M347663 - 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種晶圓清洗製程的裝置，特別是—個於晶圓乾燥的裝置。 【先前技術】 ' 本案係與晶圓片在清洗製程中的乾齡驟有關。晶圓表面清洗卫作為整個 ’生產過程的關鍵步驟，若清洗過程有瑕疫，特別是對於具有細微結構的半導體 鲁元件製程，微粒若附著於晶圓上，將對整體製程及晶圓品質有極大的影響；而 乾燥處理，更是決定了清洗製程的品質。 ~ ’ 請參見第-圖’賴示的是-習知的晶圓清洗乾燥設備1〇〇，包含上蓋體 部1〇、處理槽部20，以及晶圓承載裝置30(圖未顯示）。上蓋體部1〇係為一可門 闔之元件，包含了氣體注人裝置！卜上蓋體部1G可與處理槽部2Q結合形成一汗 密閉空間。處理槽部20包含了-處理槽21、液體注入裝置22、液體排液裝置 23、以及排氣裝置24。晶圓承載裝置30使晶圓！在移動中可以穩固。 值得注意的是’習知的晶圓清洗乾燥設備其排較及排氣裝置都在雙邊， 鲁當晶圓完成清洗’水流由兩邊排$，帶走晶圓上的污物，但由於中央水流最弱， 對於晶圓中間部的污物較不易帶走，因而降低清潔效果。#清洗完成時乾燥氣 ，體由上方排入由兩邊排出，中間氣流亦較弱，對晶圓中間部的乾燥效果亦較不 理想。 "此外，當晶圓經過清洗升至上蓋部進行乾燥，為使晶圓各部皆能接觸乾燥 ^體’晶圓與載具分離，僅由一頂持棒支撐，除此頂持棒之外並沒有其他的固 定零件，使得晶圓在乾燥氣流吹拂下容易搖晃震動，對晶圓的品質產生負面影 有鑑於此’本案提出-種新型晶圓乾燥設備，針對上述習知技術的問題進 5 M347663 樣 行改良，並提高運作效率。 【新型内容】 一種===燥設備所產生無法完全清潔朗題’本*繼 晶乾：_裝置’一徹底清*及乾燥 中固=^另—目的在於提供—種晶®舖裝置，聽舰晶圓在乾燥過程 中固疋不晃動，料會產生吹不到的死角。 ，創作之另—目的在於提供—種_舖裝置，其能夠提高整體器 作功效。 本創作之晶圓乾燥設備包含有一處理槽、—液體注人裝置、_ 置側邊排液裝置、及一排氣裝置。液體注入裝置用以將一處理液注入該處、 理槽二側邊排液裝置用以在晶圓清洗時快速地將該處理液排出該晶圓乾燥設 僙’設於該處理槽的單—邊’藉此使得該處理液朝向單—方向流動；排氣裝置 用以將乾燥氣體排出晶圓乾燥設備外，亦裝設於該處理槽的單一邊，藉此使得 籲該氣體朝向單-方向流動，底部排液裝置用以晶圓乾燥完成後，將處‘完二 地排出晶圓乾燥裝置外。 ^ 本創作之晶圓乾燥設備另包含一上蓋體，大致覆蓋該處理槽，其中該上蓋 ，於該處理槽上方狀出—内部空間，可容納至少—晶圓於其中；上蓋體内設有 至少一卡持件及至少一喷嘴埠，當晶圓被容納於該上蓋體内時，此卡持件可鬆 開地(releasably)卡持住該晶圓，喷嘴埠則用以提供一氣體以乾燥該晶圓。 本創作之晶圓乾燥設備另包含一晶圓承載裝置，用以移動該晶圓，該晶圓承 載裝置包含一頂持件、一驅動裝置驅動該頂持件，以及一週邊固持件，可分離 地與該頂持件連動。由於該頂持件與該週邊固持件可連動亦可分離式作動，此 晶圓承載裝置僅需一驅動裝置，不需有另一驅動裝置在控制固持件之移動。 6 M347663 • 本卿相較於習知細乾聽置，具有下碰點：第-、本創作之側邊單 邊排液及單邊排氣裝置可使水氣流朝單_方向流動，解決習知技術中水氣流由 =邊排出，中央流速較弱的缺點，水氣流能均勻地經過晶圓各部，提高乾燥與 /月潔的效果，第―、本創作上蓋體内的卡持具設計，可使晶圓被容納於上蓋體 $進订乾燥的雜巾，m定不晃動，且卡持件與晶圓的接觸面極小，可達到固 定的作用，卻又不會產生乾驗體吹不_死角。第三、本創作在晶圓載體的 ，二杜使頂持件期邊嗎裝置可軸，因此只需―個驅絲置即能驅動兩組 兀件的作動，有別於習知技術將兩個驅動裝置分別裝設控制頂持件與周邊固持 鲁裝置的設計，提高整體器械的運作功效。 【實施方式】 .吻參見第一圖及第二圖。根據本創作之一實施例之晶圓乾燥設備震，其 包含有-處理槽202、-液體注入裝置2〇4、一侧邊排液裝置2〇6、及一排氣裝 置208。液體注入裝置204用以將一處理液注入該處理槽2〇2;侧邊排液裝置2〇6 用以將該處理液排出該晶圓乾燥設備·，設於該處理槽2〇2的單一邊，藉此使 得該處理液朝向單-方向流動；排氣裝置2⑽用以將乾燥氣體排出晶圓乾燥設 験備200外’亦裝設於該處理槽2〇2的單一邊，藉此使得該氣體朝向單一方向流 動。 < 本創作之晶圓乾燥設備2㈣包含一上蓋體細，大致覆蓋該處理槽2〇2， ,其中該上蓋體210於該處理槽2〇2上方界定出一内部空間，可容納至少一晶圓 於/、中，上蓋體210内设有至少—^N寺件212及至少-噴嘴埠214，當晶圓被容 、内於該上蓋體内時’此卡持件m可鬆開地㈣纖吻)卡持住該晶圓，喷嘴埠 214則用以提供一氣體以乾燥該晶圓。 明參見第二圖與第二A圖。本創作之晶圓乾燥設備2〇〇(請參見第二圖)另包 含-晶圓承載裝置300，用以移動該晶圓，該晶圓承載裝置·包含一頂持件 302、-驅動裝置304用以驅動機械手臂3〇8以控制該頂持件如之移動，以及 7 M347663 •一週邊固持件306，可分離地與該頂持件3G2連動。由於該頂持件3()2與該週邊 =件3〇6可連動亦可》離式作動，此晶圓承載裝置僅需一個驅動裝置， 不需在週邊固持件306上裝置另一驅動裝置。 本創作所提供之晶圓乾燥裝置的操作方式，請參見第4A圖至第很圖。如 弟4A圖所示，首先將晶圓1放置於晶圓承餘置(請參見第三圖)上。如第 卜圖：不日日圓1降入處理槽202内清洗，如第4C圖所示，上蓋體210移往 ，^!!_槽!°2上方形成一密閉空間’喷嘴蜂214開始送出由氮氣⑽及異丙醇 α的氣體轉氣裝置208將氣體排$晶圓乾燥設備2⑽外。此實施例 造/體匕3複數個喷嘴淳214 ’成二列設置’且該些喷嘴埠係與相鄰列的喷嘴 埠=錯設置。有-進氣裝置柳與該噴嘴物相連結，且該喷嘴料4之出 2散射狀(未示於圖中）’且不具有薄膜’係藉由該進氣裝置柳使喷僻214 2減均勻分佈。嘴料214由可撓性材質粒，具有預紐定之角度， 但匕S —调整裝置，用以調整氣體噴出的方向。 ^第4C圖與第4D圖。如第4C圖所示，處理液持續由下方液體注入 ，04注入處理槽2〇2而溢流出的處理液由側邊排液裝置挪排出。清洗完 ，後晶圓1由晶圓載具3⑻(請參見第三_上升至上蓋體跡如圖奶所示， 升至一固定高度後即停止，由頂持件302繼續推動往上升 璧L凡上盍體部210。頂持件3〇2與周邊固持件306的連動或分 自動控制裝置控制，於此實施例中係使用一電腦控制。另參見第3Β 圖”第3C圖，頂持件3〇2與周邊固持件3〇6可連動 接而連動，於此實施例中係為一掛鉤。 U疋件310彼此連 請參見第4D圖至第4Η圖。如第奶圖所示，晶圓i升至 由圓柱棒體之卡持件212於相對兩邊卡持住晶圓ι，如第* <， 下隆$鱼调、喜m杜Μ®斤不’頂持件302 、夜穿置2仍# 同一位置，處理槽202内部剩餘的處理液由底部的排 /裝置〇5排出直至處理液完全排出晶圓乾燥設備細 ^ 3〇2 , 1 ^ 4〇 ^ ；：^ 8 M347663 至適當高度與周邊固持件3G6結合_同承載晶圓丨下降直至晶圓丨完全納入處 理槽部2〇2，曰噴嘴埠叫停止送出乾燥氣體。如第犯圖所示，上蓋體移離開處 理槽上方’晶圓1托持上升至處理槽2〇2頂部，完成晶圓乾燥流程。 以上本創作已藉由各個實施例及其相關圖式而清楚載明。然而，熟習該 項技術者當了解的是，本創作之各個實施此僅為例示性而非為限讎，亦 I7在不脫離本創作實質精神及範圍之内，丨述所述及之各元件的變化例及修 正例均為本創作所涵蓋。緣此，本創作係由後附之中請專利範圍所加以界定。 【圖式簡單說明】 第圖係-不意圖，顯示一習知晶圓乾燥設備。 第:圖係-透視圖，顯示本創作一實施例之晶圓乾燥設備的透視圖。 ^ 一圖係立體圖，顯不本創作_實施例之晶圓乾燥設備的晶圓載呈裝置。 1 /、上用以驅動頂持件移動之驅動裝置。 ，B圖係—側視圖，顯示本創作一實施例之晶圓乾燥設備的晶圓載具裝置 上，觸，顯示本辦—實侧之晶^乾燥設射的晶圓載具 持件/、周邊m持件能連動的固定件。 第四A四Η圖係透視圖，顯示本創作較佳實施例之流程。 【主要元件符號說明】 1晶圓 1〇〇晶圓乾燥設備 10上蓋體部 11氣體注入裝置 20處理槽部 9 M347663 21處理槽 22液體注入裝置 23液體排液裝置 24排氣裝置 30晶圓承載裝置 31頂持件 32晶圓固持件 200晶圓乾燥設備 202處理槽 204液體注入裝置 205底部排液裝置 206側邊排液裝置 208排氣裝置 210上蓋體 212卡持件 214喷嘴埠 300晶圓承載裝置 302頂持件 304驅動裝置 306週邊固持件 308臂 310固定件 402進氣裝置M347663 - VIII. New Description: [New Technology Field] This creation is about a wafer cleaning process, especially a wafer drying device. [Prior Art] 'This case is related to the dryness of the wafer in the cleaning process. Wafer surface cleaning is a key step in the entire production process. If there is a plague in the cleaning process, especially for semiconductor semiconductor components with fine structure, if the particles are attached to the wafer, the overall process and wafer quality will be Great impact; and drying treatment determines the quality of the cleaning process. ~ ‘ See Fig. Illustrated is a conventional wafer cleaning and drying apparatus 1 〇〇 comprising a top cover body 1 , a processing tank 20 , and a wafer carrier 30 (not shown). The upper cover body 1 is a door-to-door component that contains a gas injection device! The upper cover body portion 1G can be combined with the treatment groove portion 2Q to form a sweat-tight space. The treatment tank portion 20 includes a treatment tank 21, a liquid injection device 22, a liquid discharge device 23, and an exhaust device 24. Wafer carrier 30 makes the wafer! It can be stabilized while moving. It is worth noting that 'the conventional wafer cleaning and drying equipment has its row and exhaust devices on both sides, Ludang wafers are cleaned. 'Water flow is drained by both sides, taking away the dirt on the wafer, but due to the central water flow The weakest, the dirt in the middle of the wafer is less likely to be taken away, thus reducing the cleaning effect. # Drying gas is completed when the cleaning is completed. The body is discharged from the top and discharged from both sides. The middle airflow is also weak, and the drying effect on the middle portion of the wafer is also less than ideal. " In addition, when the wafer is cleaned and lifted to the upper cover for drying, in order to make all parts of the wafer contact with the dry body, the wafer is separated from the carrier, and only supported by a top stick, except for the top stick. There are no other fixed parts, so that the wafer is easy to shake and vibrate under the dry air blowing, which has a negative impact on the quality of the wafer. In view of this, a new type of wafer drying equipment is proposed for the above-mentioned conventional technology. M347663 improved and improved operational efficiency. [New content] A === dry equipment can not completely clean the problem 'this * after the crystal dry: _ device 'one thoroughly clear * and dry medium solid = ^ another - the purpose is to provide - seed crystal ® paving device, listen The ship's wafer is solid and does not shake during the drying process, and it will produce a dead angle that cannot be blown. The other is to create a kind of _ paving device, which can improve the overall function. The wafer drying apparatus of the present invention comprises a processing tank, a liquid filling device, a side draining device, and an exhaust device. The liquid injection device is used for injecting a treatment liquid into the solution, and the drainage device is disposed on the side of the treatment tank for quickly discharging the treatment liquid to the wafer drying device during the wafer cleaning process. The edge 'by the flow of the treatment liquid toward the single-direction; the exhaust device is used to discharge the dry gas out of the wafer drying device, and is also installed on a single side of the treatment tank, thereby causing the gas to be directed toward the single-direction After the flow, the bottom drain device is used to dry the wafer, it will be discharged out of the wafer drying device. The wafer drying apparatus of the present invention further comprises an upper cover body substantially covering the processing tank, wherein the upper cover is formed above the processing tank - an inner space capable of accommodating at least - a wafer therein; and at least the upper cover body is provided a holding member and at least one nozzle 可, the holding member releasably holds the wafer when the wafer is received in the upper cover, and the nozzle 用以 is used to supply a gas to dry The wafer. The wafer drying apparatus of the present invention further comprises a wafer carrying device for moving the wafer, the wafer carrying device comprises a holding member, a driving device for driving the holding member, and a peripheral holding member, which is separable The ground is interlocked with the top holding member. Since the top holding member and the peripheral holding member can be operated in a separate manner, the wafer carrying device only needs one driving device, and no other driving device is required to control the movement of the holding member. 6 M347663 • The Qing Qing has a lower touch point than the conventional one. The first side, the side of the creation, the single-side drainage and the one-side exhaust device can make the water flow flow in the single direction. In the technology, the water flow is discharged by the side, and the central flow velocity is weak. The water flow can uniformly pass through the various parts of the wafer to improve the effect of drying and/or cleaning, and the design of the holder in the upper cover of the creation is The wafer can be accommodated in the upper cover body, and the dry tissue can be stapled, and the contact surface of the holding member and the wafer is extremely small, so that the fixed effect can be achieved without causing the dry body to blow. _ dead corner. Third, the creation of the wafer carrier, the second Duo to hold the edge of the device, the device can be shaft, so only one drive can drive the operation of the two sets of components, different from the conventional technology will be two The driving devices are respectively provided with a design for controlling the top holding member and the surrounding holding device, thereby improving the operation efficiency of the whole device. [Embodiment] The kiss is shown in the first figure and the second figure. The wafer drying apparatus according to an embodiment of the present invention includes a treatment tank 202, a liquid injection device 2〇4, a side draining device 2〇6, and a venting device 208. The liquid injection device 204 is for injecting a treatment liquid into the treatment tank 2〇2; the side drainage device 2〇6 is for discharging the treatment liquid to the wafer drying device, and the single set in the treatment tank 2〇2 One side, thereby causing the treatment liquid to flow in a single direction; the exhaust device 2 (10) is configured to discharge the dry gas out of the wafer drying apparatus 200 and is also mounted on a single side of the processing tank 2〇2, thereby The gas flows in a single direction. < The wafer drying apparatus 2 (4) of the present invention comprises an upper cover body which substantially covers the processing tank 2〇2, wherein the upper cover body 210 defines an internal space above the processing tank 2〇2 to accommodate at least one crystal The upper cover body 210 is provided with at least a temple member 212 and at least a nozzle 214. When the wafer is accommodated in the upper cover body, the holder m is releasably (4) The kisser stuck the wafer and the nozzle 214 is used to provide a gas to dry the wafer. See Figure 2 and Figure 2A for details. The wafer drying apparatus of the present invention (see FIG. 2) further includes a wafer carrier 300 for moving the wafer, the wafer carrier comprising a top member 302, a driving device 304 It is used to drive the robot arm 3〇8 to control the movement of the holding member, and 7 M347663 • a peripheral holding member 306, which is detachably coupled with the holding member 3G2. Since the holding member 3() 2 and the peripheral member 3〇6 can be interlocked or actuated, the wafer carrying device only needs one driving device, and it is not necessary to install another driving device on the peripheral holding member 306. . For the operation of the wafer drying unit provided by this creation, please refer to Figure 4A to Figure. As shown in Figure 4A, wafer 1 is first placed on the wafer (see Figure 3). As shown in Fig. 2, the Japanese yen 1 is lowered into the processing tank 202 for cleaning. As shown in Fig. 4C, the upper cover 210 is moved to the ^!!_ slot! A closed space is formed above the °2 nozzle No. 214 starts to be sent out. A gas venting device 208 of nitrogen (10) and isopropanol alpha vents the gas outside of the wafer drying apparatus 2 (10). In this embodiment, the plurality of nozzles 214' are arranged in two rows and the nozzles of the nozzles are adjacent to the nozzles of the adjacent columns. The air intake device is connected to the nozzle, and the nozzle material 4 is scattered (not shown) and does not have a thin film, which is reduced by the air intake device. Evenly distributed. The mouth 214 is made of a flexible material plasmid having a pre-tensioned angle, but the 匕S-adjustment means is used to adjust the direction in which the gas is ejected. ^ 4C and 4D. As shown in Fig. 4C, the treatment liquid is continuously injected from the lower liquid, and the treatment liquid overflowed into the treatment tank 2〇2 by the 04 is discharged by the side liquid discharge device. After cleaning, the back wafer 1 is stopped by the wafer carrier 3 (8) (please refer to the third_rise to the upper cover body as shown in the milk shown in the figure, and rises to a fixed height, and continues to be pushed up by the top holding member 302. The upper body 210 is controlled by the interlocking or sub-automatic control device of the holding member 3〇2 and the peripheral holding member 306. In this embodiment, a computer control is used. See also Figure 3, Figure 3C, the holding member 3〇2 and the peripheral holding member 3〇6 can be linked in conjunction with each other, which is a hook in this embodiment. The U-shaped members 310 are connected to each other, please refer to the 4D to 4th drawings. As shown in the milk figure, the crystal The circle i is raised to hold the wafer ι on the opposite sides by the holding member 212 of the cylindrical rod body, such as the * <, the next dragon $ fish tune, hi m cuckoo® kg not 'top piece 302, night wear At the same position, the remaining treatment liquid inside the treatment tank 202 is discharged from the bottom row/device 〇5 until the treatment liquid is completely discharged from the wafer drying equipment, 3^2, 1^4〇^;:^ 8 M347663 to The appropriate height is combined with the peripheral holding member 3G6_the same carrier wafer is lowered until the wafer cassette is completely incorporated into the processing groove portion 2〇2, and the nozzle is stopped and sent. Dry gas. As shown in the figure, the upper cover moves away from the top of the processing tank. The wafer 1 is lifted up to the top of the processing tank 2〇2 to complete the wafer drying process. The above creation has been carried out by various embodiments and related It is to be understood that the skilled artisan understands that the various embodiments of the present invention are merely illustrative and not limiting, and that I7 is not within the spirit and scope of the present invention. The variations and modifications of the various elements described above are covered by this essay. Therefore, this creation is defined by the scope of the patent application in the attached section. [Simple description of the diagram] A conventional wafer drying apparatus is shown. Fig.: A perspective view showing a perspective view of a wafer drying apparatus according to an embodiment of the present invention. ^ A perspective view of a drawing, showing the creation of the wafer drying apparatus of the embodiment Wafer carrying device 1 /, driving device for driving the movement of the holding member. B-side view showing the wafer carrier device of the wafer drying device of the present embodiment, touch, display Office - solid side crystal ^ dry The wafer carrier holder/the fixed member that can be interlocked with the surrounding m holding member. The fourth A Η diagram is a perspective view showing the flow of the preferred embodiment of the present invention. [Main component symbol description] 1 wafer 1〇 〇Wafer drying apparatus 10 upper cover portion 11 gas injection device 20 treatment groove portion 9 M347663 21 treatment tank 22 liquid injection device 23 liquid discharge device 24 exhaust device 30 wafer carrier device 31 holding member 32 wafer holder 200 Wafer drying equipment 202 processing tank 204 liquid injection device 205 bottom drainage device 206 side drainage device 208 exhaust device 210 upper cover 212 holding member 214 nozzle 埠 300 wafer carrier 302 holding member 304 driving device 306 periphery Holding member 308 arm 310 fixing member 402 air intake device