•M347016 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種組接式電路模組，尤指一種具有組 接成多邊形電路的電路板模組。 【先前技術】 在科技不斷的進步下，讓許多電子元件的體積越做越 小，讓電子70件可以透過表面黏著技術直接電性連結在電 路板上，以達到電子產品朝小型、微小型或薄型化之目的 設計，便於使用者攜帶外出或收藏。 由於電子產品的體積縮小後，内部的電路板體積或面 積也相對縮小，也造成—些不常使料電路或硬體配備被 捨棄’為了讓該電子產品在往後使用上還能擴充原有功能 時白在電子產品的電路板上預留至少一個擴充槽或在電 子產品的殼體上外露多個連接器，讓使用者可以做擴充或 連接外部週邊設備使用。雖然，此種形態的設計可以讓電 子產品的體積或面積縮小，也讓使用者依所需而進行擴充 或外接週邊設備使用，但是在攜帶外㈣，讓使用者在攜 帶上極為不便。 【新型内容】 因此，本發明主要目的，在於透過一種組接式的電路 板模組，讓使用者可依所f進行記憶容量的擴充，或者讓 製造者可以依組接式的電路板模組來生產一小型化的電 腦，以此小型化電腦來控制機台或運算資料。 為達到上述之目的，本創作提供一種具有組接成多邊 5 M347016 形電路的電路板模組，包括：一第—電路板、一第二電路 板及-散熱結構。該第-電路板上具有一第一功能電路， 該功能電路為記憶體擴充電路，或者該第一功能電路為控 制電路（含微處理器），言亥第一電路板的週邊至少具有一 第-連接器，該第-連接器以提供插接複數個第二電路 板。該第二電路板上具有一第二功能電路，該第二功能電 路21為記憶體擴充電路，或者驅動電路、電源供應電路、 訊號放大電路、檢測（感測）電路、充電電路、訊號（能 量）轉換電路、傳輸介面電路、自動切斷訊號電路等之其 - ’該第二電路板的週邊具有—第二連接器、—第三連接 器及-第四連接器。該散熱結構係配置於第一電路板及該 第二電路板所圍成的空間，與該第—電路板的第一功能電 路及該第二電路板上的第二功能電路所電性連結的電子元 件接觸，以吸收該電子元件所產生的熱源。 【實施方式】 兹有關本創作之技術内容及詳細說明，現 明如下： 電路板1、H路板2及—散熱結構3。 β第電路板1 ’其上具有—第—功能電路U，該功 能電路11為記憶體擴充電路，以電性連接複數記憶體插座 in，以提供插接記憶體112，或者該第—功能電路㈣ 請參閲第-、二、三圖’係本創作之組接成多邊形電 路的電路板模組分解、組合及側視示意圖。如圖所示：本 創作之具有組接成多邊形電路的電路板模組，包括·· 一第 6 M347016 控制電路（含微處理器）。且，於該第—電路板i的週邊 具有至少-第-連接器12，該第一連接器12以提供插接複 數個第二電路板2。在本圖式中，該第—連接器為複數導 電接腳所組成。 該第二電路板2，其上具有一第二功能電路21，該第 -二功能電路21為記憶體擴充電路，以電性連接複數記憶體 .插座2H ，以提供插接記憶體212，或者該第二功能電路 # 21為其它的驅動電路、電源供應電路、訊號放大電路、檢 測（感測）電路、充電電路、訊號（能量）轉換電路、傳 輸介面電路、自動切斷訊號電路等之其一。且，於該第二 電路板2的週邊具有一第二連接器22、一第三連接器四及 一第四連接器24，該第三連接器22以提供與另一個第二電 路板2的第四連接器24插接，而該第二連接器22係供與第 一電路板1的第一連接器12插接。在本圖式中，該第二連 接器22為複數插孔的連接器，該第三連接器為排線，該第 _四連接器為複數導電接腳。 5亥散熱結構3，係配置於第一電路板1及該第二電路 板2所圍成的空間中央處，與該第一電路板1的第一功能 電路11及该第一電路板2上的第二功能電路21所電性連結 的電子元件接觸，以吸收該電子元件所產生的熱源。該散 熱結構3包含有：一導熱元件31、一散熱鰭片32及一風扇 33組成。該導熱元件31為導熱塊、導熱板、均溫板或熱管 等之其一，該導熱元件31貼覆於該記憶體212的電子元件 表面後，在吸收電子元件所產生的熱源後，將熱源傳遞給 7 ‘M347016 散熱鰭片32散熱’再由風扇32轉下使空氣流動，能讓散轨 鰭片32所釋放的熱源能快速散去，以確保電子元件的正； 運作。 請參閱第四、五圖，係本創作之第—使用狀態分解及 組合不意圖。如所示：當本創作之該第—電路板1及該第 二電路板2在作記憶容量擴充時，該第―電路板i上的第 -功能電路11與該複數個第—連接㈣電性連結，而該第 二電路板2上的第二功能電路21為記憶體電路，將第二電 路板2的第二連接器22與該第一電路^的第一連接㈣ 插接，使該第-電路板i與複數片的該第二電路板2呈電 =連結，同時該第二電路板2上的第三連接器㈣另一個 第-電路板2的第四連接器24電性連結，以組成一言六旦 的健存空間。 同合里 請參閱第六圖，係本創作之第一使用狀態示意圖。如 當本創作之該第—電路板i及該複數個第二電路板 :作機台控制或資料運算處理時，例如 ==該第一電路板1上，而第-個第二電路板; ，電源供應電路’第二個第二電路板2為記憶體電路，第 電：板為驅動電路、第四個第二電路板2為訊號 大電路’第五猶第二電路板2為訊號（能量）轉換電 路’第六個為傳輸介面電路，將前述的 、 IS?二器—電路板1的第-連接= 5時4第—電路板2上的第三連接器23與另一個 第二電路板2的第四連接器24電性連結，以形成—小型的 8 •M347016 控制裝置或電腦來進行機台控制或資料運算。 —^述僅為本創作之較佳實施例而已，並非用來限定本 創作實施之範圍。即凡依本創作中請專利範圍所做的均等 變化與修飾’皆為本創作專利範圍所涵蓋。 【圖式簡單說明】 第一圖，係本創作之組接成多邊形電路的電路板模組分解 不意圖。 第一圖，係本創作之組接成多邊形電路的電路板模組組合 示意圖。 第二圖，係本創作之組接成多邊形電路的電路板模組側視 示意圖。• M347016 VIII. New description: [New technical field] This creation is related to a modular circuit module, especially a circuit board module with a polygonal circuit. [Prior Art] Under the continuous advancement of technology, the volume of many electronic components is getting smaller and smaller, so that 70 pieces of electronic materials can be directly electrically connected to the circuit board through surface adhesion technology, so that the electronic products are small, small or small. The purpose of the thinning design is convenient for the user to carry out or collect. As the size of the electronic product shrinks, the size or area of the internal circuit board is also relatively reduced, which also causes some infrequently making the circuit or the hardware to be discarded. In order to allow the electronic product to be expanded in the future. At the time of function, at least one expansion slot is reserved on the circuit board of the electronic product or a plurality of connectors are exposed on the casing of the electronic product, so that the user can expand or connect the external peripheral device. Although this type of design allows the size or area of the electronic product to be reduced, and allows the user to expand or use the peripheral device as needed, but outside the carrying (4), the user is extremely inconvenient to carry. [New Content] Therefore, the main purpose of the present invention is to enable a user to expand the memory capacity according to the facsimile circuit board module, or to allow the manufacturer to follow the assembled circuit board module. To produce a miniaturized computer, to miniaturize the computer to control the machine or computing data. In order to achieve the above object, the present invention provides a circuit board module having a multi-pole 5 M347016-shaped circuit, comprising: a first circuit board, a second circuit board, and a heat dissipation structure. The first circuit board has a first function circuit, the function circuit is a memory expansion circuit, or the first function circuit is a control circuit (including a microprocessor), and the periphery of the first circuit board has at least one a connector, the first connector to provide a plurality of second boards. The second circuit board has a second function circuit, and the second function circuit 21 is a memory expansion circuit, or a driving circuit, a power supply circuit, a signal amplifying circuit, a detecting (sensing) circuit, a charging circuit, and a signal (energy) a conversion circuit, a transmission interface circuit, an automatic cut-off signal circuit, etc. - the periphery of the second circuit board has a second connector, a third connector, and a fourth connector. The heat dissipation structure is disposed in a space surrounded by the first circuit board and the second circuit board, and is electrically connected to the first functional circuit of the first circuit board and the second functional circuit of the second circuit board. The electronic component contacts to absorb the heat source generated by the electronic component. [Embodiment] The technical contents and detailed descriptions of this creation are as follows: Circuit board 1, H-way board 2, and heat dissipation structure 3. The β-th circuit board 1 ′ has a first-function circuit U, and the function circuit 11 is a memory expansion circuit electrically connected to the plurality of memory sockets in to provide the plug-in memory 112, or the first-function circuit (4) Please refer to the drawing, combination and side view of the circuit board module of the group of the creation of the polygon circuit in the first, second and third figures. As shown in the figure: This is a circuit board module with a polygonal circuit, including a 6th M347016 control circuit (including a microprocessor). Moreover, at least the first connector 12 is provided on the periphery of the first circuit board i, and the first connector 12 is provided to plug a plurality of second circuit boards 2. In this figure, the first connector is composed of a plurality of conductive pins. The second circuit board 2 has a second function circuit 21 thereon. The second function circuit 21 is a memory expansion circuit electrically connected to the plurality of memory sockets 2H to provide the plug memory 212, or The second functional circuit # 21 is another driving circuit, a power supply circuit, a signal amplifying circuit, a detecting (sensing) circuit, a charging circuit, a signal (energy) conversion circuit, a transmission interface circuit, an automatic cutoff signal circuit, and the like. One. Moreover, a second connector 22, a third connector four and a fourth connector 24 are provided on the periphery of the second circuit board 2, and the third connector 22 is provided to the other second circuit board 2. The fourth connector 24 is plugged, and the second connector 22 is for mating with the first connector 12 of the first circuit board 1. In the present drawing, the second connector 22 is a connector of a plurality of jacks, the third connector is a cable, and the fourth connector is a plurality of conductive pins. The 5th heat dissipation structure 3 is disposed at the center of the space surrounded by the first circuit board 1 and the second circuit board 2, and the first functional circuit 11 of the first circuit board 1 and the first circuit board 2 The second functional circuit 21 is electrically connected to the electrically connected electronic component to absorb the heat source generated by the electronic component. The heat dissipation structure 3 comprises a heat conducting component 31, a heat sink fin 32 and a fan 33. The heat conducting component 31 is one of a heat conducting block, a heat conducting plate, a temperature equalizing plate or a heat pipe. The heat conducting component 31 is attached to the surface of the electronic component of the memory 212, and after absorbing the heat source generated by the electronic component, the heat source is used. Passed to 7 'M347016 heat sink fins 32 heat dissipation' and then the fan 32 turns down to make the air flow, so that the heat source released by the loose rail fins 32 can be quickly dissipated to ensure the positive operation of the electronic components. Please refer to the fourth and fifth figures, which is the first part of the creation - the use of state decomposition and the combination of intentions. As shown in the figure: when the first circuit board 1 and the second circuit board 2 of the present invention are expanded in memory capacity, the first functional circuit 11 on the first circuit board i and the plurality of first connection (four) Sexually connected, and the second functional circuit 21 on the second circuit board 2 is a memory circuit, and the second connector 22 of the second circuit board 2 is plugged with the first connection (4) of the first circuit ^, so that The first circuit board i is electrically connected to the second circuit board 2 of the plurality of boards, and the third connector (four) of the second circuit board 2 is electrically connected to the fourth connector 24 of the other first circuit board 2. To form a living space for a word. Tongheli Please refer to the sixth figure, which is the first state of use of this creation. For example, when the first circuit board i and the plurality of second circuit boards are used for machine control or data operation processing, for example, == the first circuit board 1 and the first second circuit board; , the power supply circuit 'the second second circuit board 2 is a memory circuit, the first: the board is the drive circuit, the fourth second circuit board 2 is the signal big circuit 'the fifth and second circuit board 2 is the signal ( The sixth of the energy conversion circuits is a transmission interface circuit, and the third connector 23 on the second board 23 of the first, the second connection 23 of the IS-II-circuit board 1 is the second connector 23 and the other second The fourth connector 24 of the circuit board 2 is electrically coupled to form a small 8 M347016 control device or computer for machine control or data calculation. The description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, all the changes and modifications made in the scope of patents in this creation are covered by the scope of the patent. [Simple description of the diagram] The first figure is a decomposition of the circuit board module of the creation of the polygon circuit. The first picture is a schematic diagram of a circuit board module combination of a set of polygonal circuits. The second figure is a side view of a circuit board module in which the creation is connected into a polygonal circuit.
第四圖，係本創作之第 第五圖，係本創作之第 第六圖，係本創作之第 【主要元件符號說明】 第一電路板1 記憶體插座111 第一連接器12 第二功能電路21 記憶體212 第三連接器23 散熱結構3 散熱鰭片32 使用狀態分解示意圖 使用狀態組合示意圖 使用狀態示意圖。 第一功能電路11 記憶體112 第二電路板2 記憶體插座211 第二連接器22 第四連接器24 導熱元件31 風扇33 9The fourth picture is the fifth picture of this creation, which is the sixth picture of this creation. It is the first part of this creation. [Main component symbol description] First circuit board 1 Memory socket 111 First connector 12 Second function Circuit 21 Memory 212 Third Connector 23 Heat Dissipation Structure 3 Heat Dissipation Fin 32 Using State Decomposition Schematic The state combination diagram is used. First function circuit 11 memory 112 second circuit board 2 memory socket 211 second connector 22 fourth connector 24 heat conducting element 31 fan 33 9