TWM368224U - Thin-type laser wire bonding module - Google Patents

Thin-type laser wire bonding module Download PDF

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Publication number
TWM368224U
TWM368224U TW098210212U TW98210212U TWM368224U TW M368224 U TWM368224 U TW M368224U TW 098210212 U TW098210212 U TW 098210212U TW 98210212 U TW98210212 U TW 98210212U TW M368224 U TWM368224 U TW M368224U
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TW
Taiwan
Prior art keywords
groove
lens
module
laser
thin
Prior art date
Application number
TW098210212U
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Chinese (zh)
Inventor
jing-hui Lin
Ming-Hui Fang
Original Assignee
Arima Lasers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arima Lasers Corp filed Critical Arima Lasers Corp
Priority to TW098210212U priority Critical patent/TWM368224U/en
Publication of TWM368224U publication Critical patent/TWM368224U/en

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    • Y02E60/521

Description

M368224 五、新型說明: 【新型所屬之技術領域】 本創作係有關一種雷射打線模組,尤指一種薄型之雷射 打線模組。 【先前技術】 按,從事測量、鑽孔或切割之工作者,常使用切割機或 鑽孔機以作為輔助工具,其中切割機會於標的物上標直線, 以作為切割時之基準線,而鑽孔機則係用以於標的物上,標 記十字線或中心點,以便作為鑽孔時之基準點。 然而,上述作法皆造成標的物之表面有所損害,因此, 近來此類工作者常以雷射打線模組取代,一方面雷射打線模 組較為輕盈短小,攜帶方便,另一方面,雷射打線模組毋須 標記於標的物表面,故對標的物表面並不造成任何損害,因 此有漸而取代切割機及鑽孔機之跡象。 然而,傳統之雷射打線模組,基於其本身結構設計使然, 並無法達到使雷射打線模組輕薄化及短小化之效果,如此則 佔據使用者之攜帶空間,且因打線模組内之元件,如雷射模 組等,於實際使用時會產生熱能,則傳統做法之將該些元件 積聚成體,不僅無助於散熱,相對地亦將降低該雷射模組之 輸出功率。 【新型内容】 因此,本創作之主要目的,在於提供一種輕薄化與短小 化之薄型雷射打線模組,藉由本模組之扁平化設計,改善散 熱功能,提升輸出功率。 M368224 本創作之又一目的,*如 在提供一種可替終端商品爭取設計 二間之一種薄型雷射打線模組。 作之再目的’在提供—種可有效提昇產品競爭力 之薄型雷射打線模組。 人.j達上述功效,本創作提供_種薄型雷射打線模組,包 3 ·本體,呈扁平狀,於該本體内形成有-中空管道及一 凹槽』,其中該中空管道之—第一截面係位為該本體之一側 面°亥中空官道之一第二截面,則係位為該本體之中段部, 二截面形成於該凹槽之槽底中段部;-雷射光組, =第—截面裝置於該中空管道中,該雷射光組之出光端, ^向該凹槽方向;—聚焦鏡片,内設於該凹槽中,且該聚 “、、見片係以-接收端朝向該雷射光組之出光端方向設置;以 ^一波浪鏡片,内設於該凹槽中,藉由該凹槽之兩側槽壁設 2 —溝槽’使該波浪鏡片卡嵌於該溝槽上,而該波浪鏡片 之出光端係以平行於該本體之該侧面之方式設置。 本到作之薄型雷射打線模組,其中,該雷射模組、該聚 =⑻與該波浪鏡片係呈線狀排列,且該聚焦鏡片係設於該 二射极組與該波浪鏡片之間,而該聚焦鏡片與該波浪鏡片之 X積’可等於或小於該凹槽所形成之容置空間,意即,該該 聚焦鏡片與該波浪鏡片係以完全内設之方式容置於該凹槽所 形成之空間之中。 為讓本創作之上述和其他目的、特徵、和優點能更明顯 ’董,下文特舉-較佳實施例,並配合所附圖式,作詳細說 明如下: M368224 【實施方式】 請同時參照第-圖及第二圖所示,其中該第—圖係緣示 本創作之-種薄型雷射打線模组(1〇〇)之示意圖;第二㈣、 繪不本創作之-種薄型雷射打線模組(1〇〇)之分解圖,其令 該薄型雷射打線模組(100)包括一本體(1〇),呈扁平狀, 於該本體(ίο)内形成有一中空管道(11)及_凹槽(⑴, 其中該中空管道⑴)之—第―截面(⑴)係位為該本體(10) 之:侧面(101),該中空管道(10)之一第二截面(1⑴, 則係位為該本體(10)之中段部,且該第二截面(112)形成 於該凹槽(12)之槽底(⑵)中段部;―雷射光組(2〇), 由該第-截面(111)裝置於該中空管道(11)中,且該雷射 光組(20)之出光端(201),係朝向該凹槽(12)方向;一 聚焦鏡片(30),内設於該凹槽(12)中’且該聚焦鏡片(3〇) 係以一接收端(301)朝向該雷射光組(20)之出光端(201) 方向〇又置,以及一波浪鏡片(4〇),内設於該凹槽(a)中, 藉由該凹槽(12)之兩側槽壁設有之一溝槽(122),使該波 浪鏡片(40)卡嵌於該溝槽(122)上,而該波浪鏡片之出光 端(401)係以平行於該本體(1〇)之該側面(丨〇1)之方式 設置。 本創作之薄型雷射打線模組(100),其中,該雷射模組 (20)、該聚焦鏡片(30)與該波浪鏡片(40)係呈線狀排列, 且該聚焦鏡片(30)係設於該雷射模組(20)與該波浪鏡片 (40)之間’而該聚焦鏡片(3〇)與該波浪鏡片(4〇)之體 積’可等於或小於該凹槽所形成之容置空間,意即, 該5亥聚焦鏡片(30)與該波浪鏡片(40)係以完全内設之方 M368224 式容置於該凹槽(12)所形成之空間之中。 請同時參照第三圖,其係繪示本創作之薄型雷射打線模組 (100)之縱剖圖,本創作藉由將該薄型雷射打線模組(100) 之扁平化設計,不僅改善散熱功能,提升輸出功率,誠可提供 一種極具市場競爭力之輕薄化與短小化之薄型雷射打線模組。 本創作之該薄型雷射打線模組(100),並可提供一種替 終端商品爭取設計空間之一種薄型雷射打線模組,而達有效 提昇產品競爭力之目標。 綜上所述,本創作所揭示之構造,為昔所無,且確能達 到功效之增進,並具可供產業利用性,完全符合新型專利要 件,祈請貴審查委員核賜專利,以勵創新,無任德感。 惟,上述所揭露之圖式、說明,僅為本創作之較佳實施 例,大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或 等效變化,仍應包括在本案申請專利範圍内。 M368224 【圖式簡單說明】 第一圖係繪示本創作之一種薄型雷射打線模組(1〇〇)之 示意圖。 第二圖係繪示本創作之一種薄型雷射打線模組(100)之 分解圖。 第三圖係繪示本創作之一種薄型雷射打線模組(100)之 -縱剖圖。 【主要元件符號說明】 (100) 薄型雷射打線模組 (10) 本體 (101) 側面 (11) 中空管道 (111) 第一截面 (112) 第二截面 (12) 凹槽 (121)槽底 (122)溝槽 (20)雷射光組 (201)出光端 (30)聚焦鏡片 (301 )接收端 (40)波浪鏡片 (401)出光端M368224 V. New Description: [New Technology Field] This creation is about a laser wire-laying module, especially a thin laser wire-laying module. [Prior Art] Press, the worker engaged in measurement, drilling or cutting, often uses a cutter or a drill as an auxiliary tool, in which the cutting opportunity marks the line on the target as the reference line for cutting, while drilling The hole machine is used on the object to mark the cross line or the center point as a reference point for drilling. However, all of the above methods cause damage to the surface of the target object. Therefore, such workers are often replaced by laser wire-laying modules. On the one hand, the laser wire-laying module is lighter, shorter, and more portable. On the other hand, the laser is on the other hand. The wire-bonding module does not need to be marked on the surface of the target object, so it does not cause any damage to the surface of the target object, so there are signs of gradually replacing the cutting machine and the drilling machine. However, the traditional laser wire-laying module is designed based on its own structure, and can not achieve the effect of making the laser wire-wiring module light and thin and short, so that it occupies the user's carrying space, and because of the wire-laying module Components, such as laser modules, generate heat during actual use. Traditionally, these components accumulate into a body, which not only does not help to dissipate heat, but also reduces the output power of the laser module. [New content] Therefore, the main purpose of this creation is to provide a thin laser light-harvesting module that is lighter and thinner. With the flat design of the module, the heat dissipation function is improved and the output power is improved. M368224 Another purpose of this creation, * is to provide a thin laser line module for designing two alternatives for terminal products. The purpose of this is to provide a thin laser wire-laying module that can effectively enhance the competitiveness of products. The man.j achieves the above-mentioned effects. The creation provides a thin laser striking module, and the package body has a flat shape, and a hollow pipe and a groove are formed in the body, wherein the hollow pipe is the first A section of the section is a second section of one of the sides of the body, and the system is the middle section of the body, and the second section is formed at the middle section of the groove of the groove; - the laser beam group, = a first-section device is disposed in the hollow pipe, the light-emitting end of the laser beam group is in the direction of the groove; a focusing lens is disposed in the groove, and the poly-, "seeing film-to-receiver end Provided toward the light-emitting end of the laser beam; a wave lens is disposed in the groove, and the wave lens is embedded in the groove by the groove 2 on both sides of the groove a light-emitting end of the wave lens is disposed parallel to the side of the body. The thin laser wire-laying module of the present invention, wherein the laser module, the poly=(8) and the wave lens Arranging in a line, and the focusing lens is disposed between the two emitter groups and the wave lens The X product ' of the focusing lens and the wave lens may be equal to or smaller than the accommodating space formed by the groove, that is, the focusing lens and the wave lens are completely embedded in the concave lens. The above and other objects, features, and advantages of the present invention will become more apparent. The following is a detailed description of the preferred embodiment and the accompanying drawings, as follows: M368224 [Embodiment] Please refer to the same figure and the second figure at the same time, in which the first figure shows the schematic diagram of the thin laser striking module (1〇〇) of the creation; the second (four), the painting is not An exploded view of the thin laser striking module (1〇〇) of the present invention, the thin laser striking module (100) comprising a body (1〇) in a flat shape on the body (ίο) Forming a hollow pipe (11) and a groove ((1), wherein the hollow pipe (1)) - the first section ((1)) is the body (10): the side (101), the hollow pipe (10) One of the second sections (1(1), the system is the middle portion of the body (10), and the second section 112) formed in a middle portion of the groove bottom ((2)) of the groove (12); a laser light group (2〇), the first cross-section (111) is disposed in the hollow pipe (11), and the laser light The light-emitting end (201) of the group (20) is oriented toward the groove (12); a focusing lens (30) is disposed in the groove (12) and the focusing lens (3) is a The receiving end (301) is disposed opposite to the light emitting end (201) of the laser beam group (20), and a wave lens (4〇) is disposed in the groove (a) through the groove ( 12) The groove walls (122) are disposed on the groove walls of the two sides, so that the wave lens (40) is embedded in the groove (122), and the light exit end (401) of the wave lens is parallel to the This side (丨〇1) is provided on the side of the body (1〇). The thin laser striking module (100) of the present invention, wherein the laser module (20), the focusing lens (30) and the wave lens (40) are arranged in a line, and the focusing lens (30) Is disposed between the laser module (20) and the wave lens (40) and the volume of the focusing lens (3〇) and the wave lens (4〇) can be equal to or smaller than the groove The accommodating space means that the 5 Hz focusing lens (30) and the undulating lens (40) are accommodated in the space formed by the groove (12) by a completely built-in square M368224. Please also refer to the third figure, which is a longitudinal sectional view of the thin laser wire bonding module (100) of the present invention. The creation is not only improved by the flat design of the thin laser wire bonding module (100). The heat dissipation function and the output power increase can provide a thin laser lightning module with light weight and shortness in the market. The thin laser wire-laying module (100) of the present invention can provide a thin laser wire-laying module for designing space for the terminal product, and achieve the goal of effectively improving the competitiveness of the product. In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization. It fully complies with the new patent requirements, and invites your review committee to grant patents. Innovation, no sense of morality. However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Modifications or equivalent changes made by those skilled in the art in accordance with the spirit of the case should still be included in the scope of the patent application. M368224 [Simple description of the drawing] The first figure shows a schematic diagram of a thin laser wire bonding module (1〇〇). The second figure shows an exploded view of a thin laser wire bonding module (100) of the present invention. The third figure shows a longitudinal section of a thin laser wire bonding module (100) of the present invention. [Main component symbol description] (100) Thin laser wire bonding module (10) Body (101) Side (11) Hollow pipe (111) First section (112) Second section (12) Groove (121) groove bottom (122) Trench (20) Laser light group (201) Light exit end (30) Focusing lens (301) Receiving end (40) Wave lens (401) Light exit end

Claims (1)

M368224 六、申請專利範圍: 1 . 一種薄型雷射打線模組,包括 一本體’呈扁平狀,於該本體内形成有—中空管道及— 凹槽,其中該中空管道之—第一截面係位為該本體之一側 面^該中空管道之—第二截面,則係位為該本體之中段部, 且該第二截面形成於該凹槽之槽底中段部; 雷射光組,由該第一截面裝置於該中空管道中,該雷 射光組之出光端,係朝向該凹槽方向; 一聚焦鏡片,内設於該凹槽中;以及 =浪鏡片’⑽於該凹射’其中該聚焦鏡片係設於 "Mb 良鏡片之間,且該波浪鏡片之出光面以平 仃於該本體之該側面之方式設置。 今兩_如u利*圍第1項之薄型雷射打線模組,其中, h㈣組、該聚焦鏡片與該波浪鏡片係呈線狀排列。 如/請專利範圍第1項之薄型雷射打線模組,其中, 二該波浪鏡片之體積,可等於或小於該 該凹槽之兩側槽圍之㈣雷射打線模組,其令, 該波浪鏡如曹4上項之薄型雷射打線模組,其中,M368224 VI. Patent application scope: 1. A thin laser wire-bonding module, comprising a body having a flat shape, forming a hollow pipe and a groove in the body, wherein the hollow pipe has a first section a side of the body, a second section of the hollow pipe, the system is a middle portion of the body, and the second section is formed at a middle portion of the groove bottom of the groove; the laser beam group is a cross-sectional device in the hollow duct, the light-emitting end of the laser beam group is oriented toward the groove; a focusing lens is disposed in the groove; and a wave lens '(10) is in the concave lens, wherein the focusing lens It is disposed between the "Mb good lens, and the light emitting surface of the wave lens is disposed in such a manner as to be flat on the side of the body. The present invention is a thin laser striking module of the first item, wherein the h (four) group, the focusing lens and the wavy lens are arranged in a line. For example, the thin laser striking module of the first item of the patent scope, wherein the volume of the wave lens is equal to or smaller than the (four) laser striking module of the groove on both sides of the groove, A wave mirror such as the thin laser line module of Cao 4, wherein
TW098210212U 2009-06-09 2009-06-09 Thin-type laser wire bonding module TWM368224U (en)

Priority Applications (1)

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TW098210212U TWM368224U (en) 2009-06-09 2009-06-09 Thin-type laser wire bonding module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102882121A (en) * 2011-07-14 2013-01-16 亚洲光学股份有限公司 Small-sized laser emitting module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102882121A (en) * 2011-07-14 2013-01-16 亚洲光学股份有限公司 Small-sized laser emitting module

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