M393518 五、新型說明： 【新型所屬之技術領域】 本創作係屬於電解鍍覆用電解槽之結構件的領 域，特別是一種用來辅助固定電鍍LED載板，且大 幅提高固定時之穩固性的電鍍用架具。 【先前技術】 近年來， 用於照明 k者光電產業的蓬勃發展 的LED發光源也備受嗎目，除了用於一般照明設備 外，更進一步還應用在如液晶電視之背光源上。而 led發光源主要係由發光晶片 '載板及包覆層所組 成，其中之載板更負起了導電及承載發光晶片的功 效，載板係透過電鍍產生導電之功效。一般載板係 呈方形之平板結構體，利用一電鍍用架具固定複數 個载板後，再放入一電鍵槽中進行電鍵。 因此，請參閱第1圖，係為習知電鍍用架具的 結構示意圖。如圖中所示，該種電鍍用架具10係包 括一外框架11，且與該外框架丨丨的一面設有複數 個線夾1 2，該等線夹1 2係以具有彈性之金屬線材 考折而製成’該等線夾12之一端部分別具有對應一 載板20厚度的一容置部121，且各容置部i2l的開 口相對’供夾持於該載板20的二對稱侧緣，以將該 電鍍用架具10放入一電鍍槽中進行電鑛。 然’该種線夾1 2的設計與該等載板2 〇間本就 3 M393518 留有一些空隙’故於外框架11被帶動移動時所產生 的振動，會造成該等載板20晃動而不穩，使得該等 載板10上的電鍵厚度不均勻’特別是在該等載板 10的邊緣處，或有可能會於電鍍的過程中掉落於該 電鍍槽内。 是故’有鑑於上述電鐘用架具在使用時的缺 失，本創作係提供一種電鍍用架具結構，利用全新 設計的固定塊及彈片，以供固定該等载板的四個角 落及其中一對側緣’使該等载板被穩固地固定夾持 於一外框架内，而避免電鍍過程中的移動造成晃 動；且該載板之一面更設有一導流治具，利用該導 流治具上的導流孔及引流孔設計，可使電鑛層均勻 地在鍍在該等載板表面。 【新型内容】 本創作之一目的，旨在提供一種電鐘用架具， 俾供穩固地固定被鍍物，避免在電鑛過程中產生晃 動而造成電鍍品質不佳的情況。 本創作之次一目的，旨在提供一種設於電鍍用 架具一侧的導流治具結構，俾使電鍍層更均勻地電 鍍於該被鍍物表面；另’該導流治具上的導流孔形 狀係對應該被鍍物所需的形狀而設置。 為達上述目的，本創作之電鍍用架具係供夾持 固定一待鍍板體，其包括：一外框架；至少一固定 4 M393518 單元，設於該外框 個角落的固定塊， 片，其中，該等固 向係對應該待鍍板 角落，該彈片前端 待鍵板體的側緣。 板體的四個角落， 緣，是故，可避免 向及垂直方向之晃 品質不佳的情況。 於一實施例中 少一導流治具，該 永内，且該固定單元包含位於四 x及鄰近該等固定塊一側的彈 疋塊分別具有—開口，且開口方 體，供以固定該待鍍板體之四個 具有一 v字形開口，供以夾持該 據此，本創作係同時固定了待鍍 '及待鍍板體其中一對稱的側 該待鍍板體受振動時產生水平方 動，也能避免因晃動所造成電鍍 ，本創作之電鍍用架具更具有至 導流治具設於該固定單元之其中 一側，使該導流治具對應該待鍍板體的位置。其中， 該導流治具係一平板結構體’且具有複數個導流孔 及複數個引流孔’該等導流孔係呈矩陣排列而設置 於該導>711_治具上’且§玄專導流孔的周緣相對於咳導 流治具的二面分別凸設有一環擋牆，該等引流孔設 於該二相鄰導流孔間’且該導流孔之面積小於該待 鍍板體。再者’該導流孔之形狀係隨著該待鍍形狀 而設置，而為矩形、圓形、橢圓形或多邊形其中之 一者，該導流治具的設計係供電鍍液有穩定的流 向，而使電鍍層更均勻地鍍在該待鍍板體表面。 【實施方式】 5 M393518 為使貴審查委員能清楚了解本創作之内容，謹 以下列說明搭配圖式，敬請參閱。 請參閱第2、3圖，係為本創作較佳實施例的結 構示意圖，及夾持固定待鍍板體時的示意圖。如圖 中所示’本創作之電鍍用架具30係供夾持固定一待 鍍板體40’該電鍍用架具30主要係包括一外框架 31及複數個設於該外框架31上的固定單元32。 其中，該外框架31内部係由複數根金屬製的骨 架’平行設置而形成複數個隔間，且於該外框架31 的一側設有一把手311。 複數個固定單元32係設置於該外框架31之隔 間内，且該等固定單元32分別包含位於四個角落的 固定塊321，以及鄰近該等固定塊321 一側的彈片 322。其中’該等固定塊321分別具有一開口 32ιι， 且開口方向係對應該待鍍板體4〇，供以固定該待鍍 板體40之四個角落’該彈片322前端具有—v字^ 開口 3221，供以夾持該待鍍板體4〇的側緣。 使用時，係利用該等固定單元32的 q久塊3 21 及彈片322分別同時固定於該待鍍板體4〇 』四個角 落，以及該待链板體40其中一對稱的側緣， 田言歹 待鍍板體40係受到該等固定塊32丨及該 μ 的雙向限定後，而避免水平方向及垂直方向之 或晃動。因此，該外框架31在電鍍的移動過程動 等待鍍板體40因受到該等固定單元32的 該 6 M393518 能避免因晃動所造成電鍍品質不佳的情況。M393518 V. New description: [New technical field] This creation belongs to the field of structural parts of electrolytic cell for electrolytic plating, especially for the purpose of assisting the fixed plating of LED carrier plates and greatly improving the stability of fixing. Electroplating frame. [Prior Art] In recent years, the LED light source for the booming development of the k-optoelectronics industry has also received much attention. In addition to being used for general lighting equipment, it is further applied to backlights such as liquid crystal televisions. The led light source is mainly composed of a light-emitting chip 'carrier board and a cladding layer, wherein the carrier board is more effective in conducting and carrying the light-emitting chip, and the carrier board is electrically conductive through electroplating. Generally, the carrier board is a square flat structure, and a plurality of carrier boards are fixed by a plating frame, and then placed in a key slot for electric keys. Therefore, please refer to Fig. 1, which is a schematic view of the structure of a conventional electroplating stand. As shown in the figure, the electroplating frame 10 includes an outer frame 11 and a plurality of clips 12 are provided on one side of the outer frame, and the clips 12 are made of elastic metal. One end portion of the wire clip 12 has a receiving portion 121 corresponding to the thickness of one of the carrier plates 20, and the opening of each of the receiving portions i2l is opposite to the second member for holding the carrier plate 20 The symmetrical side edges are used to place the electroplating rack 10 into a plating bath for electric ore. However, the design of the clip 1 2 and the carrier 3 have a gap between the 3 M393518. Therefore, the vibration generated when the outer frame 11 is moved will cause the carrier 20 to sway. Unstable, making the thickness of the key on the carrier 10 non-uniform, especially at the edge of the carrier 10, or possibly falling into the plating bath during electroplating. In view of the lack of use of the above-mentioned electric clocks, the present invention provides a plating structure for the plating, using newly designed fixing blocks and shrapnel for fixing the four corners of the carrier and the middle thereof. The pair of side edges 'send the carrier plates to be firmly fixed in an outer frame to avoid shaking caused by the movement during the plating process; and one side of the carrier plate is further provided with a flow guiding tool, and the guiding current is utilized The design of the diversion holes and the drainage holes on the jig allows the electro-mineral layer to be uniformly plated on the surface of the carrier plates. [New content] One of the purposes of this creation is to provide a frame for an electric clock, which is used to firmly fix the object to be plated, thereby avoiding the occurrence of sway during the electro-mineral process and causing poor plating quality. The second purpose of the present invention is to provide a structure of a flow guiding device disposed on one side of a plating fixture, so that the plating layer is more uniformly plated on the surface of the object to be plated; The shape of the orifice is set to the desired shape of the object to be plated. In order to achieve the above object, the electroplating frame of the present invention is for clamping and fixing a plate to be plated, comprising: an outer frame; at least one fixing 4 M393518 unit, a fixing block disposed at a corner of the outer frame, a piece, Wherein, the solids are aligned with the corners of the plate to be plated, and the front end of the elastic piece is to be a side edge of the key plate body. The four corners and edges of the board are used to avoid the situation of poor quality in the vertical direction. In one embodiment, there is one less flow guiding fixture, the permanent unit, and the fixing unit includes a magazine block located on a side of the four x and adjacent to the fixing blocks, respectively, having an opening and an opening square for fixing the The four plates to be plated have a v-shaped opening for clamping. According to this, the creation system simultaneously fixes the plate to be plated and one of the symmetrical sides of the plate to be plated. The square movement can also avoid the electroplating caused by the shaking. The electroplating frame of the present invention has a flow guiding fixture disposed on one side of the fixing unit, so that the guiding fixture corresponds to the position of the plate to be plated. . Wherein, the flow guiding fixture is a flat structure body and has a plurality of flow guiding holes and a plurality of drainage holes 'the flow guiding holes are arranged in a matrix and disposed on the guiding body 711_ jig' and § The circumference of the sinusoidal diversion hole is respectively provided with a ring retaining wall on opposite sides of the cough guiding flow fixture, and the drainage holes are disposed between the two adjacent diversion holes and the area of the diversion hole is smaller than the waiting area Plated body. Furthermore, the shape of the flow guiding hole is set along the shape to be plated, and is one of a rectangular shape, a circular shape, an elliptical shape or a polygonal shape. The design of the flow guiding fixture has a stable flow direction of the power supply plating solution. And the plating layer is more uniformly plated on the surface of the plate to be plated. [Embodiment] 5 M393518 In order to make your reviewer understand the contents of this creation, please refer to the following description. Referring to Figures 2 and 3, there is shown a schematic view of the structure of the preferred embodiment of the present invention, and a schematic view of the case where the plate to be plated is clamped and fixed. As shown in the figure, the electroplating frame 30 of the present invention is for holding and fixing a plate to be plated 40'. The plate for mounting 30 mainly includes an outer frame 31 and a plurality of outer frames 31. Fixed unit 32. The inside of the outer frame 31 is formed by a plurality of metal frames erected in parallel to form a plurality of compartments, and a handle 311 is provided on one side of the outer frame 31. A plurality of fixing units 32 are disposed in the compartment of the outer frame 31, and the fixing units 32 respectively include fixing blocks 321 at four corners, and a spring piece 322 adjacent to one side of the fixing blocks 321 . Wherein the fixing blocks 321 respectively have an opening 32 ι, and the opening direction is corresponding to the plate body to be plated 4 to fix the four corners of the plate body 40 to be plated. The front end of the elastic piece 322 has a -v word opening. 3221, for clamping the side edge of the plate body to be plated. In use, the q-long block 3 21 and the elastic piece 322 of the fixing unit 32 are respectively fixed to the four corners of the plate body to be plated, and one of the symmetric side edges of the plate body 40 to be used. It is said that the plate body 40 to be plated is subjected to the bidirectional limitation of the fixing blocks 32 and the μ, and the horizontal direction and the vertical direction are prevented from being shaken. Therefore, the outer frame 31 waits for the plate body 40 to be subjected to the 6 M393518 of the fixing unit 32 during the movement of the plating to avoid the poor plating quality caused by the shaking.
再者，如第4、5圖，係為本創作較佳實施例的 另一種實施方式示意圖，以及導流治具的結構示意 圖。如圖中所示，請同時搭配第2、3圖所示，本創 作之電鍍用架具3 0在使用時，更可搭配使用一導流 治具50 ’並將該導流治具50設置於該固定單元32 之一側’以使該導流治具5 0對應該待鍍板體4 0的 位置。如第5圖所示’該導流治具5〇係為一平板結 構體，且其上方具有九個導流孔51及十二個引流孔 5 2 ’其中之各個導流孔5 1係呈矩陣排列而設置於該 導流治具5 0上’且該等導流孔51間具有適當的間 距，且各個導流孔52的周緣相對於該導流治具50 的二面分別凸設有一環擋牆511，該等引流孔5 2係 分別設於該等導流孔51的二側，且該導流孔51之 面積小於該待鍍板體40，以使該電鍍槽内的電鍍液Further, as shown in Figs. 4 and 5, there is shown a schematic view of another embodiment of the preferred embodiment of the present invention, and a schematic structural view of the flow guiding fixture. As shown in the figure, please also match the pictures shown in Figures 2 and 3. The plate holder 30 of this creation can be used with a guide tube 50' and the guide tube 50 can be set. On one side of the fixing unit 32 'to make the guiding fixture 50 correspond to the position of the plate body 40 to be plated. As shown in FIG. 5, the flow guiding fixture 5 is a flat structure, and has nine flow guiding holes 51 and twelve drainage holes 5 2 above, wherein each of the guiding holes 5 1 is The matrix is arranged to be disposed on the flow guiding device 50 and has a proper spacing between the guiding holes 51, and the peripheral edges of the respective guiding holes 52 are respectively convex with respect to the two sides of the guiding fixture 50. a ring retaining wall 511, the drain holes 52 are respectively disposed on two sides of the guiding holes 51, and the area of the guiding holes 51 is smaller than the plate body 40 to be plated, so that the plating solution in the plating tank
係透過s亥等導流孔51而流向該待鍍板體4 0，該等 引/’il孔5 2亦可協助電鑛液的流動，以將電魏層更均 勻地鍍在該待鍍板體表面。應注意的是，該導流孔 51之形狀係隨著該待鍍形狀而設置，而為矩形、圓 形、橢圓形或多邊形其中之一者，以便協助電鍍液 之導流效果，大幅提昇電鍍效果。 ’以上所述者，僅為本創作之較佳實施例而 =，並非用以限定本創作實施之範圍’其他如：該 等外框架31的尺寸或該等固定單元32的數量，甚 7 M393518 至是該導流治具50的尺寸、材質等，亦皆在本 範疇之中；故此等熟習此技術所作出等效或輕 變化者，在不脫離本創作之精神與範圍下所作 等變化與修飾，皆應涵蓋於本創作之專利範圍 综上所述，本創作之電鍍用架具，係具有 之創作性，及對產業的利用價值；申請人爰依 法之規定，向 鈞局提起新型專利之申請。 案的 易的 之均 内0 專利 專利 M393518 【圖式簡單說明】 意圖。 示意圖。 定待鍍板體時 種實施方式示 流治具的結構 第1圖，為習知電鍍用架具的結構 第2圖，為本創作較佳實施例的結 第3圖，為本創作較佳實施例夾持 的示意圖。 第4圖，為本創作較佳實施例的另 意圖。 第5圖，為本創作較佳實施例中之 示意圖。 【主要元件符號說明】 【習知】 10 電鍍用架具 11 外框架 12 線夹 121 容置部 20 載板 【本創作] 1 30 電鍍用架具 31 外框架 311 把手 32 固定單元 321 固定塊 開口 3211 9 M393518 322 彈片 3221 V字形開口 40 待鍍板體 50 導流治具 51 導流孔 511 環擋牆 52 引流孔Flowing through the flow guiding holes 51 such as shai to the plate body 40 to be plated, the lead/'il holes 5 2 can also assist the flow of the electric ore liquid to plate the electric Wei layer more uniformly on the plate to be plated. The surface of the board. It should be noted that the shape of the flow guiding hole 51 is set along the shape to be plated, and is one of a rectangular shape, a circular shape, an elliptical shape or a polygonal shape, in order to assist the guiding effect of the plating liquid, and greatly enhance the plating. effect. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Others such as the size of the outer frame 31 or the number of such fixed units 32, even 7 M393518 The size and material of the guide tube 50 are also within the scope of the present invention. Therefore, if the equivalent or slight change is made by the skilled artisan, the changes and modifications made without departing from the spirit and scope of the present invention are Modifications should be covered in the scope of the patents of this creation. The electroplating fixtures of this creation are of creative nature and use value to the industry; the applicants filed new patents with the bureau in accordance with the law. Application. The average of the case is 0 Patent Patent M393518 [Simple description of the schema] Intention. schematic diagram. The structure of the embodiment of the present invention is shown in FIG. 1 , which is a structure of a conventional plating apparatus. FIG. 3 is a third embodiment of the preferred embodiment of the present invention. A schematic view of the clamping of the embodiment. Figure 4 is a further illustration of the preferred embodiment of the present invention. Figure 5 is a schematic view of the preferred embodiment of the present invention. [Main component symbol description] [Practical] 10 Electroplating frame 11 External frame 12 Clamp 121 Housing 20 Carrier [This creation] 1 30 Plating rack 31 External frame 311 Handle 32 Fixing unit 321 Fixing block opening 3211 9 M393518 322 Shrapnel 3221 V-shaped opening 40 Plate to be plated 50 Guide jig 51 Diversion hole 511 Ring retaining wall 52 Drainage hole
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