M358298 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種等效熱傳導係數測量裝置，旨在提 供一種可快速計算得知微均溫板或者微均溫板所應用之散 熱模組之等效熱傳導係數之測量裝置。 【先前技術】 . 近年來，隨著半導體元件集成工藝之快速發展，半導 • 體元件之集成化程度越來越高，元件體積卻變得越來越 小，對散熱之要求越來越高，故散熱成為一個非常重要的 問題，為滿足這些需要，各種散熱方式被廣泛運用，如利 用風扇散熱、水冷輔助散熱及熱管散熱等方式，並取得一 定的散熱效果。但因散熱器與半導體集成元件接觸表面之 不平整性，未有一個理想之接觸介面，從根本上極大地影 響了半導體元件向散熱器進行熱傳遞之效果，故在散熱器 與半導體元件之接觸介面間增加一導熱係數較高之熱介面 φ 材料來增加介面之接觸程度就顯得十分必要。 在開發功能材料過程中，經常需要對材料之導熱性能進行 測量，特別係導熱材料，其導熱係數影響最終產品之導熱 性能。在電子設備散熱器之設計過程中，需要預先計算、 ' 模擬其散熱性能，精確測量導熱材料之導熱係數成為設計 成功之關鍵所在。 目前測量材料之導熱係數主要係採用雷射閃爍法，該 方法採用高能雷射作為熱源，短時間内迅速將一定熱量沈 積於樣品一表面，並測量樣品另一表面之溫度變化，測得 M358298 過公式計算得出該樣品材料之導熱 =昂貴，成本較高，且因材料之密度 差孝父大。 【新型内容】 有鑑於此’本創作之主要 算得知微均溫板戍者卩在臭供一種可快速計 傳導係數之測量ίί 板所應用之散熱模組之等效熱M358298 V. New description: [New technical field] This creation is about an equivalent thermal conductivity measurement device, which aims to provide a heat dissipation module that can be quickly calculated to know the micro-average temperature plate or the micro-average temperature plate. A measuring device for equivalent heat transfer coefficient. [Prior Art] In recent years, with the rapid development of semiconductor component integration processes, the integration of semiconductor components has become higher and higher, the component size has become smaller and smaller, and the requirements for heat dissipation have become higher and higher. Therefore, heat dissipation has become a very important problem. In order to meet these needs, various heat dissipation methods have been widely used, such as fan cooling, water cooling to assist heat dissipation, and heat pipe cooling, and to achieve a certain heat dissipation effect. However, due to the unevenness of the contact surface between the heat sink and the semiconductor integrated component, there is no ideal contact interface, which fundamentally greatly affects the heat transfer effect of the semiconductor component to the heat sink, so the contact between the heat sink and the semiconductor component It is necessary to increase the thermal interface φ material with a high thermal conductivity between the interfaces to increase the contact degree of the interface. In the development of functional materials, it is often necessary to measure the thermal conductivity of the material, especially thermal materials, whose thermal conductivity affects the thermal conductivity of the final product. In the design process of the electronic device heatsink, it is necessary to pre-calculate, 'simulate its heat dissipation performance, and accurately measure the thermal conductivity of the heat conductive material to become the key to the design success. At present, the thermal conductivity of the measured material is mainly laser scintillation method. This method uses high-energy laser as the heat source, and quickly deposits a certain amount of heat on the surface of the sample in a short time, and measures the temperature change on the other surface of the sample, and measures M358298. The formula calculates that the thermal conductivity of the sample material is high, the cost is high, and the density of the material is poor. [New content] In view of this, the main reason for this creation is to know that the micro-average temperature board is in the form of a quick-measurement coefficient of conductivity. ίί The equivalent heat of the heat-dissipating module used in the board
樣品之熱擴散率， 係數。該方法測量 變化使得測量之誤 第二:ΐΐ:目的’本創作之測量裝置至少包含有:第-、 用、件、#元件以及顯示元件，該第-測量元件 曰」 長、寬、高’該第二測量元件用以測 據傳送板之熱通量，並將以上測量之數 數y八^ #70件，料算元件中係存有等效熱傳導係 ’可將測量之數據由料效熱料錄計算公 領一2付知微均溫板之等效熱傳導係數，最後則可由該 兀件上顯補微均溫板之等效熱傳導係數。Thermal diffusivity of the sample, coefficient. The method measures the change so that the measurement is wrong. Second: ΐΐ: The purpose of the present measurement device includes at least: -, use, piece, # component and display element, the first - measuring element 曰 "length, width, height" The second measuring component is used for measuring the heat flux of the transfer plate, and the number of the above measurement is y8^#70 pieces, and the equivalent thermal conduction system is stored in the calculating component, and the measured data can be measured by the effect. The hot material record calculates the equivalent heat transfer coefficient of the micro-average temperature plate. Finally, the equivalent heat transfer coefficient of the micro-average plate can be supplemented by the element.
【實施方式】 “本創作之特點，可參閱本案圖式及實施例之詳細說明 而後得清楚地瞭解。 本創作「等效熱傳導係數測量裝置」，該 如第—圖所示，其至少包含有： 第一測量元件Π ,該第一測量元件u可以為長度量 度儀器、游標卡尺或2D/3D次元顯像量測，用以測量微均 溫板之長、寬、高； 第二測量元件12，該第二測量元件12可以為上述之 M358298 第一測量元件加上功率量測哭， 、 加上熱通量量測器，用 或者上述之第一測量元件 熱通量； u里發熱源作用於微均溫板上之 計算元件]3，該計| -批 數計算公式，且該計曾 13甲係存有等效熱傳導係 τ 7G件]3分別盘笼 1卜12連接，並用以接收該第—別：弟―、弟二測量元件 之測量數據，丨旦#Μ Λ 弟―;則量元件11、12 ^里双诹4冽里數據得以 一 傳導係數計算公式而快 二之等效熱 數，· 于《微均/皿板之等效熱傳導係 顯不元件14，該顯示元件14 _ 用以顯示該微均溫板之等效熱傳導係：13連接， 使用時，整體測量裝置丨進一 散熱模組2以及發熱源3， 所千口 =以供設置一 有微均溫㈣、散心㈣歧’以熱模組2係設 执料恭相、‘…'片2及風扇23，而該微均溫板21係 口又於。亥發熱源3上方，而該料始、、田士 . 00 ^ Λ微均/皿板21上方則設有散熱鰭片 Λ :，’、中，該微均溫板2丨設有一腔體211，請同時 =三圖所示’該腔體211可以為熱傳導係數高的無氧銅 或金屬材料製成’而該腔體211内設有毛細結構212，該毛 田、-構212可以為線徑3 〇 # m以上銅線或直捏丨5心⑴以下銅 粉燒結或機械化學加工成微小溝槽所製成，該毛細結構212 則填充有工作流體213，該工作流體213可以為水，因為水 具有很尚的潛熱、熱傳導係數、低的黏滯係數等熱物理性 質’且為無毒、不可燃的液體。 該測量裝置1可進一步設有電源供應器4，用以提供發 熱源3以及風扇23啟動之動力，當發熱源3工作時其發出之 熱量則傳送至上方之微均溫板21，而剛開始微均溫板21内 M358298 部是處於似真空狀態，當腔體211壁面吸收熱源熱量後，腔 體211内部的工作流體213將由原本的液態，迅速地以蒸發 或'弗騰的熱傳機制變化成為蒸氣態，並充滿整個腔體Μ 1 内部空間，蒸氣並藉由腔體211外壁面散熱鰭片22與風扇23 熱對流的冷卻作用凝結成液體，而猶著毛細結構2]2回流至 腔體211的熱源處，而形成一散熱猶環。 "中，该叶异元件13以及顯示元件μ可整合於一電腦 主機中，藉由第-、第二測量元件！！、12所測量之數據傳 达至該計算元件中，而該等效熱傳導係數計算公式係 該U係代表微均溫板之長度；Wvc係代表微均溫板之 ^，U係代表微均溫板之厚度；而“代表發熱源作用於 板上之熱通量’使測量之數據帶人該等效熱傳導係 ^十异公式中即可快速得知該微均溫板之等效熱傳導係 =所述，本_提供—祕可行之 板之等效熱傳導係數測量裝置，羡 = ;;本創作之技術内容及技術特點已揭示如 =技術之人士仍可能基於本創作之揭示㈣各種;^ 本案創作精神之替換及修飾。因二二雔 不限於實施例所揭示者，而庫 H 乍之保4乾圍應 換及修飾’並為以下之二 M358298 【圖式簡單說明】 第一圖係為本創作中等效熱傳導係數測量裝置之結 構方塊圖。 第二圖係為本創作中等效熱傳導係數測量裝置之結 構示意圖。 第三圖係為本創作中微均溫之斷面結構圖。 【主要元件符號說明】 測量裝置1 第一測量元件11 第二測量元件12 計算元件13 顯示元件14 平台15 散熱模組2 微均溫板21 腔體211 毛細結構212 工作流體213 散熱鰭片22 風扇23 發熱源3 電源供應器4[Embodiment] "The characteristics of this creation can be clearly understood from the detailed description of the drawings and the examples. The "Equivalent Thermal Conductivity Measurement Device" of this creation, as shown in the first figure, contains at least The first measuring component Π, the first measuring component u can be a length measuring instrument, a vernier caliper or a 2D/3D dimensional imaging measurement for measuring the length, width and height of the micro-average temperature plate; the second measuring component 12, The second measuring component 12 can be the first measuring component of the above M358298 plus power measurement crying, plus a heat flux measuring device, or the first measuring component heat flux described above; Computational component on the micro-average temperature plate]3, the calculation|-the calculation formula of the batch number, and the gauge has the equivalent heat conduction system τ 7G pieces] 3 respectively, the cage 1b 12 connection, and is used to receive the The first - the other: the younger brother, the second two measurement components of the measurement data, 丨 Μ Μ Λ ― ― ; ; 则 则 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Number, · in the equivalent heat conduction system of the micro-average / dish Without the component 14, the display component 14_ is used to display the equivalent heat conduction system of the micro-average temperature plate: 13 connection, when used, the overall measuring device breaks into a heat dissipation module 2 and a heat source 3, and the thousand ports are provided for setting There is a micro-average temperature (four), distraction (four) disambiguation 'to the thermal module 2 set to implement the Gongxiang phase, '...' piece 2 and the fan 23, and the micro-average temperature plate 21 system mouth is again. Above the heat source 3, and the material starts, and Tian Shi. 00 ^ Λ micro-average / above the board 21 is provided with heat-dissipating fins , :, ', medium, the micro-average temperature board 2 丨 is provided with a cavity 211 At the same time, as shown in the three figures, the cavity 211 may be made of an oxygen-free copper or metal material having a high thermal conductivity, and the cavity 211 is provided with a capillary structure 212. The hair field and the structure 212 may be lines. The diameter of the 铜# 〇# m copper wire or the straight kneading 5 core (1) below the copper powder is sintered or mechanochemically processed into a micro-groove, the capillary structure 212 is filled with a working fluid 213, the working fluid 213 may be water, Because water has a very latent heat, thermal conductivity, low viscosity coefficient and other thermophysical properties 'is a non-toxic, non-flammable liquid. The measuring device 1 can further be provided with a power supply 4 for providing the heat source 3 and the power of the fan 23 to be activated. When the heat source 3 is in operation, the heat generated by the heat source 3 is transmitted to the upper micro-temperature plate 21, and is just beginning. The M358298 part of the micro-average temperature plate 21 is in a vacuum-like state. When the wall surface of the cavity 211 absorbs the heat of the heat source, the working fluid 213 inside the cavity 211 will be changed from the original liquid state to the evaporation or the heat transfer mechanism of the 'Furton. It becomes a vapor state and fills the entire cavity Μ 1 internal space, and the vapor is condensed into a liquid by the cooling effect of the heat convection fins 22 and the heat convection of the fan 23 by the outer wall surface of the cavity 211, and the capillary structure 2] 2 is returned to the cavity. The heat source of the body 211 forms a heat-dissipating ring. In the ", the leaf element 13 and the display element μ can be integrated in a computer host, with the first and second measuring elements! ! The 12 measured data is transmitted to the computing component, and the equivalent heat transfer coefficient calculation formula is that the U system represents the length of the micro-average temperature plate; the Wvc system represents the micro-average temperature plate, and the U system represents the micro-average temperature. The thickness of the plate; and "representing the heat flux acting on the plate by the heat source" enables the measured data to bring the equivalent heat conduction system into a different formula to quickly know the equivalent heat conduction system of the micro-average plate. The present invention provides the equivalent thermal conductivity measurement device of the board, 羡 = ;; the technical content and technical features of the creation have revealed that the person who is technically possible may still be based on the disclosure of the creation (4) various; Replacement and modification of the creative spirit. Because the second and second are not limited to those disclosed in the examples, and the library H 乍 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 The block diagram of the equivalent thermal conductivity measurement device in this creation. The second diagram is the structure diagram of the equivalent thermal conductivity measurement device in this creation. The third diagram is the cross-sectional structure diagram of the micro-average temperature in the creation. Symbol Description Measuring device 1 First measuring element 11 Second measuring element 12 Computing element 13 Display element 14 Platform 15 Thermal module 2 Micro-average plate 21 Cavity 211 Capillary structure 212 Working fluid 213 Heat sink fin 22 Fan 23 Heat source 3 Power supply Provider 4