M382577 五、新型說明： 【新型所屬之技術領域】 且有種點測裝置，特別是有關於-種 具有非接觸式感測早元之點測裝置。 【先前技術】 目前’為了瞭解半導體裝置之良率，—般使 裝置來測試半導體裝置”列如在晶 極體 ，’在出廠時彡細賴，❹謝波長 ί =體色:^壓、反向擊穿電咖鍵二 測裝置即被絲職發光二極體的 t’閱第1圖’圖中顯示一種習知的點測裝置10， ^粒雷^仏針12將電流注人受測晶圓上的發光二極體 :考，讀觀察其發光特性。點測裝置ig還包括感 :中針12與晶圓2〇之間是否接觸。在感 163° I此早元161可相對於支點162上下擺動，桿 抿荽捭：端設有接點164，針壓調整裝置的彈性物165 荖梦16卜對其施加向下的壓力。探針12藉探針固 一广14固定在擺臂161上。探針固著裝置14通常是 二^主具，穩固地夾持著探針12。當探針12與晶圓20 針12罪近探針12會被晶圓2〇頂起，一旦晶圓20對探 164 作用力超過針壓’擺臂161將向上翹起造成接點 開於是點測裝置10將電流注入發光二極體晶 3 設定非常重要，如果針壓過大，探針12可能 體晶粒的表面，而且探針12也容易磨 的表面接網如果針壓太小，則探針12與發光二極體晶粒 二的:，不針屢調整裝置尚包括螺桿連接彈性物 、 曰其上下移動來調整彈性物165對擺臂161 二物165還有穩定擺臂⑹的作用在點測 ,===探針12的晃動，使其在定位後可以 决逮且精準地下壓在發光二極體晶粒上。 由於接點164於測續由τ价，， B 3； ^ j八中不斷的接觸斷開，每一次接 :=ί=Γ觸時往往會有細小的火花， 形成積碳， 維護MU 接觸效果，於點測裝置的 也、保養中疋常見且難以處理的問題。 【新型内容】 有鑑於目前點㈣置，在使用上有待改進 地所以就從事該相關產品之多年 點測裝置存在的相關問題，深田：：1且針對目别 式後’終於創造出本案之一種點 解決點测裝置使用時容易積碳H 、 根據本創作之一目的， -座體、-彈片、一？ ？ 種點測裝置’其包含 式减測單元i成擺動早疋、—調整單元及一非接觸 :成幻早70。其座體與部分彈 連接於擺動單元上，且押π *彈片之另一部份 且擺動早70以彈片為支點，依據槓 M382577 才干原理作擺動，擺動單元以此支點一端延伸設置一感測 面，並於擺動單元另一端延伸設置一探針固定裝置，且 於探針固定裝置與支點之間設置一凹槽，調整單元係嵌 设於擺動單元所設之凹槽内，並與座體下方連接並支撐 擺動單元，非接觸式感測單元位於座體上相對於擺動單 元之感測面位置，並隨著擺動單元之擺動產生偵測訊號。 其中，座體尚包括一探針壓力調整裝置，此探針壓 力調整裝置包括一塊體、一第一可調式元件及一彈性 • 體，塊體連接於座體上，第一可調式元件穿設於塊體上， 彈性體串接於第一可調式元件上並抵接於擺動元件，且 彈性體可為彈簧。 其中’彈片以一可彎曲之彈性金屬片為材質。 其中，擺動單元上之探針固定裝置係包括一探針及 一鎖壓板，此探針係為彎曲式或直立式，且擺動單元包 括一可調式元件，其可調式元件穿設於擺動單元上並抵 接於調整單元。 一 _ 其中，非接觸式感測單元係為接近感測面之一光遮 斷模組或一近接開關。 其中，座體可與機具連接，由機具之移動調整位置。 承上所述，因依本創作之點測裝置，其可具有一或 多個下述優點： 八 ^ (1)此點測裝置構造簡單且易於實作，藉此可提高 應用性及生產便利性。 μ 5 M382577 (2)此點測襞置具有非接觸式感測裝置，藉此可解 決於接觸面容易產生積碳之問題。 【實施方式】 以下將參照相關圖式，說明依本創作之點測裝置之 實施例，為使便於理解，下述實施例中之相同元件係以 相同之符號標示來說明。 請參閱第2圖，其係為本創作之點測裝置之側面架 構圖。圖中，點測裝置2包含一座體2〇、一彈片21、」 擺動單元22、一調整單元23及一非接觸式感測單元24, 座體20與部分彈片21以第一連接元件22〇鎖合連接， 另一部份彈片21與擺動單元22以第二連接元件221鎖 合連接，且彈片21為一具有彈性之金屬片，擺動單元 22以連接於彈片之位置一端延伸設置一感測面，另 ϋ㈣設置-探針㈣裝置，探針固^裝置係為一探 ^+及—鎖壓板222，於此實施例中，此探針為彎曲 上直式探針’ ^探針221藉由擺動單 兀U上之鎖壓板222通電’如圖所示， 擺動單元22以依I積才干原理’ 早το 22以彈片21為支點作擺動，擺 片2!與探針固定裝置之間設置 = =動單元22所設之凹槽，為支撐之 ί 連接於座體2。下方，非接觸感測單二 以光學方大二f:或一近接開關，利用感測面220, 傳遞出偵測訊號。 擺動出現位移，而 M382577 〜Γ卜’座體20上更設置一塊體200，_加上穿 式元件201，第一可調式元件201係為- =體Jo *旋轉方式’調整第一可調式元⑽ 於^·之位置’第一可調式元件2〇1下方串接一彈 ，體2G2，彈性體2()2 i方抵住第—可調式元件細，產 體;壓Γ並藉由第一可調式元件201調整彈性 體202產生之壓力。M382577 V. New description: [New technical field] There is a kind of measuring device, especially related to the kind of measuring device with non-contact sensing early element. [Prior Art] At present, in order to understand the yield of a semiconductor device, the device is generally tested in a semiconductor device, such as in a crystal body, and it is fine at the time of shipment. Thanks to the wavelength ί = body color: ^ pressure, anti A conventional spot measuring device 10 is shown in the figure of the first step of the breakdown of the electric coffee and the second measuring device, which is the wire-emitting diode. The light-emitting diode on the wafer: test, read and observe its light-emitting characteristics. The spot-measuring device ig also includes a sense: whether the middle needle 12 and the wafer 2 are in contact with each other. In the sense of 163 ° I, the early element 161 can be relative to The fulcrum 162 swings up and down, and the rod 抿荽捭: the end is provided with a joint 164, and the elastic 165 of the acupressure adjusting device exerts downward pressure on the armor 16b. The probe 12 is fixed on the pendulum by the probe On the arm 161. The probe fixing device 14 is usually a master, and the probe 12 is firmly held. When the probe 12 and the wafer 20 are close to the needle 12, the probe 12 is lifted by the wafer 2, Once the force of the wafer 20 on the probe 164 exceeds the pin pressure, the swing arm 161 will be tilted upward to cause the contact to be opened. The spotting device 10 injects current into the LED body 3 It is very important that if the needle pressure is too large, the probe 12 may be the surface of the body grain, and the surface of the probe 12 is also easy to be ground. If the needle pressure is too small, the probe 12 and the light-emitting diode die are two: The needle-free adjustment device further includes a screw connecting elastic body, and the upper and lower movements thereof adjust the elasticity of the elastic member 165 to the swing arm 161, the second object 165, and the stable swing arm (6), in the spot measurement, === the shaking of the probe 12, After positioning, it can be arrested and accurately pressed on the LED die. Since the contact 164 is continuously measured by the τ price, B 3; ^ j 八 continuous contact disconnection, each time: =ί=When you touch, there will always be small sparks, carbon deposits, maintenance of MU contact effects, and common and difficult to handle problems in the point-and-measure device. [New content] In view of the current point (four), In terms of use, there is a need to improve the related problems of the multi-year point-measuring device for the related products. Shentian::1 and after the target-type, finally created a point-solving device for the case that is easy to deposit carbon when used. According to one of the purposes of this creation, the seat - shrapnel, a ?? kind of spotting device's inclusive swaying unit i into a swing early, - adjustment unit and a non-contact: into a magic early 70. Its seat and part of the bullet are connected to the swing unit, and π * another part of the shrapnel and swinging 70 times with the shrapnel as the fulcrum, according to the principle of the lever M382577, the swinging unit extends a sensing surface at one end of the pivot point, and a probe is fixed at the other end of the swinging unit. a device, and a groove is arranged between the probe fixing device and the fulcrum, the adjusting unit is embedded in the groove provided by the swinging unit, and is connected with the bottom of the seat body and supports the swinging unit, and the non-contact sensing unit is located The position of the sensing surface of the base relative to the swinging unit, and the detecting signal is generated as the swinging unit swings. Wherein, the base body further comprises a probe pressure adjusting device, wherein the probe pressure adjusting device comprises a body, a first adjustable component and an elastic body, the block body is connected to the seat body, and the first adjustable component is disposed On the block, the elastic body is connected in series with the first adjustable element and abuts against the swinging element, and the elastic body can be a spring. Among them, the shrapnel is made of a flexible elastic metal sheet. The probe fixing device on the swing unit includes a probe and a lock plate, the probe is curved or upright, and the swing unit includes an adjustable component, and the adjustable component is disposed on the swing unit. And it is connected to the adjustment unit. One of the non-contact sensing units is a light blocking module or a proximity switch that is close to the sensing surface. Wherein, the seat body can be connected with the implement, and the position of the implement is adjusted by the movement of the implement. As described above, the spot measuring device according to the present invention can have one or more of the following advantages: 八 (1) The measuring device is simple in structure and easy to implement, thereby improving application and production convenience. Sex. μ 5 M382577 (2) This point measuring device has a non-contact sensing device, which solves the problem that the contact surface is prone to carbon deposition. [Embodiment] Hereinafter, embodiments of the pointing device according to the present invention will be described with reference to the related drawings. For the sake of understanding, the same components in the following embodiments are denoted by the same reference numerals. Please refer to Figure 2, which is the side frame of the point measuring device of this creation. In the figure, the spotting device 2 comprises a body 2〇, a spring piece 21, a swinging unit 22, an adjusting unit 23 and a non-contact sensing unit 24, and the seat body 20 and a part of the elastic piece 21 are connected by the first connecting element 22 The other part of the elastic piece 21 is connected to the swinging unit 22 by the second connecting element 221, and the elastic piece 21 is an elastic metal piece. The swinging unit 22 is extended at one end connected to the elastic piece to provide a sensing. The other side (4) is provided with a probe (four) device, and the probe fixing device is a probe + and a lock plate 222. In this embodiment, the probe is a curved upper probe '^ probe 221 The power is applied to the lock plate 222 on the swing unit U. As shown in the figure, the swing unit 22 swings with the spring 21 as the fulcrum according to the I-product principle, and the swing piece 2! is disposed between the probe holder and the probe fixing device. = = The groove provided by the moving unit 22 is connected to the base 2 as a support. Below, the non-contact sensing unit 2 transmits the detection signal by using the sensing surface 220 with the optical side large f: or a proximity switch. The oscillating displacement occurs, and the M382577 Γ ' 'body 20 is further provided with a body 200, _ plus the wearing element 201, the first adjustable element 201 is - = body Jo * rotation mode 'adjust the first adjustable element (10) At the position of ^· 'the first adjustable element 2〇1 is connected in series with a bomb, the body 2G2, the elastic body 2 () 2 i side against the first adjustable element thin, the body; A tunable element 201 adjusts the pressure generated by the elastomer 202.
再者’擺動單元22上設置第二可調式元件22〇，抵 接=調整單元23，藉由第二可調式元件22〇 ’可調整擺 動單7G初始之位置以配合不同物件及環境。 清參閱第3圖，其係為本創作之點測裝置之實施例 -之示意圖。中’點測裝置2配置於一機具3上，機 具3之鎖合元件30係為固定點測裝置2之用途，藉由此 機具3之調整，點測裝置2可作χ方向、γ方向及z方 向之位移。當機具30欲使點測裝置2作χ方向之位移 時，於圖中為左右方向，於調整位於機具3之第一旋鈕 31，當機具30欲使點測裝置2作γ方向之位移時，於 圖中為上下方向，調整位於機具3之第二旋鈕％，當機 具30欲使點測裝置2作2方向之位移時，即為靠近與遠 離，調整位於機具3之第一旋鈕33。 请參閱第4圖，其係為本創作之點測裝置之實施例 二之示意圖。圖中，點測裝置2配置於一機具3上，機 具3控制點測裝置2接觸於晶圓4〇上之一發光二極體， 當探針221下壓接觸晶圓40上之一發光二極體時，擺動 7 ，元22上之探針22】由晶圓4 力，使擺動單元22以 又幻在上之反作用 彈性體202之往下的廢六 為支點往上位移，並受到 實接觸晶圓40上之發光二針由有;^以禮 移，所以非接觸式减測單 ；擺動早兀22之位 功已接_4。1之:光二探針 連接之電流供應器4 /體此時，由㈣板222 光2 :?使用者便可依照主波長、發光強度、 儿 /皿、工作電壓、反向擊 發:二極趙分級，由於其是否確實接二將 斷:則由非接觸感測器24之光遮斷模組二 之電極接觸’因此不會產生接觸通電時發生之 積碳問題。 电了士生之 以上所述僅為舉例性，而非為限制性者。任何未脫 離本創作之精神與範脅，而對其進行之等效修改或變 更，均應包含於後附之申請專利範圍中。 【圖式簡單說明】 第1圖係為習知點測裝置架構圖； 第2圖係為本創作之點測裝置之侧面架構圖； 第3圖係為本創作之點測裝置之實施例—側面架構 圖；以及 第4圖係為本創作之點測裝置之實施例二側面架構圖。 M382577 【主要元件符號說明】 10 :點測裝置； 12 :探針； 14 :探針固著裝置； 161 :擺動單元； 162 :支點； 163 :桿； 164 :接點； 165 :彈性物； 2 :點測裝置； 20 :座體； 200 :塊體； 201 :第一可調式元件； 202 :彈性體 21 :彈片； 210 :第一連接元件； 211 :第二連接元件； 22 :擺動單元； 220 :感測面； 221 :探針； 222 :鎖壓板； M382577 23 :調整單元； 24 :非接觸式感測單元 3 :機具； 30 :鎖合元件； 31 :第一旋扭 32 :第二旋扭； 33 :第三旋扭； 40 :晶圓；以及 41 :電流供應器。Further, the second adjustable element 22 is disposed on the swing unit 22, and the abutment=adjustment unit 23 can adjust the initial position of the swing unit 7G to match different objects and environments by the second adjustable element 22〇'. See Fig. 3, which is a schematic diagram of an embodiment of the point measuring device of the present invention. The 'dot measuring device 2 is disposed on a implement 3, and the locking component 30 of the implement 3 is used for the fixed point measuring device 2. By the adjustment of the implement 3, the pointing device 2 can be used as the χ direction, the γ direction, and Displacement in the z direction. When the implement 30 wants to shift the pointing device 2 in the x direction, in the left and right direction in the figure, the first knob 31 located in the implement 3 is adjusted, and when the implement 30 is to make the pointing device 2 shift in the gamma direction, In the figure, the up and down direction is adjusted, and the second knob % located in the implement 3 is adjusted. When the implement 30 is to make the pointing device 2 shift in two directions, it is close to and away from the first knob 33 located on the implement 3. Please refer to FIG. 4, which is a schematic diagram of Embodiment 2 of the point measuring device of the present invention. In the figure, the spotting device 2 is disposed on a implement 3, and the implement 3 controls the spotting device 2 to contact one of the light emitting diodes on the wafer 4, and the probe 221 is pressed down to contact one of the wafers 40. In the case of the polar body, the probe 22 on the oscillating member 22 is displaced by the force of the wafer 4, and the oscillating unit 22 is displaced upward by the waste six of the reaction elastic body 202 which is oscillated upward, and is subjected to the fulcrum. The two light-emitting needles on the contact wafer 40 are provided by ^^, so that the non-contact type is reduced; the position of the swing is earlier than that of the _4. 1: the current supply of the optical two-probe connection 4 / At this time, by (4) board 222 light 2:? users can follow the main wavelength, luminous intensity, children / dish, working voltage, reverse firing: two-pole Zhao classification, because it is indeed connected to the second will be: The electrode contact of the light-blocking module 2 of the non-contact sensor 24 does not cause the carbon deposition problem that occurs when the contact is energized. The above description is for illustrative purposes only and is not a limitation. Any changes or modifications to this creation that are not removed from the spirit of this creation should be included in the scope of the appended patent application. [Simple diagram of the diagram] Figure 1 is a schematic diagram of a conventional point-measuring device; Figure 2 is a side-architecture diagram of the point-measuring device of the creation; Figure 3 is an embodiment of the point-measuring device of the creation - The side architecture diagram; and the fourth diagram is a side architecture diagram of the second embodiment of the point measurement device of the present invention. M382577 [Description of main component symbols] 10: Spot measuring device; 12: Probe; 14: Probe fixing device; 161: Swinging unit; 162: Pivot point; 163: Rod; 164: Contact; 165: Elastic; : spot measuring device; 20: seat body; 200: block; 201: first adjustable element; 202: elastic body 21: spring piece; 210: first connecting element; 211: second connecting element; 22: swinging unit; 220: sensing surface; 221: probe; 222: lock plate; M382577 23: adjustment unit; 24: non-contact sensing unit 3: implement; 30: lock component; 31: first twist 32: second Rotation; 33: third twist; 40: wafer; and 41: current supply.