M395659 • · 五、新型說明： 【新型所屬之技術領域】 本創作係關於-種晶圓移轉緩衝裝置，尤其是―種可避免#晶圓承載 裝置因故而無法容置晶圓時，可緩衝容置晶圓之裝置。 【先前技術】 目則常見的晶圓承載裝置主要有兩種不同設計…種為晶圓片gM395659 • · V. New Description: [New Technology Area] This creation is about the kind of wafer transfer buffer device, especially when it can avoid the wafer carrier device being unable to accommodate the wafer for some reason, it can be buffered. A device for accommodating a wafer. [Prior Art] The common wafer carrier device has two different designs...the wafer g
(cassette) ’具有獅、底部及左糊壁並且在賴壁上形成有複數凸 緣，而晶關從上述頂部、底部及左右側壁所共_繞出的侧向出入口進 出，而另-種晶圓承載裝置為晶圓片盒（magazine)，是一種上方形成有一 個了頁端及放口的承載裝置； 日日載裝置所移載晶圓之方式有很大差異，故是屬於兩種 不同系統所制之承餘置，但在實際制者的減過程，錄會取其所 需而自行組麵帛，__嫌歲_織㈣頻繁出現 的為了在自動化作業的移載晶圓過程中，要求晶圓片g盘晶圓片各 界關注的焦點。 .，.、试风砀系 承載：若it一種自動化緩衝容置晶圓裝置，在晶圓承載裝置無法 =以=:之功I，·測一測作 方案。 切仃能降低損醉，應為最佳解決 【新型内容】 3 聊5659 本創作之目的即在於提供—種晶圓移轉缓衝裝置 ，係為了使得晶圓在 曰曰圓承載裝置之間移轉容置時’避免晶圓承載裝置無法容置晶圓時，發生 持續運送之晶®相互碰撞而導致晶酸損情況發生。 本創作之另一目的即在於提供一種晶圓移轉緩衝裝置，係為晶圓在晶 圓承載裝置之間移轉容置時，可緩衝容置之裝置。 可達成上述新型目的之晶圓移轉緩衝裝置，係由一緩衝容置架及一驅 動機構所組成，而該緩衝容置架係設置於驅動機構上方，其中係包含有一 左右容置架，而該左右容置架係跨設於輸送帶兩側，且該左右容置架之間 所形成之空間係可允許輸送帶通過，另外該左右容置架之相對壁面上係設 置了複數個凹槽，而左右容置架之相對凹槽間則會形成一容置晶圓空間， 因此當輸送帶移載晶圓通過此一容置晶圓空間時，晶圓會被導入於左右容 置架之相對凹槽中，而該緩衝容置架下方之驅動機構則在次一片晶圓通過 前以預定行程上升，以便下一格相對凹槽容置該次一片晶圓。 因此，當晶圓承載裝置因故而無法谷置晶圓時，可藉由設置於兩個晶 圓承載裝置之輸送帶間的晶圓移轉緩衝裝置，使移載中之晶圓陸續暫存於 緩衝谷置架之容置晶圓空間中’以避免因晶圓相互碰撞而導致晶圓之毀損 更具體的說，所述晶圓承載裝置係為晶圓片匣、晶圓片盒等等可以承 載晶圓之容器。 更具體的說，所述該驅動機構係為油壓式升降台、液壓式升降台等升 降裝置。 【實施方式】 M395659 .·*· 本創作所提供之晶IB移轉緩衝裝置，與其他習用技術相互比較時更 具備下列優點： 1.本創作之晶圓移轉緩衝|置’係可使晶圓在晶圓承载裝置之間移轉 容置時，避免晶圓承載裝置無法容置晶圓時，發生持續運送之晶圓 相互碰撞而導致晶圓之毀損情況發生。 2·本鑛之晶®㈣緩衝裝置’係為-種可細於各種晶圓承載裝置 進行移轉容置時’可使各種晶圓承載裝置能夠糊轉触載傳送， • 並降低晶圓碰撞所產生的損失。 3.本創作之晶圓移轉緩衝裝置，可直接設置於晶圓輸送裝置之上，方 便使用者可以自行組合運用。 藉由以上較佳具體實關之詳述，係希望能更加清楚描述本創作之特 徵與精神，而並非以上述所揭露的較佳具體實施例來對本創作之範疇加r 限制。相反地’其目的是希望能涵蓋各種改變及具相等性的安排於 所欲申請之專利範圍的範嘴内。 # 【圖式簡單說明】 圖一A為本創作晶圓移轉緩衝裝置之立體結構圖； 圖一 B為本創作晶圓移轉緩衝裝置之側視圖； 圖一C為本創作晶圓移轉緩衝裝置之另一結構側視圖； 圖二為本創作晶圓移轉緩衝裝置之正常情況示意圖； 圓三A為本創作晶圓移轉緩衝裝置之實施例圖； 圖二B為本創作晶圓移轉緩衝裝置之實施例圖； 圖二C為本創作晶圓移轉緩衝裝置之實施例圖； 7 M395659 圖三D為本創作晶圓移轉緩衝裝置之實施例圖； 圖三E為本創作晶圓移轉緩衝裝置之實施例圖；以及 圖三F為本創作晶圓移轉緩衝裝置之實施例圖。 【主要元件符號說明】 1晶圓移轉緩衝裝置 11緩衝容置架 111底座 112左容置架 113右容置架 1131凹槽 114容置晶圓空間 115通道 12驅動機構 2輸送帶 31晶圓 32晶圓 8(cassette) 'has a lion, a bottom and a left paste wall and has a plurality of flanges formed on the wall, and the crystal is in and out from the lateral entrances and exits of the top, bottom and left and right side walls, and the other crystals The circular carrying device is a wafer box, which is a carrying device with a page end and a discharge port formed above; the way of loading the wafer by the day-loading device is very different, so it belongs to two different types. The rest of the system is set, but in the actual process of the reduction of the actual system, the record will take its own needs and set up its own face. __Year of age _ weaving (four) frequently appear in the process of transferring wafers in automated work Requires the focus of the wafer g-disc wafers. .., test wind system bearing: If it is an automatic buffer to accommodate the wafer device, the wafer carrier can not be = =: work I, · test a test plan. Cutting can reduce the damage, should be the best solution [new content] 3 Chat 5659 The purpose of this creation is to provide a kind of wafer transfer buffer device, in order to make the wafer move between the round carrying devices When the transfer is set to prevent the wafer carrier from being able to accommodate the wafer, the crystals that are continuously transported collide with each other to cause crystal acid damage. Another object of the present invention is to provide a wafer transfer buffer device which is a device for buffering a wafer when the wafer is transferred between the wafer carrier devices. The wafer transfer buffer device capable of achieving the above-mentioned novel purpose is composed of a buffer accommodating frame and a driving mechanism, and the buffer accommodating frame is disposed above the driving mechanism, and the system includes a left and right accommodating frame, and The left and right accommodating frames are arranged on both sides of the conveyor belt, and the space formed between the left and right accommodating frames can allow the conveyor belt to pass through, and the plurality of grooves are disposed on the opposite wall surfaces of the left and right accommodating frames. The accommodating wafer space is formed between the opposite grooves of the left and right accommodating frames. Therefore, when the transfer tape transfer wafer passes through the accommodating wafer space, the wafer is introduced into the left and right accommodating frames. In the opposite groove, the driving mechanism under the buffering holder rises by a predetermined stroke before the passage of the next wafer, so that the next wafer is accommodated in the next groove. Therefore, when the wafer carrier device cannot store the wafer for a reason, the wafer in the transfer can be temporarily stored in the wafer transfer buffer device disposed between the conveyor belts of the two wafer carrier devices. Buffered valley racks are accommodated in the wafer space to avoid damage to the wafer caused by wafer collisions. More specifically, the wafer carrier device is a wafer cassette, a wafer cassette, etc. A container that carries a wafer. More specifically, the drive mechanism is a lifting device such as a hydraulic lift platform or a hydraulic lift platform. [Embodiment] M395659 .·*· The crystal IB transfer buffer device provided by this creation has the following advantages when compared with other conventional technologies: 1. The wafer transfer buffer of this creation can be used to make crystal When the circle is transferred between the wafer carrier devices, when the wafer carrier device cannot accommodate the wafer, the wafers that are continuously transported collide with each other to cause damage of the wafer. 2. The crystal of the mine (4) buffer device 'can be finer than the various wafer carrier devices for transfer and placement' can enable various wafer carrier devices to be transferred to the touch carrier, and reduce wafer collision The losses incurred. 3. The wafer transfer buffer device of the present invention can be directly disposed on the wafer transfer device, so that the user can use it in combination. The above description of the preferred embodiments is intended to provide a clearer description of the features and spirit of the present invention, and is not intended to limit the scope of the present invention. Rather, the purpose is to cover a variety of changes and equivalence arrangements within the scope of the patent scope of the application. # [Simple description of the drawing] Figure 1A is a three-dimensional structure diagram of the wafer transfer buffer device; Figure 1B is a side view of the wafer transfer buffer device; Figure 1C is the creation of the wafer transfer A side view of another structure of the buffer device; FIG. 2 is a schematic diagram of the normal situation of the wafer transfer buffer device; FIG. 3A is an embodiment of the creation of a wafer transfer buffer device; FIG. 2C is a diagram showing an embodiment of a wafer transfer buffer device; 7 M395659 FIG. 3D is an embodiment of the creation of a wafer transfer buffer device; An embodiment of a wafer transfer buffer device is created; and FIG. 3F is an embodiment of a wafer transfer buffer device. [Main component symbol description] 1 wafer transfer buffer device 11 buffer holder 111 base 112 left holder 113 right holder 1131 groove 114 accommodates wafer space 115 channel 12 drive mechanism 2 conveyor belt 31 wafer 32 wafers 8