M356351 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種電路板模組，特別是右 ^ ,關—種應用於光電滑 鼠、手機及筆記型電腦等可檇式電子裝置上 夏現_游標控制的電路 板模組結構。 【先前技術】 光學職之構造，通常祕狀、手機及·”鱗可携式電 子裝置上，藉由影像感峨置偵測—表面（如工作表面或指紋）之圖 像而實現對游標的控制。 請參閱中國大陸專利第⑴題㈣f虎，以下通過對習知的光電滑 鼠之構造進行說明，該光電滑鼠通常包括控制單元、輪入單元和發光 單元，其中控制單元包括·.影像感測器' 轉換器、計算單元和通訊單 元。另外’該光電滑鼠還包括-透鏡，其中上述各單元均中設置—殼 體内，使用者可握持該殼體移動該滑鼠以控制與該滑鼠配合的電腦榮 幕上游標之移動，並結合輸人單元實現使用者想要之操作。 工作中，發光單元通常包括發光二極體或鐘射光源，其以一定的 頻率點亮，發射出光線至該滑鼠放置的工作面上，通常此工作具有— 定的紋理特徵，即微觀的凹凸不平之表面，發光單元發出的入射光經 工作面反射後，並經由透鏡聚焦後輸入到影像感測器上，該影像感測 益依據反射光之強度形成電壓或電流訊號，之後轉換器將該電壓或電 流訊號轉換為數位訊號，即將工作面的圖像數位化。而計算單元根據 5 M356351 'IV像木樣之圖像進行計算，從而確定該滑鼠的位移。 貫際中，上述控制單元為—單獨的晶片，其均係藉由該晶片之接 腳而安裝於滑鼠内的電路板上，具體安裝之構造可參閱美國專利第 4521772 #u及弟47515()5號，射第號專利將上述晶片藉由一 垂=置於電路板上的請元件而與電路板連接，而第顿奶號藉 片的夕㈣腳插接於電路板對應之焊接孔内組設於電路板上並 域电!·生連接此種方式有以下不足之處，製造者需從晶片製造商買 進早獨之晶片並焊接於電路板上，此無疑增加製造過程的複雜性，另， 指不裝置的製造者需處理好㈣發光單元及透鏡之位置組合關係， 如果其間的安裝位W當，則轉致焦距不准而無法藉由⑼之影像 感測减得有效的圖像，從而無法進行罐定位移，由此導致製造過程 複雜而不利於提高生產效率及降低成本。 有鑑於此，猶必要對前述構造進行改良，以克服前述之缺陷。 【新型内容】 本創作之目的在於提供提供—種用於光學跟縱之電路板模組，以 解決習知之具枝學跟縱功能的電子裝置於製造過財需單獨安裝影 像傳感晶片所產生㈣造過程娜及生產效率較低之_。 y 為達成前述目的，本創作提供一種用於光學跟縱之電路板模組， 應用於光電滑鼠、手機及筆記型電鱗可檇式電子裝置上，藉由—少 糊裝置偵測一表面之圖像而實現對游標的控制，該電路:二 括弟一電路板與第二電路板，其中該影像感測裝置設於第二電路板表 M356351 面’並且轉二電路板—端的表面設有躺墊，相狀第—電路板表 /應位置a有卜接塾’該第—與第二電路板共平域置，並藉由導 w >接物將第-電路板的焊轉鮮二電路板之接趣電性連接。 相較於習知技術，本創作藉由設置第—電路板與第二電路板，並 且於第—電路板上設置影像感測裝置及相應之週邊元件，製造具有光 學跟縱功能之1^«，只需賴第二板與影像_裝置等相 1元件作4 i體與第„電路板組裝，如此降低了此類電子裝置之製 &複德錢像感職置與絲及導光件的位置組合關係亦於該 第二電路板與影像感職置等相關元件之整體組合帽轉決，故， 製造此類電子裝置時不必考慮此_，從而利於提高生產效率及降低 成本。另’第-與第二電路板朗單面板並且共面設置，所有之電子 線路均設於第-與第二電路板單—的表面，並與第—電路板之焊接塾 及第二電路板的接罐共面設置，如此獅此二電路板的連接，也利 於提高生產效率及降低成本。 【實施方式】 本創作之用以光學跟縱之電路板模組可應用於光電滑鼠上、具有 光學跟蹤功能之手機、筆記型電轉可檇式電子裝置上，藉由一影像 感測裝置參卜表面（如功表面或指紋）而實現對游標之控制。 請參閱第-圖、第二圖及第三圖所示，實施本創作之光電滑鼠1 包括-上殼體10、電路板模組u及下殼體12，其中電路板模組U組 叹於上殼體10與下_ 12圍設之m内，並且該上殼體1G上還組裝 7 M356351 有滾輪100，相應之下殼體12的底板120上凸出設有支撐架122，該 上殼體10、下殼體12及滚輪100之構造及工作原理於習知技術中有詳 細描述，不再贅述。M356351 VIII. New description: [New technology field] This creation department is about a circuit board module, especially the right ^, off - kind of application on photoelectric devices such as photoelectric mouse, mobile phone and notebook computer. Xia Xian _ cursor control circuit board module structure. [Prior Art] Optical structure, usually on the secret, mobile phone and on the scale portable electronic device, the image is detected by the image sensing device - the image of the surface (such as the working surface or fingerprint) Please refer to the Chinese patent (1) (4) f tiger. The following is a description of the construction of a conventional photoelectric mouse, which usually includes a control unit, a wheel-in unit and a light-emitting unit, wherein the control unit includes an image. a sensor 'converter, a computing unit, and a communication unit. In addition, the optical mouse further includes a lens, wherein each of the above units is disposed in the housing, and the user can hold the housing to move the mouse to control The computer screen with the mouse moves upstream of the standard screen, and combines with the input unit to realize the operation desired by the user. In operation, the light unit usually includes a light emitting diode or a clock light source, which lights up at a certain frequency. , emitting light to the working surface on which the mouse is placed, usually the work has a certain texture feature, that is, a microscopic uneven surface, and the incident light emitted by the light emitting unit works. After the surface is reflected, and then focused by the lens, the image sensor is input to the image sensor, and the image sensing energy forms a voltage or current signal according to the intensity of the reflected light, and then the converter converts the voltage or current signal into a digital signal, that is, the working surface The image is digitized, and the calculation unit calculates the displacement of the mouse according to the image of 5 M356351 'IV like the wood sample. In the middle, the control unit is a separate wafer, which is The pins of the chip are mounted on the circuit board in the mouse. For the specific installation structure, refer to U.S. Patent No. 4521772 #u and 弟47515() No. 5, the patent of the above-mentioned wafer is placed on the circuit by a vertical drop = The components on the board are connected to the circuit board, and the ante (four) feet of the first piece of the milk is inserted into the corresponding soldering holes of the circuit board and assembled on the circuit board and electrically connected! Insufficient, the manufacturer needs to buy the wafer from the wafer manufacturer and solder it on the circuit board, which will undoubtedly increase the complexity of the manufacturing process. In addition, the manufacturer of the device does not need to handle it. (4) The light-emitting unit and the lens Location group In the relationship, if the mounting position W is in the middle, the focal length is not accurate, and the effective image cannot be obtained by the image sensing of (9), so that the tank positioning shift cannot be performed, thereby causing the manufacturing process to be complicated and unfavorable. Production efficiency and cost reduction. In view of this, it is necessary to improve the above structure to overcome the aforementioned drawbacks. [New content] The purpose of this creation is to provide a circuit board module for optical and vertical to solve The electronic device with the knowledge of the branch and the vertical function is produced by the separate installation of the image sensor chip. (4) The process is low and the production efficiency is low. y To achieve the above purpose, the present invention provides a method for optical tracking. The vertical circuit board module is applied to the photoelectric mouse, the mobile phone and the notebook type electric scale type electronic device, and the cursor is controlled by detecting the image of a surface by the device, the circuit: a circuit board and a second circuit board, wherein the image sensing device is disposed on the surface of the second circuit board table M356351 and the surface of the second circuit board is provided with a lying pad, which is phased The board table/should be in a position to be connected to the second board, and the soldering of the first board to the second board is controlled by the w > connection. Compared with the prior art, the present invention manufactures an optical tracking function by providing a first circuit board and a second circuit board, and an image sensing device and corresponding peripheral components are disposed on the first circuit board. , only need to rely on the second board and the image_device phase 1 component for the 4i body and the first board assembly, thus reducing the system of such electronic devices & Fude money image sensory position and wire and light guide The positional combination relationship is also in the overall combination of the second circuit board and the image sensor and other related components, so that it is not necessary to consider this when manufacturing such an electronic device, thereby improving production efficiency and reducing cost. The first and second circuit boards are singularly and coplanarly disposed, and all of the electronic circuits are disposed on the surface of the first and second circuit boards, and are connected to the first circuit board and the second circuit board. The tank is coplanar, so the connection of the two boards can also improve the production efficiency and reduce the cost. [Embodiment] The circuit board module for optical and vertical can be applied to the optical mouse with optical Tracking phone On the notebook type electronic device, the control of the cursor is realized by an image sensing device (such as a work surface or a fingerprint). Please refer to the first, second and third figures. The photoelectric mouse 1 implementing the present invention includes an upper casing 10, a circuit board module u and a lower casing 12, wherein the circuit board module U group sighs within the m of the upper casing 10 and the lower -12, and The upper housing 1G is further assembled with a roller M100. The lower base 120 of the housing 12 is convexly provided with a support frame 122. The structure and working principle of the upper housing 10, the lower housing 12 and the roller 100 are provided. It is described in detail in the prior art and will not be described again.
請參閱第四圖、第五圖及第六圖所示，電路板模組11包括第一電 路板110及第二電路板15，其中第一電路板11〇設有一方形開口 in， 該第二電路板15組設於該開口 ill内，並且該第一電路板n〇開口 in 一端中部設有一缺口 112，該缺口 112之寬度與第二電路板15的寬度 相同，以便該第二電路板15的一端組設於該缺口 112内。誠然，第二 電路板15與第一電路板110可均呈矩形設置，而第二電路板15可直 接設於第一電路板11〇 一側，即形成τ形構造，第一電路板11〇 一側 也可設有一缺口’該缺口寬度與第二電路板15之寬度相同，該第二電 路板15的一端組設於該缺口内’或者第二電路板15也可設置於第一 電路板110—側邊之邊緣位置’如此第一與第二電路板110、15呈L 形设置，或者該第—與第二電路板n〇、15也可採用直角交又形式設 置。 另外，該第二電路板15表面150組設有一影像感測裝置，本實施 例中’該影像感測裝置為影像感測器管芯154，該影像感測器管芯154 藉由引線（未圖示）與該第二電路板15上之焊接墊（未標號）電性連 接。 該影像感測器管芯154週邊覆蓋一殼體152,該殼體152組合於該 第二電路板15上，並且該殼體152還設有一透光孔（未標號），本實 8 M356351 施例中，該殼體152可以藉由膠體（如雙面膠帶）或卡柱等方式組設 於第二電路板15上。 §亥弟二電路板15上還設有一光源14及用以改變光線路徑之導光 件13，本實施例中，該光源14為一發光二極體，當然也可為鐳射光源^ 該光源14發射之光線經過該導光件13傳導並經一工作表面反射後，Referring to the fourth, fifth, and sixth figures, the circuit board module 11 includes a first circuit board 110 and a second circuit board 15, wherein the first circuit board 11 is provided with a square opening in, the second The circuit board 15 is disposed in the opening ill, and a notch 112 is defined in a middle portion of the first circuit board, and the width of the notch 112 is the same as the width of the second circuit board 15 so that the second circuit board 15 is One end of the group is disposed in the gap 112. It is true that the second circuit board 15 and the first circuit board 110 can be disposed in a rectangular shape, and the second circuit board 15 can be directly disposed on one side of the first circuit board 11 , that is, a τ-shaped structure is formed, and the first circuit board 11 〇 One side may also be provided with a notch 'the width of the notch is the same as the width of the second circuit board 15, one end of the second circuit board 15 is disposed in the notch' or the second circuit board 15 may be disposed on the first circuit board. 110—edge position of the side ′ such that the first and second circuit boards 110, 15 are disposed in an L shape, or the first and second circuit boards n, 15 may also be disposed in a right angle and form. In addition, an image sensing device is disposed on the surface 150 of the second circuit board 15. In the embodiment, the image sensing device is an image sensor die 154, and the image sensor die 154 is provided by a lead wire. The figure is electrically connected to a solder pad (not labeled) on the second circuit board 15. The image sensor die 154 is covered by a casing 152. The casing 152 is combined with the second circuit board 15. The casing 152 is also provided with a light transmission hole (not labeled). For example, the housing 152 can be assembled on the second circuit board 15 by means of a colloid (such as a double-sided tape) or a post. The light source 14 is a light source 14 and a light guide 13 for changing the light path. In the embodiment, the light source 14 is a light emitting diode, and of course, the laser light source. The emitted light is conducted through the light guide 13 and reflected by a working surface.
該反射光線穿過該導光件13及殼體152的透光孔而照射於該影像感測 器管芯154上。本實施例中，該導光件13包括一板狀主體部13〇，該 板狀主體部13G-側設有—凸出部132 ’而該第二電路板15對應設有 -開口 m，該導光件13的凸出部132穿過該開口 151而設于該光源 14 -側，以接收該絲14發射之紐。同_導光件13兩側設有卡 扣131，用以卡扣於第二電路板15的側緣，從而與第二電路板形成 一整體’相應的該下殼體12的絲12〇上設有相應之定倾⑵，用 以保證將第二電路板15等元件正確安裝於下殼體12上。 該第二電路板15 —端設有接難⑺，減之第—電路11〇對應 又有焊接塾（未標號並且該第—與第二電路板⑽、b共平面設置， 並藉由導電性焊接物將第―電路板⑽之焊接墊與第二電路板15的接 觸塾I53電性連接。該第—與第二電路板⑽、Μ表面賴有一層里 漆或類似黑軸，從而防止外界光線透過第—與第二電路板ιι〇二 而入射至該影像感·管芯154上。 、.第七圖為第二電路板15電子線路示意圖，其中第-線㈣為光 # 14所使用’而第二線路156為影像感測器管芯154所用，接觸塾⑸The reflected light passes through the light guides of the light guide 13 and the housing 152 to illuminate the image sensor die 154. In this embodiment, the light guiding member 13 includes a plate-shaped main body portion 13B. The plate-shaped main body portion 13G-side is provided with a protruding portion 132', and the second circuit board 15 is correspondingly provided with an opening m. The protruding portion 132 of the light guiding member 13 is disposed on the side of the light source 14 through the opening 151 to receive the button of the wire 14 to be emitted. A buckle 131 is disposed on both sides of the same light guiding member 13 for engaging the side edge of the second circuit board 15 to form an integral 'corresponding to the wire 12 of the lower casing 12 corresponding to the second circuit board. A corresponding tilting (2) is provided to ensure that the components such as the second circuit board 15 are properly mounted on the lower casing 12. The second circuit board 15 is provided at the end of the second circuit board 15 (7), and the first circuit 11 〇 corresponds to a soldering 塾 (not labeled and the first and the second circuit board (10), b are coplanar and are electrically conductive. The soldering material electrically connects the solder pad of the first circuit board (10) to the contact port I53 of the second circuit board 15. The first and second circuit boards (10) and the surface of the crucible are provided with a lacquer or black shaft to prevent the outside. The light is incident on the image sensing die 154 through the first and second circuit boards. The seventh drawing is a schematic diagram of the electronic circuit of the second circuit board 15, wherein the first line (four) is used by the light #14. 'The second line 156 is used by the image sensor die 154, the contact 塾 (5)
M356351 :’第I路155與第二線路156連接之埠與第-電路板110連接， 亦即將所有的電讀路均設置於帛二電路板15之—絲，從而利於降 低該第二電路板的製造成本。同時，第-與第二電路板U0、15共平 面汉置’第-電路板110的焊接墊與第二電路板15的接觸塾⑸共面 。又置如此利於此二電路板的連接，從而也利於提高生產效率及降低 成本。 印多閱第八圖與第九圖所示，為實施本創作之電路板模組的第二 實施例之示意圖，該電路板模組16包括第—電路板17及第二電路板 18 ’其中第-電路板17—側邊凹人設有—缺口 17G，該缺口 m之寬 度與第—電路板18喊度相同，以便該第二電路板18的-端組設於 缺170 Θ g外’該第—電路板^於鄰近缺口⑺的王個側邊均 設有焊接塾172 ’該第二電路板18 一端的多個側邊表面設有接觸墊 18〇，如此該第-電路板17與第二電路板18在多個側面均有連接從 而加強其間之組合強度，本實施例中，該第二電路板18 —端的三個侧 邊表面均設有接觸墊18G，而第—電路板17於對應_邊表面位置均 設有焊接墊Π2。當然也可僅於第二電路板18 _端_平行之兩側邊 表面設置接觸塾180 ’相應的第—電路板17亦只僅於相平行的二側邊 表面設置焊接墊172。本實施财其他安胁第二電路板18上之其他 元件及安裝方式可參前述，此處不再詳述。 上述實施例中，光源與導光件之位置可有各種變化，如光源也可 設置於第二電路板設Ϊ該影像感·管芯之表面，如此於第二電路板 M356351 上不需設置開Π。另外，殼體與導光件也可設置為—體，直接藉由枯 貼或卡柱等方式直接組合於第二電路板上。另外，上述的影像感測器 管芯於實際個中不僅可以完成影像採集之功能，而且還可完成位移 計算及祕控歡魏，此在f知技财物純，此處不再資述。 將本創作應用至具有光學跟縱功能之手機、筆記型電腦等可搞式 電子裝置上時’上述第一電路板可為該類電子裝置之主電路板，而第M356351: The first circuit 155 is connected to the second circuit 156 and connected to the first circuit board 110, that is, all the electrical reading paths are disposed on the second circuit board 15, thereby facilitating the reduction of the second circuit board. Manufacturing costs. At the same time, the pads of the first and second circuit boards U0, 15 which are coplanar with the 'first board 110' are coplanar with the contact pads (5) of the second board 15. This is also advantageous for the connection of the two boards, which also helps to improve production efficiency and reduce costs. In the eighth and ninth drawings, in order to implement the second embodiment of the circuit board module of the present invention, the circuit board module 16 includes a first circuit board 17 and a second circuit board 18' The first circuit board 17 is provided with a notch 17G, and the width of the notch m is the same as that of the first circuit board 18, so that the end of the second circuit board 18 is disposed outside the 170 Θ g The first circuit board is provided with a soldering pad 172 on the side of the king adjacent to the notch (7). The plurality of side surfaces of one end of the second circuit board 18 are provided with contact pads 18, such that the first circuit board 17 is The second circuit board 18 is connected on a plurality of sides to enhance the combined strength therebetween. In this embodiment, the three side surfaces of the second circuit board 18 are provided with contact pads 18G, and the first circuit board 17 Solder pads 2 are provided at the corresponding _ edge surface positions. Of course, it is also possible to provide the first circuit board 17 of the contact 塾 180 ′ only on the side surfaces of the second circuit board 18 _ end _ parallel side, and to provide the solder pads 172 only on the two side surfaces which are parallel. Other components and installation methods on the second circuit board 18 of this embodiment can be referred to above, and will not be described in detail herein. In the above embodiment, the position of the light source and the light guiding member may be variously changed. For example, the light source may be disposed on the surface of the second circuit board disposed on the image sensing die, so that the second circuit board M356351 does not need to be opened. Hey. In addition, the housing and the light guiding member may also be disposed as a body, and directly combined with the second circuit board by means of a dry or a post. In addition, the above-mentioned image sensor die can not only complete the function of image acquisition in the actual one, but also complete the displacement calculation and the secret control, which is pure in the knowledge of the technology, and will not be described here. When the present application is applied to a portable electronic device such as a mobile phone or a notebook computer having optical and vertical functions, the first circuit board may be the main circuit board of the electronic device, and
二電路板之構造可與上述構造相同，第—電路板之舰及構造，此處 不再贅述。 與習知技術相比較’本創作藉由設置第一電路板110與第二電路 板15，並且於第二電路板15上設置影像感測襄置及相應週邊元件，如 此於製造具有光學翁德之電子裝置時，只需_第二電路板Μ與 影像感測裝置等相關元件作為—整體與第—電路板⑽組裝，如此降 低了此類電子裝置之製造_性，並且雜_裝置與絲及導光件 的位置組合關係亦可於製造該第二電路板15與影像感測裝置等相關元 件的組合巾得轉決，耻製造絲電子裝置日林必考慮此問題，從 利於提间生產效率及降低成本。第一與第二電路板採用單面板並且 共表面設置，所有電子、鱗触於第Hf路板單-的表面，並 與第-電路板鱗«料二電路板之墊細設置，如此便於此 二電路板之連接，從而也利於提高生產效率及降低成本。 雖然本創作已以較佳實施例揭露如上，然其並非用以限定本創 作’任何《此技藝者’在不脫離本創作之精神和細内，當可作些 11 M356351 井之更動與潤飾，m此本創作之賴視後社㈣專利範圍所 界定者為準。另外’本創作的任—實施例射請專利範圍不須達成本 創作所揭露之全部目的或優點或特點^此外，摘要部分和標題僅是用 來輔助專顺搜尋之用，並_來聞本創狀權利範圍。 【圖式簡單說明】 弟-圖係實施本創作之光電滑鼠之立體分解圖。 第二圖係第一圖另一角度之視圖。 第二圖係第一圖另一角度之視圖。 第四圖係實施本射之電路板漁之示意圖。 第五圖係第四圖另一角度之示意圖。 第六圖係第四圖之後視圖。 第七圖係第四圖巾第二電路板電子線路佈局之示意圖。 第八圖係魏本_之電路板模_仏實關之分解示意圖。 第九圖係實財_之電路板模組㈣二實_之組合圖。 【主要元件符號說明】 1 光電滑鼠 10 上殼體 100 滾輪 11 ' 16電路板模組 110、 17第一電路板 111 、151 開口 112、 170 缺口 12 下殼體 120 底板 121 定位槽 122 支撐架 13 導光件 12 M356351 130 主體部 131 卡扣 132 凸出部 14 光源 15、18 第二電路板 152 殼體 153 、 180 接觸墊 154 影像感測器管芯 155 第一線路 156 第二線路 172 焊接墊 150 表面The construction of the two circuit boards can be the same as the above-mentioned configuration, and the ship and the structure of the first circuit board will not be described herein. Compared with the prior art, the present invention provides an optical sensing device by providing a first circuit board 110 and a second circuit board 15 and an image sensing device and corresponding peripheral components on the second circuit board 15. In the case of the electronic device, only the relevant components such as the second circuit board and the image sensing device are simply assembled as a whole with the first circuit board (10), thus reducing the manufacturing property of the electronic device, and the device and the wire And the positional combination relationship of the light guide member can also be used to manufacture the combination of the second circuit board 15 and the image sensing device and the related components, and the silk manufacturing electronic device must consider this problem, which is beneficial to the production of the room. Efficiency and cost reduction. The first and second circuit boards are arranged in a single panel and are coplanar, and all the electrons and scales are touched on the surface of the Hf board, and are arranged with the pad of the first circuit board, so that it is convenient. The connection of the two circuit boards is also beneficial to increase production efficiency and reduce costs. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the creation of any of the "artists" to the modification and refinement of the 11 M356351 well. m This is the definition of the patent scope of the creation of the company (4). In addition, the scope of the patent application does not require the full purpose or advantages or features disclosed in this creation. In addition, the abstract section and the title are only used to assist the search for specialization, and Create a range of rights. [Simple diagram of the diagram] The brother-picture is an exploded view of the photoelectric mouse that implements the creation. The second figure is a view of the other angle of the first figure. The second figure is a view of the other angle of the first figure. The fourth figure is a schematic diagram of the circuit board fishing that implements the shot. The fifth figure is a schematic diagram of another angle of the fourth figure. The sixth picture is a rear view of the fourth figure. The seventh figure is a schematic diagram of the electronic circuit layout of the second circuit board of the fourth figure. The eighth picture is a schematic diagram of the decomposition of the board model _ 仏 关 魏. The ninth picture is the combination of the circuit board module (four) and the two real _. [Main component symbol description] 1 Photoelectric mouse 10 Upper case 100 Roller 11 '16 Circuit board module 110, 17 First circuit board 111, 151 Opening 112, 170 Notch 12 Lower case 120 Base plate 121 Positioning groove 122 Support frame 13 Light guide 12 M356351 130 Body portion 131 Buckle 132 Projection 14 Light source 15, 18 Second circuit board 152 Housing 153, 180 Contact pad 154 Image sensor die 155 First line 156 Second line 172 Solder Pad 150 surface