M391.757 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種導電端子，尤其係一種將晶片模組電性 連接至印刷電路板之導電端子。 【先前技術】 [0002] 一種習知的導電端子主要用於電性連接晶片模組至電路 板，其包括包括主體、自主體之中部向上延伸形成一對 延伸臂、於延伸臂之末端向前彎折形成接觸部、自主體 之下端向下彎折延伸形成焊接部。其中，接觸部之内表 面在實際下料生產之過程中會產生斷面，形成表面較為 光滑之沖切面和表面較為粗糙之撕裂面：。 [0003] 習知的導電端子至少具有以下缺點‘：當晶片模組之端腳 與導電端子之接觸部接觸時，形成於沖切面與撕裂面交 界處之尖鋒部分容易磨損端腳之外表面，在長時間之接 觸中很容易損耗端腳之結構。而且撕裂面之外表面較為 粗糙，對其進行電鍍時，其電鍍之品質也較差，容易產生 電性接觸不穩定，電阻值偏大之現象，進而影響晶片模 組與導電端子之間之電性連接。 [0004] 鑒於此，實有必要提供一種改進之導電端子，以克服上 述導電端子之缺陷。 【新型内容】 [0005] 本創作所解決之技術問題係提供一種穩定與晶片模組相 接觸並不會損耗晶片模組之導電端子。 [0006] 為瞭解決前述技術問題，本創作之導電端子係通過以下 表單編號A0101 第3頁/共12頁 M391757 技術方案實現：一種導電端子，可電性連接晶片模組至 電路板，其包括：主體、自主體向上延伸之延伸臂、於 延伸臂之末端彎折形成之接觸部及自主體向下彎折延伸 之焊接部，所述接觸部設有與晶月模組配合之接觸面， 該接觸面包括位於上端表面較為粗糙之撕裂面和位於下 端且表面較為光滑之沖切面，該沖切面側向凸伸。 [0007] 相較於先前技術，本創作之導電端子之接觸部設有表面 光滑並與晶片模組接觸之沖切面，不易磨損晶片模組之 結構並具有較為穩定且較低之電阻值。 【實施方式】 [0008] 本創作之導電端子1主要用於電性連接晶片模組（未圖示） 至電路板（未圖示），如第一圓和第二圖/所示，該導電端 子1包括主體10、自主體10之中部分別向上延伸形成一對 延伸臂11、於延伸臂11之末端向前彎折形成接觸部12、 自主體10之下端中部向前彎折延伸形成與電路板（未圖示 )相配合之焊接部13。其中，晶片模組（未圖示）底部設有 與導電端子1相接觸之端腳2。 [0009] 所述該對延伸臂11自主體10之頂部豎直向上延伸後分別 朝向彼此遠離之方向延伸，之後再豎直向上延伸後再向 彼此靠近之方向延伸後繼續豎直向上延伸所形成。所述 該對接觸部1 2内緣之内表面沖切後通過治具成型向上翻 形成一個傾斜之接觸面120，於接觸部12之末端設有一寬 度逐漸擴大之引導部123。所述接觸面120包括位於傾斜 接觸面120上端且外表面較為粗糙之撕裂面121和位於傾 斜接觸面12 0下端側向凸伸且外表面較為光滑之沖切面 表單編號A0101 第4頁/共12頁 M391757 122，所述導電端子1沖切成型時，先與治具之刀頭接觸 之部分被沖切形成沖切面122，故沖切面122之外表面較 為光滑，由於導電端子1存在一定之厚度，當治具再向下 沖切時，剩餘部分相當於被拉開，即形成外表面較為粗 糙之撕裂面121。本創作之導電端子1之接觸部12沖切完 成後，自沖切面122朝向撕裂面121之方向施壓，使沖切 面122向外並向撕裂面121翻移，相對於撕裂面121更加 突出。在接觸面120成型後對其表面進行電鍍，由於撕裂 面121之外表面較為粗糙，所以電鍍層之外表面較為粗糙 ;而沖切面122之外表面較為光滑，所以電鍍層之外表面 較為光滑，電鍍之品質較好、品質較高，電阻值較小， 可與晶片模組（未圖示）之端腳2穩定之電性連接。 [0010] 將晶片模組（未圖示）置於導電端子1之上方並對晶片模組 (未圖示）施加外力，晶片模組（未圖示）之端腳2位於所述 該對接觸部12之間，端腳2之外側面與接觸部12凸伸之沖 切面122相接觸，由於沖切面122之外表面較為光滑，在 長期之使用過程中，不會輕易之磨損端腳2之外側面，而 且光滑之沖切面122之電鍍層與端腳2接觸時還具有較為 穩定且較低之電阻值，從而實現電連接器之間穩定之電 性連接。 [0011] 综上所述，本創作確已符合新型專利之要件，爰依法提 出專利申請。惟，以上所述者僅係本創作之較佳實施方 式，本創作之範圍並不以上述實施方式為限，舉凡熟習 本案技藝之人士援依本創作之精神所作之等效修飾或變 化，皆應涵蓋於以下申請專利範圍内。 表單編號A0101 第5頁/共12頁 M391757 【圖式簡單說明】 [0012] 第一圖係本創作之導電端子之立體圖； [0013] 第二圖係本創作之導電端子之另一角度之立體圖；及 [0014] 第三圖係晶片模組之端腳插入導電端子中之正視圖。 【主要元件符號說明】 [0015] 導電端子：1 [0016] 主體：10 [0017] 延伸臂：11 [0018] 接觸部：12 [0019] 接觸面：120 [0020] 撕裂面：121 [0021] 沖切面·· 122 [0022] 引導部：123 [0023] 焊接部：1 3 [0024] 端腳：2 表單編號A0101 第6頁/共12頁M391.757 V. New Description: [New Technology Field] [0001] The present invention relates to a conductive terminal, and more particularly to a conductive terminal for electrically connecting a wafer module to a printed circuit board. [Prior Art] [0002] A conventional conductive terminal is mainly used for electrically connecting a wafer module to a circuit board, comprising: a main body, extending upward from a middle portion of the main body to form a pair of extending arms, and extending at an end of the extending arm The bent portion forms a contact portion, and is bent downward from the lower end of the main body to form a welded portion. Among them, the inner surface of the contact portion will have a cross section during the actual production process, forming a smooth surface with a rough surface and a rough surface with a rough surface: [0003] Conventional conductive terminals have at least the following disadvantages: when the end legs of the wafer module are in contact with the contact portions of the conductive terminals, the sharp portions formed at the interface between the punched surface and the tear surface are easily worn outside the end portions. On the surface, it is easy to lose the structure of the end foot during long-term contact. Moreover, the outer surface of the tearing surface is rough, and the quality of the plating is poor when it is plated, and the electrical contact is unstable, and the resistance value is too large, thereby affecting the electricity between the chip module and the conductive terminal. Sexual connection. In view of this, it is necessary to provide an improved conductive terminal to overcome the above-described defects of the conductive terminal. [New Content] [0005] The technical problem solved by this creation is to provide a conductive terminal that stably contacts the wafer module without damaging the wafer module. [0006] In order to solve the foregoing technical problem, the conductive terminal of the present invention is realized by the following form number A0101, page 3/12, M391757 technical solution: a conductive terminal electrically connecting the chip module to the circuit board, which includes a main body, an extending arm extending upward from the main body, a contact portion formed by bending at an end of the extending arm, and a welding portion extending downward from the main body, wherein the contact portion is provided with a contact surface matched with the crystal moon module. The contact surface includes a torsion surface which is rough on the upper end surface and a punched surface which is located at the lower end and which is relatively smooth, and the punching surface protrudes laterally. [0007] Compared with the prior art, the contact portion of the conductive terminal of the present invention is provided with a punched surface having a smooth surface and in contact with the wafer module, which is not easy to wear the structure of the wafer module and has a relatively stable and low resistance value. [Embodiment] [0008] The conductive terminal 1 of the present invention is mainly used for electrically connecting a chip module (not shown) to a circuit board (not shown), such as the first circle and the second figure/showing, the conductive The terminal 1 includes a main body 10, and a pair of extension arms 11 extend upward from the middle portion of the main body 10, and the end portion of the extension arm 11 is bent forward to form a contact portion 12, and the middle portion of the lower end portion of the main body 10 is bent forward to form a circuit. A welded portion 13 to which a plate (not shown) is fitted. The bottom end of the wafer module (not shown) is provided with an end leg 2 that is in contact with the conductive terminal 1. [0009] The pair of extension arms 11 extend vertically upward from the top of the main body 10 and then extend away from each other, and then extend vertically upwards and then extend toward each other to continue to extend vertically upwards. . The inner surface of the inner edge of the pair of contact portions 1 2 is punched and formed by the jig to form an inclined contact surface 120, and a guide portion 123 whose width is gradually enlarged is provided at the end of the contact portion 12. The contact surface 120 includes a tear surface 121 which is located at the upper end of the inclined contact surface 120 and has a rough outer surface, and a punched surface which is laterally protruded at the lower end of the inclined contact surface 12 0 and has a smooth outer surface. Form No. A0101 Page 4 / Total On page 12, M391757 122, when the conductive terminal 1 is die-cut, the portion in contact with the tip of the jig is punched to form a punched surface 122, so that the outer surface of the punched surface 122 is smooth, due to the existence of the conductive terminal 1 The thickness, when the jig is further punched down, the remaining portion is equivalent to being pulled apart, that is, a tear surface 121 having a rough outer surface is formed. After the punching of the contact portion 12 of the conductive terminal 1 of the present invention is completed, the punching surface 122 is pressed toward the tearing surface 121, so that the punching surface 122 is turned outward and toward the tearing surface 121, relative to the tearing surface 121. More prominent. After the contact surface 120 is formed, the surface thereof is plated. Since the outer surface of the tear surface 121 is rough, the surface of the plating layer is rough; and the outer surface of the punching surface 122 is smooth, so the surface of the plating layer is smooth. The electroplating has good quality, high quality, and small resistance value, and can be electrically connected to the terminal 2 of the wafer module (not shown). [0010] A wafer module (not shown) is placed over the conductive terminal 1 and an external force is applied to the wafer module (not shown), and the end pins 2 of the wafer module (not shown) are located at the pair of contacts Between the portions 12, the outer side of the end leg 2 is in contact with the punching surface 122 of the contact portion 12, and the outer surface of the punching surface 122 is smooth, so that it is not easily worn outside the end leg 2 during long-term use. The side, and the smoothed stamped surface 122 has a relatively stable and low resistance value when in contact with the end leg 2, thereby achieving a stable electrical connection between the electrical connectors. [0011] In summary, the creation has indeed met the requirements of the new patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application. Form No. A0101 Page 5 of 12 M391757 [Simple Description of the Drawing] [0012] The first figure is a perspective view of the conductive terminal of the present invention; [0013] The second figure is a perspective view of another angle of the conductive terminal of the present invention And [0014] The third figure is a front view of the end of the wafer module inserted into the conductive terminal. [Main component symbol description] [0015] Conductive terminal: 1 [0016] Main body: 10 [0017] Extension arm: 11 [0018] Contact portion: 12 [0019] Contact surface: 120 [0020] Tear surface: 121 [0021 ] Punching surface · · 122 [0022] Guide: 123 [0023] Weld: 1 3 [0024] Pin: 2 Form No. A0101 Page 6 of 12