M342729 八、新型說明·· 【新型所屬之技術領域】 本創作係有關一種散熱模組，旨在提供一種能夠有 效提高空氣熱對流，進而大幅提升散熱效率的振盪散熱 模組。 【先前技術】 如第一圖所示即為一種晶片普遍習用的散熱模組， 此散熱模組主要係由一組與熱源體1(例如發光二極體或 顯示晶片）形成熱傳導接觸的一組散熱片2所構成；經由 散熱片2直接與熱源體1之間產生熱傳導作用，使熱源 體1所產生的熱能得以傳遞至散熱片2，透過盥散埶片2 與周圍空氣產生熱能交制熱對流仙，達賴孰源體 20降溫之目的。M342729 VIII. New Description·· [New Technology Field] This creation is about a heat dissipation module designed to provide an oscillating heat dissipation module that can effectively improve air heat convection and greatly improve heat dissipation efficiency. [Prior Art] As shown in the first figure, a heat dissipation module commonly used in a wafer is mainly used as a group of heat conduction contacts with a heat source body 1 such as a light emitting diode or a display wafer. The heat sink 2 is configured to directly transmit heat to the heat source body 1 via the heat sink 2, so that the heat energy generated by the heat source body 1 is transmitted to the heat sink 2, and the heat is generated by the heat sink 2 and the surrounding air. Convection, the purpose of the Dalai Lama source body 20 to cool down.
提升對熱源體1散熱效率。 當然’亦可進一步於散熱片2處裝設溫控風扇(圖 2的熱能排 ，作用，進而Improve the heat dissipation efficiency of the heat source body 1. Of course, it is also possible to further install a temperature-controlled fan at the heat sink 2 (the heat energy row of Figure 2, function, and further
5 M342729 【新型内容】5 M342729 [New content]
有鑑於此，本創作之主I 降提高散熱片之线即在提供—種能夠有效 β ” h,L效應’進而提升整體振盪散熱模 :二Γί率’甚至可藉此縮減散熱片之體積，使達到節 讀t即省空間功效的振盪散熱模組。 -組二本=之振_組係主要包括有 熱片上，利職蓋器所釋出之離=2=係裝設在散 用，提高散熱Jit 或超音波產生共振作 模組之散熱效率。工、⑽應’進而提升整體振盪散熱 小的赶」：，：放t ’在於上揭振盪器係可以為體積微 2超音波振盪子、壓電陶竟片或 形= h，相對較溫控風扇節省體積。 t π的振 的链=!!之功效之―’在於可配合將㈣器設於散埶片 間，不致於增加散熱片的體積，甚至在空以 料、節省空間之2。熱片之體積’達到節省材 【實施方式】 -獲可參閱本案圖式及實施例之詳-說明 組二广f叙縣料餘餘括有… 欣…片10及至少一振盪器20 ;其中·· 6 M342729 散熱片ίο係具有有一基部 用基部u供直接與熱源體3〇接;片ι:= 片 與熱源體30之間產生熱傳導作用 由政…片10 能得以傳遞至散熱片_各鰭片 熱能熱對流作用，達到對熱源、體3〇降溫二In view of this, the main I drop of the creation of the heat sink is to provide a kind of effective β ′ h, L effect 'and thus improve the overall oscillating thermal mode: two Γ rate' can even reduce the volume of the heat sink, The oscillating heat-dissipating module that achieves the space-saving effect of the section reading t--the group of two = the vibration _ group mainly includes the hot film, and the release of the profit cover is = 2 = the system is installed in the scattered, Improve the heat dissipation efficiency of the heat dissipation Jit or ultrasonic resonance module. The work, (10) should 'further improve the overall oscillation heat dissipation":,: put t 'is that the upper shaker system can be a volume micro 2 ultrasonic oscillator Piezoelectric ceramic film or shape = h, relatively lighter than the temperature-controlled fan. The chain of t π vibration =!! The effect of '! is that it can be used to set the (four) device between the divergent films, so as not to increase the volume of the heat sink, even in the space and space. The volume of the hot film 'to achieve material savings' [Embodiment] - can be referred to the drawings and the details of the embodiment - the description of the group of two broad f, the county of the remaining materials include ... Xin... 10 and at least one oscillator 20; · · 6 M342729 heat sink ίο has a base with a base u for direct connection with the heat source body 3; sheet ι: = heat transfer between the sheet and the heat source body 30 can be transferred to the heat sink Fin thermal energy convection, reaching the heat source, body 3 〇 cooling two
振盪Π=一振盪_係可以為體積微小的超音波 用以卜^ £或石英振盪子等形式的振盪器，主要 用以裝权在政熱片1G上’利雜盪_所釋出之離子風或 超音波產生共振作用，提高散熱片1G之空氣對流效應，進 而知1升整體振盪散熱模組之散熱效率。 請同時配合參照第二圖及第三圖所示，由於振盪器2〇 的體積相當微小，縱使直接設於散熱片1〇的外侧，亦相對 車父震設溫控風扇更節省體積，當然亦可如第四圖所示，將 振靈器20設於散熱片10的鰭片12之間，不致於增加散熱片 的體積，甚至在空氣對流效應提升之後，可藉此縮減散熱 片之體積，達到節省材料、節省空間之功效。 於實施時，熱源體係可以如第二圖及第三圖所示，為 包括若干發光二極體31及供裝載發光二極體31的基板 32，該散熱片10係可以如第三圖所示，採用鰭片12朝向熱 源體30方向延伸的方式配置，或是如第六圖所示，採用鰭 片12朝向熱源體3〇相反方向延伸的方式配置’並且如第三 圖所示，於散熱片1〇的基部11設有供與熱源體30基板32 接觸的片狀導熱材40;當然，散熱片1〇亦可以如第四圖所 不，採用鰭片12與熱源體30併列的方式配置，以及在各鰭 7 M342729 片12之間穿設有至少一與熱源體30接觸的管狀導熱材 50，使與散熱片10與熱源體30產生較佳熱傳導效應。 綜上所述，本創作提供一較佳可行之振盪散熱模組， 爰依法提呈新型專利之申請；本創作之技術内容及技術特 點巳揭示如上，然而熟悉本項技術之人士仍可能基於本創 作之揭示而作各種不背離本案創作精神之替換及修飾。因 此，本創作之保護範圍應不限於實施例所揭示者，而應包 括各種不背離本創作之替換及修飾，並為以下之申請專利 範圍所涵蓋。 【圖式簡單說明】 第一圖係為一般習用散熱模組之結構示意圖。 第二圖係為本創作第一實施例之振盪散熱模組外觀立體 圖。 第三圖係為本創作第一實施例之振盪散熱模組結構剖視 圖。 第四圖係為本創作第二實施例之振盪散熱模組結構平面 圖。 第五圖係為本創作第三實施例之振盪散熱模組結構剖視 圖0 【主要元件代表符號說明】 1熱源體 2散熱片 M342729 ίο散熱片 11基部 12鰭片 20振盪器 30熱源體 31發光二極體 • 32基板 ^ 40片狀導熱材 50管狀導熱材Oscillation Π = an oscillation _ can be used for small-sized ultrasonic waves in the form of oscillators or quartz oscillators, mainly used to charge the ions released on the political hot film 1G Wind or ultrasonic waves generate resonance, improve the air convection effect of the heat sink 1G, and then know the heat dissipation efficiency of the 1 liter overall oscillating heat dissipation module. Please refer to the second and third figures at the same time. Since the volume of the oscillator 2 is quite small, even if it is directly placed on the outer side of the heat sink 1 , it is more space-saving than the temperature-controlled fan of the vehicle. As shown in the fourth figure, the vibrator 20 is disposed between the fins 12 of the heat sink 10, so as not to increase the volume of the heat sink, and even after the air convection effect is increased, the volume of the heat sink can be reduced. Achieve material saving and space saving. In the implementation, the heat source system can include a plurality of light-emitting diodes 31 and a substrate 32 for mounting the light-emitting diodes 31 as shown in the second and third figures. The heat sink 10 can be as shown in the third figure. The fins 12 are arranged to extend toward the heat source body 30, or as shown in the sixth figure, the fins 12 are arranged to extend in the opposite direction of the heat source body 3' and extend as shown in the third figure. The base portion 11 of the sheet 1 is provided with a sheet-like heat conductive material 40 for contacting the substrate 32 of the heat source body 30; of course, the heat sink 1 can also be arranged in parallel with the heat source body 30 as shown in the fourth figure. And a tubular heat conductive material 50 that is in contact with the heat source body 30 is interposed between each fin 7 M342729 sheet 12 to produce a better heat conduction effect with the heat sink 10 and the heat source body 30. In summary, the present invention provides a preferred and feasible oscillating heat dissipation module, and submits a new patent application according to law; the technical content and technical features of the present invention are disclosed above, but those familiar with the technology may still be based on this The creation of the creation and the various changes and modifications that do not depart from the creative spirit of the case. Therefore, the scope of protection of this creation should not be limited to those disclosed in the examples, but should include various substitutions and modifications that do not depart from the present invention and are covered by the following patent application. [Simple diagram of the diagram] The first diagram is a schematic diagram of the structure of a conventional conventional heat dissipation module. The second figure is an external perspective view of the oscillating heat dissipation module of the first embodiment of the present invention. The third figure is a cross-sectional view of the structure of the oscillating heat dissipation module of the first embodiment of the present invention. The fourth figure is a plan view of the structure of the oscillating heat dissipation module of the second embodiment of the present invention. The fifth figure is a cross-sectional view of the structure of the oscillating heat dissipation module of the third embodiment of the present invention. [Description of main components and symbols] 1 heat source body 2 heat sink M342729 ίο heat sink 11 base 12 fin 20 oscillator 30 heat source body 31 light two Polar body • 32 substrates ^ 40 sheet heat conduction material 50 tubular heat conduction material