M400002 五、新型說明： 【新型所屬之技術領域】 本創作係提供一種電腦系統，尤指一種可將機械能與熱 能轉換為電能’之電腦系統。 【先前技術】 在現代化的今曰資訊社會，電腦系統已經成為多數人耳 可或缺的資訊工具之-，而不論是桌上型個人電腦、筆記空 個人電腦或是词服器等，其運作時脈越來越高，應用層面也 日益廣泛。而隨著電腦系統元件之功能日趨強大，因此各元 件在執行各種功能時所伴隨產生的振動與熱能也相對地增 加’若電腦㈣之㈣元件所產生的振動錢能無法有效率 的排除’料影響到電腦线之㈣敎性和運算速度，甚 致機械_，造成使用者的損^舉例來說，目前 戶業界二:散熱機制為在元件熱源處加入散熱系統，如風 :卢二二Γ、散熱片，或致冷晶片等，藉以減低元件 要以電力料之主動式散熱 Z專而 如何設計出-㈣散熱㈣能環料=W α要求’故 現今電腦產業所需努力之重;=要求之壤保設計，已成為 M400002 【新型内容】 本創作係提供一種可將機械能與熱能轉換為電能之電腦 系統，以解決上述之問題。 ' 本創作之申請專利範圍係揭露一種可將機械能與熱能 • 轉換為電能之電腦系統，其包含有一殼體；一處理單元，其 * 安裝於該殼體内，該處理單元係用來運算資料；一儲存裝 置，其安裝於該殼體内，該儲存裝置係用來儲存資料；一電 力供應模組，其係安裝於該殼體内，該電力供應模組係用來 提供電力至該儲存裝置；一散熱模組，其安裝於該殼體内， 該散熱模組係用來散除該處理單元與該儲存裝置所產生之 熱量；一機械能/電能轉換模組，其安裝於該殼體内且耦合於 . 該電力供應模組，該機械能/電能轉換模組係用來將該散熱模 • 組所產生振動之機械能轉換為電能，並輸出相對應電能至該 電力供應模組；以及一熱能/電能轉換模組，其安裝於該殼體 内且耦合於該電力供應模組，該熱能/電能轉換模組係用來將 該處理單元所產生之熱能轉換為電能，並輸出相對應電能至 該電力供應模組。 本創作之申請專利範圍係另揭露該處理單元係為一中央 處理器。 5 M400002 本創作之申請專利範圍係另揭露該儲存裝置係為一磁碟 陣列裝置。 本創作之申請專利範圍係另揭露該電力供應模組係為 一備援電池模組。 本創作之申請專利範圍係另揭露該散熱模組係為一風 扇。 本創作之申請專利範圍係另揭露該機械能/電能轉換模組 係為一壓電式電能墊片，其係安裝於該風扇上，該壓電式電 能墊片係於該風扇旋轉時產生振動，藉以產生相對應電能。 本創作之申請專利範圍係另揭露該電腦系統另包含一散 熱槽，其係安裝於該處理單元之一側，該熱能/電能轉換模組 · 係安裝於該處理單元與該散熱槽之間，並藉由該處理單元與 該散熱槽間之溫差產生相對應電能。 本創作電腦系統之機械能/電能轉換模組與熱能/電能轉 換模組係可將散熱模組所產生振動之機械能轉換為電能以 及將處理單元所產生之熱能轉換為電能，故其係為符合綠色 工展保郎能要求之設計。 6 M400002 【實施方式】 請參閱第1圖，第1圖為本創作較佳實施例一電腦系統 50之功能方塊示意圖，電腦系統50係可將機械能與熱能轉 換為電能，電腦系統50包含有一殼體52、一處理單元54、 一儲存裝置56、一電力供應模組58、一散熱模組60、一機 械能/電能轉換模組62，以及一熱能/電能轉換模組64。處理 單元54係安裝於殼體52内且用來運算資料，舉例來說處理 單元54係可為一中央處理器等；儲存裝置56係安裝於殼體 52内且用來儲存資料，儲存裝置56係可為一硬碟裝置或一 磁碟陣列裝置等；電力供應模組58係安裝於殼體52内且用 來提供電力至儲存裝置56，電力供應模組58係可為一備援 電池模組(Battery Backup Unit, BBU);散熱模組60係安裝於 殼體52内且用來散除處理單元54與儲存裝置56所產生之 熱量，散熱模組60係可為一風扇。 機械能/電能轉換模組62係安裝於殼體52内且耦合於電 力供應模組58，機械能/電能轉換模組62係用來將散熱模組 60所產生振動之機械能轉換為電能，並輸出相對應電能至電 力供應模組58，舉例來說機械能/電能轉換模組62係可為一 壓電式電能塾片（piezoelectric pad)，其係安裝於該風扇上， 該壓電式電能墊片係於該風扇旋轉時產生振動，藉以產生相 7 M400002 對應電能，由於該壓電式電能墊片係由壓電材料所組成，壓 電材料之作用原理乃是材料偏極化電荷的產生，是由外界施 加在材料上的應力而產生，當應力很小時，其偏極化的變化 與應力約成正比，由於壓電材料本身之機械與電性粞合作 用，當該壓電式電能墊片產生形變，其晶體之兩相對面（正 負極）會產生一電位差，故可將機械能轉換為電能。機械能/ 電能轉換模組62或可以直流發電機之形式呈現，意即當該 風扇轉動時可帶動轉子線圈，藉以切割直流發電機内部之磁 場而產生感應電壓（法拉第定律），若以該備援電池模組之 電池作為負載，則可輸出感應電流對電池進行充電。 熱能/電能轉換模組64係安裝於殼體52内且耦合於電力 供應模組58，熱能/電能轉換模組64係用來將處理單元54 所產生之熱能轉換為電能，並輸出相對應電能至電力供應模 組58。舉例來說，請參閱第2圖，第2圖為本創作熱能/電 能轉換模組64與處理單元54之配置示意圖，電腦系統50 另包含有一散熱槽(heat sink)66，其係安裝於處理單元54之 一側，熱能/電能轉換模組64係安裝於處理單元54與散熱槽 66之間，若高溫端之處理單元54之溫度為Th，低溫端之散 熱槽66之溫度為Tc，熱能/電能轉換模組64可藉由處理單 元54與散熱槽66間之溫差（△T^Th-Tc)以產生相對應電能。 熱能/電能轉換模組64係可由熱電材料(thermoelectric material)所組成，如由P型半導體及N型半導體所構成，其 M400002 一端連接於處理單元54 (高溫端），另一端連接於散熱槽66 (低溫端）。當兩端有溫度差時，高溫區域的載子濃度會高 於低溫區域，如此會使得載子由高溫區域擴散至低溫區域， 如此載子不均勻的分佈會在開口端形成一電動勢，並在迴路 中產生一電流，此現象亦稱為塞貝免效應（Seeback Effect)。 如此一來，熱能/電能轉換模組64便可利用熱電轉換原理將 處理單元54所產生之熱能轉換為相對應電能，若以該備援 φ 電池模組之電池作為負載，則可輸出感應電流對電池進行充 電。由熱電轉換之特性可知溫度差越大便可產生越高的電壓 跟電流，此外單位體積内的熱電偶密度越高也可以產生越高 的電壓跟電流。故若能有效地降低低溫端之溫度（Tc)，便可 增加熱電轉換之效率，舉例來說可於殼體52之上蓋部分設 計成可讓液體流動的通道，並藉由液體循環流動以降低散熱 槽66之溫度(Tc)。一般來說，中央處理器之工作溫度大約在 I 75°C，而藉由液體循環流動之設計可讓熱能/電能轉換模組 • 64兩側之溫度差達到70°C。 相較於先前技術1本創作電腦系統之機械能/電能轉換模 組與熱能/電能轉換模組係可將散熱模組所產生振動之機械 能轉換為電能以及將處理單元所產生之熱能轉換為電能，故 其係為符合綠色環保節能要求之設計。 以上所述僅為本創作之較佳實施例，凡依本創作申請專 9 Μ4Θ0002 利範圍所做之均等變化與修飾，皆應屬本創作專利之涵蓋範 圍。 【圖式簡單說明】 第1圖為本創作較佳實施例電腦系統之功能方塊示意圖。 第2圖為本創作熱能/電能轉換模組與處理單元之配置示意 圖。 【主要元件符號說明】 50 電腦糸統 54 處理單元 58 電力供應模組 62 機械能/電能轉換 t I X. # 棋殂 66 散熱槽 52 殼體 56 儲存裝置 60 散熱模組 64 熱能/電能轉換 模組M400002 V. New Description: [New Technology Area] This creation provides a computer system, especially a computer system that converts mechanical energy and thermal energy into electrical energy. [Prior Art] In the modern information society of today, the computer system has become an indispensable information tool for most people, regardless of whether it is a desktop personal computer, a note-taking personal computer or a word processor. The clock is getting higher and higher, and the application level is becoming more and more extensive. As the functions of computer system components become stronger and stronger, the vibration and thermal energy accompanying each component in performing various functions are relatively increased. 'If the vibration generated by the (four) component of the computer (4) cannot be effectively excluded. Affects the computer line's (four) sturdiness and computing speed, even the machine _, causing user damage ^ For example, the current household industry two: the heat dissipation mechanism is to add heat dissipation system at the component heat source, such as the wind: , heat sink, or cooling chip, etc., in order to reduce the component to be designed with the active heat dissipation of the power material, and how to design - (4) heat dissipation (four) energy ring material = W α requirements, so the current computer industry needs to work hard; The required design of the soil protection has become M400002 [New content] This creation department provides a computer system that can convert mechanical energy and thermal energy into electrical energy to solve the above problems. The patent application scope of the present invention discloses a computer system for converting mechanical energy and thermal energy into electrical energy, which comprises a casing; a processing unit, which is mounted in the casing, and the processing unit is used for calculation Information storage device installed in the housing for storing data; a power supply module mounted in the housing, the power supply module for supplying power to the a heat dissipating module is mounted in the housing, the heat dissipating module is configured to dissipate heat generated by the processing unit and the storage device; and a mechanical energy/electric energy conversion module is mounted on the The power supply module is configured to convert the mechanical energy of the vibration generated by the heat dissipation module into electrical energy and output corresponding electrical energy to the power supply module. And a thermal energy/electric energy conversion module installed in the housing and coupled to the power supply module, wherein the thermal energy/electric energy conversion module is configured to convert the thermal energy generated by the processing unit into electrical energy And the output power corresponding to the power supply module. The scope of the patent application of the present invention further discloses that the processing unit is a central processor. 5 M400002 The scope of the patent application of the present invention further discloses that the storage device is a disk array device. The scope of the patent application of the present invention further discloses that the power supply module is a spare battery module. The patent application scope of the present invention further discloses that the heat dissipation module is a fan. The patent application scope of the present invention further discloses that the mechanical energy/electric energy conversion module is a piezoelectric electric energy gasket, which is mounted on the fan, and the piezoelectric electric energy gasket is vibrated when the fan rotates. In order to generate corresponding electrical energy. The patent application scope of the present invention further discloses that the computer system further includes a heat dissipation slot, which is mounted on one side of the processing unit, and the thermal energy/electric energy conversion module is installed between the processing unit and the heat dissipation slot. And generating a corresponding electrical energy by a temperature difference between the processing unit and the heat dissipation slot. The mechanical energy/electric energy conversion module and the thermal energy/electric energy conversion module of the computer system can convert the mechanical energy generated by the heat dissipation module into electrical energy and convert the thermal energy generated by the processing unit into electrical energy, so It conforms to the design requirements of GreenWorks Exhibition. 6 M400002 [Embodiment] Please refer to FIG. 1 , which is a functional block diagram of a computer system 50 according to a preferred embodiment of the present invention. The computer system 50 converts mechanical energy and thermal energy into electrical energy, and the computer system 50 includes The housing 52, a processing unit 54, a storage device 56, a power supply module 58, a heat dissipation module 60, a mechanical energy/electric energy conversion module 62, and a thermal energy/electric energy conversion module 64. The processing unit 54 is mounted in the housing 52 and used to calculate data. For example, the processing unit 54 can be a central processing unit or the like. The storage device 56 is mounted in the housing 52 and used to store data. The storage device 56 The power supply module 58 is mounted in the housing 52 and is used to provide power to the storage device 56. The power supply module 58 can be a backup battery module. The heat dissipation module 60 is mounted in the casing 52 and is used to dissipate the heat generated by the processing unit 54 and the storage device 56. The heat dissipation module 60 can be a fan. The mechanical energy/electric energy conversion module 62 is mounted in the housing 52 and coupled to the power supply module 58 for converting the mechanical energy generated by the heat dissipation module 60 into electrical energy. And outputting the corresponding electrical energy to the power supply module 58. For example, the mechanical energy/electric energy conversion module 62 can be a piezoelectric electric energy pad mounted on the fan. The electric energy gasket generates vibration when the fan rotates, thereby generating phase 7 M400002 corresponding electric energy. Since the piezoelectric electric energy gasket is composed of a piezoelectric material, the piezoelectric material functions as a material polarized charge. The generation is caused by the stress applied to the material by the outside. When the stress is small, the change of the polarization is proportional to the stress, due to the mechanical and electrical cooperation of the piezoelectric material itself, when the piezoelectric type The electric energy gasket is deformed, and the opposite faces (positive and negative electrodes) of the crystal generate a potential difference, so that mechanical energy can be converted into electric energy. The mechanical energy/electric energy conversion module 62 can be presented in the form of a direct current generator, that is, the rotor coil can be driven when the fan rotates, thereby cutting the magnetic field inside the direct current generator to generate an induced voltage (Faraday's law). When the battery of the battery module is used as a load, the induced current can be output to charge the battery. The thermal energy/electricity conversion module 64 is mounted in the housing 52 and coupled to the power supply module 58. The thermal energy/electric energy conversion module 64 is configured to convert the thermal energy generated by the processing unit 54 into electrical energy and output corresponding electrical energy. To the power supply module 58. For example, please refer to FIG. 2, which is a schematic diagram of the configuration of the thermal energy/electric energy conversion module 64 and the processing unit 54. The computer system 50 further includes a heat sink 66, which is installed in the processing. On one side of the unit 54, the thermal energy/electric energy conversion module 64 is installed between the processing unit 54 and the heat sink 66. If the temperature of the processing unit 54 at the high temperature end is Th, the temperature of the heat sink 66 at the low temperature end is Tc, heat energy. The power conversion module 64 can generate a corresponding electrical energy by a temperature difference (ΔT^Th-Tc) between the processing unit 54 and the heat sink 66. The thermal energy/electric energy conversion module 64 can be composed of a thermoelectric material, such as a P-type semiconductor and an N-type semiconductor, and one end of the M400002 is connected to the processing unit 54 (high temperature end), and the other end is connected to the heat dissipation slot 66. (low temperature end). When there is a temperature difference between the two ends, the carrier concentration in the high temperature region will be higher than that in the low temperature region, which will cause the carrier to diffuse from the high temperature region to the low temperature region, so that the uneven distribution of the carrier will form an electromotive force at the open end, and A current is generated in the loop, which is also known as the Seeback Effect. In this way, the thermal energy/electric energy conversion module 64 can convert the thermal energy generated by the processing unit 54 into the corresponding electrical energy by using the thermoelectric conversion principle, and if the battery of the backup φ battery module is used as the load, the induced current can be output. Charge the battery. The characteristics of the thermoelectric conversion show that the higher the temperature difference, the higher the voltage and current, and the higher the thermocouple density per unit volume, the higher the voltage and current. Therefore, if the temperature (Tc) at the low temperature end can be effectively lowered, the efficiency of the thermoelectric conversion can be increased. For example, the cover portion of the casing 52 can be designed as a passage for allowing the liquid to flow, and can be reduced by circulating the liquid. The temperature (Tc) of the heat sink 66. In general, the operating temperature of the central processing unit is approximately 75 °C, and the design of the liquid circulation flow allows the temperature difference between the two sides of the thermal energy/electric energy conversion module to reach 70 °C. Compared with the prior art, the mechanical energy/electric energy conversion module and the thermal/electric energy conversion module of the computer system can convert the mechanical energy of the vibration generated by the heat dissipation module into electrical energy and convert the thermal energy generated by the processing unit into Electrical energy, so it is designed to meet the requirements of green environmental protection and energy conservation. The above descriptions are only the preferred embodiments of the present invention. All changes and modifications made to the scope of this creation application are subject to the scope of this creation patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a functional block diagram of a computer system in accordance with a preferred embodiment of the present invention. Figure 2 is a schematic diagram of the configuration of the thermal energy/electric energy conversion module and processing unit. [Main component symbol description] 50 Computer system 54 Processing unit 58 Power supply module 62 Mechanical energy/electric energy conversion t I X. #棋殂66 Heat sink 52 Housing 56 Storage device 60 Heat dissipation module 64 Thermal energy/electric energy conversion module group
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