M344578 八、新型說明： 【新型所屬之技術領域】 本創作係有關於-種電池之電性連接結構，特別係關於 一種鈕釦電池之電性連接結構。 【先前技術】 . 近年來’⑽半導體產業的縣發展，在先進的半導體 製程配合下’電子產品的體積越來越小，使得對應的蓄電裝 • £也以採用錄電池的設計為主，其設計方式通常係以電池 扣件來對她電池進行固定及電性連接，一般電池扣件的電 性連接處，主要負責提供與鈕釦電池之正極電性連接，至於 她電池的負極電性，則需要透過直接接觸在印刷電路板、 (Pnnted Circuit Board，PCB)上的烊盤(pAD)來導通 整個電源迴路。 口月茶閱第1圖」，「第1圖」係為細口電池於理想狀況 下的電性連接結翻面圖。在理想的電性連接狀態中，係在 • 印刷電路板1〇(包含填充材料層Π、銅箱層I2以及阻焊層13) 上，透過餘刻技術去除阻悍層13，使其銅箱層12外露，此外 露_域又鱗盤14，有焊盤14將在碰作說明；在焊 f 14上焊接一層高度略大於阻焊層13的焊錫層15，且為了 月b狗產生良好的電性連接絲，必需讓焊錫層15表面非常平 ，’此焊錫層15即為紐知電池2〇與印刷電路板1〇接觸的第 -電性接點16，因此細口電池負極21即可與第一電性接點 16上表面達到良好電性連接。 印刷電路板1〇與電池扣件3〇固定形成電性連接，並且 M344578 =:3°與印刷電路板10之間形成-個容置空間，除了 ::上二㈣:20同時還可固定知_也20，透過電池扣 成電性2 接點31，可以與細電池20的正極22形 成電丨生連接，即可完成整個電源迴路。 =祕生產技術的限制，實際上的焊錫層15並不容易 理4狀射的高度及平整度，為了改善此賴題，目前 :有兩種壯技術被普義來形成焊錫層15，第 喷錫技術；第二種方法為人工烊峨術。 "、、 =做術請參考「第2圖」所示，「第2圖」係為喷锡技 術之電性連接結構剖關，财省略電池扣件3()部份。此— 技術係為對，盤14表面進行倾作業，使鋪層12上方可 =形成-層局度ϋ定料層15;此—技術可以使烊錫層巧的 表面較為平整’並且可以完成大區域的接_積；但是，嗔 錫f标所產生的焊錫層15容易因高度不足，造成絲電池20 =錫層15之__面存在雜，產生雜連 的問題。 +卜反 =工烊錫技術請參考「第3圖」所示，「第3圖」係為人 工知錫技術之電性連接結。此-技___ 14 以人工方式進行焊錫作業，使銅騎12上方可以增加—層 錫層15 ;此-技術可以保證焊錫層15的高奴夠，使^ 池負極21與第-電性接點16的電性連接，不會產生電 接效果不，的_ ;但*，*於人王方式健，其焊锡 層15之尚度難以控制，過厚的焊錫層15不僅會增加 的成本，更會導致電池扣件3〇在固定錄電池2〇時1^M344578 VIII. New description: [New technical field] This creation is about the electrical connection structure of a battery, especially regarding the electrical connection structure of a button battery. [Prior Art] In recent years, '(10) the county development of the semiconductor industry, with the cooperation of advanced semiconductor processes, the volume of electronic products is getting smaller and smaller, so that the corresponding storage battery packs are also based on the design of the recording battery. The design method usually uses a battery fastener to fix and electrically connect her battery. Generally, the electrical connection of the battery fastener is mainly responsible for providing electrical connection with the positive electrode of the button battery. As for the negative polarity of the battery, The entire power supply circuit needs to be turned on by direct contact with a pad (pAD) on a printed circuit board or a Pnnted Circuit Board (PCB). "The first picture of the mouth of the moon is read in the first picture", and "the first picture" is a view of the electrical connection of the thin-mouth battery under ideal conditions. In the ideal electrical connection state, on the printed circuit board 1 (including the filling material layer 铜, the copper box layer I2 and the solder resist layer 13), the barrier layer 13 is removed by a residual technique to make the copper box The layer 12 is exposed, and in addition, the _ domain and the scale 14 are covered with a pad 14; a solder layer 15 having a height slightly larger than the solder resist layer 13 is soldered on the solder f 14 and is good for the month b dog. For the electrical connection wire, the surface of the solder layer 15 must be very flat. 'The solder layer 15 is the first electrical contact 16 of the Nikon battery 2〇 and the printed circuit board 1〇, so the thin battery negative electrode 21 can be The upper surface of the first electrical contact 16 achieves a good electrical connection. The printed circuit board 1〇 is fixedly connected to the battery fastener 3〇 to form an electrical connection, and the M344578=:3° forms an accommodation space with the printed circuit board 10, except:: the upper two (four): 20 can also be fixed. _ also 20, through the battery buckle into the electrical 2 contact 31, can be electrically connected to the positive electrode 22 of the thin battery 20, the entire power circuit can be completed. = The limitation of the production technology, in fact, the solder layer 15 is not easy to understand the height and flatness of the 4 shots. In order to improve this problem, at present: there are two kinds of strong technology by the Puyi to form the solder layer 15, the first spray Tin technology; the second method is artificial sputum. ",, = Please refer to the "Fig. 2" for the technique. The "Fig. 2" is the electrical connection structure of the tin-spraying technology, and the battery fastener 3 () is omitted. This - the technology is correct, the surface of the disk 14 is tilted so that the top of the layer 12 can be formed - the layer of the layer of the leveling layer 15; this technology can make the surface of the layer of tin-tin is relatively flat 'and can be completed However, the solder layer 15 generated by the bismuth tin standard is likely to be insufficient in height, causing the problem that the wire battery 20 = the surface of the tin layer 15 is miscellaneous, causing a miscellaneous connection. +Bu reversed = Please refer to "Figure 3" for the technology of industrial tin. The "3" is the electrical connection of the tin technology. This-technology ___ 14 manual soldering operation, so that the copper ride 12 can be added - layer of tin layer 15; this technology can ensure that the solder layer 15 high enough, so that the cathode 21 and the first - electrical connection The electrical connection of point 16 does not produce an electrical connection effect. However, *, * is hard to control the solder layer 15 in the way of the king, and the excessively thick solder layer 15 not only increases the cost. It will cause the battery fastener 3 to be in the fixed recording battery 2〇1^
焊盤 本 M344578 過大壓力而使「第3圖」圖中的電池扣件30變形彎曲，使得 鈕釦電池20難以放入及取出。 前面提到’焊盤14係用以焊接一層高度略大於阻焊層a 的焊錫層15, 一般常用的焊盤14的形狀請參閱「第4圖」，「第 4圖」係為圓形焊盤俯視圖，在印刷電路板10上的鈕釦電池 放置處40中間有一個圓形的焊盤14,透過焊接一層如「第3 圖」中的焊錫層15，用以接觸如「第3圖」中的鈕釦電池2〇 之鈕釦電池負極21，然而使用此形狀製成的焊盤14，因為面 積範圍較大，所以需要的焊錫料也隨之增加，產生耗費多餘 的焊錫料之問題。 、、 綜上所述，可知先前技術中長期以來一直存在細口電池 屯性連接效果不良、焊盤上錫不賴不均關題，甚至耗費 多餘的焊珊關題，·實有必要提出改進的技術手段，、 來解決此一問題。 【新型内容】 有馨於先雜畴在餘電池雜連接效果不良^ 創作不均的問題，甚至㈣多餘的桿錫料的問題， 作逐揭路一種細1電池之電性連接結構。 印屈=創作提供—種餘電池之電性連接結構，其中包含. 板、柵形焊錫層及電池扣件所組成。_電路板上 所串職嶋軸之數個栅 上垾錫料卿成，賴域之表_數個柵上焊 板之焊錫層，二=數個柵上形成高出於印刷電路 吏柵科錫層得叫密朗連接細σ電池之電 M344578 才°電池扣件係固定於印刷電路板上，並且在與拇形焊 錫層之間形成谷置空間，用以容納錦口電池並可緊密接觸钮 釦電池之電性另一極。 本創作所揭露之結構如上，與先前技術之間的差異在於 本創作透過焊編彡狀的改良，配合回流焊技術來產生與紐知 • 電池貞極雜連接之㈣層。透過上述的技術手段，本創作 可⑽成增強電池與電池扣狀緊密度以及節省觸料的技 術功效。 * 【實施方式】 、以下將配δ圖式及實施例來詳細說明本創作之實施方 式’藉此對本創作如何應用技術手段來解決技術問題並達成技 術功效的實現過程能充分理解並據以實施。 一般而&，習知的焊盤形狀如「第4圖」中的焊盤14所 示意，因為焊盤14的面積範圍較大，所以需要的焊錫料也隨 之增加，因此，本創作提出一種鈕釦電池之電性連接結構，透 • 聯盤14形狀的改良，配合回流焊技術來產生與紐知電池之 電性一極(例如··負極）電性連接之焊錫層，所述回流焊技術為 習知麟，翻以控辩勒的高度，關於回辦技術的詳細 做法，在此不作贅述。 以下配合「第5圖」及「第6圖」以實施例方式進行如下 說明’請先參閱「第5圖」，「第5圖」係為本創作之柵形焊盤 俯視圖，包含：印刷電路板10、紐知電池放置處4〇及栅形焊 盤50。其中’拇形辉盤5〇係藉由蝕刻技術去除阻焊層13形 成於印刷電路板10上，栅形焊盤5〇中的栅形區域係由數個柵 M344578 所串聯組成(例如：以一個垂直的栅將數個等間隔的平行拇串 聯），其柵職域的位置可如「第5圖」所示意位於絲電池 的電1·生極(例如·負極)之範圍的中心位置，而其拇形區域的 形狀為圓形、四邊形或三角形的幾何圖形，且面積可小於鈕釦 電池之電性-極(例如：負極）的面積；紐知電池放置處， ' 係用以在印刷電路板10上放置錄電池的地方，如「第5圖」 所示意，可看到栅形焊盤50係由九個平行且等間隔的拇所組 • 成’且可在中間以—個垂直的栅進行串聯，形成-個栅形焊盤 5〇的形狀’此栅形焊盤50的材料可從銅、銀、金、鎳及錫的 材料組合中選擇，與「第4圖」中習知的焊盤14形狀相比， 面積範圍較小，所以能夠節省焊錫料。 、請參閱「第6圖」，「第6圖」係為本創作紐知電池之電 性連接結構剖面圖，包含：印刷電路板1〇、銅箱層12、阻焊 層13、鈕釦電池20、鈕釦電池負極21、鈕釦電池正極22、 電池扣件30、柵形焊盤50及柵形焊錫層51。其中，印刷電 • 路板10具有銅箱層12及阻焊層I3，透過爛技術去除阻焊 • 層I3，使銅箔層12外露形成柵形區域之栅形焊盤5〇，並在 栅形焊盤50上以回流焊技術焊接一層高於阻焊層13的栅形 焊錫層51，使柵形焊錫層51得以緊密接觸連接鈕釦電池之電 性一極(例如：鈕釦電池負極21)，所述姓刻技術係將材料（例 如阻力干層13)以化學反應或物理撞擊作用而移除的技術，由 於蝕刻技術為習知技術，故在此不再作贅述；電池扣件30可 透過焊接或螺釘固定於印刷電路板10上，更包含至少一個電 性接點用以頂抵鈕釦電池2〇，並且在栅形焊錫層51之間形成 9 M344578 ίί:Γ:广容納一池2°並可緊密接觸—電池2〇 之電性另一極(例如:鈕釦電池正極22)。 田細口電池2G如「第6圖」所示意置於上述容置空間時， 口為栅形焊錫層51高出於印刷電路板1〇， :。之電性一極(例如⑽^ J mr/ #極(例如.知知電池正極22)得以緊密接觸電池 扣件30而產生良好的電性連接。 紅上所述，可知本創作與先前技術之間的差異在於透過 ^盤形狀改㈣技術手段，藉由此—技射段可賤合回流 焊技術產生具冑_闕層的雜連接賴，來解決先前技 術所，在絲電池電性連接效果不良、焊盤上錫不易與不均 的問題’甚至耗費多餘的蟬錫料的問題，進而達成增強電池 與電池扣件之緊密度、簡化焊盤上錫程序以及節省谭錫料的 技術功效。 雖然本創作所揭露之實施方式如上，惟所述之内容並非 用以直接限定本創作之專娜護範圍。任何本創作所屬技術 領域中具有通常知識者，在不脫離本創作所揭露之精神和範 圍的則長:下，可以在實施的形式上及細節上作些許之更動。 本創作之專利保護範圍，仍須以所附之申請專利範圍所界定 者為準。 【圖式簡單說明】 第1圖為標準鈕釦電池之電性連接結構剖面圖。 第2圖為利用噴錫技術所產生紐釦電池之電性連接結構 剖面圖。 10 M344578 第3圖為利用人工焊錫技術所產生鈕釦電池之電性連接 結構剖面圖。 第4圖為圓形焊盤俯視圖。 第5圖為本創作之栅形焊盤俯視圖。 第6圖為本創作鈕釦電池之電性連接結構剖面圖。 【主要元件符號說明】 10 印刷電路板 11 填充材料層 12 銅箱層 13 阻焊層 14 焊盤 15 焊錫層 16 第一電性接點 20 鈕釦電池 21 紐知電池負極 22 紐知電池正極 30 電池扣件 31 第二電性接點 40 知知電池放置處 50 柵形焊盤 51 栅形焊錫層 11Pad This M344578 excessive pressure causes the battery fastener 30 in the "Fig. 3" diagram to be deformed and bent, making it difficult to insert and remove the button battery 20. As mentioned above, the pad 14 is used to solder a solder layer 15 having a height slightly larger than the solder resist layer a. For the shape of the commonly used pad 14, please refer to "Fig. 4", and "Fig. 4" is a circular solder. In the top view of the disk, there is a circular pad 14 in the middle of the button cell placement 40 on the printed circuit board 10, and a solder layer 15 as in "Fig. 3" is soldered to contact the "Fig. 3". In the button cell of the button cell 2, the cell negative electrode 21 is used. However, since the pad 14 made of this shape has a large area, the required solder material is also increased, which causes a problem of excessive solder material. In summary, it can be seen that in the prior art, there has been a long-term poor connection of the fine-mouth battery, the unevenness of the solder on the pad, and even the unnecessary soldering problem, and it is necessary to propose an improved technology. Means, to solve this problem. [New content] There is a problem that the miscellaneous miscellaneous miscellaneous miscellaneous miscellaneous miscellaneous connection in the remaining cells, the problem of uneven creation, and even (four) the problem of excess rod tin, is the electrical connection structure of a fine 1 battery. Yin Qu = creation provides - the electrical connection structure of the remaining battery, which consists of a plate, a grid solder layer and a battery fastener. _The number of gates on the circuit board is on the grid, and the surface of the Lai domain is _ several soldering layers on the gate, and the second gate is formed on the gate. The tin layer is called Mlang's electric M344578. The battery fastener is fixed on the printed circuit board and forms a valley space between the thumb and the solder layer to accommodate the Jinkou battery and can be in close contact. The other side of the button battery is electrically. The structure disclosed in the present application is as above, and the difference from the prior art is that the creation is improved by the weld braid, and the reflow soldering technique is used to produce the (four) layer which is connected to the battery of the Nikko battery. Through the above technical means, the creation can (10) enhance the battery and battery button tightness and save the technical effect of the touch. * [Embodiment] The following is a description of the implementation of the present invention in conjunction with the δ schema and the examples. Thus, the implementation process of how to apply the technical means to solve the technical problem and achieve the technical effect can be fully understood and implemented. . Generally, the conventional pad shape is as shown by the pad 14 in "Fig. 4". Since the area of the pad 14 is large, the required solder material is also increased. Therefore, this creation proposes An electrical connection structure of a button battery, which improves the shape of the through-disc 14 and cooperates with a reflow soldering technique to generate a solder layer electrically connected to an electric pole (for example, a negative electrode) of a Nikko battery. The welding technology is Xi Zhilin, and the height of the control is the height of the control. The detailed practice of the technology is not described here. The following is a description of the following examples in conjunction with "Figure 5" and "Figure 6". Please refer to Figure 5 for details. Figure 5 is a top view of the grid pad of the creation, including: Printed Circuit The board 10, the battery compartment 4 and the grid pad 50. Wherein, the 'bump-shaped flash disk 5' is formed on the printed circuit board 10 by etching removal of the solder resist layer 13, and the gate-shaped region in the gate pad 5 is composed of a plurality of gates M344578 connected in series (for example: A vertical grid will be connected in series with a number of equally spaced parallel thumbs. The position of the grid is as shown in Figure 5, which is located at the center of the range of the electricity source (eg, the cathode) of the wire battery. The shape of the thumb-shaped area is a circular, quadrangular or triangular geometry, and the area may be smaller than the area of the electric-pole (eg, the negative electrode) of the button battery; the battery is placed at the location, ' is used in the printed circuit Where the battery is placed on the board 10, as shown in Fig. 5, it can be seen that the grid pad 50 is composed of nine parallel and equally spaced thumbs and can be vertically vertical. The gates are connected in series to form a shape of a gate pad 5A. The material of the gate pad 50 can be selected from a combination of materials of copper, silver, gold, nickel and tin, and is known in FIG. Compared with the shape of the pad 14, the area is small, so that solder can be saved. Please refer to "Figure 6", "Figure 6" is a cross-sectional view of the electrical connection structure of the battery, including: printed circuit board 1 铜, copper box layer 12, solder resist layer 13, button battery 20. The button battery negative electrode 21, the button battery positive electrode 22, the battery fastener 30, the grid pad 50, and the grid solder layer 51. Wherein, the printed circuit board 10 has a copper box layer 12 and a solder resist layer I3, and the solder resist layer I3 is removed by a rotting technique, so that the copper foil layer 12 is exposed to form a gate-shaped region of the gate-shaped pad 5 〇, and A grid-shaped solder layer 51 higher than the solder resist layer 13 is soldered on the pad 50 by a reflow soldering technique, so that the gate solder layer 51 is in close contact with the one pole of the button cell (for example, the button cell negative electrode 21) The technique of surname engraving removes the material (for example, the resistance dry layer 13) by chemical reaction or physical impact. Since the etching technique is a conventional technique, it will not be described herein; the battery fastener 30 It can be fixed to the printed circuit board 10 by soldering or screwing, and further comprises at least one electrical contact for abutting the button battery 2 〇 and forming a 9 M344578 ίί: 广 between the grid-shaped solder layers 51 The pool is 2° and can be in intimate contact—the other pole of the battery 2〇 (eg button cell positive 22). When the field fine-cell battery 2G is placed in the above-mentioned accommodation space as shown in "Fig. 6", the gate-shaped solder layer 51 is higher than the printed circuit board 1 :. The electrical one pole (for example, (10)^J mr/# pole (for example, knowing the battery positive electrode 22) is in close contact with the battery fastener 30 to produce a good electrical connection. As described above, it can be seen that the present invention and the prior art The difference between the two is to change the (four) technical means by means of the shape of the disk, whereby the technique can be combined with the reflow soldering technology to produce a hybrid connection with a 胄 阙 layer to solve the prior art, the electrical connection effect in the wire battery Poor, the problem of tin and uneven solder on the pad 'even the problem of excess tin-filled material, and thus achieve the enhanced battery and battery fastener tightness, simplify the soldering process on the pad and save the technical benefits of tan tin. Although the embodiments disclosed in the present disclosure are as described above, the above description is not intended to directly limit the scope of the present invention. Anyone having ordinary knowledge in the technical field of the present invention does not deviate from the spirit and spirit of the present disclosure. The scope is long: the following can be made in the form and details of the implementation. The scope of patent protection of this creation must still be defined by the scope of the attached patent application. Single explanation] Fig. 1 is a cross-sectional view showing the electrical connection structure of the standard button battery. Fig. 2 is a cross-sectional view showing the electrical connection structure of the button battery produced by the tin-spraying technique. 10 M344578 Fig. 3 shows the use of artificial soldering technology. A cross-sectional view of the electrical connection structure of the button battery is produced. Fig. 4 is a top view of the circular pad. Fig. 5 is a top view of the grid pad of the present invention. Fig. 6 is a cross section of the electrical connection structure of the button cell of the present invention. Fig. [Description of main component symbols] 10 printed circuit board 11 filling material layer 12 copper box layer 13 solder resist layer 14 pad 15 solder layer 16 first electrical contact 20 button battery 21 New Zealand battery negative 22 New Zealand battery Positive electrode 30 battery fastener 31 second electrical contact 40 knowing battery placement 50 grid pad 51 grid solder layer 11