M343287 八、新型說明： 【新型所屬之技術領域】 本創作涉及一種電連接器，尤其涉及一種可電性連接晶 模組至印刷電路板之電連接器。 Μ 【先前技術】 LGA(Land Grid Array)電連接器插座用以電性連接曰片模 組至印刷電路板。典型的LGA電連接器插座包括絕緣本=及= 容於絕緣本體内之複數導電端子，其中絕緣本體設有 導電端子之收容孔，導電端子包括固持部、自固持部一端 设置用以與印刷電路板連接之焊接部及自固持部另—沪 八 置之彈性部，彈性部末端設有與晶片模組接觸之接觸告:。^ 片模組下壓時，彈性部會彈性變形，以保證晶片模組:曰山曰 子間良好之電性連接。，然，彈性部彈性變形後 目對於晶片模組有一定之位移，隨著電連接】= 導= ，端子數目亦相應增加，晶片模組上之 W片數目亦相應增加’很容易發生個別導電端子滑出 ”且導電片之現象’使晶片模組與導電端子間脫離連接。a、 鑒於此，確有必要提供一種改進之 電連接器存在之缺陷。 【新型内容】 本創作之目的係提供一種電連， 曰^ ^ 插入力的同時可確保導電端子愈 日日片杈組苓 〇 /曰片柄組間良好之電性連接。 口口、馬貫現前述目的，本創作採用如下技術方 ^，包括絕緣本體、複數導電端 σ ^ ^ 私連接 φ ^ ^ ^ L 子、弹性兀件及一座體。豆 中、、、巴緣本體包括底壁及自底壁四週 / :二、 括凹陷部及相對凹陷部位置較高 、土 & 土匕 收容導電端子之端子收容孔。導 陷部設有複數 電片接觸之接觸部及與印刷電路=^又有與晶片模組之導 於絕緣本體之支撐部上用以二焊；：。座體抵靠 今日日片挺組，座體略大於晶片 M343287 模組且可於水平方向上進行移動。 之座二技術’本創作通過設置-尺寸略大於晶片模组 入力：=:曰曰=組’保證了晶片模組與導電端子間以零插 晶片模組導電片ί導電端子之接觸部相對於 之電性連接。 ,，保證了晶片模組與導電端子間良好 【實施方式】 彈性2、*創作電連接11 _包括、絕緣本體1、 坪f生70件2、導電端子3及座體4。 壁12絕广 ==括底;Γ及自底壁11四週延伸設置之側 ΐ二面二部112包括用以安裝至印刷電路板(未圖示) G二==數第:ί:，貫穿第-表面^ 甘Γ 叹有稷數收谷導電端子3之端子收容孔 右第if 一側壁12内側設有凹槽121，凹槽121延伸設置 有弟一凸柱1211。 &丨τ σ又直 伸之ίΐΓ313ϊϊ固持部32、自固持部32 一端向上彎折延 及自固持部32另一端向下延伸出煜 33’彈/體V:末端設有接觸部311用以電性 底邱41 晶片模組5，其包括平板狀之底部41及自 曰i模电四5週延伸設置之側牆42。其中底部41設有用以承接 二^ 土之承接面411及相對之抵靠面412 ’貫穿承接面 及抵靠面412設有複數貫穿孔4111，其中一 側向1 卜延伸設有第二凸柱421。 相U回42之外 緣本100組裝完成後’彈性元件2 -端連接至絕 切。座許4^凸柱12U，另一端連接至座體4之第二凸柱 於π绫太辦 於絕緣本體1内，座體4之抵靠面412抵靠 導：：丨之支撐部lu上且可於水平方向上進行移動。 U23内，二固Λ部山32牢固定位於絕緣本體1之端子收容孔 崔保¥电端子3牢固定位於絕緣本體1中，導電端 6 M343287 子3之焊接部33露出絕緣本體丨之第 焊接至印刷電路板，導電端 22用以電性M343287 VIII. New Description: [New Technical Field] The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a crystal module to a printed circuit board. Μ [Prior Art] LGA (Land Grid Array) electrical connector socket is used to electrically connect the cymbal module to the printed circuit board. A typical LGA electrical connector socket includes an insulating body and a plurality of conductive terminals housed in the insulating body, wherein the insulating body is provided with a receiving hole of the conductive terminal, the conductive terminal includes a holding portion, and one end of the self-holding portion is disposed for the printed circuit The welded portion and the self-holding portion of the board are connected to each other, and the elastic portion of the Shanghai-eighth portion is provided with a contact with the wafer module at the end of the elastic portion. ^ When the film module is pressed down, the elastic part will be elastically deformed to ensure a good electrical connection between the wafer module and the mountain. However, after the elastic portion is elastically deformed, there is a certain displacement for the wafer module. With the electrical connection, the number of terminals is correspondingly increased, and the number of W chips on the chip module is correspondingly increased. The terminal slides out "and the phenomenon of the conductive sheet" to disconnect the wafer module from the conductive terminal. A. In view of this, it is necessary to provide a defect of the improved electrical connector. [New content] The purpose of this creation is to provide An electrical connection, 曰 ^ ^ insertion force can ensure a good electrical connection between the conductive terminals and the 柄 曰 曰 曰 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 、 、 。 。 、 。 、 、 。 。 。 。 、 、 ^, including the insulating body, the complex conductive end σ ^ ^ private connection φ ^ ^ ^ L sub, elastic element and a body. The bean body, the body of the bar edge includes the bottom wall and the periphery of the bottom wall /: two, including the depression The position of the portion and the relatively depressed portion is higher, and the soil & the earthworm accommodates the terminal receiving hole of the conductive terminal. The guiding portion is provided with a contact portion of the plurality of electrical sheets and is insulated from the printed circuit. this The support part is used for two-welding; the seat body is abutted against the Japanese film set, the seat is slightly larger than the chip M343287 module and can be moved in the horizontal direction. The seat two technology 'this creation by setting - the size is slightly Greater than the wafer module input force: =: 曰曰 = group 'guarantee ensures that the contact between the wafer module and the conductive terminal is electrically connected to the contact portion of the conductive chip of the wafer module. Good with the conductive terminals [Embodiment] Elastic 2, *Create electrical connection 11 _include, insulative body 1, 70 pieces of flat, 2 conductive terminals 3 and seat 4. Wall 12 is wide == bottom; Two sides and two sides 112 extending from the periphery of the bottom wall 11 are included for mounting to a printed circuit board (not shown). G===Number: ί:, through the first surface ^ Gan Γ 稷 稷The terminal receiving hole of the valley conductive terminal 3 is provided with a groove 121 on the inner side of the right side wall 12, and the groove 121 is extended with a protrusion 1211. The device 丨τ σ is extended directly to the holding portion 32 and the self-holding portion 32. One end is bent upward and extends from the other end of the self-holding portion 32 downwards 煜 33' bullet / body V: end design The contact portion 311 is used for the electrical bottom plate 41. The wafer module 5 includes a flat bottom portion 41 and a side wall 42 extending from the 四i mold for four weeks. The bottom portion 41 is provided for receiving the two soils. The surface 411 and the opposing abutment surface 412' are provided with a plurality of through holes 4111 extending through the receiving surface and the abutting surface 412, wherein the second protrusion 421 is extended from one side to the other side. After completion, the elastic member 2 - end is connected to the absolute cut. The seat 4 ^ stud 12U, the other end is connected to the second stud of the seat 4 in the π 绫 too in the insulative body 1 , the seat 4 abuts The surface 412 abuts against the guide: the support portion lu of the crucible and is movable in the horizontal direction. In U23, the two solids are partially positioned in the terminal receiving hole of the insulative housing 1. The Cui Bao ¥ electrical terminal 3 is firmly positioned in the insulative housing 1, and the soldering portion 33 of the conductive end 6 M343287 sub 3 is exposed to the first insulative body. To the printed circuit board, the conductive end 22 is used for electrical
之Μ #而11 、 早性邛3 1露出絕緣本體I 孔川W吏導電端子3之接觸部311露出座體 以便與晶片模組5實現電性連接。 11， 模组二ί广挪一圖所不’晶片模組5組裝入座體4時，曰片 =_4之側牆42間有一 ；：片 與導電端子3、* 4 17 則承日日月換組5 告曰g H 令插力方式接觸。請同時參閱第三圖所干， 觸部3H位置相對曰片二會受T麼力彈性變形，接 合向讯右笛Λ /日日片杈刖移，同時晶片模組5相岸地 曰向叹有罘二凸柱421之側牆4 仰應地t I縮彈性元件2，第 ：近凸：而二動座體4 動。 「J罪近弟一凸柱1211方向運 請同時參閱第四圖所示，當第二 對接接觸時，晶片模组5血導；=二與弟-凸柱1211 此時，導電踹早i l拉* 達到最佳之接觸狀態， 葬由接觸部311與座體4之承接面4U齊平。 猎由座體4之運動，佶曰H《士 r牧W w i月十。 動，減小了導電端可相應地向同-方向運 圖示）之位移，確相對於晶片模組導電片（未 組Λί:片二導了電^^ 性連接。 了 aa片权組5與導電端子3間良好之電 2晶片模組5後，晶片模 之作用力消除，故座體4為剌# — 丄篮4及子3 平方向上向遠離第二Γ2 ^ 性部31恢復初始狀態，，導電端子3之彈 之承接面411。 ， 柒子3之接觸部311露出座體4 白上於#!作重,Ua構在於：於絕緣本體1上設置一可於水平方 向上移動之座體4，卞乃 模組5盘導勺山子片板組5略小於座體4之大小，確保晶片 於水平方： 零插入力方式接觸，同時由於座體何 子3之Γ 1纖行移動，使晶片模組5下壓時，可隨著導電端 平艾开^進仃移動，減小了導電端子^之接觸部3 U相對 7 M343287 於晶片模組導電片之位移，確保導電端子 滑出晶片模組5之導電片，保 觸邻311不曾 好之電性連接。 、SB吴、、且與導電端子3間良 ‘上所述，本創作符合難專利要件，依法提出專利申杜。 惟，以上所述者僅為本創作之較佳實 ^ 舉凡熟習_^ ，一圖係本創作電連接器之立體分解圖； 組裝創作電連接器之立體組合圖，其中晶片模組未 ^圖係本㈣t連接器之立體組合目，其巾晶片模組組 衣至=連接器，彈性元件處於初始狀態； 壯石I四圖係本創作電連接器之立體組合圖，其中晶片模組組 ^ 电連接裔’彈性元件處於壓縮狀態。 電連接器 底壁 凹陷吾[5 弟一表面 側壁 第一凸柱 導電端子 焊接部 接觸部 底部 抵靠面 侧牆 晶片模la 主要元件符號說明】 100 11 112 1122 12 1211 3 33 311 41 412 42 5 絕緣本體 1 支撐部 111 第二表面 1121 端子收容槽 1123 凹槽 121 彈性元件 2 固持部 32 彈性部 31 座體 4 承接面 411 貫穿孔 4111 第二凸柱 421Then, the early 邛3 1 exposes the insulating body I. The contact portion 311 of the hole W 吏 conductive terminal 3 exposes the body to be electrically connected to the wafer module 5. 11, module 2 广 挪 一 图 图 ' 晶片 晶片 晶片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片Group 5 tells g H to make contact with the insertion force. Please refer to the third figure at the same time. The position of the contact part 3H will be elastically deformed by the force of the T-piece 2, and the joint will be moved to the right-handed flute/Japanese-Japanese film, and the chip module will sigh on the shore. The side wall 4 having the second stud 421 is responsive to the ground, and the first and second convex bodies 4 are moved. "J crimes close to a pillar 1211 direction, please refer to the fourth figure, when the second docking contact, the wafer module 5 blood guide; = two brothers - studs 1211 At this point, the conductive 踹 early il pull * To achieve the best contact state, the burial is made by the contact part 311 and the bearing surface 4U of the seat body 4. The hunting is carried out by the movement of the seat body 4, 佶曰H "士r牧W W月月10. Moving, reducing the conductivity The displacement of the end can be correspondingly transferred to the same direction, and is indeed relative to the conductive piece of the wafer module (not set to :ί: the chip is electrically connected. The aa chip group 5 and the conductive terminal 3 are good. After the electric 2 chip module 5, the force of the wafer mold is eliminated, so the seat body 4 is 剌#_ 丄 basket 4 and sub 3 squares are returned upwards away from the second Γ 2 ^ portion 31 to restore the initial state, the conductive terminal 3 The contact surface 311 of the spring 3, the contact portion 311 of the rafter 3 is exposed to the body 4, and the Ua is placed on the body. The Ua is disposed on the insulating body 1 with a seat body 4 movable in the horizontal direction. The 5 disc guide spoons are set to be slightly smaller than the size of the seat body 4, ensuring that the wafer is horizontally: zero insertion force contact, and at the same time due to the seat body 3 1 fiber movement, when the wafer module 5 is pressed down, the conductive end can be moved with the conductive end, and the displacement of the contact portion 3 U of the conductive terminal to the conductive piece of the chip module is reduced. Ensure that the conductive terminals slide out of the conductive strips of the wafer module 5, and ensure that the adjacent 311 does not have a good electrical connection. SB Wu, and the conductive terminal 3 between the good, the creation meets the difficult patent requirements, according to the law Patent Shendu. However, the above is only a better example of this creation. _^, a picture is an exploded view of the original electrical connector; assembled stereo assembly of the electrical connector, in which the wafer module The group does not have a three-dimensional combination of the (four) t-connector, the towel chip module is assembled to the = connector, and the elastic element is in an initial state; the Zhuang Shi I four-picture is a three-dimensional combination diagram of the original electrical connector, wherein the wafer Module group ^ Electrical connection element 'elastic element is in compression state. The bottom wall of the electrical connector is recessed. [5 brother one surface side wall first stud conductive terminal soldering part contact part bottom abutment side wall chip mold la main component symbol description 】 100 11 112 1122 12 1211 3 33 311 41 412 42 5 Insulation body 1 Support part 111 Second surface 1121 Terminal receiving groove 1123 Groove 121 Elastic element 2 Retaining part 32 Elastic part 31 Seat 4 Bearing surface 411 Through hole 4111 Second stud 421