M365569 五、新型說明： 【新型所屬之技術領域】 本創作涉及-種電連接器’尤其係一種將晶片模組電性連 接至電路板之平面栅格陣列電連接器。 【先前技術】 電連接器根據導電端子與晶片模組或電路板之接觸方式 可以分爲平面栅格陣列（Land Grid Array)電連接器，球狀栅格 陣列(Ban Grid Array)電連接器及針腳柵格陣列（pin㈣八叫） 電連接器。 2006年7月11日公告之美國專利第7 G74，G48號揭露了 —種與晶片模組和電路板之接觸方式分別為Land Airay(LGA)和Ball Grid Airay(BGA)型之電連接器。該電連接 器包括絕緣本體、收容於絕緣本體内之複數導電端子。導電端 子包括固持於絕緣本體之端子收容槽中之基部及自該基部向 兩端分別延伸出之彈性臂與水平焊接部，其中彈性部末端設有 用於與晶片模組之導電片接觸之接觸部，烊接部下方設有踢 球，並通過錫球將電連接器焊接至電路板之導電片。電連接器 與晶片模组導接時，借-按壓外力使得導電蠕子之彈性臂發: 彈性變形，使導電端子之接觸部彈性抵接於晶片模組之導電 片，從而達成3模组與電路板之€料接。該種電連接器 中，相鄰導電端子之接觸部之間距與對應緙接部之間距相等。 隨電氣設備不斷向小型化，高速度方 接器的導電端子間之密度亦越來越大。惟，目二 4 M365569 ' 純之技術發展不相—致，新的制程能力已經可以獲得導電片 間距更小之高密度晶片模組，若要製造與上述晶片模組具有相 等間距導電片之電路板，則費用相對較高且成品率低。上述習 知電連接器只能連接導電片間距相同之晶片模組和電路板因 此不能用於將具有小間距導電片之晶片模組連接至習知之電 路板’從而限制了小間距高密度晶片模組之發展。 、 #於此’貫有必要提供—種改進之電連接器，以克服上述 電連接器之不足。 【新型内容】 本創作所解決之技術問題係提供—種能夠電性連接導電 »間距不等之晶片模組和電路板之電連接器。 本創作所解決之技術問題係提供一種電連接器其包括絕 緣本體及收容於絕緣本體内之複數排端子組。絕緣本體設有相 對之上表面及下表面，每排端子組包括複數個導電端子。每個 導電端子包括將導電端子固定於絕緣本體内之固持部自固持 • 冑向上延伸出絕緣本體上表面之雜臂、自ϋ持部向電路板延 伸之過渡部及位於過渡部末端之水平焊接部，彈性臂末端設有 用於與晶片模組連接之接觸部。其中，位於同一排的所有導電 端子之彈性臂結構相同，且該等導電端子中至少有兩個相鄰導 電料之過渡部與登直方向所形成之夹角不等，以使該相鄰導 電端子之焊接部之間距大於該相鄰端子之接觸部之間距。 與習知技術相比，本創作之電連接器之導電端子與晶片模 組導接之接觸部之間距小於焊接部之間距，因此可以連接具有 小間距導電片之晶片模組至具有較大間距導電片之電路板以 5 M365569 適應現有高密度晶片模組之發展。 【實施方式】 參閲第—圖至第四圖所示，本創作為一種可電性連接晶片 模組3與印刷電路板4之電連接器⑽，該電連接器議包括 絕緣本體1及收容於絕緣本體1内之複數導電端子2。M365569 V. New Description: [New Technology Field] This creation involves a kind of electrical connector', especially a planar grid array electrical connector that electrically connects the chip module to the circuit board. [Prior Art] The electrical connector can be divided into a planar grid array (Land Grid Array) electrical connector, a ball grid array (Ban Grid Array) electrical connector according to the contact manner of the conductive terminal and the chip module or the circuit board. Pin grid array (pin (four) eight) electrical connector. U.S. Patent No. 7, G74, G48, issued July 11, 2006, discloses a type of electrical connector that is in contact with a die module and a circuit board, namely a Land Airay (LGA) and a Ball Grid Airay (BGA) type. The electrical connector includes an insulative housing and a plurality of conductive terminals received in the insulative housing. The conductive terminal includes a base portion held in the terminal receiving groove of the insulating body, and a resilient arm and a horizontal soldering portion extending from the base portion to the two ends, wherein the end of the elastic portion is provided with a contact portion for contacting the conductive piece of the wafer module The kicking ball is arranged under the splicing portion, and the electrical connector is soldered to the conductive sheet of the circuit board through the solder ball. When the electrical connector is connected to the wafer module, the elastic force of the conductive creeper is caused by pressing the external force: elastic deformation, so that the contact portion of the conductive terminal elastically abuts the conductive piece of the chip module, thereby achieving 3 modules and The material of the circuit board is connected. In the electrical connector, the distance between the contact portions of the adjacent conductive terminals is equal to the distance between the corresponding splicing portions. As electrical equipment continues to be miniaturized, the density between the conductive terminals of high-speed connectors is also increasing. However, the second M 4569 'M pure technology development is inconsistent, the new process capability has been able to obtain a high-density wafer module with a smaller pitch of conductive sheets, and to manufacture a circuit with conductive pads of equal spacing to the above-mentioned wafer module. The board is relatively expensive and has a low yield. The above conventional electrical connector can only connect the wafer module and the circuit board having the same pitch of the conductive sheets, and therefore cannot be used to connect the wafer module having the small-pitch conductive sheet to the conventional circuit board', thereby limiting the small-pitch high-density wafer module. The development of the group. It is necessary to provide an improved electrical connector to overcome the deficiencies of the above electrical connectors. [New Content] The technical problem solved by this creation is to provide an electrical connector capable of electrically connecting a conductive module and a chip module and a circuit board having different pitches. The technical problem solved by the present invention is to provide an electrical connector comprising an insulating body and a plurality of rows of terminal blocks housed in the insulating body. The insulative housing is provided with a relatively upper surface and a lower surface, and each row of terminal groups includes a plurality of conductive terminals. Each of the conductive terminals includes a fixing portion for fixing the conductive terminal to the insulating body, and a supporting arm extending upward from the upper surface of the insulating body, a transition portion extending from the holding portion to the circuit board, and horizontal welding at the end of the transition portion The end of the elastic arm is provided with a contact portion for connecting to the wafer module. Wherein, the elastic arms of all the conductive terminals in the same row have the same structure, and the transition portions of at least two adjacent conductive materials of the conductive terminals are not equal to the angle formed by the straightening direction, so that the adjacent conductive The distance between the soldering portions of the terminals is greater than the distance between the contact portions of the adjacent terminals. Compared with the prior art, the distance between the conductive terminals of the electrical connector of the present invention and the contact portion of the wafer module is smaller than the distance between the soldering portions, so that the wafer module having the small pitch conductive sheets can be connected to have a larger pitch. The circuit board of the conductive sheet adapts to the development of the existing high-density chip module with 5 M365569. [Embodiment] Referring to the first to fourth figures, the present invention is an electrical connector (10) electrically connecting the chip module 3 and the printed circuit board 4, the electrical connector includes an insulating body 1 and receiving A plurality of conductive terminals 2 in the insulative housing 1.
絶緣本體1呈平板狀’其設有大致呈矩形之基板η，基 板η相對兩側分別向外延伸有—凸出部12。基板u設有相 對之上表面13和下表面14，上表面13與晶片模組3之底面 31相^，下表面14與印刷電路板4之頂面“相對應。 ¥電端子2係通過故入成型（即insert-mold)之方式固定於 絕緣本體1 ‘料導電端子2排列成複數排，本實施方式中， 每排包括人個並排排列且結構之導電端子2。每個導電端 子括將導電端子2固定於絕緣本體1内之固持部21、自 固持21向上延伸出絕緣本體1之上表面13之彈性臂22、 自固持部21 ^卩刷電路板4延伸之過渡部23、位於過渡部23 7 接部24以及設於焊接部24下方之錫球25。固 持部21為平极狀，其進一步包括豎直段2U及自豎直段211 彳向外延伸之水平段212。彈性臂U包括自固持部 21之賢直^ 211 1彎折延伸而出之連接部⑵及自連接部 〇 3折延伸之彈性部222，彈性部222末端設有用於與 晶片模組3連接之光滑圓弧狀接觸部223。 閱第—圖及第三圖，每排導電端子2被稱為一端子 組（未標、號）’且每—端子組（未標號）中所包含之八個導電 左向右標記為.ΤΙ、Τ2.·.Τ8，並可將上述八個 6 M365569 . 導電端子2分為左右兩部分，左側部分包括導電端子ΤΙ-Τ4， 右側部分包括導電端子Τ5-Τ8。兩部分導電端子ΤΙ-Τ4和Τ5-Τ8 不同之處在於，導電端子Τ1-Τ4之過渡部23係自固持部21 之水平段212之末端向下延伸而成，而導電端子Τ5-Τ8之過渡 部23係自固持部21之豎直段211之末端向下延伸而成。左側 部分導電端子Τ1-Τ4中，導電端子ΤΙ、Τ2之過渡部23與豎 直方向所成之夾角依次逐漸減小，導電端子Τ3和Τ4之過渡 部23均為豎直方向，但焊接部24分別位於相應過渡部23之 # 左侧及右側；右側部分導電端子Τ5-Τ8中，導電端子Τ8、Τ7 之過渡部23與豎直方向所成之夾角亦依次逐漸減小，導電端 子Τ5和Τ6之過渡部23亦均為豎直方向，但焊接部24分別 位於相應過渡部23之左侧及右側。由以上結構可看出，位於 同一排端子組（未標號）中之八個導電端子Τ1-Τ8之過渡部 23與豎直方向之夾角係自中間向兩側逐漸增大，即大致呈扇 形散開。另，八個導電端子Τ1-Τ8之固持部21和彈性臂22 之結構則相同，從而使得導電端子Τ1-Τ8中相鄰兩導電端子2 之接觸部223之間距Ρ1小於相鄰導電端子2之焊接部24之間 距Ρ2。 本電連接器1〇〇在加工時，可通過端子料帶衝壓出複數排 端子組（未標號），然後再將端子組（未標號）通過嵌入成型 之方式植入絕緣本體1内，再將錫球25植在導電端子2之焊 接部24下方。 請參閱第四圖，本電連接器100在使用時，通過錫球25 焊接於印刷電路板4上，晶片模組3通過一外力壓設於電連接 7 M365569 器100之導電端子2之上方。此時，晶片模組3之導電片32 分別與電連接器100之導電端子2之接觸部223相壓接，印刷 電路板4之導電片42則分別與電連接器100之導電端子2之 錫球25焊接在一起，晶片模組3從而通過電連接器100電性 連接至印刷電路板4。由於本電連接器100之導電端子2之接 觸部223之間距P1小於焊接部24之間距P2，則其可以連接 導電片32間距較小之晶片模組3至導電片42間距較大之印刷 電路板4，因此可促進目前高密度晶片模組3之應用和發展。The insulative housing 1 has a flat plate shape. It is provided with a substantially rectangular substrate η, and the base plate η has outwardly extending projections 12 on opposite sides thereof. The substrate u is provided with an upper surface 13 and a lower surface 14, the upper surface 13 is opposite to the bottom surface 31 of the wafer module 3, and the lower surface 14 is corresponding to the top surface of the printed circuit board 4. In the form of insert-mold, the conductive terminals 2 are arranged in a plurality of rows. In this embodiment, each row includes a conductive terminal 2 arranged side by side and structured. Each conductive terminal includes The conductive terminal 2 is fixed to the holding portion 21 in the insulative housing 1 , the elastic arm 22 extending from the upper surface 21 of the insulating body 1 from the holding 21 , the self-holding portion 21 , the transition portion 23 extending from the brush circuit board 4 , and the transition The portion 23 is a joint portion 24 and a solder ball 25 disposed under the solder portion 24. The retaining portion 21 is a flat pole shape, and further includes a vertical portion 2U and a horizontal portion 212 extending outward from the vertical portion 211 。. The U includes a connecting portion (2) extending from the retaining portion 21, and an elastic portion 222 extending from the connecting portion 〇3. The elastic portion 222 is provided with a smooth arc for connecting with the die module 3 at the end. Contact portion 223. Read the first and third figures, each row of conductive ends 2 is called a terminal group (unlabeled, number)' and the eight conductive left-to-rights contained in each-terminal group (unlabeled) are marked as .ΤΙ, Τ2.·.Τ8, and the above eight 6 M365569 . The conductive terminal 2 is divided into left and right parts, the left part includes the conductive terminals ΤΙ-Τ4, and the right part includes the conductive terminals Τ5-Τ8. The two parts of the conductive terminals ΤΙ-Τ4 and Τ5-Τ8 differ in that the conductive terminals Τ1- The transition portion 23 of the crucible 4 extends downward from the end of the horizontal section 212 of the holding portion 21, and the transition portion 23 of the conductive terminal Τ5-Τ8 extends downward from the end of the vertical section 211 of the holding portion 21. In the left part of the conductive terminals Τ1-Τ4, the angle between the transition portions 23 of the conductive terminals ΤΙ and Τ2 and the vertical direction gradually decreases, and the transition portions 23 of the conductive terminals Τ3 and Τ4 are vertical, but the soldering portion 24 The left side and the right side of the corresponding transition portion 23 are respectively located; in the right portion of the conductive terminals Τ5-Τ8, the angle between the transition portion 23 of the conductive terminals Τ8 and Τ7 and the vertical direction is gradually decreased, and the conductive terminals Τ5 and Τ6 are successively reduced. The transition portion 23 is also in the vertical direction, but the welding The portions 24 are respectively located on the left side and the right side of the corresponding transition portion 23. As can be seen from the above structure, the angle between the transition portion 23 of the eight conductive terminals Τ1-Τ8 located in the same row of terminal groups (not labeled) and the vertical direction is Gradually increasing from the middle to the sides, that is, substantially fan-shaped. Further, the structure of the holding portions 21 of the eight conductive terminals Τ1-Τ8 and the elastic arms 22 are the same, so that the adjacent two conductive terminals of the conductive terminals Τ1-Τ8 The distance Ρ1 between the contact portions 223 of the 2 is smaller than the distance Ρ2 between the soldering portions 24 of the adjacent conductive terminals 2. When the electrical connector 1 is processed, a plurality of terminal groups (not labeled) can be punched out through the terminal strips, and then Then, the terminal group (not labeled) is implanted into the insulative housing 1 by insert molding, and the solder ball 25 is implanted under the soldering portion 24 of the conductive terminal 2. Referring to the fourth figure, the electrical connector 100 is soldered to the printed circuit board 4 by solder balls 25, and the wafer module 3 is pressed by an external force above the conductive terminals 2 of the electrical connection 7 M365569. At this time, the conductive sheets 32 of the chip module 3 are respectively pressed against the contact portions 223 of the conductive terminals 2 of the electrical connector 100, and the conductive sheets 42 of the printed circuit board 4 are respectively tinned with the conductive terminals 2 of the electrical connector 100. The balls 25 are welded together, and the wafer module 3 is thus electrically connected to the printed circuit board 4 through the electrical connector 100. Since the distance P1 between the contact portions 223 of the conductive terminals 2 of the electrical connector 100 is smaller than the distance P2 between the soldering portions 24, the printed circuit can be connected to the wafer module 3 with a small pitch of the conductive sheets 32 to the conductive sheet 42 with a large pitch. Board 4, thus facilitating the application and development of current high density wafer modules 3.
综上所述，本創作確已符合新型專利之要件，爰依法提出 專利申請。惟，以上所述者僅係本創作之較佳實施方式，本創 作之範圍並不以上述實施方式為限，舉凡熟習本案技藝之人士 援依本創作之精神所作之等效修飾或變化，皆應涵蓋於以下申 請專利範圍内。 【圖式簡單說明】 第一圖為本創作電連接器之立體組合圖； 第二圖為本創作電連接器其中一排導電端子之立體圖； 第三圖為第二圖所示本創作電連接器之一排導電端子之 正視圖； 第四圖為本創作電連接器與晶片模組和印刷電路板連接 之示意圖。 【主要元件符號說明】 電連接器 100 絕緣本體 1 基板 11 凸出咅P 12 上表面 13 下表面 14 M365569 導電端子 2、ΤΙ、T2、 T3、T4、T5、 T6、T7、T8 固持部 21 豎直段 211 水平段 212 彈性臂 22 連接部 221 彈性部 222 接觸部 223 過渡部 23 焊接部 24 錫球 25 晶片模組 3 底面 31 導電片 32、 印刷電路板 4 頂面 41 42In summary, this creation has indeed met the requirements of the new patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those who are familiar with the skill of the present invention are equivalent to the equivalent modifications or changes made by the spirit of the present creation. It should be covered by the following patent application. [Simple description of the diagram] The first figure is a three-dimensional combination diagram of the creative electrical connector; the second figure is a perspective view of one row of conductive terminals of the creative electrical connector; the third figure is the second electrical connection of the creation A front view of one of the rows of conductive terminals; the fourth figure is a schematic diagram of the connection of the creative electrical connector to the chip module and the printed circuit board. [Main component symbol description] Electrical connector 100 Insulating body 1 Substrate 11 Projection 咅P 12 Upper surface 13 Lower surface 14 M365569 Conductive terminals 2, ΤΙ, T2, T3, T4, T5, T6, T7, T8 Holding portion 21 Vertical Straight section 211 Horizontal section 212 Elastic arm 22 Connection part 221 Elastic part 222 Contact part 223 Transition part 23 Weld part 24 Tin ball 25 Wafer module 3 Bottom surface 31 Conductive sheet 32, Printed circuit board 4 Top surface 41 42
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