TWM405642U - Trichromatic light emitting diode module - Google Patents

Trichromatic light emitting diode module Download PDF

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Publication number
TWM405642U
TWM405642U TW099225582U TW99225582U TWM405642U TW M405642 U TWM405642 U TW M405642U TW 099225582 U TW099225582 U TW 099225582U TW 99225582 U TW99225582 U TW 99225582U TW M405642 U TWM405642 U TW M405642U
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TW
Taiwan
Prior art keywords
insulating base
emitting diode
color
terminal
terminals
Prior art date
Application number
TW099225582U
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English (en)
Inventor
jing-hao Zhong
Xiu-Zhen Li
Pei-Dong Zhong
Original Assignee
Forward Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Priority to TW099225582U priority Critical patent/TWM405642U/zh
Priority to US13/064,512 priority patent/US20120168807A1/en
Priority to DE202011000722U priority patent/DE202011000722U1/de
Priority to GB1105756.9A priority patent/GB2487804B/en
Publication of TWM405642U publication Critical patent/TWM405642U/zh

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00Subject matter not provided for in other groups of this subclass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W90/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)

Description

M405642 五、新型說明: 【新型所屬之技術領域】 本創作係關於一種發光二極體,尤指一種適用於模組 化之三色發光二極體結構。 【先前技術】 按發光二極體(Light Emitting Diode, LED)是一種半 φ 導體元件’具有耗電少、壽命長、及節省能源之優點,於 現今講求環保、節省能源的時代’已日益普遍使用於各種 照明設備中。 一般習知之發光二極體為因應小型封裝與工廠自動 化之需求’係採表面黏著之技術將發光二極體晶片與連接 端子組裝成一發光二極體成品’即俗稱之SMD(Sui*faee Mount Device,SMD) LED,然發光二極體晶片之耐熱性較 一般的晶片為低,因此發光二極體成品易因受高溫之錫爐 製程影響,而產生功能不良現象,影響整體成品之良率, " 無形中也造成人力、時間之浪費,廠商之成本提高,相對 地降低競爭力。 此外’習知之發光二極體晶片因需與連接端子組裝成 成品’其組裝後之發光二極體成品之體積較大,於現今電 子資訊產品走向輕薄短小之趨勢,並不相符。又習知之 發光二極體晶片侷限於單一原色,無法混成他種顏色,亦 即使用者無法改變顏色。因此,習知之發光二極體結構並 非十分理想。 3 巫思一 」,幾 創作人原因於此,本於積極發明創作之精神, :重可以解決上述問題之「三色發光二極體模組結構 '、至研究實驗終至完成本創作。 【新型内容】 本創作之主要目的俜右趄板 达—h心 …係在k供一種。色發光二極體模 ••且'·〇構,俾能透過四支獨立的 又询立的鳊子與二色發光二極體晶片 合配’構成紅、綠、藍三色發光體獨立迴路,以不同的 電壓組合,控制混成顏色。 本創作之另一目的係在提供一種三色發光二極體模 2搆’俾能^支料利料壓技術完錢可與絕緣底 於(射出成型’再透過上蓋將三色發光二極體晶片蓋設 1緣底座上,不需透過焊接方式安裝,可避免習用表面 j著1私方式易文尚溫製程之影響,因而可提昇產品品 質’且整體三色發光二極體之結構也可達到輕薄短小之目 的。 為達成上述目的’本創作之三色發光二極體模組結 一。:、吧緣底座 '四端子、-三色發光二極體晶片 及一亡蓋。其中,絕緣底座包括有-上表面,上表面凹設 有一谷室,且容室包括有一容置檜。 上述四端子包括有一第一端子一苐二端子'一第三 而千及$四端子,彼此立+接觸,每一端子包括有相連 之插αχ σ卩及一接觸部,接觸部係容設於絕緣底座之容置 M405642 檜内,而插設部則凸伸於絕緣底座外,且四端子與絕緣底 座係為一體成型之結構。 * 上述三色發光二極體晶片承置於絕緣底座之容置槽 上,二色發光二極體晶片之四接腳並分別與四端子之接觸 部接觸。另上蓋係蓋設於絕緣底座之容室上,上蓋並包括 , 有—對應套設於三色發光二極體晶片之貫孔。 上述一色發光一極體晶片可具有一肩部,上蓋之貫孔 可抵頂於三色發光二極體晶片之肩部,俾可使上蓋與三色 發光二極體晶片易於相互固定。 上述四端子之插設部可位於絕緣底座之同側,當然四 端子之插設部也可位於絕緣底座之不同侧。另,絕緣底座 之側面可凹設有一卡合槽,俾可使整體三色發光二極體模 組結構易於與搭配使用之其他零組件相互固定。 【實施方式】 . 請同時參閱圖1係本創作一較佳實施例之分解圖、圖2 ·· 係本創作—較佳實施例之端子立體圖及圖3係本創作一較 佳貫施例之剖視圖。本實施例之三色發光二極體模組結 構’包括有:一絕緣底座2、四端子31,33,35,37、一三色發 光一極體晶片4及一上蓋5。 如圖1所示’絕緣底座2具有一上表面21,上表面21凹 ax有一谷室22,容室22並具有一容置槽221。在本實施例 中’谷置槽221係位於絕緣底座2之中心位置,且絕緣底座2 之相對應二側面並各自凹設有二卡合槽25,該等卡合槽25 5 M405642 起·•歧二巴發光二極體棋組結構易於與搭配使用之其他 令組件相互卡合固定。 四端子31,33,35,37彼此互不接觸,包括有一第一端子 31 —第二端子33、一第三端子35及一第四端子37,每一 J而子31,3 3,35,37包括有相連之一插設部31 1,331,351,371及 —接觸部 3 12,332,352,372,接觸部 3 12,332,352,372係容設 於絕緣底座2之容置槽221内’插設部311,331,35 1,371則凸 伸於絕緣底座2外,四端子31,33,35,37與絕緣底座2係為一 體成型之結構(如圖2所示)。在本實施例中,四端子 31,33,35,37之插設部311,331,351,371係位於絕緣底座2之 同側’且每一端子31,33,35,37之插設部311,33 1,35 1,371係 垂直於絕緣底座2。 二色發光二極體晶片4承置於絕緣底座2之容置槽 221 —色發光一極體晶片4之四接腳41,43,45,47並分別與 四端子31,33,35,37之接觸部312,332,352,372接觸。 如圖1所示,上蓋5係蓋設於絕緣底座2之容室22上,上 盍5具有一貫孔5卜貫孔5 1係對應套設於三色發光二極體晶 片4之二肩部49上。亦即,如圖3所示,上蓋5係抵頂三色發 光二極體晶片4之二肩部49,因此上蓋5與三色發光二極體 晶片4組合後,上蓋5與三色發光二極體晶片4之頂面係齊 平,而整體三色發光二極體模組結構之上蓋5、三色發光二 n μ晶片4舆絕緣底座2之頂品也係齊平= 藉此,本貫施例不僅可透過四獨立端子31,33 35,37與 二色發光一極體晶片4之搭配,構成紅、綠、藍三色發光體 M405642 =迴路’以不同的電频合,控制混成顏色。且可將四 料,33,35,37利用沖壓技術完成後再與絕緣底座2-起 缝成聖肖透過上盍5將三色發光二極體晶片4蓋設於絕 田:座2之容置槽221,不需透過焊接方式安裝,可避免習 α ^黏著製程方式易受高溫製程之影響,因而可提昇產 ”品質’且整體三色發光二極體模組結構也可達到輕薄短 小之功效。
上述實施例僅係為了方便說明而舉例而已,本創作所 主張之權利範圍自應以申請專利範圍所述為準,而非僅限 於上述貫施例。 【圖式簡單說明】 圖1係本創作一較佳實施例之分解圖。 圖2係本創作一較佳實施例之立體圖。 圖3係本創作一較佳實施例之剖視圖。
【主要元件符號說明】 2 絕緣底座 22 容室 25 卡合槽 311,331,351,371 插設部 33 第二端子 37 第四端子 41,43,45,47 接腳 21 上表面 221 容置槽 31 第一端子 312,332,352,372 接觸部 35 第三端子 4 三色發光二極體晶 49 肩部 M405642

Claims (1)

  1. 六、申請專利範圍: 1 一㈣種二色發光二極體模組結構,包括: 室 j六〜底座 包括有—上表面,該上表面凹設有一容 5亥谷室包括有一容置槽; 四端子,包括有—第— .π 1 1 —第二'一第三及一第四端 皮此互不接觸’每-端子包括有相連之-插設部及― 觸卩。$接觸。Ρ係谷設於該容置槽内,該插設部係四伸 1該絕緣底座外,該四端子與該絕緣 結構; “—色發光一極體晶片,承置於該容置槽,該三色發 光二極體晶片之四接腳並分別與該四端子之該接觸部接 觸;以及 —上蓋,係蓋設於該絕緣底座之該容室上,該上蓋包 有貝孔°玄貝孔係對應套設於該三色發光二極體晶片。 ^ 2.如申請專利範圍第1項所述之三色發光二極體模組 =構,其中,該三色發光二極體晶片包括有一肩部,該上 盖之底面係抵頂該肩部。 3·如申請專利範圍第丨項所述之三色發光二極體模組 結構,其令,該四端子之該插設部係位於該絕緣底座之 伽J 〇 _ Β 4. 如申請專利範圍第1項所述之三色發光二極體模組 構,其中’ έ亥絕緣底座之側面並凹設有--合槽。 5. 如申請專利範圍第1項所述之三色發光二極體模組 構其中,母一端子之該插設部係垂直於該绝緣底座。
TW099225582U 2010-12-30 2010-12-30 Trichromatic light emitting diode module TWM405642U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW099225582U TWM405642U (en) 2010-12-30 2010-12-30 Trichromatic light emitting diode module
US13/064,512 US20120168807A1 (en) 2010-12-30 2011-03-30 Tri-color LED module structure
DE202011000722U DE202011000722U1 (de) 2010-12-30 2011-03-30 Dreifarben-LED-Modulstruktur
GB1105756.9A GB2487804B (en) 2010-12-30 2011-04-05 Tri-color LED module structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099225582U TWM405642U (en) 2010-12-30 2010-12-30 Trichromatic light emitting diode module

Publications (1)

Publication Number Publication Date
TWM405642U true TWM405642U (en) 2011-06-11

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TW099225582U TWM405642U (en) 2010-12-30 2010-12-30 Trichromatic light emitting diode module

Country Status (4)

Country Link
US (1) US20120168807A1 (zh)
DE (1) DE202011000722U1 (zh)
GB (1) GB2487804B (zh)
TW (1) TWM405642U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104433028A (zh) * 2011-11-21 2015-03-25 长广科技有限公司 伞具的整合型发光零件及其导线架

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015116855A1 (de) 2015-10-05 2017-04-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einem Leiterrahmen mit einer Versteifungsstruktur

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266817A (en) * 1992-05-18 1993-11-30 Lin Paul Y S Package structure of multi-chip light emitting diode
US7637737B2 (en) * 1999-12-21 2009-12-29 S.C. Johnson & Son, Inc. Candle assembly with light emitting system
US7775685B2 (en) * 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104433028A (zh) * 2011-11-21 2015-03-25 长广科技有限公司 伞具的整合型发光零件及其导线架

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GB2487804A (en) 2012-08-08
DE202011000722U1 (de) 2011-09-02
US20120168807A1 (en) 2012-07-05
GB201105756D0 (en) 2011-05-18
GB2487804B (en) 2014-11-05

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