TWM357185U - Heat dissipation module and electronic device thereof - Google Patents
Heat dissipation module and electronic device thereof Download PDFInfo
- Publication number
- TWM357185U TWM357185U TW97223607U TW97223607U TWM357185U TW M357185 U TWM357185 U TW M357185U TW 97223607 U TW97223607 U TW 97223607U TW 97223607 U TW97223607 U TW 97223607U TW M357185 U TWM357185 U TW M357185U
- Authority
- TW
- Taiwan
- Prior art keywords
- dissipation module
- heat dissipation
- electronic device
- heat
- thermoelectric cooling
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 238000001816 cooling Methods 0.000 abstract 4
- 230000020169 heat generation Effects 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052723 transition metal Inorganic materials 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation module, which is arranged with at least one heat generation element, includes a thermoelectric cooling element and a heat conduction element. The thermoelectric cooling element has one hot surface and one cool surface. The cooling surface is electrically connected to the heat generation element while the hot surface is connected to the heat conductive element. The material of the thermoelectric cooling element abovementioned includes silicon element and at least one transition metal element. Meanwhile, an electronic device, which the heat dissipation module mentioned is applied for, is disclosed hereinafter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97223607U TWM357185U (en) | 2008-12-30 | 2008-12-30 | Heat dissipation module and electronic device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97223607U TWM357185U (en) | 2008-12-30 | 2008-12-30 | Heat dissipation module and electronic device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM357185U true TWM357185U (en) | 2009-05-11 |
Family
ID=44379516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97223607U TWM357185U (en) | 2008-12-30 | 2008-12-30 | Heat dissipation module and electronic device thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM357185U (en) |
-
2008
- 2008-12-30 TW TW97223607U patent/TWM357185U/en unknown
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