M406830 五、新型說明： 【新型所屬之技術領域】 [0001]本創作涉及一種電連接器，尤其涉及一種用以電性連接 晶片模組與電路板之電連接器。 【先前技術】 _2]球面栅格（BGA)陣列電連接器係一種商業用途越來越廣泛 之電連接器，此種電連接器一般包括絕緣本體、複數組 0X於絕緣本體中之導電端子及複數設於絕緣本體底面之 錫球。電連接器可藉錫球經回流焊工藝焊接至電路板上 ’並藉導電端子夾持設於晶片模組下方之琴球，實現晶 片模組與電路板間之電性連接' ν" -^#1 .Γ.^'ύ·, ν- 广 ， ..-：, · V. ..M406830 V. New Description: [New Technology Field] [0001] The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a chip module and a circuit board. [Prior Art] _2] Spherical Grid (BGA) Array Electrical Connector is a kind of electrical connector with more and more commercial applications. The electrical connector generally includes an insulating body, a plurality of conductive terminals in the insulating body, and A plurality of solder balls disposed on the bottom surface of the insulating body. The electrical connector can be soldered to the circuit board by solder ball soldering process, and the magnetic ball is placed between the chip module and the circuit board by the conductive terminal to hold the magnetic ball between the chip module and the circuit board. ν" -^ #1 .Γ.^'ύ·, ν- 广, ..-:, · V. ..
[0003]與本創作相關之電連接器，用以電性連有錫球之晶 片模組與電路板’如中國大陸實用新型專利公告第 201 1 671 99號所揭示。該電連接器包括絕緣本體、複數 收容於絕緣本體中之導電端子及複數設跨兔緣本體下方 之錫球。絕緣本體具有相對設置之上表面與下表面及複 數貫穿上表面與下表面設秦之破子收容槽。絕緣本體之 下表面向上凹陷設有位於端子收容槽下方之收容空間， 用以收容錫球。導電端子包括豎直板狀主體部、由主體 部豎直向上延伸設置之兩彈性臂及由主體部豎直向下延 伸設置之兩導接部。兩彈性臂末端各設有一失持部，用 以夾持晶片模組之錫球，實現電連接器與晶片模組間電 性導通。兩導接部可與位於絕緣本體下表面之錫球接觸 ’並藉錫球焊接於電路板上，以實現電連接器與電路板 間之電性導通。 表單編號A0101 第4頁/共23頁 [0004] [0004] [0005] [0006] [0007] 表單編號A0101 惟’因晶片模組之接觸部為球狀，電連接器僅 子伸出絕緣本體上表面之兩彈性臂末端之失持部 錫球兩側，會有接觸不穩定之問題產生，進而影響電連 接器與晶片模組間之電性連接；另，當晶片模組設於電 „偏斜時，會造成導電端子之夾持部無法正 *夾持晶>{模組之錫球，進而影響電連接器與晶片模纪 之電性連接’且於移動晶片馳時會有損壞導電端子之 可能。 繫於此’確有必要提供-改進之電連接H，以克服先前 技術存在之缺陷。[0003] The electrical connector associated with the present invention is used to electrically connect a wafer module and a circuit board of a solder ball as disclosed in Chinese Utility Model Patent Publication No. 201 1 671 99. The electrical connector includes an insulative housing, a plurality of conductive terminals received in the insulative housing, and a plurality of solder balls disposed under the body of the rabbit bead. The insulative housing has oppositely disposed upper and lower surfaces and a plurality of broken sub-receiving slots extending through the upper surface and the lower surface. The lower surface of the insulative housing is recessed upwardly to provide a receiving space under the terminal receiving slot for receiving the solder ball. The conductive terminal includes a vertical plate-shaped main body portion, two elastic arms extending vertically upward from the main body portion, and two guiding portions extending vertically downward from the main body portion. Each of the ends of the two elastic arms is provided with a missing portion for clamping the solder balls of the chip module to electrically connect the electrical connector and the chip module. The two guiding portions can be in contact with the solder balls on the lower surface of the insulating body and soldered to the circuit board by solder balls to electrically conduct electrical connection between the electrical connector and the circuit board. Form No. A0101 Page 4 of 23 [0004] [0004] [0005] [0006] [0007] Form No. A0101 Only because the contact portion of the wafer module is spherical, the electrical connector only extends out of the insulating body On both sides of the solder ball at the end of the two elastic arms on the upper surface, there is a problem of unstable contact, which in turn affects the electrical connection between the electrical connector and the chip module. In addition, when the chip module is set in the electric device When deflected, the clamping portion of the conductive terminal cannot be positively clamped into the crystal ball, which affects the electrical connection between the electrical connector and the die, and is damaged when the mobile wafer is moved. The possibility of a conductive terminal is that it is necessary to provide an improved electrical connection H to overcome the drawbacks of the prior art.
【新型内容】 > ‘；H 本創作之目的係提供一種可，且可實 現與晶片模組間之良好電性連接功能之電連接器。 本創作之電連接器藉以下技術方案實現：一種電連接器 ’用以電性連接設有錫球芝丨蟲:姑摸斑輿電各板，其包括 設有複數端子收容槽之絕緣本碰:及教數收容於端子收容 gr > ·, < 槽中之導電端子。導電端手包括主喻部、由主體部向上 彎折延伸設置之彈性臂及由主體部向下彎折延伸設置之 焊接部°絕緣本體之上表面向下凹陷形成有與端子收容 槽連通之第一凹槽。第一凹槽與導電端子之彈性臂圍設 形成有收容晶片模組之錫球之第一收容空間。彈性臂末 端分叉設有夾持晶片模組之錫球之兩夾持部。 本創作之電連接器還可藉以下技術方案實現：一種電連 接器’用以電性連接設有錫球之晶片模組與電路板，其 第5頁/共23頁 [0008] M406830 包括設有複數收容孔之絕緣本體及複數收容於絕緣本體 之收容孔中之導電端子。導電端子包括主體部、由主體 部向上彎折延伸設置之一對彈性臂及由主體部向下彎折 延伸設置之焊接部。導電端子之彈性臂收容於端子收容 孔中並與端子收容孔之相應壁面圍設形成有收容晶片模 組之錫球之第一收容空間。 [0009] 相較於先前技術，本創作之電連接器藉導電端子之彈性 臂與絕緣本體之第一凹槽形成之第一收容空間以收容晶 片模組之錫球，可防止晶片模組因正位度問題損壞導電 端子，且藉彈性臂末端分叉設置之兩接觸部夾持晶片模 組之錫球，使導電端子與晶备彡模:組之錫‘球v間丨杲有兩接觸 點，以保證導電端子與晶片模:組*間具有良好電性接觸， 進而保證電連接器與晶片模組間良好電性連接。 【實施方式】 [0010] 第一圖至第七圖所示，其中策一圖至第六圖為本創作之 第一實施方式，第七圖為本創作之第二實施方式。第一 實施方式之電連接器100，辱.以電:性連接其上設有錫球40 之晶片模組4與電路板5，其包括絕緣本體1、複數組設於 絕緣本體1中之導電端子2及複數機械固持於絕緣本體1下 方之錫球3。 [0011] 請重點參閱第二圖至第六圖所示，絕緣本體1由絕緣材料 製成並大致呈矩形板狀構造，其具有相對設置之上表面 10、下表面11及貫穿上表面10與下表面11設置之複數端 子收容槽12。端子收容槽12用以收容導電端子2,其包括 一容納槽120及位於容納槽120相對兩側並與容納槽120 表單編號A0101 第6頁/共23頁 一側連通之固持槽1 21。容納槽1 2 0大致呈半圓形設置， 具有一弧狀第一導引面122。固持槽121大致呈矩形設置 ’其具有傾斜之第二導引面123。絕緣本體1之上表面10 向下凹陷形成有與端子收容槽12之容納槽120相對之第一 凹槽13。第一凹槽13大致呈半圓形設置，其具有一用以 承接晶片模組4之錫球40底部之承接面130。絕緣本體1之 下表面11向上凹陷形成有位於第一凹槽13正下方之第二 凹槽14。第二凹槽14呈半圓形設置，其具有一抵接錫球3 頂端之抵接面140。所述第一凹槽13與第二凹槽14位於端 子收容槽12之同一側。端子收容槽12 '第一凹槽13與第 二凹槽14構成收容孔17。. —. v ' ':'<'，、 [0012] §青重點參閱第二圖、第三圖养.第六圖所，,導電端子2可 於絕緣本體1之端子收容槽12之第一導引面122與第二導 引面123之引導下插入端子收容槽12中，其包括一板狀主 體部20。主體部20頂端兩螂豎直内上延伸設有收容於絕 緣本體1之端子收容槽12之:固#槽121中之兩固持部21。 固持部21可與絕緣本體1之端子收容槽12之固持槽121之 相應壁面干涉配合’用以將導電端子2固持於絕緣本體1 中。主體部20頂端中部向上彎折延伸設有一位於兩固持 部21之間之彈性臂22。所述彈性臂22收容於絕緣本體1之 端子收容槽12之容納槽120中，其與絕緣本體1之第—凹 槽13間形成有用以收容晶片模組4之錫球4〇之第一收容空 間 15。 · 彈性臂22大致呈「S」型設置，其末端分叉設有兩接觸部 23。兩接觸部23可爽持晶片模組4之錫球40，使導電端子 表單編號A0101 第7頁/共23頁 [0013] M406830 2與晶片模組4之錫球40之一側具有兩接觸點，以實現導 電端子2與晶片模組4間之穩定接觸，進而實現電連接器 100與晶片模組4間穩定電性連接。兩接觸部23具有相對 設置之弧狀第一央持面230。導電端子2還包括由主體部 20底端中部向下彎折延伸設置之勾狀焊接部24。焊接部 24伸出絕緣本體1之下表面11，可與絕緣本體1之第二凹 槽14之壁面配合，用以將錫球3機械固持於絕緣本體1上 。所述焊接部24與絕緣本體1之第二凹槽14間形成有一用 以收容錫球3之第二收容空間16。所述彈性臂22與焊接部 24位於主體部20同一側。所述彈性臂22末端之接觸部23 間形成一開口 231。 ， . -Ά· ·， ...... '、乂?..： ...[New Content] >‘;H The purpose of this creation is to provide an electrical connector that can perform good electrical connection with the chip module. The electrical connector of the present invention is realized by the following technical solution: an electrical connector is used for electrically connecting a solder ball with a scorpion locust: each board of the plaque, which comprises an insulating cover with a plurality of terminal receiving slots : and the number of the relays in the terminal housing gr > ·, < The conductive end hand includes a main part, a resilient arm extending upwardly from the main body portion, and a welded portion extending downwardly from the main body portion. The upper surface of the insulating body is recessed downward to form a connection with the terminal receiving groove. a groove. The first recess and the elastic arm of the conductive terminal enclose a first receiving space in which the solder ball of the wafer module is formed. The end of the elastic arm is provided with two clamping portions for holding the solder balls of the wafer module. The electrical connector of the present invention can also be realized by the following technical solution: an electrical connector 'for electrically connecting a chip module and a circuit board provided with a solder ball, the fifth page/total 23 pages [0008] M406830 includes The insulating body has a plurality of receiving holes and a plurality of conductive terminals received in the receiving holes of the insulating body. The conductive terminal includes a main body portion, one of which is bent upwardly and extended from the main body portion, and a pair of elastic arms and a welded portion which is bent and extended downward from the main body portion. The elastic arm of the conductive terminal is received in the terminal receiving hole and surrounds the corresponding wall surface of the terminal receiving hole to form a first receiving space for receiving the solder ball of the wafer module. [0009] Compared with the prior art, the electrical connector of the present invention forms a first receiving space formed by the elastic arm of the conductive terminal and the first recess of the insulating body to receive the solder ball of the chip module, thereby preventing the wafer module from being damaged. The positive position problem damages the conductive terminal, and the two contact portions provided by the end of the elastic arm are clamped to hold the solder ball of the wafer module, so that the conductive terminal and the crystal die: the tin 'ball v between the group has two contacts Point to ensure good electrical contact between the conductive terminal and the wafer mold: group*, thereby ensuring a good electrical connection between the electrical connector and the wafer module. [Embodiment] [0010] The first to seventh figures are shown, wherein the first to sixth figures are the first embodiment of the creation, and the seventh figure is the second embodiment of the creation. The electrical connector 100 of the first embodiment is electrically connected to the chip module 4 and the circuit board 5 on which the solder balls 40 are disposed, and includes an insulating body 1 and a plurality of conductive layers disposed in the insulating body 1. The terminal 2 and the plurality of mechanical balls are held by the solder balls 3 below the insulating body 1. [0011] Please refer to the second to sixth figures, the insulative housing 1 is made of an insulating material and has a substantially rectangular plate-like configuration, and has an oppositely disposed upper surface 10, a lower surface 11 and a through-surface 10 The plurality of terminal receiving grooves 12 are provided on the lower surface 11. The terminal receiving slot 12 is configured to receive the conductive terminal 2, and includes a receiving slot 120 and a retaining slot 1 21 on opposite sides of the receiving slot 120 and communicating with the receiving slot 120 on the side of the form number A0101. The receiving groove 120 is substantially semi-circular and has an arc-shaped first guiding surface 122. The holding groove 121 is substantially rectangular in shape and has a second guiding surface 123 which is inclined. The upper surface 10 of the insulative housing 1 is recessed downwardly to form a first recess 13 opposite to the receiving groove 120 of the terminal receiving groove 12. The first recess 13 is substantially semi-circular and has a receiving surface 130 for receiving the bottom of the solder ball 40 of the wafer module 4. The lower surface 11 of the insulative housing 1 is recessed upwardly to form a second recess 14 directly below the first recess 13. The second recess 14 is semi-circular and has an abutting surface 140 that abuts the top end of the solder ball 3. The first groove 13 and the second groove 14 are located on the same side of the terminal receiving groove 12. The terminal receiving groove 12' first groove 13 and the second groove 14 constitute a receiving hole 17. v. ':'<',, [0012] § Green focus refers to the second and third figures. In the sixth figure, the conductive terminal 2 can be in the terminal receiving slot 12 of the insulative housing 1. A guiding surface 122 and a second guiding surface 123 are guided into the terminal receiving groove 12, and include a plate-shaped main body portion 20. The two ends of the main body portion 20 are vertically disposed to extend in the terminal receiving groove 12 of the insulating body 1 and two holding portions 21 of the solid groove 121. The holding portion 21 can interfere with the corresponding wall surface of the holding groove 121 of the terminal receiving groove 12 of the insulative housing 1 to hold the conductive terminal 2 in the insulative housing 1. The middle portion of the top end of the main body portion 20 is bent upwardly and extends with a resilient arm 22 between the two holding portions 21. The elastic arm 22 is received in the receiving groove 120 of the terminal receiving groove 12 of the insulative housing 1 , and forms a first receiving space between the first groove 13 of the insulative housing 1 for receiving the solder ball 4 of the wafer module 4 . Space 15. The elastic arm 22 is disposed substantially in an "S" shape, and the end portion is bifurcated with two contact portions 23. The two contact portions 23 can hold the solder balls 40 of the wafer module 4 so that the conductive terminal form number A0101 page 7/23 pages [0013] M406830 2 has two contact points with one side of the solder ball 40 of the wafer module 4. In order to achieve stable contact between the conductive terminal 2 and the die module 4, a stable electrical connection between the electrical connector 100 and the die module 4 is achieved. The two contact portions 23 have opposite arcuate first central holding surfaces 230. The conductive terminal 2 further includes a hook-shaped soldering portion 24 which is bent downwardly from the central portion of the bottom end of the main body portion 20. The soldering portion 24 extends from the lower surface 11 of the insulative housing 1 to cooperate with the wall surface of the second recess 14 of the insulative housing 1 for mechanically holding the solder ball 3 on the insulative housing 1. A second receiving space 16 for receiving the solder balls 3 is formed between the soldering portion 24 and the second recess 14 of the insulative housing 1. The elastic arm 22 and the welded portion 24 are located on the same side of the main body portion 20. An opening 231 is formed between the contact portions 23 at the ends of the elastic arms 22. , . -Ά· ·, ...... ',乂?..: ...
[0014] 組裝時，首先將導電端子2於絕緣本智士各端，子收容槽12 • ,，ra ：； '·*, 之第一導引面122與第二導引面123之引導下組入絕緣本 體1中。此時，導電端子2之固持部21收容於絕緣本體1之 端子收容槽12之固持槽121中。彈性臂22收容於絕緣本體 1之端子收容槽12之容納槽120中。接著#導電端子2之焊 : . 接部24與絕緣本體1之第二凹槽14之配合以將錫球3固持 .；. Λ 於絕緣本體1上。此時，錫球3收容於焊接部24與第二凹 槽14形成之第二收容空間16中。電連接器100可藉錫球3 將導電端子2焊接於電路板5上，以實現電連接器100與電 路板5間電性導通。 [0015] 組裝好後，可將晶片模組4組設於電連接器100上。此時 ，晶片模組4之錫球40收容於導電端子2之彈性臂22與絕 緣本體1之第一凹槽13形成之第一收容空間15中，並與導 電端子2之兩接觸部24接觸。此時，即實現了晶片模組4 表單编號Α0101 第8頁/共23頁 /、電連接器1 Ο0間電性導通。 [0016] ^ _ _ ^ θ所不為本創作之第二實施方式之導電端子2,，其 褒方式與第-實施方式相同，與第一實施方式不同之 處在於·導電端子2,之兩接觸部23,間之開口 231，自接 觸。Ρ 23之底端沿彈性臂22，之彎折方向延伸至彈性臂 與主體。Ρ20之連接處。兩固持部21，之内側各朝遠 彈I·生邊22之方向彎折後沿水平方向延伸設有一彎折臂 山，可夾持於晶片模組4之錫球4〇之相對兩侧，使導電 =子2’與晶片模組4之錫球4〇具有四個接.觸點，實現導電 端子2與晶片模組4間良好之電性接觸。所述彎折臂25， 於導電端子2,組設於絕緣轉丄端子乂!^2中後位於 第7凹槽13中。所述彎折臂^5，輿彈^臂2卜焊接部 24刀別位於主體部2〇’之相對兩側。所述彎折臂具 有弧狀第二夾持面250’。 ， _本創作電連接器100藉導警制之彈_22與絕緣本體i 之第—凹槽13之相應壁面率令，將晶片模組4之錫球4〇固 持於第一收容空間15中，可_晶⑩模組4之錫球4〇因正 位度問題而損壞導電端子2，並藉導電端子2之兩接觸部 23夾持晶片模組4之錫球40，使導電端子2與晶片模組4之 錫球40間具有兩接觸點，進而使導電端子2與晶片模組* 間具有較穩定之電性連接，且；藉導電端子2之勾狀痒接 部24與絕緣本體丨之第二凹槽14之相應壁面配合將锡球3 機械固持於第二收容空間16中，無需預先將錫球3焊接於 導電端子2上，可簡化操作過程、節省加工成本。另電 連接器100藉導電端子2,之兩彎折臂25,與兩接觸部23， 表單编號A0101 第9頁/共23頁 M406830 夾持晶片模組4之錫球40，可使導電端子2’與晶片模組4 之錫球40間具有四個接觸點，以使導電端子2’與晶片模 組4之錫球40間具有更穩定之電性接觸，進而保證電連接 器100與晶片模組4間具有良好電性連接。 [0018] 综上所述，本創作符合新型專利要件，爰依法提出專利 申請。惟，以上所述者僅為本創作之較佳實施例，本創 作之範圍並不以上述實施例為限，舉凡熟習本案技藝之 人士援依本創作之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内》 【圖式簡單說明】 Λ • ·，. Ί务 [0019] 第一圖係本創作苐一實施例之電連接.器:&曰曰曰片模組之立 體組合圖； ◊ [0020] 第二圖係本創作第一實施例之電連接器之立體組合圖； [0021] 第三圖係第二圖所示電連接器之立體分解圖； [0022] 第四圖係第二圖所示電連接器之絕緣本體之立體圖； [0023] 第五圖係第二圖所示電連接器之絕婊本體之另一視角之 立體圖； [0024] 第六圖係本創作第一實施例之電連接器電性連接晶片模 組與電路板之剖視圖；及 [0025] 第七圖係本創作第二實施例之電連接器之導電端子之立 體圖。 【主要元件符號說明】 [0026] 電連接器：100 表單編號Α0101 第10頁/共23頁 M406830 [0027] [0028] [0029] [0030] [0031] [0032] [0033][0014] When assembling, firstly, the conductive terminal 2 is guided by the first guiding surface 122 and the second guiding surface 123 of the insulated main body, the sub-accommodating groove 12 • , , ra :; Into the insulative body 1. At this time, the holding portion 21 of the conductive terminal 2 is received in the holding groove 121 of the terminal receiving groove 12 of the insulative housing 1. The elastic arm 22 is received in the receiving groove 120 of the terminal receiving groove 12 of the insulative housing 1. Then, the soldering of the conductive terminal 2: the connecting portion 24 cooperates with the second recess 14 of the insulative housing 1 to hold the solder ball 3 on the insulating body 1. At this time, the solder ball 3 is housed in the second housing space 16 formed by the soldering portion 24 and the second recess 14. The electrical connector 100 can solder the conductive terminal 2 to the circuit board 5 by solder balls 3 to electrically connect the electrical connector 100 and the circuit board 5. [0015] After assembly, the wafer module 4 can be assembled on the electrical connector 100. At this time, the solder ball 40 of the wafer module 4 is received in the first receiving space 15 formed by the elastic arm 22 of the conductive terminal 2 and the first recess 13 of the insulative housing 1, and is in contact with the two contact portions 24 of the conductive terminal 2. . At this time, the wafer module 4 form number Α0101, page 8/23 pages, and the electrical connector 1 Ο0 are electrically connected. [0016] ^ _ _ ^ θ is not the conductive terminal 2 of the second embodiment of the present invention, and the 褒 is the same as that of the first embodiment, and is different from the first embodiment in that the conductive terminal 2, two of The contact portion 23, the opening 231 between the contacts, is self-contacting. The bottom end of the crucible 23 extends along the elastic arm 22 in a bending direction to the elastic arm and the main body. Ρ20 connection. The inner side of each of the two holding portions 21 is bent in the direction of the far side I and the green side 22, and then extends in the horizontal direction to form a bent arm mountain, which can be clamped on opposite sides of the solder ball 4 of the wafer module 4. The conductive = sub- 2' and the solder ball 4 of the wafer module 4 have four contacts, which achieve good electrical contact between the conductive terminal 2 and the wafer module 4. The bending arm 25 is disposed in the seventh recess 13 after the conductive terminal 2 is disposed in the insulating switch terminal 乂! The bending arm ^5, the arm portion 2, and the welding portion 24 are located on opposite sides of the main body portion 2'. The bending arm has an arcuate second clamping surface 250'. The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The solder ball 4 of the crystal module 4 can damage the conductive terminal 2 due to the problem of the positive position, and sandwich the solder ball 40 of the wafer module 4 by the two contact portions 23 of the conductive terminal 2, so that the conductive terminal 2 and the conductive terminal 2 The solder balls 40 of the chip module 4 have two contact points, thereby providing a relatively stable electrical connection between the conductive terminals 2 and the wafer module *, and the hook-shaped hem portions 24 and the insulating body of the conductive terminals 2 The corresponding wall surface of the second recess 14 mechanically holds the solder ball 3 in the second receiving space 16 without soldering the solder ball 3 to the conductive terminal 2 in advance, which simplifies the operation process and saves processing costs. The electrical connector 100 can hold the solder ball 25 of the wafer module 4 by the conductive terminal 2, the two bending arms 25, and the two contact portions 23, Form No. A0101, page 9 / 23 pages M406830, and the conductive terminal can be used. 2' has four contact points with the solder ball 40 of the wafer module 4, so that the conductive terminal 2' and the solder ball 40 of the wafer module 4 have more stable electrical contact, thereby ensuring the electrical connector 100 and the wafer. The modules 4 have a good electrical connection. [0018] In summary, the creation complies with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered in the following patents. [Simplified illustration] Λ • ·,. Ί [0019] The first picture is the electrical connection of the present embodiment. The device: & [0021] The second figure is a perspective assembled view of the electrical connector of the first embodiment of the present invention; [0021] The third figure is an exploded perspective view of the electrical connector shown in the second figure; [0022] 4 is a perspective view of the insulative housing of the electrical connector shown in FIG. 2; [0023] FIG. 5 is a perspective view of another perspective view of the main body of the electrical connector shown in FIG. 2; [0024] A cross-sectional view of the electrical connector of the first embodiment of the present invention is electrically connected to the chip module and the circuit board; and [0025] FIG. 7 is a perspective view of the conductive terminal of the electrical connector of the second embodiment of the present invention. [Main component symbol description] [0026] Electrical connector: 100 Form number Α 0101 Page 10 / Total 23 pages M406830 [0028] [0029] [0033] [0033]
[0034] [0035] [0036] [0037] [0038] [0039][0039] [0039] [0039]
[0040] [0041] [0042] [0043] [0044] [0045] 絕緣本體：1 上表面：10 下表面：11 端子收容槽：12 容納槽：120 固持槽：121 第一導引面：122 第二導引面：123 第一凹槽：13 承接面：13 0 第二凹槽：14 抵接面：140 第一收容空間：15 第二收容空間：16 收容孔：17 導電端子：2、2’ 主體部：20、20’ 固持部：21、21’ 彈性臂：22、22’ 表單編號A0101 第11頁/共23頁 M406830 [0046] 接觸部：23 、23， [0047] 第一炎持面 :230 ' 230 [0048] 開口 ： 231、 231， [0049] 焊接部：24 、24’ [0050] 彎折臂：25’ [0051] 第二央持面 :250’ [0052] 錫球：3 [0053] 晶片模組· 4 [0054] 錫球：4 0 [0055] 電路板：5 表單編號A0101 第12頁/共23[0044] [0044] [0045] Insulating body: 1 upper surface: 10 lower surface: 11 terminal receiving groove: 12 receiving groove: 120 holding groove: 121 first guiding surface: 122 Second guiding surface: 123 First groove: 13 Bearing surface: 13 0 Second groove: 14 Abutment surface: 140 First receiving space: 15 Second receiving space: 16 Receiving hole: 17 Conductive terminal: 2. 2' Main body: 20, 20' Holding part: 21, 21' Elastic arm: 22, 22' Form No. A0101 Page 11 / Total 23 pages M406830 [0046] Contact: 23, 23, [0047] First inflammation Hold: 230 ' 230 [0048] Opening: 231, 231, [0049] Weld: 24, 24' [0050] Bent arm: 25' [0051] Second central holding surface: 250' [0052] Tin ball :3 [0053] Wafer Module · 4 [0054] Tin Ball: 4 0 [0055] Board: 5 Form No. A0101 Page 12 of 23