M361176 八、新型說明： 【新型所屬之技術領域】 本創作係涉及光收發模組，尤指一種應用於高速資科傳輸 時，可藉由該接地元件可達到所需求接地效果之光收發模解 良。 【先前技術】 隨著電腦的大量普及與網路技術的快速發展，利用網$ $ #以快速的獲取資料或提供服務。而光電通訊能提供快速與木奠 的資訊傳輸，因此，光電產業受到各個階層人士與相關產業人 員的重視。目前正在急遽發展的光電產業係將電子學 (Electronics)與光學（Optics)相互結合而產生的一種應用領 域。而其中一重要的關鍵元件為光收發模組，其包括一光發送 器（Transmitter)及一光接收器（Receiver)或整合兩者為一光 收發器（Transceiver)。 發送器的功能在於將電氣訊號轉換成為光訊號進行發 籲送，一般依照光源來區分，而光纖通訊的光源以發光二極體與 雷射二極體為主，由於雷射二極體具有輸出功率高、傳輸速度 快、發光角度小（表示光源麵合進入光纖中的效率較高）與頻 譜較窄（色散較小），故較適合中、長距離傳輸之用，至於發 '光二極體則因為成本低、較易使用（驅動與補償電路較簡單） 等優點’較適合短距離傳輸用途。其中，雷射二極體（Laser Diode)或稱半導體雷射（semiconduct〇r Laser )，具有體積 小、耗電少、反應快、耐衝撞、壽命長、效率高及價格低等優 M361176 點，於光電系統產品中應用範圍十分廣泛。 光接受器的主要功能就是將所收到的光訊號轉換為電氣 訊號’其中最關鍵的組件就是檢光器（Detector)。而檢光器則 係利用光照射光'電二極體（Photo Diode )以產生犮夠的能量’ 得以激發出成對的電子電洞對，並因而產生電流訊號。 隨著光纖的大量運用，區域網路也逐漸光纖化，但光通訊 的高價格一直是跨進用戶端的一大門檻，因此低成本、易安 裝、小型化的產品成為區域網路市場發展的重點，小尺寸插拔 鲁式多源協定（Small Form-Factor Pluggable,SFP )光纖區域網路 主要是指光收發器與光連接器的小型化。小型化的光收發器有 著精巧的尺寸，體積小了約50% ，標準的小型光收發器只有 0.5英吋寬，為目前SFP收發模組所依循的製造標率。相較於 前一代產品的寬度為一英吋，這些小型收發模組讓系統設計人 員在相同的電路板上，放入兩倍的收發器數量，因此輸出入埠 的密度加倍’並降低系統成本，故現在廠商大多致力於如何確 實防止EMI之干擾，以有效操作於大約每秒一百億位元數 # (10Gb/s)的資料速率下之光收發模組。 【新型内容】 有鐘於此’本創作之主要目的係在於解決上述之缺失，本 創作係為一種可符合小尺寸插祓式多源協定（SFP)，且應用於 大約每秒一百億位元數（10Gb/s)的高速資料速率下，可達到所 需求接地效果之光收發模組改良。 為達上述目的，本創作之光收發模組改良，該光收發模組 主要包括殼體、提供光訊號之發光元件、接收光訊號之光接收 M361176 元件以及主電路板，該殼體用以承載發光元件、光接收元件與 主電路板，而主電路板具有可插拔之電性連接器；其中，該殼 體上並套設有一接地元件，該接地元件係設有包覆部以及由該 包覆部所延伸之複數每片，各彈片之寬度約為0.5〜1.5Mk，而 各彈片間之間距約為0.2〜0.7MM，使整體光收發模組應用於高 速資料傳輸時，可藉由該接地元件可達到所需求之接地效果。 【實施方式】 φ 為能使貴審查委員清楚本創作之結構組成，以及整體 運作方式，茲配合圖式說明如下： 本創作「光收發模組改良」如第一圖及第二圖所示，該光 收發模組1主要包括殼體11、提供光訊號之發光元件12、接 收光訊號之光接收元件13以及主電路板14,該殼體11可以為 鋅合金材質並用以承載發光元件12、光接收元件13與主電路 板14,該殼體11係設有可相相互蓋合之上、下殼件111、112， 該上殼件111 一端側係設有二個開口 113,以供發光元件12 籲以及光接收元件13得以露出，該電路板14可以為FR4(玻璃 纖維板)材質，而該發光元件12可以為發光二極體或雷射二極 體，該發光元件12以及光接收元件13係設於主電路板14之 一侧，而並有一可插拔之電性連接器15則設於主電路板14之 另側，該電性連接器15如圖所示可以為金手指。 其中，該殼體11上並套設有一接地元件2,該接地元件2 係設有包覆部21以及由該包覆部21所延伸之複數彈片22,該 上殼件111係環設有凹部114以供卡掣接地元件之包覆部21， 如第三圖及第四圖所示，各彈片22係由包覆部21朝開口 113 M361176 處延伸，且各彈片22係設有朝殼體彎折之卡擎部221，各彈片 22之寬度約為0.5〜1.5MM(以1MM較佳），而各彈片間之間距 約為0.2〜0.7MM(以0.5MM較佳），由接地元件之包覆部21以 及各彈片22之作用可將外郝電磁波利用接地而消除。 、 另外，該發光元件12以及光接收元件13分別與上、下殼 件111、112間設有玎相互卡合之卡固組件3，請同時參閱第二 圖及第五圖所示，該卡固組件3可以為凹槽31以及凸塊32， 如圖所示之實施例中’該凹槽31可設於上、下殼件in、U2 φ處’而該凸塊32則設於發光元件12以及光接收元件13上相 對於凹槽31處，如圖所示該凸塊32可圍繞於發光元件12以 及光接收元件13外而形成環狀，使凹槽31以及凸塊32相互 卡合之作用，使發光元件12以及光接收元件13與上、下殼件 U1、112得以相互密合’進而防止EMI由該上、下殼件ui、 112前端處外洩。 值得一提的是’本創作可符合小尺寸插拔式多源協定 (SFP)，且應用於大約每秒一百億位元數（1 〇Gb/s)的高速資料速 •率時，藉由該接地元件可達到所需求接地效果，且殼體之上、 下殼件間’於周圍處以及前端處設有防止EMI外洩之結構， 以增加整體光收發模組防止EMI干擾，以有效提高操作的次 料速率。 貝 如上所述，本創作提供—種較佳可行之光收發模組改良， 爰依法提呈新型專利之申請；惟，以上之實施說明及圖式所 示，係本創作較佳實施例者’並非以此侷限本創作，是以，舉 凡與本創作之構造、裝置、特徵等近似或相雷同者，均應屬本 創作之創設目的及申請專利範圍之内。 M361176 【圖式簡單說明】 第一圖係為本創作中光收發模組之結構立體圖。 第二圖係為本創作中光收奋模組之立體分解圖。 弟二圖係為本創作中上殼件與接地元件之結構示意M361176 VIII. New Description: [New Technology Field] This creation relates to optical transceiver modules, especially when used in high-speed transmission, the grounding component can achieve the required grounding effect. . [Prior Art] With the proliferation of computers and the rapid development of network technologies, the use of the network $$ to quickly obtain information or provide services. Optoelectronic communication can provide information transmission between the fast and the wood. Therefore, the optoelectronic industry is valued by people from all walks of life and related industries. The photovoltaic industry, which is currently in rapid development, is an application field that combines electronics and optics. One of the important key components is an optical transceiver module, which includes an optical transmitter (Transmitter) and a light receiver (Receiver) or both of which are an optical transceiver (Transceiver). The function of the transmitter is to convert the electrical signal into an optical signal for transmission, generally according to the light source, and the light source of the optical fiber communication is mainly composed of a light-emitting diode and a laser diode, since the laser diode has an output. High power, fast transmission speed, small illumination angle (indicating that the light source is more efficient to enter the fiber) and narrower spectrum (less dispersion), so it is more suitable for medium and long-distance transmission, as for the 'light diode' Because of its low cost and ease of use (the drive and compensation circuit is simpler), it is more suitable for short-distance transmission. Among them, the Laser Diode or semiconductor laser (Semiconductor laser) has the advantages of small size, low power consumption, fast response, collision resistance, long life, high efficiency and low price. It is widely used in photovoltaic system products. The main function of the optical receiver is to convert the received optical signal into an electrical signal. The most critical component is the Detector. The illuminator uses light to illuminate the 'Photo Diode' to generate enough energy' to excite pairs of electron holes and thus generate current signals. With the extensive use of optical fiber, the regional network is gradually becoming optical fiber, but the high price of optical communication has always been a threshold for entering the user side. Therefore, low-cost, easy-to-install and miniaturized products have become the focus of the development of the regional network market. The Small Form-Factor Pluggable (SFP) fiber-optic area network mainly refers to the miniaturization of optical transceivers and optical connectors. The miniaturized optical transceivers are compact in size and are about 50% smaller. The standard compact optical transceivers are only 0.5 inches wide, which is the manufacturing standard for current SFP transceiver modules. Compared to the previous generation, which is one inch wide, these small transceiver modules allow system designers to double the number of transceivers on the same board, thus doubling the density of input and output 并 and reducing system cost. Therefore, most manufacturers are now working on how to prevent EMI interference to effectively operate optical transceiver modules at data rates of approximately 10 billion bits per second (10 Gb/s). [New content] There is a clock here. The main purpose of this creation is to solve the above-mentioned shortcomings. This creation is a small-sized plug-in multi-source agreement (SFP) that can be applied to approximately 10 billion bits per second. Under the high-speed data rate of the number (10Gb/s), the optical transceiver module that can achieve the required grounding effect is improved. In order to achieve the above object, the optical transceiver module of the present invention is improved. The optical transceiver module mainly comprises a housing, a light-emitting component for providing an optical signal, a light receiving M361176 component for receiving an optical signal, and a main circuit board for carrying a light-emitting element, a light-receiving element and a main circuit board, and the main circuit board has a pluggable electrical connector; wherein the housing is sleeved with a grounding element, the grounding element is provided with a covering portion and Each of the plurality of pieces extending from the covering portion has a width of about 0.5 to 1.5 Mk, and a distance between the elastic pieces is about 0.2 to 0.7 MM, so that the entire optical transceiver module can be applied to high-speed data transmission. The grounding element achieves the required grounding effect. [Embodiment] φ is to enable your review committee to understand the structure of the creation and the overall operation mode. The following is a description of the following: The "Transformation Module Improvement" of this creation is shown in the first and second figures. The optical transceiver module 1 mainly includes a housing 11, a light-emitting component 12 for providing an optical signal, a light-receiving component 13 for receiving an optical signal, and a main circuit board 14. The housing 11 may be made of a zinc alloy material and used to carry the light-emitting component 12, The light receiving component 13 and the main circuit board 14 are provided with upper and lower casing members 111 and 112, and the upper casing member 111 is provided with two openings 113 at one end thereof for illumination. The component 12 and the light-receiving component 13 are exposed. The circuit board 14 may be made of FR4 (glass fiberboard), and the light-emitting component 12 may be a light-emitting diode or a laser diode, and the light-emitting component 12 and the light-receiving component The 13 series is disposed on one side of the main circuit board 14, and a pluggable electrical connector 15 is disposed on the other side of the main circuit board 14. The electrical connector 15 can be a gold finger as shown. The grounding member 2 is provided with a grounding member 2, and the grounding member 2 is provided with a covering portion 21 and a plurality of elastic pieces 22 extending from the covering portion 21, wherein the upper shell member 111 is provided with a recess 114 is a cover portion 21 for the card grounding member. As shown in the third and fourth figures, each of the elastic pieces 22 extends from the covering portion 21 toward the opening 113 M361176, and each of the elastic pieces 22 is provided to face the housing. The bent card portion 221, the width of each elastic piece 22 is about 0.5~1.5MM (preferably 1MM), and the distance between the elastic pieces is about 0.2~0.7MM (preferably 0.5MM), by the grounding element The action of the covering portion 21 and the respective elastic pieces 22 can eliminate the external electromagnetic waves by grounding. In addition, the light-emitting element 12 and the light-receiving element 13 are respectively provided with a locking component 3 which is engaged with the upper and lower casing members 111 and 112. Please refer to the second and fifth figures at the same time. The solid component 3 can be a recess 31 and a bump 32. In the embodiment shown, the recess 31 can be disposed at the upper and lower shells in, U2 φ and the bump 32 is disposed on the light-emitting component. 12 and the light receiving member 13 with respect to the groove 31, as shown, the bump 32 can be formed around the light emitting element 12 and the light receiving element 13 to form an annular shape, so that the groove 31 and the bump 32 are engaged with each other. The function of the light-emitting element 12 and the light-receiving element 13 and the upper and lower casing members U1, 112 are brought into close contact with each other' to prevent EMI from leaking from the front ends of the upper and lower casing members ui, 112. It is worth mentioning that 'this creation can meet the small size plug-in multi-source agreement (SFP), and when applied to high-speed data rate of about 10 billion bits per second (1 〇 Gb / s), borrow The grounding component can achieve the required grounding effect, and a structure for preventing EMI leakage is provided at the periphery and at the front end between the upper and lower casings of the casing to increase the overall optical transceiver module to prevent EMI interference, so as to effectively Increase the secondary rate of operation. As mentioned above, this creation provides a better and feasible optical transceiver module to improve, and to apply for a new patent in accordance with the law; however, the above implementation description and the drawings show that the preferred embodiment of the present invention is ' This is not a limitation of this creation. Therefore, any similarity or similarity to the structure, installation, and features of this creation should be within the creation purpose and patent application scope of this creation. M361176 [Simple description of the diagram] The first diagram is a three-dimensional diagram of the structure of the optical transceiver module. The second picture is a three-dimensional exploded view of the light-recovery module in the creation. The second picture of the brother is the structure of the upper shell and the grounding element.
第四圖係為本創作中 第五圖係為本創作中上、 ^與接地元件之結構放大示 下戏件之結構示意圖。The fourth picture is the schematic diagram of the fifth picture in the creation of the above-mentioned creation, and the structure of the grounding element is enlarged.
〇 【主要元件符號說明】 光收發模組1 殼體11 上殼件111 下殼件112 開口 113 凹部114 φ發光元件12 電性連接器15 接地元件2 包覆部21 彈片22 卡掣部221 卡固組件3 凹槽31 凸塊32〇【Main component symbol description】 Optical transceiver module 1 Housing 11 Upper housing member 111 Lower housing member 112 Opening 113 Recessed portion 114 φ Light-emitting element 12 Electrical connector 15 Grounding element 2 Covering part 21 Spring piece 22 Clamping part 221 card Solid component 3 groove 31 bump 32