M383830 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係關於一種電連接器，尤其涉及一種連接記憶模 組至電路板的電連接器。 【先前技術】 [0002] 現有電腦等電子設備中，為滿足功能需要通常採用堆疊 式S己憶模組電連接器以可同時插入兩個記憶模組。先前 技術的该種電連接器包括安裝於電路板一表面的下層座 體及堆疊於下層座體上方的上層座體，所述上層座體與 下層座體均安裝於電路板該表面上，並均包括複數縱向 排列的導電端子，所述導電端子用以焊接於所述電路板 的該表面上，其中，上層座體導電端子焊接於所述下層 座體導電端子的外側電路板上，使得該上層座體及下層 座體的導電料在電路板的該表©上分卿成各自的焊 接區域疋故，需要化用電路板該表面相對較多的空間 另由於上層座體與下層座體均完全位於電路板的一 表面的上方，使得電路板的該表面的上方需具備足夠的 南度空間來容納上層座體與下層座體堆疊後整體的高度 准隨著電路板上電子元件的佈局密集度逐漸提高， 人們對電路板空間的利料及電連接器尺寸小型化的要 求越來越两，±述電連接器已經無法滿足應用的需求及 未來的發展趨勢。 _3]因此’針對上述問題有必要提出一種新電連接器以解 決上述問題β 表單編號Α0101 第3頁/共19頁 【新型内容】.M383830 V. New description: [New technical field] [0001] This paper relates to an electrical connector, and more particularly to an electrical connector for connecting a memory module to a circuit board. [Prior Art] [0002] In an existing electronic device such as a computer, a stacked S-remember module electrical connector is usually used to meet the function requirements, so that two memory modules can be simultaneously inserted. The electrical connector of the prior art includes a lower base mounted on a surface of the circuit board and an upper base stacked above the lower base, the upper base and the lower base being mounted on the surface of the circuit board, and Each of the plurality of longitudinally arranged conductive terminals, the conductive terminals are for soldering to the surface of the circuit board, wherein the upper conductive terminals are soldered to the outer circuit board of the lower layer conductive terminals, such that The conductive material of the upper layer body and the lower layer body is divided into the respective soldering areas on the surface of the circuit board. Therefore, the surface of the circuit board needs to be relatively more space, and the upper layer body and the lower layer body are both It is completely above a surface of the circuit board, so that the surface of the circuit board needs to have enough south space to accommodate the overall height of the upper and lower bases. The overall layout of the electronic components on the circuit board is dense. Gradually increasing the degree of demand for circuit board space and the size of the electrical connector is becoming more and more two, the description of the electrical connector can not meet the needs of the application Future trends. _3] Therefore, it is necessary to propose a new electrical connector to solve the above problem for the above problem. β Form number Α0101 Page 3 of 19 [New content].
[0004] 本創作的目的在於提供—制以連接記憶模組至電路板 的電連㈣’其可減小電連接器的贿尺寸並提高電路 板空間的利用率。 [0005] 為了實現上述目的，本創作採用如下技術方案：_種電 連接器1於連接域模組至電路板，該電連接器包括 沉板型設置的下層座體及位於下層座體上方的上層座體 ，所述上、下層座體分別設有插槽，所述上、下層座體 均包括複數導電料，所料電端子設有凸伸入插槽内 的接觸臂及連接至電路板料接腳，所述上層座體與下 層座體的焊接腳上下相對設置且均為表面焊接型焊接腳 [0006] 相較於Μ技術’本創作電連接器藉下層座體沉板型設 置且與上層座趙堆疊設置，及上層座趙與下層座體的焊 接腳均為表面焊接型焊接腳且上下相對設置’藉此，使 電路板的空間得到了充分利用，又亦減小了電連接器的 整體尺寸。 【實施方式】 [0007] 請參閱第一圖、第二圖及第五圖所示，本創作提供一種 連接記憶模組200至電路板3〇〇的電連接器1〇〇〇所述電 路板包括上表面301及下表面302 ^所述電連接器1〇〇包 括焊接於上表面301的上層座體1及焊接於下表面3〇2的下 層座體2，並且上層座體1位於下層座體2的上面，兩者上 下堆疊設置。 表單編號Α0101 第4頁/共19頁 M383830 [0008]凊參閱第三圖至第五圖，所述上層座體1從上到下安裝於 電路板300的上表面301並位於該上表面3〇1上，該上層 座體1包括縱長的第一本體11、固持於第一本體丨丨的複數 第一導電端子12、一對於第一本體〗〗兩端水平延伸出並 與第—本體11相垂直的固定臂13及固持於固定臂13上的 金屬固定件14。所述第一本體η與兩固定臂13構成一收 容記憶模組200的收容空間，第一本體〗丨於面向收容空間 的一側上設有沿縱長方向延伸的第一插槽丨5，該第一插 槽15的上下壁面上均設有收容第一導電端子12的複數端 子收谷槽（未標號）。所述兩固定臂13自第一本體"的 縱長兩端水平延伸出並且相對設置用以限位所述記憶模 組2 0 0，固定臂13的外側設有向外凸伸的凸塊丨3丨及固持 所述固定件14的固定槽132，所述凸塊131上插置一金屬 定位片16，藉該定位片16可增強固定臂12與電路板3〇〇 的固持。所述固定件14沿水平方向由前向後插入所述固 定臂12的固定槽132内，所述金屬定位片16由上而下插入 所述凸塊131内並進一步插入電路板3〇〇實現固持作用。 [〇〇〇9]所述第一導電端子12包括由後向前組裝入所述端子收容 槽（未標號）的上排端子120及自下向上組裝入所述端子 收谷槽（未標號）的下排端子121。所述上排端子12〇與 下排端子121結構相似，兩者均設有l型基部12〇1、1211 、由基部一端向前延伸並凸伸入第一插槽15並可與插入 的記憶模組200接觸的彈性接觸臂12〇2、1212、自基部 朝端子插入方向延伸並干涉固持於第一本體11内的固持 41203、1213及由基部下方向下延伸出且暨直設置的第 表單編號A0101 第5頁/共19頁 M383830 一、第二焊接腳1204、1214。所述第一、第二焊接腳 1 204、1214均設置於基部1201、1211下端的前側或後 側，並於上下排上分別呈前後侧交錯排列。所述第一、 第二焊接腳丨2〇4、1214均為豎直焊接腳其末端聚攏形成 焊接點1 205、1215，所述第一導電端子12焊接於電路板 300時，所述第一 '第二焊接腳12〇4、1214垂直於電路 板300使焊接點1205、1215在焊接時抵觸電路板3〇()，並 且錫膏可附著在焊接點周圍，即藉表面焊接的方式將第 導电^子12焊接於電路板300上，亦即第一、第二焊接 腳1 204、1214為表面焊接型焊接腳。 [0010]凊參第二圖至第五圖，下層座體2從下向上固持於電路板 的下表面302。所述下層座體2與上層座體丨結構相似，其 同樣包括縱長型第二本體21、固持於第二本體21的複數 第二導電端子22、一對於第二本體21兩端水平延伸出並 與第二本體21相垂直的固定臂23及固持於固定臂23上的 金屬固定件24。所述第二本體21的一部分位於下表面 302的下方，一部分藉設置於電路板3〇〇的一開口 303延 伸至上表面301的上方，即所述下層座體2以沉板的方式 固持於電路板300。所述第二本體21亦與兩固定臂23構成 一收容記憶模組200的收容空間，並且第二本體21於面向 收容空間的一側上亦設有沿縱長方向延伸的第二插槽2 5 ’該第二插槽25的上下壁面上亦均設有收容第二導電端 子22的複數端子收容槽（未標號）。同理的，所述兩固 定臂23自第二本體21的縱長兩端水平延伸出並且相對設 置用以限位所述記憶模組200，固定臂23的外側設有向外 表單編號Α0101 第6頁/共19頁 凸伸的凸塊231及固持所述固定件24的固定槽232，所述 凸塊231上插置一金屬定位片26，藉該定位片26可增強固 定臂23與電路板300的固持。所述固定件24沿水平方向由 前向後插入所述固定臂23的固定槽232内，所述金屬定位 片26由下而上插入所述凸塊231内並進一步插入電路板 300實現固持作用。 [0011] 所述第二導電端子22同樣包括由後向前組裝如所述端子 收容槽（未標號）的上排端子220及自下組裝入所述端子 收容槽（未標號）的下排端子221。所述上、下排端子 220、221結構相似’兩者均包括基部22〇1、2211、由基 部一端向前延伸並凸伸入第二插槽25且可與插入的記憶 模組200接觸的彈性接觸臂2202、2212、自基部朝端子 插入方向延伸並干涉固持於第二本體21的固持部22〇3、 2 213及由基部向上延伸並於每排上分別呈前後側交錯排 列呈豎直設置的第三、第四焊接腳2204、2214。類似的 ，所述第三、第四焊接腳2204、2214均為豎直焊接腳且 末端聚攏形成焊接點2205、2215。所述第二導電端子22 焊接於電路板300時，所述第三、第四焊接腳2204、 2214垂直於電路板3〇〇使焊接點2205、2215在焊接時抵 觸電路板300的下表面302，並且錫膏可附著在焊接點周 圍。即藉表面焊接的方式將第二導電端子22焊接於電路 板300上，亦即第一、第二焊接腳22〇4、2214為表面焊 接型焊接腳。 請參閱第五圖，所述上層座體！的焊接腳12〇4、ΜΗ表 面焊接於電路板的上表面3(U，其焊接區域靠近開口 表單编號Α0101 第7頁/共19頁 [0012] M383830 ;所述下層座體2的焊接腳2204、2214表面焊接於電路 板300的下表面3〇2，其焊接區域亦靠近開口且位於上表 面301焊接區域的正下方，即上下座體的端子焊接腳間隔 電路板300呈上下相對設置，使得下層座體2的焊接腳 2204、2214焊接於電路板300時只佔用下表面302的區域 而並不佔用上表面3〇1的區域’從而使得上下座體上下充 分堆疊設置，減小電連接器100於電路板300水平方向上 的尺寸。又，下層座體2部分位於下表面302的下方，部 分位於開口 303内，使得僅有小部分位於上表面3〇1的上 方，以降低下層座體2突出上表面301的高度，從而減小 電連接器100於電路板300垂直方向上的尺寸。藉此，電 連接器100的整體尺寸得以減小，從而提高電連接器 整體對電路板300空間的利用率。 [0013] 另，所述記憶模組200由下而上傾斜插入所述上層座體i 及下層座體2的第一、第二插槽15、25内，並與該兩插槽 内的第一、第二導電端子12、22接觸，所述上排端子的 接觸臂1202、2202分別較下排端子的接觸臂12丨2、 2212更靠近所述第一、第二插槽15、25的插入口側，以 此配合記憶模組200斜向上的插入方式。 [0014] 本創作電連接器主要藉將上層座體與下層座體堆疊設置 ，下層座體係沉板型且其表面焊接型焊接腳表面焊接於 電路板的下表面，而上層座體的表面焊接型焊接腳表面 焊接於下表面焊接區域的正上方相對的上表面，使得上 下座體的焊接腳上下相對設置且在兩者之間構成收容電 路板的收容槽道，藉此’使電路板收容於該收容槽道後 表單編號A0101 第8頁/共19頁 電路板的空間得到了充分利用，又亦減小了電連接器的 整體尺寸。又，導電端子的焊接腳上可開設朝垂直於基 部方向開口的孔，以使焊接時錫膏爬上焊接腳並進入孔 中，從而加強焊接效果。需特別說明下，本創作所定義 的表面焊接型焊接腳係指導電端子的焊接腳在焊接到電 路板時，焊接腳與電路板的表面接觸並利用焊料將焊接 腳固定在電路板上，電路板上不設置槽或孔。本創作實 施例所描述的焊接腳均為垂直於電路板的豎直焊接腳， 此外，上下座體如上述堆疊後亦可以用其他的表面焊接 方式，‘例如採用水平焊接腳的方式，並且水平焊接腳上 可粘有錫球，藉此，亦可實現提高電路板空間利用率的 目的。 [0015] 綜上所述，本創作符合新型專利要件，爰依法提出專利 申請。惟，以上所述者僅為本創作之較佳實施例，本創 作之範圍並不以上述實施例為限，舉凡熟習本案技藝之 人士援依本創作之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 [0016] 第一圖係本創作電連接器連接記憶模組至電路板的立體 組合圖； [0017] 第二圖係本創作電連接器安裝於電路板上的立體組合圖 [0018] 第三圖係第二圖所示電連接器的部分立體分解圖； [0019] 第四圖係本創作電連接器的導電端子的立體圖； 表單編號A0101 第9頁/共19頁 M383830 [0020] 第五圖係第二圖沿V - V線的刳視圖。 【主要元件符號說明】 [0021] 電連接器：100 [0022] 記憶模組：200 [0023] 電路板：300 [0024] 上表面：301 [0025] 下表面：302 [0026] 上層座體：1 [0027] 第一本體：11 [0028] 第一導電端子：12 [0029] 固定臂：13 [0030] 凸塊：131 [0031] 固定槽：132 [0032] 固定件：14 [0033] 第一插槽：15 [0034] 定位片：16 [0035] 下層座體：2 [0036] 第二本體：21 [0037] 第二導電端子：22 [0038] 固定臂：23 表單編號A0101 第10頁/共19頁 M383830 [0039] [0040] [0041] [0042] [0043] [0044] [0045][0004] The purpose of this creation is to provide an electrical connection (four) that connects a memory module to a circuit board, which reduces the size of the electrical connector and increases the utilization of the board space. [0005] In order to achieve the above object, the present invention adopts the following technical solution: the electrical connector 1 is connected to the domain module to the circuit board, and the electrical connector includes a lower layer body disposed on the sinker type and above the lower layer body. The upper base and the lower base are respectively provided with slots, and the upper and lower bases each include a plurality of conductive materials, and the electrical terminals are provided with contact arms protruding into the slots and connected to the circuit board. a material pin, wherein the upper base body and the lower seat body have opposite soldering legs and are surface-welded soldering legs. [0006] Compared with the Μ technology, the present invention is provided by a lower-layer seat plate type and It is stacked with the upper seat Zhao, and the welding feet of the upper seat Zhao and the lower seat are surface-welded welding feet and are placed up and down relative to each other, thereby making the space of the circuit board fully utilized and reducing the electrical connection. The overall size of the device. [Embodiment] [0007] Referring to the first, second, and fifth figures, the present invention provides an electrical connector 1 that connects the memory module 200 to the circuit board 3〇〇. The upper surface 301 and the lower surface 302 are included. The electrical connector 1 includes an upper layer body 1 welded to the upper surface 301 and a lower layer body 2 welded to the lower surface 3〇2, and the upper layer body 1 is located in the lower layer seat. Above the body 2, the two are stacked one on top of the other. Form No. 1010101 Page 4 of 19 M383830 [0008] Referring to FIGS. 3 to 5, the upper base 1 is mounted on the upper surface 301 of the circuit board 300 from the top to the bottom and is located on the upper surface 3〇. 1 , the upper base body 1 includes an elongated first body 11 , a plurality of first conductive terminals 12 held by the first body 、 , and a horizontal extension of the first body 〗 〖 and the first body 11 The vertical fixing arm 13 and the metal fixing member 14 fixed on the fixing arm 13. The first body η and the two fixing arms 13 form a receiving space for receiving the memory module 200. The first body is disposed on a side facing the receiving space and has a first slot 丨5 extending in the longitudinal direction. The upper and lower wall surfaces of the first slot 15 are provided with a plurality of terminal valleys (not labeled) for accommodating the first conductive terminals 12. The two fixed arms 13 extend horizontally from the longitudinal ends of the first body and are oppositely disposed to limit the memory module 200. The outer side of the fixed arm 13 is provided with outwardly protruding protrusions. The fixing slot 132 of the fixing member 14 is fixed, and a metal positioning piece 16 is inserted into the protrusion 131. The positioning piece 16 can enhance the fixing of the fixing arm 12 and the circuit board 3. The fixing member 14 is inserted into the fixing groove 132 of the fixing arm 12 from the front to the rear in the horizontal direction, and the metal positioning piece 16 is inserted into the protruding block 131 from above and below and further inserted into the circuit board 3 to be held. effect. [〇〇〇9] The first conductive terminal 12 includes an upper row of terminals 120 that are assembled into the terminal receiving groove (not labeled) from the front and the rear, and is assembled into the terminal receiving groove (not labeled) from the bottom to the top. The lower row of terminals 121. The upper row of terminals 12 is similar in structure to the lower row of terminals 121, both of which are provided with an l-type base 12〇1, 1211, a front end extending from the base end and protruding into the first slot 15 and can be inserted into the memory The elastic contact arms 12 〇 2, 1212 contacting the module 200 extend from the base toward the terminal insertion direction and interfere with the holdings 41203 and 1213 held in the first body 11 and the first form extending downward from the base and straightened No. A0101 Page 5 of 19 M383830 First, the second welding feet 1204, 1214. The first and second soldering legs 1 204 and 1214 are respectively disposed on the front side or the rear side of the lower ends of the base portions 1201 and 1211, and are alternately arranged on the front and rear sides in the upper and lower rows. The first and second soldering fins 2〇4 and 1214 are vertical soldering legs, and the ends thereof are gathered to form solder joints 1205 and 1215. When the first conductive terminals 12 are soldered to the circuit board 300, the first 'The second soldering legs 12〇4, 1214 are perpendicular to the circuit board 300 such that the solder joints 1205, 1215 interfere with the circuit board 3〇() during soldering, and the solder paste can be attached around the solder joint, that is, by surface soldering The conductive member 12 is soldered to the circuit board 300, that is, the first and second soldering legs 1 204, 1214 are surface soldering type soldering legs. [0010] Referring to the second to fifth figures, the lower base 2 is held from the bottom to the lower surface 302 of the circuit board. The lower base body 2 is similar to the upper base body structure, and also includes a vertically long second body 21, a plurality of second conductive terminals 22 held by the second body 21, and a horizontal extension of the second body 21 And a fixing arm 23 perpendicular to the second body 21 and a metal fixing member 24 fixed on the fixing arm 23. A portion of the second body 21 is located below the lower surface 302, and a portion of the second body 21 extends over the upper surface 301 by an opening 303 disposed on the circuit board 3, that is, the lower layer body 2 is held in the circuit board by the sinking plate. Board 300. The second body 21 and the two fixing arms 23 form a receiving space for receiving the memory module 200, and the second body 21 is also provided with a second slot 2 extending in the longitudinal direction on a side facing the receiving space. 5' The upper and lower wall surfaces of the second slot 25 are also provided with a plurality of terminal receiving slots (not labeled) for accommodating the second conductive terminals 22. Similarly, the two fixed arms 23 extend horizontally from the longitudinal ends of the second body 21 and are oppositely disposed to limit the memory module 200. The outer side of the fixed arm 23 is provided with an outward form number Α0101. a 6-page/19-page protruding protrusion 231 and a fixing groove 232 for holding the fixing member 24, and a metal positioning piece 26 is inserted into the protrusion 231, by which the fixing arm 23 and the circuit can be reinforced The holding of the board 300. The fixing member 24 is inserted into the fixing groove 232 of the fixing arm 23 from the front to the rear in the horizontal direction, and the metal positioning piece 26 is inserted into the protruding piece 231 from bottom to top and further inserted into the circuit board 300 for holding. [0011] The second conductive terminal 22 also includes an upper row of terminals 220 assembled from the rear to the front, such as the terminal receiving slots (not labeled), and a lower row of terminals loaded from the lower group into the terminal receiving slots (not labeled). 221. The upper and lower rows of terminals 220 and 221 are similar in structure. 'Both both include a base portion 22〇1, 2211, extending forward from one end of the base portion and projecting into the second slot 25 and being in contact with the inserted memory module 200. The elastic contact arms 2202, 2212 extend from the base toward the terminal insertion direction and interfere with the holding portions 22〇3, 2213 held by the second body 21, and extend upward from the base and are vertically arranged on the front and rear sides of each row. The third and fourth soldering legs 2204, 2214 are provided. Similarly, the third and fourth soldering legs 2204, 2214 are vertical soldering legs and the ends are gathered to form solder joints 2205, 2215. When the second conductive terminal 22 is soldered to the circuit board 300, the third and fourth soldering legs 2204, 2214 are perpendicular to the circuit board 3 such that the solder joints 2205, 2215 interfere with the lower surface 302 of the circuit board 300 during soldering. And the solder paste can be attached around the solder joint. That is, the second conductive terminal 22 is soldered to the circuit board 300 by surface soldering, that is, the first and second soldering legs 22, 4, and 2214 are surface soldering type soldering legs. Please refer to the fifth figure, the upper seat! The soldering foot 12〇4, the surface of the crucible is soldered to the upper surface 3 of the circuit board (U, the soldering area is close to the opening form number Α0101, page 7/19 pages [0012] M383830; the soldering feet of the lower layer body 2 2204 and 2214 are surface-welded to the lower surface 3〇2 of the circuit board 300, and the soldering area is also close to the opening and directly under the soldering area of the upper surface 301, that is, the terminal soldering-foot spacing circuit board 300 of the upper and lower body is vertically disposed opposite to each other. When the soldering legs 2204, 2214 of the lower base 2 are soldered to the circuit board 300, only the area of the lower surface 302 is occupied without occupying the area of the upper surface 3〇1, so that the upper and lower seats are vertically stacked to reduce the electrical connection. The size of the device 100 in the horizontal direction of the circuit board 300. Further, the lower layer body 2 is partially located below the lower surface 302 and partially within the opening 303 such that only a small portion is located above the upper surface 3〇1 to lower the lower layer The body 2 protrudes from the height of the upper surface 301, thereby reducing the size of the electrical connector 100 in the vertical direction of the circuit board 300. Thereby, the overall size of the electrical connector 100 is reduced, thereby improving the overall electrical connection of the electrical connector. [0013] In addition, the memory module 200 is inserted into the first and second slots 15, 25 of the upper base body i and the lower base body 2 from the bottom to the top, and Contacting the first and second conductive terminals 12, 22 in the two slots, the contact arms 1202, 2202 of the upper row of terminals are closer to the first, than the contact arms 12, 2, 2212 of the lower row of terminals, respectively The insertion port side of the second slot 15, 25 is matched with the oblique insertion manner of the memory module 200. [0014] The present invention is mainly provided by stacking the upper base body and the lower base body, and the lower seat system is sunken. The surface of the surface-welded soldering foot is soldered to the lower surface of the circuit board, and the surface of the upper soldering surface of the upper soldering body is soldered to the upper upper surface of the lower surface of the soldering area, so that the soldering feet of the upper and lower housings The storage channel for accommodating the circuit board is disposed between the upper and lower sides, thereby accommodating the circuit board in the storage channel, and the space of the circuit board No. A0101, page 8 / 19 pages is fully utilized, and Also reduces the overall size of the electrical connector Further, the soldering leg of the conductive terminal may have a hole opening perpendicular to the base direction, so that the solder paste climbs on the soldering foot and enters the hole during soldering, thereby enhancing the soldering effect. Special description is required, as defined by the present invention. The surface soldering type soldering foot guides the soldering leg of the electrical terminal when soldered to the circuit board, the soldering leg contacts the surface of the circuit board, and the soldering leg is fixed on the circuit board by solder, and no groove or hole is provided on the circuit board. The soldering feet described in the embodiments are vertical soldering legs perpendicular to the circuit board. In addition, the upper and lower housings may be soldered by other surface welding methods as described above, for example, using horizontal soldering feet and horizontal soldering feet. A solder ball can be adhered to it, thereby achieving the purpose of improving the space utilization of the circuit board. [0015] In summary, the creation complies with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application. [0016] The first figure is a three-dimensional combination diagram of the memory connector connected to the memory module to the circuit board; [0017] The second figure is a three-dimensional combination of the original electrical connector mounted on the circuit board Figure 3 is a partially exploded perspective view of the electrical connector shown in Figure 2; [0019] The fourth figure is a perspective view of the conductive terminal of the present electrical connector; Form No. A0101 Page 9 of 19 M383830 [0020] The fifth figure is a top view of the second figure along the V-V line. [Main component symbol description] [0021] Electrical connector: 100 [0022] Memory module: 200 [0023] Circuit board: 300 [0024] Upper surface: 301 [0025] Lower surface: 302 [0026] Upper layer body: 1 [0027] First body: 11 [0028] First conductive terminal: 12 [0029] Fixed arm: 13 [0030] Bump: 131 [0031] Fixed groove: 132 [0032] Fixing member: 14 [0033] One slot: 15 [0034] Positioning tab: 16 [0035] Lower base: 2 [0036] Second body: 21 [0037] Second conductive terminal: 22 [0038] Fixed arm: 23 Form number A0101 Page 10 [1945] [0045] [0045] [0045] [0045]
[0046] [0047] [0048] [0049] [0050] [0051][0049] [0050] [0050]
[0052] [0053] [0054] [0055] [0056] [0057] 凸塊：231 固定槽：232 固定件：24 第二插槽：25 定位片：26 上排端子：120、220 基部：1201、2201 接觸臂：1202、2202 固持部：1203、2203 焊接點：1205、2205 下排端子：121、221 基部：1211、2211 接觸臂：1212、2212 固持部：1213、2213 焊接點：1215、2215 第一焊接腳·· 1204 第二焊接腳：1214 第三焊接腳：2204 第四焊接腳：2214 表單編號A0101 第11頁/共19頁[0055] [0057] [0057] Bump: 231 Fixed slot: 232 Fixing member: 24 Second slot: 25 Positioning piece: 26 Upper row of terminals: 120, 220 Base: 1201 , 2201 Contact arm: 1202, 2202 Holding part: 1203, 2203 Soldering point: 1205, 2205 Lower row of terminals: 121, 221 Base: 1211, 2211 Contact arm: 1212, 2212 Holding part: 1213, 2213 Soldering point: 1215, 2215 First soldering foot ·· 1204 Second soldering foot: 1214 Third soldering foot: 2204 Fourth soldering foot: 2214 Form No. A0101 Page 11 of 19