M392316 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種發光裝置及其發光模組。 【先前技術】 各種不同的發光裝置已成為一般人日常生活中，不可 或缺的電器用品之一，例如高速公路或者街道，都會將複 數發光裝置連接，並藉由系統化的方式進行照明的亮暗控 制。另外，由於發光二極體（Light-Emitting Diode，LED) 具有高亮度及省電等優點，因此，隨著發光二極體的技術 逐漸成熟，其也逐漸被應用在不同的發光模組中。 請參照圖1所示，其為一種習知發光模組1的示意 圖。發光模組1包括一發光二極體11、一電路板12以及 一散熱鰭片13。發光二極體11及散熱鰭片13分別設置在 電路板12的兩側。 因此，在發光模組1中，發光二極體11發光時所產 生的大量熱能，係藉由熱傳導方式經由電路板12將熱傳 遞到散熱鰭片13再散逸至空氣中。然而，電路板12的導 熱效果不佳，且散熱鰭片13設置在電路板12的背面，也 無法有效地藉由熱對流的方式來進行散熱，因此使得發光 模組1的散熱效果不佳。 【新型内容】 有鑑於上述課題，本創作之目的為提供一種能提升散 M392316 熱效果的發光裝置及其發光模組。 本創作之另一目的為提供一種能減輕重量的發光裝 置及其發光模組。 為達上述目的，依據本創作之一種發光裝置包括一殼 體、一發光模組以及一固定模組。發光模組與殼體連接， 具有一散熱基板、一電路基板及複數個發光二極體。散熱 • 基板具有—環狀定位結構及一多孔式鏤空結構，多孔式鏤 . 空結構設置在環狀定位結構周圍。電路基板設置在環狀定 • 位結構’該些發光二極體設置在電路基板。固定模組連接 固定殼體與發光模組。 為達上述目的，依據本創作之一種發光模組包括—散 熱基板、一電路基板以及複數個發光二極體。散熱基板具 有一環狀定位結構及一多孔式鏤空結構，多孔式鏤空結構 設置在環狀定位結構周圍。電路基板設置在環狀定位結 構’該些發光二極體設置在電路基板。 在本創作一實施例中，環狀定位結構具有複數個定位 ® 部’該些定位部環狀配置。藉此，該些發光二極體可分別 設置在各定位部上。 在本創作一實施例中，發光模組更包括一散熱鰭片， 相對於發光二極體設置在環狀定位結構的另一侧，藉此可 提高發光模組的散熱效率。 在本創作一實施例中，散熱基板具有一第一散熱子基 板及複數個第二散熱子基板，第一散熱子基板具有環狀定 位結構’各第二散熱子基板具有複數個開口部對應於環狀 5 M392316 定位結構。其中，第一散熱子基板的環狀定位結構與該些 第二散熱子基板的該些開口部共同形成複數個容置空 間，該些發光二極體位於該容置空間。因此，發光二極體 可位於第一散熱子基板的環狀定位結構與該些第二散熱 子基板的開口部所共同形成的容置空間内，藉此可減少發 光模組的體積。 承上所述，本創作之發光裝置之發光模組的散熱基板 係具有環狀定位結構及多孔式鏤空結構，電路基板及複數 個發光二極體則對應設置在環狀定位結構上。藉此，發光 二極體的熱量可藉由散熱基板的多孔式鏤空結構以傳導 及熱對流方式散出，以提升散熱效果，且藉由多孔式鏤空 結構可減輕發光模組的重量。 再者，在環狀定位結構上相對於發光二極體的另一側 更可設置散熱鰭片，藉以提高發光模組的散熱效率。或 者，散熱基板亦可具有一第一散熱子基板及複數個第二散 熱子基板，而將第一散熱子基板夾置在該些第二散熱子基 板之間，發光二極體則位於第一散熱子基板的環狀定位結 構與該些第二散熱子基板的開口部所共同形成的容置空 間内，藉此可減少發光模組的體積。 【實施方式】 以下將參照相關圖式，說明依本創作較佳實施例之一 種發光裝置及其發光模組，其中相同的元件將以相同的符 號加以說明。 M392316 請參照圖2A及圖2B所示，其中圖2A為本創作較佳 實施例之發光裝置的分解示意圖，圖2B為本創作較佳實 施例之發光裝置的組合示意圖。發光裝置2例如可以是公 路或街道的路燈、或是建築物之長廊的室内照明燈具、或 是外部庭院的照明燈具、或是其他戶外開放空間的照明燈 具、或是室内小型燈具、或是桌上型小型燈具。發光裝置 2包括一殼體3、一發光模組4以及一固定模組5。 殼體3的外觀形狀及材質非限制性，而其具有與發光 模組4形狀及大小匹配的開口 31。另外，殼體3亦可具有 複數的散熱孔32，然其非限制性。請參考圖5A及5B所 示，其中圖5A為本創作較佳實施例之殼體另一變化態樣 的分解示意圖，圖5B為本創作較佳實施例之殼體另一變 化態樣的組合示意圖。殼體3a本身亦可於其中央處形成至 少一散熱孔H1用以散熱，並提供一上蓋H2遮蔽散熱孔 H1用以防止雨水滲入，且上蓋H2可一體成型多個螺絲套 孔F1，搭配殼體3a設置相對應的螺絲套孔F3，藉由外加 螺絲F2同時穿過螺絲套孔F1及F3鎖固的方式固定上蓋 H2於殼體3a，在此螺絲鎖固的方式僅為舉例性，當然亦 可利用機構設計達到卡合或套合等方式，在此非用以限制 本發明。 發光模組4包括一散熱基板41、一電路基板42及複 數個發光二極體43。在本實施例中，以複數電路基板42 為例作說明。 散熱基板41的材質例如可利用銅或者其他熱傳導率 7 M392316 高的材質，並具有一環狀定位結構411及一多孔式鏤空結 構412，在本實施例中，以散熱基板41具有複數個環狀定 位結構411作說明，其非限制性，當然散熱基板41亦可 僅具有一個環狀定位結構411。其中，散熱基板41的面積 及厚度非限制性，端以整體尺寸、結構剛性、散熱效率為 主要考量，且環狀定位結構411的形狀也非限制性。另外， 多孔式鏤空結構412的形狀可為蜂巢式、圓孔式、或其他 形狀，其非限制性。 電路基板42例如可為金屬電路板、玻璃電路板、樹 脂電路板、陶瓷電路板或玻璃纖維電路板等。另外，電路 基板42的形狀係可對應於環狀定位結構411來設計。在 本實施例中，以電路基板42的形狀為六個六邊型環狀配 置為例，其非限制性。另外，電路基板42可藉由黏合、 卡合、鎖合或嵌合在散熱基板41的環狀定位結構411。 發光二極體43設置在電路基板>42。發光二極體43可 選自紅光發光二極體、綠光發光二極體、藍光發光二極 體、黃光發光二極體、白光發光二極體或其組合，在此不 予以限制。另外，該些發光二極體43可藉由為串聯連接， 且連接該些發光二極體43的導線例如可位於電路基板42 中（例如電路基板42為多層電路板），藉此可避免導線氧 化等問題。 固定模組5的外觀形狀及材質非限制性，其例如可藉 由黏合、卡合、鎖合或嵌合等方式連接固定殼體3與發光 模組4，在此以鎖合方式連接固定為例，其非限制性。 M392316 因此，由於發光模組4的散熱基板41具有多孔式鏤 空結構412,發光二極體43的熱量可直接藉由傳導及熱對 流方式散出，以提升散熱效果。且，藉由散熱基板41的 多孔式鏤空結構412可減少發光裝置2的重量。 請參照圖3A及圖3B所示，其中圖3A為本創作另一 較佳實施例之發光模組的分解示意圖，圖3B為發光模組 的組合示意圖。發光模組4a之散熱基板41a可具有一第一 散熱子基板413及複數個第二散熱子基板414，第一散熱 子基板413夾置在該些第二散熱子基板414之間，第一散 熱子基板413具有環狀定位結構411，各第二散熱子基板 414具有複數個開口部0對應於環狀定位結構411。 第一散熱子基板413及第二散熱子基板414的材質係 可相同或不相同。其中，第二散熱子基板414的個數、面 積及厚度非限制性，且開口部〇的形狀也非限制性。實際 應用時，以第二散熱子基板414的面積及厚度與第一散熱 子基板413對應，開口部0的形狀與環狀定位結構411對 應為佳。再者，在此以四個第二散熱子基板414作說明， 其非限制性。 另外，該些第二散熱子基板414分別具有與第一散熱 子基板413對應的多孔式鏤空結構412。又，在此第一散 熱子基板413夾置在該些第二散熱子基板414之間，而第 一散熱子基板413的環狀定位結構411與該些第二散熱子 基板414的該些開口部0可共同形成複數個容置空間，該 些發光二極體43位於容置空間（如圖3B所示）。 9 M392316 需注意的是，第二散熱子基板414的個數非限制性， 在此，以第一散熱子基板413的上方具有二個第二散熱子 基板414，第一散熱子基板413的下方具有二個第二散熱 子基板414作說明，其非用以限制本創作。 因此，藉由使發光二極體43位於第一散熱子基板413 的環狀定位結構411與該些第二散熱子基板414的開口部 0所共同形成的容置空間内，可避免發光二極體43突出於 發光模組4a，以減少發光模組4a的體積。 請參照圖4所示，其為本創作再一較佳實施例之發光 模組的分解示意圖。發光模組4b之散熱基板41b同樣可 具有一第一散熱子基板413及複數個第二散熱子基板 414，但，第一散熱子基板413設置在該些第二散熱子基 板414的一側。 另外，發光模組4b更包括一散熱鰭片44相對於各發 光二極體43,設置在環狀定位結構411的另一側。換言之， 發光二極體43與散熱鰭片44分別設置在環狀定位結構 411的兩側。且，散熱鰭片44位於環狀定位結構411與開 口部〇共同形成的容置空間内。在此，對應複數發光二極 體43，以發光模組4b包括複數散熱鰭片44作說明，其非 限制性。再者，散熱鰭片44例如可藉由鎖合、貼合（例 如藉由散熱膏等）或焊接方式設置在環狀定位結構411， 或者散熱鰭片44也可與環狀定位結構411 一體成型。 因此，藉由設置散熱鰭片44在環狀定位結構411上相 對於發光二極體43的另一側，可更提高發光模組4b的散 M392316 熱效率。 需注意的是，本實施例的第一散熱子基板413也可以 如圖3A及圖3B的第一散熱子基板413,夾置在該些第二 散熱子基板414之間，而其結構特徵已在上述實施例中詳 述，在此不再贅述。再者，如圖3B及圖4B的發光模組 4a、4b亦可應用在如圖2B的發光裝置2中。 綜上所述，本創作之發光裝置之發光模組的散熱基板 係具有環狀定位結構及多孔式鏤空結構，電路基板及複數 個發光二極體則對應設置在環狀定位結構上。藉此，發光 二極體的熱量可藉由散熱基板的多孔式鏤空結構以傳導 及熱對流方式散出，以提升散熱效果，且藉由多孔式鏤空 結構可減少發光模組的重量。 再者，在環狀定位結構上相對於發光二極體的另一側 更可設置散熱鰭片，藉以提高發光模組的散熱效率。或 者，散熱基板亦可具有一第一散熱子基板及複數個第二散 熱子基板，而將第一散熱子基板夾置在該些第二散熱子基 板之間，發光二極體則位於第一散熱子基板的環狀定位結 構與該些第二散熱子基板的開口部所共同形成的容置空 間内，藉此可減少發光模組的體積。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本創作之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 11 M392316 圖1為一種習知發光模組的示意圖； 圖2A為本創作較佳實施例之發光裝置的分解示意 圖，圖2B為本創作較佳實施例之發光裝置的組合示意圖； 圖3A為本創作另一較佳實施例之發光模組的分解示 意圖，圖3B為如圖3A之發光模組的組合示意圖； 圖4為本創作再一較佳實施例之發光模組的分解示意 圖；以及 圖5A為本創作較佳實施例之殼體另一變化態樣的分 解示意圖，圖5B為圖5A的組合示意圖。 【主要元件符號說明】 〔習知〕 I :發光模組 II :發光二極體 12 :電路板 13 :散熱鰭片 〔本創作〕 2:發光裝置 3 ' 3a :殼體 31 :開口 32 :散熱孔 4、4a、4b :發光模組 41、41a、41b :散熱基板 411 :環狀定位結構 12 M392316 412 :多孔式鏤空結構 413 :第一散熱子基板 414 :第二散熱子基板 42 :電路基板 43 :發光二極體 44 :散熱鰭片 5 :固定模組 FI、F3 :螺絲套孔 F2 :螺絲 H1 :散熱孔 H2 :上蓋 Ο :開口部M392316 V. New description: [New technical field] This creation is about a light-emitting device and its light-emitting module. [Prior Art] A variety of different light-emitting devices have become one of the indispensable electrical appliances in daily life, such as highways or streets, which connect multiple light-emitting devices and lightly darken them in a systematic manner. control. In addition, since the light-emitting diode (LED) has advantages of high brightness and power saving, as the technology of the light-emitting diode is gradually matured, it is gradually applied to different light-emitting modules. Please refer to FIG. 1, which is a schematic diagram of a conventional light-emitting module 1. The light emitting module 1 includes a light emitting diode 11, a circuit board 12, and a heat sink fin 13. The light emitting diode 11 and the heat dissipation fins 13 are respectively disposed on both sides of the circuit board 12. Therefore, in the light-emitting module 1, a large amount of thermal energy generated when the light-emitting diode 11 emits light is transferred to the heat-dissipating fins 13 via the circuit board 12 by heat conduction and then dissipated into the air. However, the heat conduction effect of the circuit board 12 is not good, and the heat dissipation fins 13 are disposed on the back surface of the circuit board 12, and the heat dissipation is not effectively performed by the heat convection, so that the heat dissipation effect of the light-emitting module 1 is not good. [New content] In view of the above problems, the purpose of this creation is to provide a light-emitting device and a light-emitting module capable of improving the thermal effect of the dispersion M392316. Another object of the present invention is to provide a light-emitting device and a light-emitting module thereof that can reduce weight. In order to achieve the above object, a lighting device according to the present invention comprises a casing, a lighting module and a fixing module. The light emitting module is connected to the casing, and has a heat dissipation substrate, a circuit substrate and a plurality of light emitting diodes. Heat Dissipation • The substrate has an annular positioning structure and a porous hollow structure, and the porous structure is disposed around the annular positioning structure. The circuit board is disposed in a ring-shaped fixed structure. The light-emitting diodes are disposed on the circuit board. The fixed module is connected to the fixed housing and the light emitting module. In order to achieve the above object, a light-emitting module according to the present invention comprises a heat-dissipating substrate, a circuit substrate and a plurality of light-emitting diodes. The heat dissipating substrate has an annular positioning structure and a porous hollow structure, and the porous hollow structure is disposed around the annular positioning structure. The circuit substrate is disposed in an annular positioning structure. The light emitting diodes are disposed on the circuit substrate. In an embodiment of the present invention, the annular positioning structure has a plurality of positioning portions. Thereby, the light emitting diodes can be respectively disposed on the respective positioning portions. In an embodiment of the present invention, the light-emitting module further includes a heat-dissipating fin disposed on the other side of the annular positioning structure with respect to the light-emitting diode, thereby improving heat dissipation efficiency of the light-emitting module. In one embodiment of the present invention, the heat dissipation substrate has a first heat dissipation sub-substrate and a plurality of second heat dissipation sub-substrates, and the first heat dissipation sub-substrate has an annular positioning structure. Each of the second heat dissipation sub-substrates has a plurality of openings corresponding to Ring 5 M392316 positioning structure. The ring-shaped positioning structure of the first heat-dissipating sub-substrate and the opening portions of the second heat-dissipating sub-substrate together form a plurality of accommodating spaces, and the light-emitting diodes are located in the accommodating space. Therefore, the light emitting diode can be located in the accommodating space formed by the annular positioning structure of the first heat dissipation sub-substrate and the opening portion of the second heat dissipation sub-substrate, thereby reducing the volume of the light-emitting module. As described above, the heat dissipation substrate of the light-emitting module of the light-emitting device of the present invention has an annular positioning structure and a porous hollow structure, and the circuit substrate and the plurality of light-emitting diodes are correspondingly disposed on the annular positioning structure. Thereby, the heat of the light-emitting diode can be dissipated by conduction and heat convection by the porous hollow structure of the heat dissipation substrate to improve the heat dissipation effect, and the weight of the light-emitting module can be reduced by the porous hollow structure. Furthermore, heat dissipation fins may be disposed on the other side of the light-emitting diode on the annular positioning structure, thereby improving the heat dissipation efficiency of the light-emitting module. Alternatively, the heat dissipation substrate may have a first heat dissipation sub-substrate and a plurality of second heat dissipation sub-substrate, and the first heat dissipation sub-substrate is sandwiched between the second heat dissipation sub-substrates, and the light-emitting diode is located at the first The annular positioning structure of the heat dissipation sub-substrate and the opening portion of the second heat dissipation sub-substrate are formed together, thereby reducing the volume of the light-emitting module. [Embodiment] Hereinafter, a light-emitting device and a light-emitting module thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. 2A and FIG. 2B, FIG. 2A is an exploded perspective view of a light-emitting device according to a preferred embodiment of the present invention, and FIG. 2B is a schematic view showing the combination of the light-emitting device of the preferred embodiment. The illuminating device 2 can be, for example, a street lamp of a road or a street, an indoor lighting fixture of a promenade of a building, or an external courtyard lighting fixture, or other outdoor open space lighting fixtures, or an indoor small luminaire, or Small table lamps. The illuminating device 2 includes a casing 3, a lighting module 4 and a fixing module 5. The outer shape and material of the casing 3 are not limited, and have an opening 31 matching the shape and size of the light-emitting module 4. In addition, the housing 3 may have a plurality of heat dissipation holes 32, which are not limited. 5A and 5B, wherein FIG. 5A is an exploded perspective view of another variation of the housing of the preferred embodiment, and FIG. 5B is a combination of another variation of the housing of the preferred embodiment. schematic diagram. The housing 3a itself may also form at least one heat dissipation hole H1 at the center for heat dissipation, and provide an upper cover H2 to shield the heat dissipation hole H1 for preventing rainwater from penetrating, and the upper cover H2 may integrally form a plurality of screw sleeve holes F1. The body 3a is provided with a corresponding screw sleeve hole F3, and the upper cover H2 is fixed to the housing 3a by the screw F2 and the screw sleeve holes F1 and F3 at the same time, and the screw locking manner is only an example, of course. It is also possible to use a mechanism design to achieve a snap fit or a nesting, etc., and is not intended to limit the present invention. The light emitting module 4 includes a heat dissipation substrate 41, a circuit substrate 42, and a plurality of light emitting diodes 43. In the present embodiment, the plurality of circuit boards 42 will be described as an example. The material of the heat dissipation substrate 41 can be, for example, copper or other material having a high thermal conductivity of 7 M392316, and has an annular positioning structure 411 and a porous hollow structure 412. In the embodiment, the heat dissipation substrate 41 has a plurality of rings. The shape positioning structure 411 is described, which is not limited. Of course, the heat dissipation substrate 41 may have only one annular positioning structure 411. The area and thickness of the heat dissipation substrate 41 are not limited, and the ends are mainly considered in terms of overall size, structural rigidity, and heat dissipation efficiency, and the shape of the annular positioning structure 411 is also not limited. Additionally, the shape of the porous hollow structure 412 can be honeycomb, circular, or other shape, which is not limiting. The circuit board 42 can be, for example, a metal circuit board, a glass circuit board, a resin circuit board, a ceramic circuit board, or a fiberglass circuit board. In addition, the shape of the circuit substrate 42 can be designed corresponding to the annular positioning structure 411. In the present embodiment, the six-sided annular configuration of the circuit board 42 is exemplified, which is not limited. In addition, the circuit board 42 can be bonded, snapped, locked, or fitted to the annular positioning structure 411 of the heat dissipation substrate 41. The light-emitting diode 43 is provided on the circuit board > 42. The light-emitting diode 43 may be selected from the group consisting of a red light emitting diode, a green light emitting diode, a blue light emitting diode, a yellow light emitting diode, a white light emitting diode, or a combination thereof, and is not limited herein. In addition, the light-emitting diodes 43 can be connected in series, and the wires connecting the light-emitting diodes 43 can be located, for example, in the circuit substrate 42 (for example, the circuit substrate 42 is a multi-layer circuit board), thereby avoiding the wires. Oxidation and other issues. The shape and material of the fixing module 5 are not limited. For example, the fixing shell 3 and the light-emitting module 4 can be connected by bonding, snapping, locking, or fitting, and are connected and fixed in a locking manner. For example, it is not limiting. M392316 Therefore, since the heat dissipation substrate 41 of the light-emitting module 4 has a porous hollow structure 412, the heat of the light-emitting diode 43 can be directly radiated by conduction and heat convection to improve the heat dissipation effect. Moreover, the weight of the light-emitting device 2 can be reduced by the porous hollow structure 412 of the heat dissipation substrate 41. 3A and FIG. 3B, FIG. 3A is an exploded perspective view of a light-emitting module according to another preferred embodiment of the present invention, and FIG. 3B is a schematic diagram of a combination of the light-emitting modules. The heat dissipation substrate 41a of the light-emitting module 4a may have a first heat dissipation sub-substrate 413 and a plurality of second heat dissipation sub-substrates 414. The first heat dissipation sub-substrate 413 is interposed between the second heat dissipation sub-substrates 414. The sub-substrate 413 has an annular positioning structure 411, and each of the second heat dissipation sub-substrates 414 has a plurality of openings 0 corresponding to the annular positioning structure 411. The materials of the first heat dissipation sub-substrate 413 and the second heat dissipation sub-substrate 414 may be the same or different. The number, area, and thickness of the second heat dissipation sub-substrate 414 are not limited, and the shape of the opening portion 也 is also not limited. In actual use, the area and thickness of the second heat-dissipating sub-substrate 414 correspond to the first heat-dissipating substrate 413, and the shape of the opening portion 0 corresponds to the annular positioning structure 411. Furthermore, four second heat sink sub-boards 414 are described herein, which are not limited. In addition, each of the second heat dissipation sub-substrates 414 has a porous hollow structure 412 corresponding to the first heat dissipation sub-substrate 413. In addition, the first heat dissipation sub-substrate 413 is interposed between the second heat dissipation sub-substrates 414 , and the annular positioning structures 411 of the first heat dissipation sub-substrate 413 and the openings of the second heat dissipation sub-substrates 414 . The portion 0 can form a plurality of accommodating spaces, and the illuminating diodes 43 are located in the accommodating space (as shown in FIG. 3B). 9 M392316 It should be noted that the number of the second heat dissipation sub-substrate 414 is not limited. Here, the second heat dissipation sub-substrate 414 is disposed above the first heat dissipation sub-substrate 413, below the first heat dissipation sub-substrate 413. There are two second heat sink sub-substrates 414 for illustration, which are not intended to limit the creation. Therefore, the light-emitting diodes can be avoided by locating the light-emitting diodes 43 in the accommodating space formed by the annular positioning structure 411 of the first heat-dissipating sub-substrate 413 and the opening portion 0 of the second heat-dissipating sub-substrates 414. The body 43 protrudes from the light emitting module 4a to reduce the volume of the light emitting module 4a. Please refer to FIG. 4, which is an exploded perspective view of a light emitting module according to still another preferred embodiment. The heat dissipation substrate 41b of the light-emitting module 4b may have a first heat dissipation sub-substrate 413 and a plurality of second heat dissipation sub-substrates 414. However, the first heat dissipation sub-substrate 413 is disposed on one side of the second heat dissipation sub-substrates 414. In addition, the light-emitting module 4b further includes a heat-dissipating fin 44 disposed on the other side of the annular positioning structure 411 with respect to each of the light-emitting diodes 43. In other words, the light-emitting diodes 43 and the heat dissipation fins 44 are respectively disposed on both sides of the annular positioning structure 411. Moreover, the heat dissipating fins 44 are located in the accommodating space formed by the annular positioning structure 411 and the opening portion 。. Here, the corresponding plurality of light-emitting diodes 43 are described by the light-emitting module 4b including a plurality of heat-dissipating fins 44, which are not limited. Furthermore, the heat dissipation fins 44 can be disposed on the annular positioning structure 411 by, for example, locking, bonding (for example, by thermal grease, etc.) or welding, or the heat dissipation fins 44 can be integrally formed with the annular positioning structure 411. . Therefore, by providing the heat dissipating fins 44 on the annular positioning structure 411 with respect to the other side of the light emitting diode 43, the thermal efficiency of the light emitting module 4b can be further improved. It should be noted that the first heat dissipation sub-substrate 413 of the present embodiment may also be sandwiched between the second heat dissipation sub-substrates 414 as shown in FIG. 3A and FIG. 3B, and the structural features thereof have been It is described in detail in the above embodiments, and details are not described herein again. Furthermore, the light-emitting modules 4a, 4b of Figs. 3B and 4B can also be applied to the light-emitting device 2 of Fig. 2B. In summary, the heat dissipation substrate of the light-emitting module of the light-emitting device of the present invention has an annular positioning structure and a porous hollow structure, and the circuit substrate and the plurality of light-emitting diodes are correspondingly disposed on the annular positioning structure. Thereby, the heat of the light-emitting diode can be dissipated by conduction and heat convection by the porous hollow structure of the heat dissipation substrate to improve the heat dissipation effect, and the weight of the light-emitting module can be reduced by the porous hollow structure. Furthermore, heat dissipation fins may be disposed on the other side of the light-emitting diode on the annular positioning structure, thereby improving the heat dissipation efficiency of the light-emitting module. Alternatively, the heat dissipation substrate may have a first heat dissipation sub-substrate and a plurality of second heat dissipation sub-substrate, and the first heat dissipation sub-substrate is sandwiched between the second heat dissipation sub-substrates, and the light-emitting diode is located at the first The annular positioning structure of the heat dissipation sub-substrate and the opening portion of the second heat dissipation sub-substrate are formed together, thereby reducing the volume of the light-emitting module. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of this creation shall be included in the scope of the appended patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional light-emitting device; FIG. 2A is an exploded perspective view of a light-emitting device according to a preferred embodiment of the present invention, and FIG. 2B is a combination of the light-emitting device of the preferred embodiment. 3A is a schematic exploded view of a light-emitting module according to another preferred embodiment of the present invention, and FIG. 3B is a schematic diagram of a combination of the light-emitting module of FIG. 3A; FIG. 4 is a schematic diagram of a light-emitting module according to another preferred embodiment of the present invention; FIG. 5A is an exploded perspective view showing another variation of the casing of the preferred embodiment of the present invention, and FIG. 5B is a schematic diagram of the combination of FIG. 5A. [Major component symbol description] [General] I: Light-emitting module II: Light-emitting diode 12: Circuit board 13: Heat-dissipating fins [This creation] 2: Light-emitting device 3' 3a: Case 31: Opening 32: Heat dissipation Holes 4, 4a, 4b: light-emitting modules 41, 41a, 41b: heat-dissipating substrate 411: annular positioning structure 12 M392316 412: porous hollow structure 413: first heat-dissipating sub-substrate 414: second heat-dissipating sub-substrate 42: circuit substrate 43 : Light-emitting diode 44 : Heat-dissipating fin 5 : Fixed module FI, F3 : Screw sleeve hole F2 : Screw H1 : Cooling hole H2 : Upper cover Ο : Opening