TWM376909U - Frame structure for light emitting diodes - Google Patents

Frame structure for light emitting diodes Download PDF

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Publication number
TWM376909U
TWM376909U TW98217283U TW98217283U TWM376909U TW M376909 U TWM376909 U TW M376909U TW 98217283 U TW98217283 U TW 98217283U TW 98217283 U TW98217283 U TW 98217283U TW M376909 U TWM376909 U TW M376909U
Authority
TW
Taiwan
Prior art keywords
stand
chip
plastic
light emitting
emitting diodes
Prior art date
Application number
TW98217283U
Other languages
Chinese (zh)
Inventor
Chen-Feng Chu
Yuan-Fu Chen
Original Assignee
Fu Sheng Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50594181&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWM376909(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fu Sheng Ind Co Ltd filed Critical Fu Sheng Ind Co Ltd
Priority to TW98217283U priority Critical patent/TWM376909U/en
Publication of TWM376909U publication Critical patent/TWM376909U/en

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Abstract

A frame structure for the light emitting diodes includes a plastic stand, a plurality of metal leads and a chip-bearing stand. The plastic stand has a hollow function area. Metal leads extend from the hollow function of the plastic stand to extend to the outside of the plastic stand. The chip-bearing stand is arranged within the hollow function area and has a concave cup structure. The bottom of the chip-bearing stand is exposed to the bottom of the plastic stand. Comparing with those metal leads, the chip bearing stand is down set within the plastic stand so as the horizontal position of the cup edge of the chip-bearing stand is lower than the horizontal position of those metal leads extending to the outside of the plastic stand.

Description

M376909 103年9月19日更正替換頁 6. (刪除)如請求項4所述之發光二極體支架結構，其中該些金屬接腳於該膠座 内與該中空功能區處係呈階梯狀。 7. 如請求項4所述之發光二極體支架結構，其中該凹杯狀晶片承座係與該些金 屬接腳之其一連接。 098217283 _ 1033325648-0</ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; . 7. The light-emitting diode support structure of claim 4, wherein the concave cup-shaped wafer holder is coupled to one of the metal pins. 098217283 _ 1033325648-0

TW98217283U 2009-09-28 2009-09-28 Frame structure for light emitting diodes TWM376909U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98217283U TWM376909U (en) 2009-09-28 2009-09-28 Frame structure for light emitting diodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98217283U TWM376909U (en) 2009-09-28 2009-09-28 Frame structure for light emitting diodes

Publications (1)

Publication Number Publication Date
TWM376909U true TWM376909U (en) 2010-03-21

Family

ID=50594181

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98217283U TWM376909U (en) 2009-09-28 2009-09-28 Frame structure for light emitting diodes

Country Status (1)

Country Link
TW (1) TWM376909U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103794698A (en) * 2012-10-31 2014-05-14 展晶科技(深圳)有限公司 Light-emitting diode
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
CN103794698A (en) * 2012-10-31 2014-05-14 展晶科技(深圳)有限公司 Light-emitting diode
TWI479701B (en) * 2012-10-31 2015-04-01 榮創能源科技股份有限公司 Light-emitting diode

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