TWM403110U - Structure of light emitted diode package - Google Patents

Structure of light emitted diode package

Info

Publication number
TWM403110U
TWM403110U TW099223740U TW99223740U TWM403110U TW M403110 U TWM403110 U TW M403110U TW 099223740 U TW099223740 U TW 099223740U TW 99223740 U TW99223740 U TW 99223740U TW M403110 U TWM403110 U TW M403110U
Authority
TW
Taiwan
Prior art keywords
light emitted
diode package
emitted diode
indentation
base
Prior art date
Application number
TW099223740U
Other languages
Chinese (zh)
Inventor
Chung-Hsin Chao
Mu-Chih Chung
Original Assignee
Jentech Precision Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jentech Precision Industrial Co Ltd filed Critical Jentech Precision Industrial Co Ltd
Priority to TW099223740U priority Critical patent/TWM403110U/en
Publication of TWM403110U publication Critical patent/TWM403110U/en

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Abstract

A structure of light emitted diode package comprises a base, a LED chip and a metal conductive plate embedded in the base. The metal conductive plate is provided with an indentation and two conductive leads. The LED chip is disposed in the indentation and electrically connected with the conductive leads.
TW099223740U 2010-12-07 2010-12-07 Structure of light emitted diode package TWM403110U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099223740U TWM403110U (en) 2010-12-07 2010-12-07 Structure of light emitted diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099223740U TWM403110U (en) 2010-12-07 2010-12-07 Structure of light emitted diode package

Publications (1)

Publication Number Publication Date
TWM403110U true TWM403110U (en) 2011-05-01

Family

ID=60593190

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099223740U TWM403110U (en) 2010-12-07 2010-12-07 Structure of light emitted diode package

Country Status (1)

Country Link
TW (1) TWM403110U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616005B (en) * 2013-06-28 2018-02-21 流明通營運有限責任公司 Laser diode package, and process and method for fabricating a laser package
TWI690032B (en) * 2019-04-15 2020-04-01 健策精密工業股份有限公司 Pre-molded air cavity module and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616005B (en) * 2013-06-28 2018-02-21 流明通營運有限責任公司 Laser diode package, and process and method for fabricating a laser package
TWI690032B (en) * 2019-04-15 2020-04-01 健策精密工業股份有限公司 Pre-molded air cavity module and manufacturing method thereof

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees