TWM405642U - Trichromatic light emitting diode module - Google Patents
Trichromatic light emitting diode module Download PDFInfo
- Publication number
- TWM405642U TWM405642U TW099225582U TW99225582U TWM405642U TW M405642 U TWM405642 U TW M405642U TW 099225582 U TW099225582 U TW 099225582U TW 99225582 U TW99225582 U TW 99225582U TW M405642 U TWM405642 U TW M405642U
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K99/00—Subject matter not provided for in other groups of this subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H10W90/00—
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
Description
M405642 五、新型說明: 【新型所屬之技術領域】 本創作係關於一種發光二極體,尤指一種適用於模組 化之三色發光二極體結構。 【先前技術】 按發光二極體(Light Emitting Diode, LED)是一種半 φ 導體元件’具有耗電少、壽命長、及節省能源之優點,於 現今講求環保、節省能源的時代’已日益普遍使用於各種 照明設備中。 一般習知之發光二極體為因應小型封裝與工廠自動 化之需求’係採表面黏著之技術將發光二極體晶片與連接 端子組裝成一發光二極體成品’即俗稱之SMD(Sui*faee Mount Device,SMD) LED,然發光二極體晶片之耐熱性較 一般的晶片為低,因此發光二極體成品易因受高溫之錫爐 製程影響,而產生功能不良現象,影響整體成品之良率, " 無形中也造成人力、時間之浪費,廠商之成本提高,相對 地降低競爭力。 此外’習知之發光二極體晶片因需與連接端子組裝成 成品’其組裝後之發光二極體成品之體積較大,於現今電 子資訊產品走向輕薄短小之趨勢,並不相符。又習知之 發光二極體晶片侷限於單一原色,無法混成他種顏色,亦 即使用者無法改變顏色。因此,習知之發光二極體結構並 非十分理想。 3 巫思一 」,幾 創作人原因於此,本於積極發明創作之精神, :重可以解決上述問題之「三色發光二極體模組結構 '、至研究實驗終至完成本創作。 【新型内容】 本創作之主要目的俜右趄板 达—h心 …係在k供一種。色發光二極體模 ••且'·〇構,俾能透過四支獨立的 又询立的鳊子與二色發光二極體晶片 合配’構成紅、綠、藍三色發光體獨立迴路,以不同的 電壓組合,控制混成顏色。 本創作之另一目的係在提供一種三色發光二極體模 2搆’俾能^支料利料壓技術完錢可與絕緣底 於(射出成型’再透過上蓋將三色發光二極體晶片蓋設 1緣底座上,不需透過焊接方式安裝,可避免習用表面 j著1私方式易文尚溫製程之影響,因而可提昇產品品 質’且整體三色發光二極體之結構也可達到輕薄短小之目 的。 為達成上述目的’本創作之三色發光二極體模組結 一。:、吧緣底座 '四端子、-三色發光二極體晶片 及一亡蓋。其中,絕緣底座包括有-上表面,上表面凹設 有一谷室,且容室包括有一容置檜。 上述四端子包括有一第一端子一苐二端子'一第三 而千及$四端子,彼此立+接觸,每一端子包括有相連 之插αχ σ卩及一接觸部,接觸部係容設於絕緣底座之容置 M405642 檜内,而插設部則凸伸於絕緣底座外,且四端子與絕緣底 座係為一體成型之結構。 * 上述三色發光二極體晶片承置於絕緣底座之容置槽 上,二色發光二極體晶片之四接腳並分別與四端子之接觸 部接觸。另上蓋係蓋設於絕緣底座之容室上,上蓋並包括 , 有—對應套設於三色發光二極體晶片之貫孔。 上述一色發光一極體晶片可具有一肩部,上蓋之貫孔 可抵頂於三色發光二極體晶片之肩部,俾可使上蓋與三色 發光二極體晶片易於相互固定。 上述四端子之插設部可位於絕緣底座之同側,當然四 端子之插設部也可位於絕緣底座之不同侧。另,絕緣底座 之側面可凹設有一卡合槽,俾可使整體三色發光二極體模 組結構易於與搭配使用之其他零組件相互固定。 【實施方式】 . 請同時參閱圖1係本創作一較佳實施例之分解圖、圖2 ·· 係本創作—較佳實施例之端子立體圖及圖3係本創作一較 佳貫施例之剖視圖。本實施例之三色發光二極體模組結 構’包括有:一絕緣底座2、四端子31,33,35,37、一三色發 光一極體晶片4及一上蓋5。 如圖1所示’絕緣底座2具有一上表面21,上表面21凹 ax有一谷室22,容室22並具有一容置槽221。在本實施例 中’谷置槽221係位於絕緣底座2之中心位置,且絕緣底座2 之相對應二側面並各自凹設有二卡合槽25,該等卡合槽25 5 M405642 起·•歧二巴發光二極體棋組結構易於與搭配使用之其他 令組件相互卡合固定。 四端子31,33,35,37彼此互不接觸,包括有一第一端子 31 —第二端子33、一第三端子35及一第四端子37,每一 J而子31,3 3,35,37包括有相連之一插設部31 1,331,351,371及 —接觸部 3 12,332,352,372,接觸部 3 12,332,352,372係容設 於絕緣底座2之容置槽221内’插設部311,331,35 1,371則凸 伸於絕緣底座2外,四端子31,33,35,37與絕緣底座2係為一 體成型之結構(如圖2所示)。在本實施例中,四端子 31,33,35,37之插設部311,331,351,371係位於絕緣底座2之 同側’且每一端子31,33,35,37之插設部311,33 1,35 1,371係 垂直於絕緣底座2。 二色發光二極體晶片4承置於絕緣底座2之容置槽 221 —色發光一極體晶片4之四接腳41,43,45,47並分別與 四端子31,33,35,37之接觸部312,332,352,372接觸。 如圖1所示,上蓋5係蓋設於絕緣底座2之容室22上,上 盍5具有一貫孔5卜貫孔5 1係對應套設於三色發光二極體晶 片4之二肩部49上。亦即,如圖3所示,上蓋5係抵頂三色發 光二極體晶片4之二肩部49,因此上蓋5與三色發光二極體 晶片4組合後,上蓋5與三色發光二極體晶片4之頂面係齊 平,而整體三色發光二極體模組結構之上蓋5、三色發光二 n μ晶片4舆絕緣底座2之頂品也係齊平= 藉此,本貫施例不僅可透過四獨立端子31,33 35,37與 二色發光一極體晶片4之搭配,構成紅、綠、藍三色發光體 M405642 =迴路’以不同的電频合,控制混成顏色。且可將四 料,33,35,37利用沖壓技術完成後再與絕緣底座2-起 缝成聖肖透過上盍5將三色發光二極體晶片4蓋設於絕 田:座2之容置槽221,不需透過焊接方式安裝,可避免習 α ^黏著製程方式易受高溫製程之影響,因而可提昇產 ”品質’且整體三色發光二極體模組結構也可達到輕薄短 小之功效。
上述實施例僅係為了方便說明而舉例而已,本創作所 主張之權利範圍自應以申請專利範圍所述為準,而非僅限 於上述貫施例。 【圖式簡單說明】 圖1係本創作一較佳實施例之分解圖。 圖2係本創作一較佳實施例之立體圖。 圖3係本創作一較佳實施例之剖視圖。
【主要元件符號說明】 2 絕緣底座 22 容室 25 卡合槽 311,331,351,371 插設部 33 第二端子 37 第四端子 41,43,45,47 接腳 21 上表面 221 容置槽 31 第一端子 312,332,352,372 接觸部 35 第三端子 4 三色發光二極體晶 49 肩部 M405642
Claims (1)
- 六、申請專利範圍: 1 一㈣種二色發光二極體模組結構,包括: 室 j六〜底座 包括有—上表面,該上表面凹設有一容 5亥谷室包括有一容置槽; 四端子,包括有—第— .π 1 1 —第二'一第三及一第四端 皮此互不接觸’每-端子包括有相連之-插設部及― 觸卩。$接觸。Ρ係谷設於該容置槽内,該插設部係四伸 1該絕緣底座外,該四端子與該絕緣 結構; “—色發光一極體晶片,承置於該容置槽,該三色發 光二極體晶片之四接腳並分別與該四端子之該接觸部接 觸;以及 —上蓋,係蓋設於該絕緣底座之該容室上,該上蓋包 有貝孔°玄貝孔係對應套設於該三色發光二極體晶片。 ^ 2.如申請專利範圍第1項所述之三色發光二極體模組 =構,其中,該三色發光二極體晶片包括有一肩部,該上 盖之底面係抵頂該肩部。 3·如申請專利範圍第丨項所述之三色發光二極體模組 結構,其令,該四端子之該插設部係位於該絕緣底座之 伽J 〇 _ Β 4. 如申請專利範圍第1項所述之三色發光二極體模組 構,其中’ έ亥絕緣底座之側面並凹設有--合槽。 5. 如申請專利範圍第1項所述之三色發光二極體模組 構其中,母一端子之該插設部係垂直於該绝緣底座。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099225582U TWM405642U (en) | 2010-12-30 | 2010-12-30 | Trichromatic light emitting diode module |
| US13/064,512 US20120168807A1 (en) | 2010-12-30 | 2011-03-30 | Tri-color LED module structure |
| DE202011000722U DE202011000722U1 (de) | 2010-12-30 | 2011-03-30 | Dreifarben-LED-Modulstruktur |
| GB1105756.9A GB2487804B (en) | 2010-12-30 | 2011-04-05 | Tri-color LED module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099225582U TWM405642U (en) | 2010-12-30 | 2010-12-30 | Trichromatic light emitting diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM405642U true TWM405642U (en) | 2011-06-11 |
Family
ID=44751822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099225582U TWM405642U (en) | 2010-12-30 | 2010-12-30 | Trichromatic light emitting diode module |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120168807A1 (zh) |
| DE (1) | DE202011000722U1 (zh) |
| GB (1) | GB2487804B (zh) |
| TW (1) | TWM405642U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104433028A (zh) * | 2011-11-21 | 2015-03-25 | 长广科技有限公司 | 伞具的整合型发光零件及其导线架 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015116855A1 (de) | 2015-10-05 | 2017-04-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einem Leiterrahmen mit einer Versteifungsstruktur |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5266817A (en) * | 1992-05-18 | 1993-11-30 | Lin Paul Y S | Package structure of multi-chip light emitting diode |
| US7637737B2 (en) * | 1999-12-21 | 2009-12-29 | S.C. Johnson & Son, Inc. | Candle assembly with light emitting system |
| US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
| US7777247B2 (en) * | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
-
2010
- 2010-12-30 TW TW099225582U patent/TWM405642U/zh not_active IP Right Cessation
-
2011
- 2011-03-30 US US13/064,512 patent/US20120168807A1/en not_active Abandoned
- 2011-03-30 DE DE202011000722U patent/DE202011000722U1/de not_active Expired - Lifetime
- 2011-04-05 GB GB1105756.9A patent/GB2487804B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104433028A (zh) * | 2011-11-21 | 2015-03-25 | 长广科技有限公司 | 伞具的整合型发光零件及其导线架 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2487804A (en) | 2012-08-08 |
| DE202011000722U1 (de) | 2011-09-02 |
| US20120168807A1 (en) | 2012-07-05 |
| GB201105756D0 (en) | 2011-05-18 |
| GB2487804B (en) | 2014-11-05 |
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