M403863 五、新型說明： 【新型所屬之技術領域】 特別是指一種 本新型是有關於一種麥克風音頭裝置 電容式麥克風音頭裝置。 【先前技術】M403863 V. New description: [New technology field] Especially refers to a new type of microphone head device Capacitive microphone head device. [Prior Art]
-般電容式麥克風裝配時’部分設計是將音頭固定在 管身的音頭座中，而直接與放大電路㈣連接，而為了降 低觸摸音頭座所產生之雜音，有些設計會在音㈣上再加 裝-個避震座，並將音頭安裝固定於該避震座上，作此設 計會造成音頭與放大電路板無法直接電連接，必須在音頭 與放大電路板間以導線電連接，但是因為電容式音頭的輸 出端阻抗非常高’若以導線導接該音頭與放大電路板導 線很容易錢到周邊的雜音，而嚴重料麥克風的聲音品 質。因此，如何降低觸摸音頭座所產生之雜音，同時二低 周遭雜音的影響，《目前電容式麥克風發展上，巫待改善 突破的問題。 【新型内容】 因此’本新型之目的，即在提供一種可減少觸摸雜音 ，並可降低周遭雜音之影響的電容式麥克風音頭裝置。 於是’本新型電容式麥克風音頭裝置，包含一基座、 一安裝固定於該基座之彈性的避震座、一可感測聲音而輸 出一電訊號地安裝固定於該避震座的電容式音頭，及一電 連接於該電容式音頭之電路機構。該電路機構包括一個固 定於避震座中並直接電連接固定於電容式音頭而可接收處 3 M403863 理電容式音頭之電訊號的阻抗轉換電路板，及一安裝於該 基座且電連接於該阻抗轉換電路板並可接收處理該阻抗轉 換電路板輸出之電訊號的主電路板。 本新型之功效：透過把可將高阻抗輸出轉換成低阻抗 輸出之阻抗轉換電路板直接電連接於該電容式音頭的設計 ，可有效避免導線感應周遭雜音的情況，而可大幅提高所 製成之麥克風的音質。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 如圖1、2所示，本新型電容式麥克風音頭裝置的較佳 實施例，適用於安裝固定在一音頭座機構丨〇令’該音頭座 機構1〇具有—座本體10卜及-往下罩蓋於該座本體101 之音頭罩102。 該電容式麥克風音頭裝置包含一安裝固定於該座本體 1〇1之環狀的基座3、-安裝於該基座3上之彈性的避震座 4、一嵌裝固定於該避震座4之電容式音頭5 ,及一電連接 於該電容式音帛5且安裝於避震器4與基座3間之電路機 構6 〇 該基座3是螺設固定於該座本體1()1頂端部中且其 頂面凹設有一環狀的嵌裝槽30。 該避震座4是同軸嵌裝固定於該嵌裝槽％中並且有 -嵌置固定於該嵌裝槽30中之環狀的底環部41、一自該底 4 :。“1内周緣同體往上突伸出基座3外並呈中空 性錐部42、多個間隔對稱地自該錐部42外周：往上突伸 間桿部43' 一水平跨接固定於該等頂揮桿部《 :了 ％部44’及-徑向突設於頂環部料内周面頂側 :狀的限位環部45，且該錐部42具有二間隔自其外周面 延伸貫穿之穿孔421 ’及-自其頂端中心往下延伸貫穿 之軸孔422 ^ λ 6玄電谷式音頭5包括一被該頂« 44㊣性束套地嵌裝 U於頂環部44中之音頭本體5卜及—電連接焊固於該音 頭本體51並往下延伸貫穿該錐部42之轴孔422的直桿狀 5虎端子52。该音頭本體5 j是以其頂緣往上限位靠抵於該 位核部45 ’而以其底緣往下彈性限位靠抵於該錐部42頂 Λ並可感應周遭聲音而對應輸出一電訊號，該訊號端子 疋電連接於4音頭本體51輸出端，而可將該音頭本體 51之電Λ娩傳送至該電路機構6。實施時，該電容式音頭$ 還會在該音頭本體51電連接-接地線53，該接地線53會 往下延伸貫穿該錐部42之其中—穿孔421，而電連接於該 電路機構6。 4電路機構6包括-電連接焊固於該訊號端子52底端 4之阻^u轉換電路板6丨…經由導線⑼而電連接於該阻抗 轉換電路板61之主電路板62,及—電連接固定於該主電路 板62之輸出端子63。該阻抗轉換電路板61是設置於該錐 邙42中，並往上彈性靠抵於該錐部42内壁面，該主電路 板62是往上嵌裝固定於該基座3底端部中。 M403863 由於該電容式音頭5之輸出端阻抗非常高，通常可達 數百萬歐姆或數億歐姆，而所述阻抗係指電阻性、電感性 及電容性的集合統稱。該阻抗轉換電路板61之功用，即是 用以將電容式音頭5之高阻抗輸出轉換成低阻抗輸出，也 就是利用訊號端子52提供直接連結及電連接該音頭本體51 與阻抗轉換電路板61，將現有電容式音頭5直接經由導線 輸出訊號的過程中，導線在高阻抗狀態下易受干擾的情形 排除，轉換為較不易受干擾的低阻抗後，再傳至該主電路 板62進行後續相關訊號處理。由於阻抗轉換電路板61與 該主電路板62之訊號處理功能皆為習知技術，因此不再詳 述。 透過sfl號端子52直接連結及電連接該音頭本體51與 阻抗轉換電路板61 ’且訊號端子5 2及阻抗轉換電路板61 均設置於該彈性避震座4上’可有效避免高阻抗段易受觸 摸、碰撞、雜訊或靜電干擾的情況，且經轉換為較不易受 雜Ml干擾的低阻抗訊號後，再經由導線6〇電連接於主電路 板62的結構設計，確實可利用該彈性避震座4提供之緩衝 彈性，降低觸摸、碰撞音頭座機構10所產生之雜音，進而 使得本新型電容式麥克風音頭裝置可同時避免觸摸及撞擊 的雜音，及避免感應周遭雜音，可大幅提高所製成之麥克 風音質。 知上所述，透過將電容式音頭5安裝定位於該彈性避 震座4，並把可將高阻抗輸出轉換成低阻抗輸出之阻抗轉換 電路板61直接機構及電連接於該電容式音頭5的設計，除 6 M403863 了可藉由該避震座4降低觸摸及撞擊音頭座機構iq的雜音 外’也可有效避免導線感應周4雜音的情況，&而可大幅 提高以本新型電容式麥克風音頭裝置所製成之麥克風的音 質，相當方便f用。故確實能達成本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此㈣本新型實施之範圍，即大凡依本新型中請專利 範圍及新型說明内容所作之簡显When a condenser microphone is assembled, part of the design is to fix the sound head in the head holder of the tube body and directly connect it to the amplifier circuit (4). In order to reduce the noise generated by the touch head holder, some designs will be added to the sound (4). Install a shock mount and fix the head to the shock mount. This design will cause the sound head and the amplifier board to be directly connected. It must be electrically connected between the head and the amplifier board, but because of the capacitor The output of the head is very high impedance. 'If the lead is connected to the head and the board is amplified, it is easy to get the noise around, and the sound quality of the microphone is serious. Therefore, how to reduce the noise generated by the touch headphone, and at the same time the influence of the two low-circle noises, "the current development of condenser microphones, the problem of improving the breakthrough. [New content] Therefore, the purpose of the present invention is to provide a condenser microphone head device that can reduce the noise of touch and reduce the influence of surrounding noise. Thus, the novel condenser microphone head device includes a base, an elastic shock mount fixed to the base, and a capacitive type that can sense sound and output a signal to be fixed to the shock mount. a sound head, and a circuit mechanism electrically connected to the capacitive sound head. The circuit mechanism comprises an impedance conversion circuit board fixed in the suspension seat and directly electrically connected to the capacitive sound head and capable of receiving the electrical signal of the 3 M403863 capacitive acoustic head, and is mounted on the base and electrically connected to the base The impedance conversion circuit board can receive a main circuit board that processes the electrical signals output by the impedance conversion circuit board. The effect of the novel: by directly connecting the impedance conversion circuit board capable of converting the high-impedance output into the low-impedance output to the design of the capacitive sound head, the wire can be prevented from detecting the surrounding noise, and the effect can be greatly improved. The sound quality of the microphone. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. As shown in FIG. 1 and FIG. 2, the preferred embodiment of the novel condenser microphone head device is suitable for mounting and fixing to a head holder mechanism. The headphone mechanism 1 has a body 10 and a downward direction. The cover is covered by the head cover 102 of the seat body 101. The condenser microphone head device comprises a ring base 3 fixed to the seat body 1〇1, an elastic shock mount 4 mounted on the base 3, and a mounting fixed to the suspension seat. a capacitive sound head 5 of 4, and a circuit mechanism 6 electrically connected to the capacitive sound box 5 and mounted between the shock absorber 4 and the base 3. The base 3 is screwed to the seat body 1 () An annular fitting groove 30 is recessed in the top end portion of the top end portion. The suspension seat 4 is coaxially fitted and fixed in the fitting groove %, and has an annular bottom ring portion 41 which is embedded and fixed in the fitting groove 30, and a bottom portion 4 from the bottom. "1 inner circumference of the same body protrudes upwardly from the base 3 and has a hollow tapered portion 42, a plurality of intervals symmetrically from the outer circumference of the tapered portion 42: the upward protruding portion 43' is horizontally bridged and fixed The top swing portion ": % portion 44' and - radially projecting on the top side of the inner circumferential surface of the top ring portion: a limit ring portion 45, and the tapered portion 42 has two spaces from the outer peripheral surface thereof The through hole 421 'and the shaft hole 422 extending from the center of the top end thereof through the shaft hole 422 ^ λ 6 Xuandian Valley type sound head 5 includes a top portion of the top ring portion 44 embedded in the top portion 44 The head body 5 is electrically connected to the head body 51 and extends downwardly through the straight rod-shaped 5 tiger terminal 52 of the shaft hole 422 of the taper portion 42. The head body 5 j is upper limit with its top edge Positioned against the core portion 45' and with the bottom edge of the lower edge elastically biased against the top of the tapered portion 42 and can sense the surrounding sound, and correspondingly output a signal, the signal terminal is electrically connected to the 4-head. The output end of the body 51 can transmit the electrical delivery of the head body 51 to the circuit mechanism 6. In practice, the capacitive head $ is also electrically connected to the head body 51 - The grounding wire 53 extends downwardly through the through hole 421 of the tapered portion 42 and is electrically connected to the circuit mechanism 6. The circuit mechanism 6 includes an electrical connection and is soldered to the bottom end of the signal terminal 52. The resistance conversion circuit board 6 is electrically connected to the main circuit board 62 of the impedance conversion circuit board 61 via a wire (9), and is electrically connected to the output terminal 63 of the main circuit board 62. The impedance conversion circuit board 61 is disposed in the taper 42 and elastically abuts against the inner wall surface of the taper portion 42. The main circuit board 62 is fitted and fixed to the bottom end portion of the base 3. The M403863 is due to the capacitive type. The output of the head 5 has a very high impedance, usually up to several million ohms or hundreds of millions of ohms, and the impedance is a collective term for the combination of resistance, inductance and capacitance. The function of the impedance conversion board 61 is The high-impedance output of the capacitive head 5 is converted into a low-impedance output, that is, the signal terminal 52 is used to directly connect and electrically connect the head body 51 and the impedance conversion circuit board 61, and the existing capacitive head 5 is directly output via the wire. In the process of signal, The line is excluded from the situation of being susceptible to interference in the high-impedance state, and converted to a less susceptible low-impedance, and then transmitted to the main circuit board 62 for subsequent correlation signal processing. Since the impedance conversion circuit board 61 and the main circuit board 62 The signal processing functions are all known in the art, and therefore will not be described in detail. The head body 51 and the impedance conversion circuit board 61' are directly connected and electrically connected through the sfl terminal 52, and the signal terminal 52 and the impedance conversion circuit board 61 are both provided. The elastic suspension seat 4 can effectively avoid the situation that the high-impedance section is susceptible to touch, collision, noise or static electricity, and is converted into a low-impedance signal which is less susceptible to interference by the M1, and then via the wire 6〇 The structural design of the main circuit board 62 is electrically connected, and the cushioning elasticity provided by the elastic suspension seat 4 can be utilized to reduce the noise generated by the touch and collision of the headstock mechanism 10, thereby enabling the new condenser microphone head device to be avoided at the same time. The noise of touch and impact, and the avoidance of the surrounding noise, can greatly improve the sound quality of the microphone produced. As described above, the capacitive acoustic head 5 is mounted and positioned on the elastic suspension mount 4, and the impedance conversion circuit board 61 that can convert the high-impedance output into a low-impedance output is directly and mechanically connected to the capacitive acoustic head 5. The design, in addition to 6 M403863, can reduce the noise of the touch and impact headphone mechanism iq by the suspension seat 4, and can effectively avoid the situation of the wire sensing the 4th noise, and can greatly improve the capacitance type of the present invention. The sound quality of the microphone made by the microphone head device is quite convenient. Therefore, the purpose of this new type can be achieved. However, the above is only the preferred embodiment of the present invention, and it is not possible to use the scope of the present invention in the scope of the present invention, that is, the scope of the patent application and the new description in the present invention.
a ^ 間早的荨效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 頭裝置的一較佳實施例 g頭座機構時的組合側 圖1是本新型電容式麥克風音 之立體分解圖；及 圖2是該較佳實施例組合於 視剖面圖。 7 M403863 【主要元件符號說明】 10 ..... ....音頭座機構 44 .... .....頂環部 101.··. ----座本體 45 .... .....限位環部 102.... ....音頭罩 5...... .....電容式音頭 3....... ....基座 51 .... .....音頭本體 30 …·· ....嵌裝槽 52..… •…訊號端子 4....... ....避震座 53·...· •…接地線 41 ..... ....底環部 6…… •…電路機構 42 ….· ....錐部 60·...· •…導線 421.... …·穿孔 61 .··.· •…阻抗轉換電路板 422.... ....軸孔 62···· •…主電路板 43 ..... ....頂撐桿部 63...·· •…導電片The early changes and modifications of a ^ are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a condenser microphone of the present invention; and FIG. 2 is a cross-sectional view of the preferred embodiment of the present invention. . 7 M403863 [Description of main component symbols] 10 ..... .... Sound head mechanism 44 .... ..... Top ring part 101.··. ---- Seat body 45 .... ..... Limit ring part 102...... Sound head cover 5...... ..... Capacitive sound head 3......... Base 51 .... ..... head body 30 ...·· .... inlay slot 52..... •...signal terminal 4.........shock seat 53·... · •... Grounding wire 41 ..... .... Bottom ring part 6... •...Circuit mechanism 42 .........Cone section 60·...·......Wire 421.... - Perforation 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...·· •…Conductive sheet