M362469 八、新型說明： 【新型所屬之技術領域】 尤其係指一種結合現有智 配之具天線電子裝置進行 本創作係關於一種ic晶片， 慧卡、§己憶卡晶片並可利用所搭 資料傳輸之IC晶片。 【先前技術】 塑膠卡片在2 0世紀已漸漸敌冲伸& _ 〇聊斯取代傳統使用紙張的商業交 易、h料傳輸專行為’例如金融卡可w坦似％M362469 VIII. New description: [New technical field] In particular, it refers to an antenna electronic device combined with the existing intelligent distribution. This creation is about an ic chip, a smart card, a § memory card, and can be transmitted by using the data. IC chip. [Prior Art] Plastic cards have gradually become more powerful in the 20th century. _ 〇 斯 斯 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代 取代
m峨卞可以提供取代錢幣使用 的功能，記憶卡可以取代以往紙張記料料、影像的功能， 而演變至今，塑膠卡片上甚至設置有晶片，使得塑膠卡片 的使用範圍及能力大幅的提升。 以目前具有晶片卡的塑膠卡片主要分為兩種，一種為 記憶用戶資料以進行商業行為的智慧卡（如金融卡、攸遊 卡），另-㈣為記憶卡（如使用在相機、行動電話上的記 憶卡）。以智慧卡而言又區分為兩種，一種為接觸式晶片智 慧卡（如金融卡），另一種則為感應式晶片智慧卡（如悠遊 卡）’此兩種卡在結構上存有些許的差異。 請參看第三圖所示，現有接觸式晶片智慧卡具有一卡 片本體（30)，該卡片本體（3〇)上之預設位置設置 有晶片（3 1 ) ’該晶片（3工）上設有對向設置排列的 複數端子（3 2 )，該端子（3 2 )分別為Vcc/Vss (電源 接腳）、1〇(智慧卡信號接腳）、CLK(震盪頻率信號接腳）、 RST(復歸信號接腳）、LA/LB (非接觸式天線接腳）、nc (無用途），然而該晶片（3 1 )的端子（3 2 )必須與 5 M362469 搭配的電子裝置（如提款機）之内設端子接觸始可進行資 料讀取’並不具有遠端傳輸之功能。 請參看第四圖所示，現有感應式晶片智慧卡則具有一 卡片本體（40)、設置於該卡片本體（4〇)上之晶片 (41)、設置於該卡片本體（4〇)上並與該晶片 1)接續之環形天線（42)以及與該卡片本體（4〇) 疊合以將該晶4 ( 4 1 )及天線（4 2 )隱蔽之蓋片（4 3)。此結構之晶片（41)可不需與電子裝置接觸，透 過天線（4 2 )來進行資料的傳輸，惟此一結構將增加卡 片製造廠商必須製作天線的成本。 …再者’上述晶片卡之晶片在記憶容量上並不夠大，無 法符合多重使用功能之效果。 【新型内容】 本創作人有鐘於上述ί 0晶片之結構缺失，乃積極著m峨卞 can provide functions to replace coins. Memory cards can replace the functions of paper recording materials and images. In the past, plastic wafers have even been equipped with wafers, which greatly improved the range and capabilities of plastic cards. There are two types of plastic cards with wafer cards at present, one is a smart card (such as a financial card or a travel card) for memorizing user data for commercial activities, and the other is a memory card (such as used in a camera or a mobile phone). On the memory card). In terms of smart cards, they are divided into two types, one is a contact chip smart card (such as a financial card), and the other is an inductive chip smart card (such as a leisure card). difference. Referring to the third figure, the existing contact chip smart card has a card body (30), and the preset position on the card body (3〇) is provided with a chip (3 1 ). There are multiple terminals (3 2 ) arranged in opposite directions. The terminals (3 2 ) are Vcc/Vss (power pin), 1〇 (smart card signal pin), CLK (oscillation frequency signal pin), RST. (return signal pin), LA/LB (non-contact antenna pin), nc (no use), however, the terminal (3 2 ) of the chip (3 1 ) must be combined with the 5 M362469 electronic device (such as withdrawal) The device can be read after the terminal contact is made. It does not have the function of remote transmission. As shown in the fourth figure, the existing inductive chip smart card has a card body (40), a chip (41) disposed on the card body (4〇), and is disposed on the card body (4〇). a loop antenna (42) connected to the wafer 1) and a cover sheet (43) overlapping the card body (4〇) to conceal the crystal 4 (41) and the antenna (42). The wafer (41) of this structure can transmit data through the antenna (42) without contacting the electronic device, but this structure will increase the cost of the chip manufacturer having to fabricate the antenna. ... Again, the wafer of the above wafer card is not large enough in memory capacity to conform to the effect of multiple use functions. [New content] This creator has a lack of structure in the above ί 0 wafer, which is positive
I從事研發’以期可以解決上述的問題，經過不斷的試驗 及努力’終於開發出本創作。 本創作之主要目的在於提供一種結合現有智慧卡、記 隐卡晶片並可利用所搭配之呈 天線電子裝置進行資料傳輸 < 1L晶片。 為了達到上述創作目的’本創作係採取以下之技術手 又予以達成，其中本創作Ic晶片係包括有： 載體，係略呈長方形之片體； 記憶端子部’係設置於該載體之—侧； 接觸端子部，係設置於該載體之另一側。 6 M3 62469 另外，本創作之載體上亦可設置有第一外接端子部， 藉此讓ic晶片與外接天線相接續，進而達到感應式晶片智 慧卡之無線感應功效。 又，本創作之載體上亦可設置有第二外接端子部，藉 此讓1C晶片與任何具有天線之電子裝置（如行動電話）結合 來達到感應式晶片智慧卡之無線感應功效。 藉由上述結構’本|"乍！ c晶片便可具有智慧卡晶片及 記憶卡晶片之雙效功能，同時利用外接端子部的設置能使 得晶片卡與外接天線’或與任何具有天線之電子裝置(如行 動電話)結合來達到感應式晶片智慧卡之無線感應功效，故 能省去天線的設計，大幅降低1C晶片的製造成本。 【實施方式】 請參看第一圖所示’本創作1(：晶片之第一實施例係包 載體（10)，係略呈長方形之片體； »己隱端子部（1工），係設置於該載體（1 〇 )之 側，其具有8個並排設置之端子； 接觸端子部（12)，係設置於該載體（1〇)之 —側’其具有對應於接觸式智慧卡晶片端子之端子。 杜人藉由上述之結構，本創作能將記憶卡及智慧卡之功 ^於體，其中接觸端子部（12)能提供同效於既 田慧卡晶片之功能，而記，丨咅 ' 於既有記憶卡晶片之功能。 杈仏Π 再請參看第二圖戶斤千 太別 圃所不，本創作1C晶片之第二實施例 7 M362469 包括有： 載體（10)，係略呈長方形之片體； °己隐端子部（1 1 )，係設置於該載體（1 q )之一 側，其具有8個並排設置之端子； 接觸端子部（1 2 )，係設置於該載體（工〇 )之另 一側’其具有肖應於接觸式智慧卡晶片端子之端子，本實 施例之端子係5個並排設置之結構；I is engaged in research and development, in order to solve the above problems, and through continuous experimentation and hard work, I finally developed this creation. The main purpose of this creation is to provide a data transfer < 1L wafer that combines existing smart cards, memory card chips, and the associated antenna electronics. In order to achieve the above-mentioned creative purpose, the present invention is achieved by the following technical hand, wherein the Ic chip system comprises: a carrier, which is a slightly rectangular piece; the memory terminal portion is disposed on the side of the carrier; The contact terminal portion is provided on the other side of the carrier. 6 M3 62469 In addition, the first external terminal can also be provided on the carrier of the creation, thereby allowing the ic chip to be connected with the external antenna, thereby achieving the wireless sensing effect of the inductive chip smart card. Moreover, the second external terminal portion can also be disposed on the carrier of the creation, thereby combining the 1C chip with any electronic device having an antenna (such as a mobile phone) to achieve the wireless sensing function of the inductive chip smart card. With the above structure 'this|"乍! The c-chip can have the dual-effect function of the smart card chip and the memory card chip, and the arrangement of the external terminal portion enables the wafer card to be combined with the external antenna 'or any electronic device having an antenna (such as a mobile phone) to achieve the inductive The wireless sensor function of the chip smart card can eliminate the antenna design and greatly reduce the manufacturing cost of the 1C chip. [Embodiment] Please refer to the first figure 'This creation 1 (: the first embodiment of the wafer package carrier (10), which is a slightly rectangular piece; » The hidden terminal part (1 work), the system setting On the side of the carrier (1 〇), there are 8 terminals arranged side by side; the contact terminal portion (12) is disposed on the side of the carrier (1 ') which has a terminal corresponding to the contact smart card chip With the above structure, Du Ren can make the memory card and the smart card work, and the contact terminal part (12) can provide the same function as the Ertian Hui card chip, and remember, 丨咅' In the function of the existing memory card chip. 杈仏Π Please refer to the second picture, the household is not awkward. The second embodiment of the creation 1C chip 7 M362469 includes: carrier (10), slightly a rectangular piece; the hidden terminal portion (1 1 ) is disposed on one side of the carrier (1 q ), and has eight terminals arranged side by side; the contact terminal portion (1 2 ) is disposed on the carrier The other side of the (worker's) has the terminal of Xiao Ying's contact smart card chip terminal. The terminal of the embodiment is five structures arranged side by side;
第一外接端子部（13)，係設置於該載體（1〇) 設置接觸端子部（12)之—側，俾用以與外接天線接續， 本實施例係三個端子之結構； 第二外接端子部（i 4 )，係設置於該載體（丄〇 ) 設置接觸端切（1 2 )之-側，俾用以與任何具有天線 之電子裝置(如行動電話，圖中未示)結合，本實施例係設 置」°己隐端子部（1 1 )及接觸端子冑（1 2 )間之兩個 端子結構。 *藉由上述之結構設計，本創作IC晶片不僅可以具有既 曰〜、卡曰曰片及§己憶卡晶片之雙效功能，更可藉由第一外 接^子部（1 3 )來連接外接天線以使得本創作具有感應 式智慧卡之功能，並藉由第二外接端子部（1 4 )與任何 具有天線之電子裝置結合來達到感應式晶片智慧卡之無線 感應功效。 又本創作I c晶片之載體（1 〇 )可與任何既有的卡 片進仃結合以成為目前市面之智慧卡形式來方便消費者使 用，亦可以直接將載體（1 0 )直接用作目前相機、手機 8 M362469 所使用之微型c憶卡使用，因此使用的範圍上十分的 泛，亦可依消費者之需求靈活的被加以運用。 、 【圖式簡單說明】 第一圖係本創作第一實施例之立體圖。 第二圖係本創作第二實施例之立體圖。 第-圖係既有接觸式晶片智慧卡之立體分解圖。 第圖係既有感應式晶片智慧卡之立體分解圖。 【主要元件符號說明】 ’ （1 〇 )载體 (1 1 )記憶端子部 (1 2 )接觸端子部 (1 3 )第一外接端子部. (1 4)第二外接端子部 (3 〇 )卡片本體 (31)晶片 (3 2 )端子 ’ （4 〇 )卡片本體 (41)晶片 (4 2 )環形天線 (4 3 )蓋片 9The first external terminal portion (13) is disposed on the side of the carrier (1) provided with the contact terminal portion (12), and is configured to be connected to the external antenna. The embodiment is a structure of three terminals; The terminal portion (i 4 ) is disposed on the side of the carrier (丄〇) where the contact end is cut (1 2 ), and is used for combining with any electronic device having an antenna (such as a mobile phone, not shown). In this embodiment, two terminal structures between the hidden terminal portion (1 1 ) and the contact terminal 胄 (1 2 ) are provided. * With the above structural design, the IC chip can not only have the dual function of the 曰 、, 曰曰 及 及 § § § , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The external antenna is such that the present invention has the function of an inductive smart card, and the second external terminal portion (14) is combined with any electronic device having an antenna to achieve the wireless sensing function of the inductive chip smart card. The carrier of the Ic chip (1 〇) can be combined with any existing card to become the smart card form of the current market for consumer convenience, and the carrier (10) can be directly used as the current camera. The mobile phone 8 M362469 uses the micro c memory card, so the scope of use is very broad, and can be flexibly applied according to the needs of consumers. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of the first embodiment of the present creation. The second drawing is a perspective view of the second embodiment of the present creation. The first figure is an exploded view of the contact chip smart card. The figure is an exploded view of an inductive wafer smart card. [Description of main component symbols] ' (1 〇) carrier (1 1 ) Memory terminal section (1 2 ) Contact terminal section (1 3 ) First external terminal section. (1 4) Second external terminal section (3 〇) Card body (31) wafer (3 2 ) terminal ' (4 〇) card body (41) wafer (4 2 ) loop antenna (4 3 ) cover sheet 9