminal 2 are located at the first position, and the elastic arm 21 of the conductive terminal 2 is in a closed state, and the pins 40 of the wafer module 4 are clamped. The connecting portion 24 of the conductive terminal 2 is located in the second receiving groove 121 of the insulative housing 1 and is located on both sides of the wider portion 140 of the blocking block 14. The first arm portion 210 and the second arm portion 211 of the conductive terminal 2 are located in the first receiving groove 120 of the insulative housing 1, and the first arm portion 210 is located on both sides of the transition portion 141 of the blocking block 14. The first arm portion 210 of the conductive terminal 2 is no longer biased by the wider portion 140 of the stop block 14 to cause the resilient arm 21 to transition from the open state to the closed state. The clamping portion 22 of the conductive terminal 2 extends into the stitch guiding groove of the insulative housing 1. Form No. A0101 Page 10 of 22 M409607 [0017]
[0018] 表單編號A0101 100年04月13日梭正替換頁 13中，並夾持晶片模組4之針腳40，實現電連接器100與 晶片模組4間之電性導通。由此，即實現了晶片模組4與 電路板5間之電性連接。 測試完畢後，可將晶片模組4取出，並施力使絕緣本體1 向上運動以位於第二位置處，即可測試另一晶片模組4， 以實現電連接器100多次使用之功能。 本創作之電連接器100之導電端子2之彈性臂21在絕緣本 體1受外力向上運動並位於第二位置處、向下運動並位於 第一位置處時受絕緣本體1之擋止塊14之作用可在張開狀 態與閉合狀態之間轉換，以夾持晶片模組4之針腳40，實 現與晶片模組4間之電性導通，進而防止因晶片模組4之 針腳40與導電端子2之正位度問題而損壞晶片模組4或導 電端子2。且，絕緣本體1受力向上運動位於第二位置時 ，導電端子2可藉掌部211抵靠於絕緣本體1之端子收容槽 12之台階122上，以將導電端子2限位於絕緣本體1中。另 ，絕緣本體1之針腳導引槽13之傾斜導引部130可引導晶 片模組4之針腳40組入端子收容槽12中，以方便導電端子 2之夾持部22準確夾持針腳40。 綜上所述，本創作符合新型專利要件，爰依法提出專利 申請。惟，以上所述者僅為本創作之較佳實施例，本創 作之範圍並不以上述實施例為限，舉凡熟習本案技藝之 人士援依本創作之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 第11頁/共22頁 M409607 100年04月13日修正替換頁 [0019] 第一圖係本創作之電連接器之立體組合圖； [0020] 第二圖係本創作之電連接器之立體分解圖； [0021] 第三圖係本創作之電連接器之絕緣本體之立體圖； [0022] 第四圖係本創作之電連接器與電路板之剖視圖，其中導 電端子處於張開狀態；及 [0023] 第五圖係本創作之電連接器電性連接晶片模組與電路板 之剖視圖，其中導電端子處於閉合狀態。 【主要元件符號說明】 [0024] 電連接器：100 [0025] 絕緣本體：1 [0026] 支撐面：10 [0027] 安裝面：11 [0028] 端子收容槽：12 [0029] 第一收容槽：120 [0030] 第二收容槽：121 [0031] 台階：122 [0032] 針腳導引槽：13 [0033] 導引面：130 [0034] 擋止塊：14 [0035] 較寬部：140 表單编號A0101[0018] Form No. A0101 On April 13, 100, the shuttle is replacing page 13, and the pins 40 of the wafer module 4 are clamped to electrically connect the electrical connector 100 and the die module 4. Thereby, electrical connection between the wafer module 4 and the circuit board 5 is achieved. After the test is completed, the wafer module 4 can be taken out and the insulating body 1 can be moved upward to be located at the second position, so that the other wafer module 4 can be tested to realize the function of the electrical connector 100 being used multiple times. The elastic arm 21 of the conductive terminal 2 of the electrical connector 100 of the present invention is received by the blocking block 14 of the insulating body 1 when the insulating body 1 is moved upward by an external force and is moved at the second position and moved downward and is at the first position. The function can be switched between the open state and the closed state to clamp the pins 40 of the wafer module 4 to achieve electrical conduction with the wafer module 4, thereby preventing the pins 40 and the conductive terminals 2 of the wafer module 4 The positive position problem causes damage to the wafer module 4 or the conductive terminal 2. When the insulative housing 1 is moved upward in the second position, the conductive terminal 2 can be abutted against the step 122 of the terminal receiving slot 12 of the insulative housing 1 by the palm portion 211 to limit the conductive terminal 2 to the insulative housing 1. . In addition, the inclined guiding portion 130 of the pin guiding groove 13 of the insulative housing 1 can guide the pins 40 of the wafer module 4 into the terminal receiving groove 12 to facilitate the clamping of the pin 40 by the clamping portion 22 of the conductive terminal 2. In summary, the creation complies with the new patent requirements and submits a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application. [Simple description of the drawing] Page 11 of 22 M409607 Correction replacement page of April 13, 100 [0019] The first picture is a three-dimensional combination diagram of the electrical connector of the present invention; [0020] The second picture is the creation 3D exploded view of the electrical connector of the present invention; [0022] FIG. 4 is a cross-sectional view of the electrical connector and circuit board of the present invention, wherein the conductive terminal [0023] The fifth figure is a cross-sectional view of the electrical connector of the present invention electrically connected to the chip module and the circuit board, wherein the conductive terminals are in a closed state. [Main component symbol description] [0024] Electrical connector: 100 [0025] Insulating body: 1 [0026] Support surface: 10 [0027] Mounting surface: 11 [0028] Terminal receiving groove: 12 [0029] First receiving groove : 120 [0030] Second receiving groove: 121 [0031] Step: 122 [0032] Pin guiding groove: 13 [0033] Guide surface: 130 [0034] Stop block: 14 [0035] Wide portion: 140 Form number A0101
第12頁/共22頁 M409607 • «. 100年04月13日按正替换頁 [0036] 過渡部：141 [0037] 較窄部：142 [0038] 導電端子：2 [0039] 基部：20 [0040] 頂面：143 ' [0041] 底面：144 [0042] 應 彈性臂：21 W [0043] 第一臂部：210 [0044] 掌部：211 [0045] 第二臂部：212 [0046] 夾持部：22 [0047] 焊接部：23 [0048] 籲， 連接部：24 [0049] 錫球：3 [0050] 晶片模組：4 [0051] 針腳：40 [0052] 電路板：5 表單編號A0101 第13頁/共22頁Page 12 of 22 M409607 • «. 100年04月13日正正换页[0036] Transition: 141 [0037] Narrower part: 142 [0038] Conductive terminal: 2 [0039] Base: 20 [ 0040] Top surface: 143 ' [0041] Bottom surface: 144 [0042] Elastic arm: 21 W [0043] First arm: 210 [0044] Palm: 211 [0045] Second arm: 212 [0046] Grip: 22 [0047] Weld: 23 [0048] Call, connection: 24 [0049] Tin ball: 3 [0050] Chip module: 4 [0051] Pin: 40 [0052] Board: 5 Form No. A0101 Page 13 of 22