TWM394683U - Frame of power supply module - Google Patents

Frame of power supply module Download PDF

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Publication number
TWM394683U
TWM394683U TW99208749U TW99208749U TWM394683U TW M394683 U TWM394683 U TW M394683U TW 99208749 U TW99208749 U TW 99208749U TW 99208749 U TW99208749 U TW 99208749U TW M394683 U TWM394683 U TW M394683U
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TW
Taiwan
Prior art keywords
power supply
supply module
circuit board
connecting portion
frame
Prior art date
Application number
TW99208749U
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Chinese (zh)
Inventor
I-Fu Liang
Qi-De Lin
Original Assignee
Cincon Electronics Co Ltd
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Publication date
Application filed by Cincon Electronics Co Ltd filed Critical Cincon Electronics Co Ltd
Priority to TW99208749U priority Critical patent/TWM394683U/en
Publication of TWM394683U publication Critical patent/TWM394683U/en

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Description

五、新型說明: 【新型所屬之技術領域】 本創作之係有關於-種電源供麵組之框架,尤指一種 結構簡單、組躲纽可散熱之電祕賴組之框架。 【先前技術】 一般電子裝置中,包括主機板、巾央處理單元(CPU)、 各種資料存取單元、散熱系統之風扇,以及各種介面卡等設備 工作所需之電力均由電源供應器所供給,以使各個組件可動 作。 驾知電源供應器組裝至電子裝置之機殼内部時,一般均 先將電源供應模組配合與一電路板電性連接,且該電路板上設 有與s亥電子裳置之機殼穿孔對應之鎖孔,俾使藉由螺絲穿過該 電路板上及電子裝置之機殼上之鎖孔及穿孔,再配合螺帽鎖接, ⑽電源供顧組_於電子裝置之機殼上,此麵構簡單且 容易組裝’但對於電源供顧組所產生之熱無法傳導至電子裝 =之機殼散熱出去,而使得電源供應模組之元件容易損壞,遂 發展出一種結合該電源供應模組之電路板的U型框架,該電 制絲模紐之電路板係固定於㈣型框架上,而該U型框架 下叹有~^栓,該電子裝置之機殼對應該螺栓設有—穿孔,藉 由螺、糸由下往上穿過該電子裝置之機殼的穿孔而與該U型 框架之螺栓鎖接,以將該電源供應模組所產生之熱源,藉由該 U型框架之側壁傳導至電子裝置之機殼上,以達到散熱目的, M394683 然此種u型框架之結構,其與電子裝置之機殼鎖接時,礙於 結構上之設計及空間上之問題,鎖接之方式僅能由下往上與電 T裝置之機殼鎖接,增加組裝上之困難性,故如何設計出結構 簡單、組裝料且可散無電驗應餘德架,為此產業亟 需解決之問題。 【新型内容】 本創作之目的在於提供一種電源供應模組之框架,藉由 該電源供應模組之電路板與一散熱件之兩構件的纽合以增加 組裝上之方便性同時達到散熱之效果。 達到上述目的之本創作電源供應模組之框架,包含:一 散熱件,係置於-機殼上,且該散熱件設有至少一第一連接部; 以及-電源供賴組之電雜,係置於該散熱件上,且該電源 供應模組之㈣板面積A於該散熱件,該電源供應模組之 電路板凸出_散齡之板面積處設#複數個鎖接部,該鎖接 部係用以與該鑛鎖接’而該電祕顧組之電路板對應該第 -連接部設有-第二連接部,藉由連接該第—連接部及該第二 連接部,明定錄熱件及該電祕賴組之電路板。 【實施方式】 請參考第-圖,係顯示本創作電源供應模組之框架之分 解立體圖。本創作電源供應模組之框帛刚包含:一散熱件 10及電源供應模組之電路板20。 該散熱件10係置於-機殼上⑽絲),且於一侧設有 4 至少一第一連接部11。 該電源供應模組之電路板20,係置於該散熱件10上, 用以組接該電源供應餘於該(圖未示)上,且該電源供 應模組之f職20的板面積纽概齡1G,使該電源供應 換組之電路板20完全覆纽雜齡1(),且該電源供應模組 之包路板20凸出於該散熱件1〇之板面積處設有複數個鎖接部 2卜該鎖接部21 _稍賴殼健,而該電源供應模組之 電路板20對應該第-連接部u設有一第二連接部22,藉由 連接該第-連接部11及該第二連接部22,以固定該散熱件1〇 及该電源供應模組之電路板2G,且藉由該散熱件1G與該電源 供應模組之電路板2G硕構件之轉,讓㈣者较將電源 供應模組組裝於韻殼内且啊可透過該散熱件1G,將易產 生熱源之元件傳導至機殼上,俾使達到散熱之功效。 於本實施例中,該第一連接部u、該第二連接部22及 該鎖接部21均為一穿孔’該電源供應模組之電路板2〇藉由該 鎖接部21之穿孔利用-栓鎖元件(圖未示)而鎖固於該機殼 上’而遠散熱件10及該電源供應模組之電路板2〇藉由該第一 連接部11及該第二連接部22之穿孔利用一連接件30,以鎖 固5亥電源供應模組之電路板20及該散熱件1〇。 該栓鎖元件為一螺絲及螺帽,而該連接件包含一六角銅 柱30及一螺絲(圖未示)’且該六角銅柱3〇具有内螺紋以 與該螺絲鎖接。 M394683 請參考第二圖,係顯示本創作電源供應模組之框架的另 一實施例之分解立體圖。本實施例與第一圖之實施例大致 相同,不同之處僅在於本實施例之散熱件10兩側垂直向 上分別延伸一第一側板12及第二侧板13,藉由該第一侧板12 及第二側板13,以將該電源供應模組之電路板20所產生之熱 源傳導至該機殼散熱,且該第一側板12之兩側端緣各設有一 内凹之卡扣部14’而該電源供應模組之電路板20對應該第一 侧板12及第二側板13各設有一内凹部23,以使該第一側板 4 12及第二側板13之兩側板緣恰好置於該内凹部23處,且對 應該第一側板12之内凹部23的轉折處係配合與該卡扣部14 扣接。 請參考第三圖及第四圖,係顯示本創作電源供應模組之 框架的另一實施例之組合立體圖及顯示本創作電源供應模組 之框架的另一實施例之後側視圖。當欲組合本創作電源供應模 組之框架100時’首先將該電源供應模組之電路板2〇置於該鲁 散熱件10上,此時該第一側板12及第二侧板13之兩侧板緣 恰好置於該内凹部23處’且該電源供應模組之電路板2〇之一 側’即對應該第-側板12之内凹部23的轉折處係配合與該卡 扣部14扣接’而因該連接件之六角銅柱3〇係穿過該散熱件 10之第-連接部11 ’使該連接件之六角銅柱% i於該散熱件 10上’且該六角銅柱3〇本身高度恰與該卡扣部14之高度相 同,而使該電祕賴組之電输20之另-㈣應置於該連 6 M394683 接件之六角銅柱30上,且該電源供應模組之電路板2〇之第二 連接部22所設之位置對應與該散熱件10之第一連接部u之 位置相同,因此再藉由該連接件之螺絲穿過該第二連接部2 而與該連接件之六角她%雜,以完成本創作電源供應模 組之框架1〇0的組合,且再將組合後之本創作電源供應模組之 框架__機殼之預定錄處(圖匈此咖該電源 供應模組之魏板2G輸面狱觸賊件Μ陳面積,使 该電源供應模組之電路板20兩側凸出於該散熱件1()之板面積, :置=該機殼上,再利用一栓鎖元件之螺絲穿過該電源供應模 .且之路板20之各個鎖接部21及對應該電源供應模組之電路 板2〇各個鎖接部21的機殼的穿孔(圖未示)’再藉由該螺帽 ^合與該螺紋鎖接,俾使本創作電源供應模組之框_鎖固 另本創作電源供應模組之框架1_—鎖 彳術往上鎖接 電路;^=電秘賴組之框架,勤該魏供應模組之 帝路极錄賴件之不同齡的組合,而使該電源供應模組之 _,_第-_及第二連接部,以 齡與電源供應模组之輪,_者方便將電源 裝於錢殼内且同時可透過該散熱件,將易產生熱 “ 70彳傳導至機殼上’俾使達到散熱之功效。 7 M394683 【圖式簡單說明】 第-圖係齡本創作騎、供絲組之框料分解立體 圖。 第二圖係顯示本創作電源供應模組之框架的另一實施 例之分解立體圖。 第三圖係顯示本創作電源供應模組之框架的另一實施 例之組合立體圖。 第四圖係顯示本創作電源供應模組之框架的另一實施 例之後側視圖。 【主要元件符號說明】 100—-電源供應模組之框架 …散熱件 11…第一連接部 12…第一側板 13—-第二側板 14 —卡扣部 20-—電源供應模組之電路板 21…鎖接部 22…第二連接部 23 内凹部 3〇 -•六角銅柱V. New description: [New technology field] The system of this creation has a framework for a power supply surface group, especially a framework of a simple structure that can hide heat and dissipate heat. [Prior Art] In the general electronic device, the power required for the operation of the main board, the towel processing unit (CPU), various data access units, the fan of the heat dissipation system, and various interface cards are supplied by the power supply. To make each component moveable. When the power supply is assembled to the inside of the casing of the electronic device, the power supply module is generally electrically connected to a circuit board, and the circuit board is provided with a hole corresponding to the casing of the electronic device. The locking hole is made to pass through the locking hole and the perforation on the circuit board and the casing of the electronic device through the screw, and then the nut is locked, and (10) the power supply is provided on the casing of the electronic device. The surface structure is simple and easy to assemble 'but the heat generated by the power supply unit cannot be transmitted to the housing of the electronic device, and the components of the power supply module are easily damaged, and a power supply module is developed. The U-shaped frame of the circuit board, the circuit board of the electric wire mold is fixed on the (four) type frame, and the U-shaped frame is sighed with a ~^ bolt, and the casing of the electronic device is corresponding to the bolt-perforation And a bolt of the U-shaped frame is locked by a screw and a cymbal through the through hole of the casing of the electronic device to drive the heat source generated by the power supply module by the U-shaped frame The sidewall is conducted to the casing of the electronic device to achieve For the purpose of heat, M394683 is the structure of the u-shaped frame. When it is locked with the casing of the electronic device, due to structural design and space problems, the locking method can only be from bottom to top and electric T device. The lock of the casing increases the difficulty of assembly. Therefore, how to design a simple structure, assemble materials and disperse the electricity and verify the need for the frame, which is an urgent problem for the industry. [New content] The purpose of this creation is to provide a framework for a power supply module, by which the circuit board of the power supply module and the two components of a heat sink are combined to increase the convenience of assembly and achieve the effect of heat dissipation. . The framework of the present invention is characterized in that: a heat dissipating member is disposed on the casing, and the heat dissipating member is provided with at least one first connecting portion; and - a power supply group, The device is disposed on the heat dissipating member, and the (four) board area A of the power supply module is in the heat dissipating member, and the circuit board of the power supply module protrudes from the board area of the aging age to provide a plurality of locking portions. The locking portion is configured to be coupled to the mine and the circuit board of the electric secret group is provided with a second connecting portion corresponding to the first connecting portion, by connecting the first connecting portion and the second connecting portion, Mingding recorded hot parts and the circuit board of the electric secret group. [Embodiment] Please refer to the figure - figure for the exploded perspective view of the framework of the author's power supply module. The frame of the creation power supply module has just included: a heat sink 10 and a circuit board 20 of the power supply module. The heat dissipating member 10 is disposed on the casing (10) and has at least one first connecting portion 11 on one side. The circuit board 20 of the power supply module is disposed on the heat dissipating component 10 for assembling the power supply to the (not shown), and the board area of the power supply module The age of 1G is such that the circuit board 20 of the power supply is completely overlapped with the age of 1 (), and the packet board 20 of the power supply module protrudes from the board area of the heat sink 1 The locking portion 2 is slightly adjacent to the housing portion, and the circuit board 20 of the power supply module is provided with a second connecting portion 22 corresponding to the first connecting portion u, by connecting the first connecting portion 11 And the second connecting portion 22 is configured to fix the heat dissipating member 1 and the circuit board 2G of the power supply module, and the heat dissipating member 1G and the circuit board 2G of the power supply module are rotated to make (4) The power supply module is assembled in the sleek casing, and the heat-dissipating component can be transmitted to the casing through the heat-dissipating component 1G, so as to achieve the heat dissipation effect. In the embodiment, the first connecting portion u, the second connecting portion 22 and the locking portion 21 are each a through hole. The circuit board 2 of the power supply module is utilized by the punching of the locking portion 21. a latching member (not shown) that is locked to the casing, and the remote heat sink 10 and the circuit board 2 of the power supply module are supported by the first connecting portion 11 and the second connecting portion 22 The through hole utilizes a connecting member 30 to lock the circuit board 20 of the power supply module and the heat dissipating member 1 . The latching member is a screw and a nut, and the connecting member includes a hexagonal copper post 30 and a screw (not shown) and the hexagonal copper post 3〇 has an internal thread to be locked with the screw. M394683 Please refer to the second figure for an exploded perspective view of another embodiment of the framework of the present power supply module. This embodiment is substantially the same as the embodiment of the first embodiment. The difference is that the first side panel 12 and the second side panel 13 extend perpendicularly upward on both sides of the heat dissipating component 10 of the embodiment. 12 and the second side plate 13 are configured to transmit heat generated by the circuit board 20 of the power supply module to the heat dissipation of the casing, and a concave portion 14 is disposed on each of the two end edges of the first side plate 12 The circuit board 20 of the power supply module is provided with a recessed portion 23 corresponding to each of the first side panel 12 and the second side panel 13 so that the edge edges of the first side panel 4 12 and the second side panel 13 are placed exactly The inner concave portion 23 and the turning portion corresponding to the inner concave portion 23 of the first side plate 12 are engaged with the buckle portion 14 . Please refer to the third and fourth figures, which are a perspective view showing another embodiment of the frame of the present power supply module and a side view showing another embodiment of the frame of the present power supply module. When the frame 100 of the power supply module is to be combined, the circuit board 2 of the power supply module is first placed on the heat sink 10, and the first side plate 12 and the second side plate 13 are respectively The side edge of the side plate is disposed at the inner recess 23 and the one side of the circuit board 2 of the power supply module, that is, the turning portion corresponding to the inner concave portion 23 of the first side plate 12 is engaged with the buckle portion 14 And the hexagonal copper post 3 of the connecting member passes through the first connecting portion 11 ' of the heat dissipating member 10 to make the hexagonal copper column % i of the connecting member on the heat dissipating member 10' and the hexagonal copper post 3 The height of the crucible itself is exactly the same as the height of the buckle portion 14, and the other (4) of the electric transmission 20 of the electro-disciplinary group should be placed on the hexagonal copper post 30 of the 6 M394683 connector, and the power supply mode is The second connecting portion 22 of the circuit board 2 of the group is disposed at the same position as the first connecting portion u of the heat dissipating member 10, and thus the second connecting portion 2 is passed through the screw of the connecting member. With the hexagon of the connector, she is miscellaneous, in order to complete the combination of the frame 1〇0 of the creation power supply module, and then combine the combined As the framework of the power supply module __ the predetermined record of the chassis (Figure Hung this coffee power supply module of the Wei board 2G transmission face thief pieces Μ Chen area, so that the power supply module circuit board 20 two The side is convex out of the plate area of the heat dissipating member 1 (), placed on the casing, and then passed through a power supply die by using a screw of a latching component; and each of the locking portions 21 of the road board 20 and the pair The circuit board 2 of the power supply module, the through hole (not shown) of the casing of each of the locking portions 21, is connected to the thread by the nut, so that the frame of the creation power supply module is _locking the other creation of the power supply module framework 1_- locks up the lock circuit; ^ = the framework of the electric secret group, the combination of the different ages of the Wei supply module _,_第__ and the second connection part of the power supply module, with the wheel of the age and the power supply module, the _ convenient to install the power supply in the money shell and at the same time through the heat sink, It is easy to generate heat "70 彳 conduction to the casing", so that it can achieve the effect of heat dissipation. 7 M394683 [Simple diagram description] The first picture shows the age of the creation, An exploded perspective view of another embodiment of the frame of the present power supply module. The third figure shows a combination of another embodiment of the framework of the present power supply module. The fourth figure shows a side view of another embodiment of the frame of the present power supply module. [Main component symbol description] 100—The frame of the power supply module... The heat sink 11... The first connection part 12... The first side plate 13 - the second side plate 14 - the buckle portion 20 - the circuit board 21 of the power supply module ... the locking portion 22 ... the second connecting portion 23 the inner recess 3 - the hexagonal copper column

Claims (1)

M394683 /、、申凊專利範圍: 1.一種電源供應模組之框架,包含: i 说:、: 年Λ曰 修正補充 散熱件,係置於一機殼上,且該散熱件設有至少一第 一連接部;以及 電源供應模組之電路板,係置於該散熱件上,且該電 源供應模組之電路板的板面積大於該散熱件,該電源供應模組M394683 /, 申凊 patent scope: 1. A power supply module framework, comprising: i said:,: Λ曰 correction supplemental heat sink, is placed on a casing, and the heat sink is provided with at least one a first connecting portion; and a circuit board of the power supply module is disposed on the heat dissipating member, and a board area of the power supply module is larger than the heat dissipating member, the power supply module 之電路板凸出於该散熱件之板面積處設有複數個鎖接部,該鎖 接部係用以與該機殼鎖接,而該電源供應模組之電路板對應該 第連接。Ρ叹有-第二連接部,藉由連接該第一連接部及該第 二連接部’明定該散熱件及該電源供應模組之電路板。 2.如申請專利範圍第丨項所述之電源供應模組之框架,1中該散 熱件兩侧垂直向上分舰伸—第—側板及第二側板,藉由該第- 侧板及第二· ’靖該電祕雜組之電路板職生之熱源傳 導至該機殼散熱。The circuit board is provided with a plurality of locking portions protruding from the board area of the heat dissipating member, the locking portion is for locking with the casing, and the circuit board of the power supply module is correspondingly connected. The sigh has a second connecting portion that defines the heat sink and the circuit board of the power supply module by connecting the first connecting portion and the second connecting portion. 2. In the framework of the power supply module described in the scope of claim 2, the heat dissipating member is vertically upwardly divided into two sides, a first side plate and a second side plate, by the first side plate and the second side. · 'The heat source of the circuit board of the Jingji Electric Miscellaneous Group is transmitted to the chassis for heat dissipation. 3·如申請專利範圍第2項所述之電源供應模組之框架,其中該第一 側板,_端緣各設有—卡扣部,而該電源供賴組之電路板對 應該第一側板之卡扣部設有一内凹部。 4·如申請專利範圍第丨項所述之電源供應模組之框架,其中該第— 連接部、該第二連接部及該鎖接部為一穿孔。 5.如申請專利_第4項所述之麵供應她之框架,其中該電源 供應模組之電路板藉由該鎖接部之穿孔利用—栓航件而鎖固 9 M394683 :)·Ί c〆、j 6_如亨請翻範圍第4項所述之電源供應模組之框架,其中該電源、 供應模組之電路板及該散熱件藉由該第一連接部及該第二連接' 部之穿孔利用一栓鎖元件,以鎖固該電源供應模組之電路板及該 散熱件。 M394683 七、圖式:3. The frame of the power supply module according to claim 2, wherein the first side plate and the _ end edge are respectively provided with a buckle portion, and the circuit board of the power supply group corresponds to the first side plate The buckle portion is provided with an inner recess. 4. The frame of the power supply module of claim 2, wherein the first connecting portion, the second connecting portion and the locking portion are a perforation. 5. The frame of the power supply module is supplied as described in the patent application _ 4, wherein the circuit board of the power supply module is locked by the piercing portion of the locking portion by means of a sling member 9 M394683 :)·Ί c 〆, j 6_如亨 Please turn the frame of the power supply module described in the fourth item, wherein the power supply, the circuit board of the supply module and the heat sink are connected by the first connection portion and the second connection The perforation of the portion utilizes a latching element to lock the circuit board of the power supply module and the heat sink. M394683 VII, schema: 21 2221 22 11 5^-30 、22 第一圖 1/4 M394683 jffi. 0. i i i -r- ί L11 5^-30 , 22 First picture 1/4 M394683 jffi. 0. i i i -r- ί L 2/4 ^-^302/4 ^-^30
TW99208749U 2010-05-11 2010-05-11 Frame of power supply module TWM394683U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465178B (en) * 2011-12-20 2014-12-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465178B (en) * 2011-12-20 2014-12-11

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