M342518 八、新型說明： 【新型所屬之技術領域】 本創作疋有關於^一種液晶顯不模組（Liquid Crystal • DisplayModule’LCM)，且特別是有關於一種組裝容易、重 工簡便之液晶顯示模組。 【先前技術】M342518 Eight, new description: [New technology field] This creation is about a liquid crystal display module (Liquid Crystal • DisplayModule 'LCM), and especially related to a simple assembly, easy to work, liquid crystal display module . [Prior Art]
隨著現代視訊技術的進步，液晶顯示模組已被大量地 使用於手機、筆記型電腦、個人電腦及個人數位助理(pDA) 等消費性電子產品的顯示螢幕上。一般而言，液晶顯示模 組是由液晶顯示面板、主印刷電路板與背光模組所組成， 其中主印刷電路板是用於提供外界電源至液晶顯示面板與 背光模組，以使背光模組產生光源而使液晶顯示面板顯示 影像。 .、 此外，背光模組通常由副印刷電路板、發光二極體 (Light Emitting Diode，LED)以及導光板所構成，其中發光 二極體是配置於副印刷電路板之表面，並鄰近導光板之入 光處，且副印刷電路板與主印刷電路板焊接組裝，以獲得 外界電源而使發光二極體產生光源。 & &' 圖1A為習知之一種液晶顯示模組的後視立體圖，而 圖1B為圖1A之液晶顯示模組之副印刷電路板與 體的上視圖。請參考圖ΙΑ、1B，習知之、'卢θ θ 1 X 一 一 /夜晶顯示模組100 之副印刷电路板120包括連接之光源部12如、彎折部η仳 與連接部120c而呈現L形狀，且多個發光二極體設於 光源部120a’而副印刷電路板120具有兩個第二^墊 5 M342518 (Pad)124，且兩第二接墊124是位於連接部12〇c，並分別 以A、K表示正負極性。 承接上述’液晶顯示模組100之主印刷電路板11〇具 有對應第二接墊124之第一接墊(未繪示），而副印刷電路 板120之光源部120a是卡置於主印刷電路板丨丨〇的背面上 (在圖1A中，因光源部120a被外框（未標示）遮住，故以虛 線表示透視狀態）。此外，習知技藝將彎折部12〇b向上彎 折，以使連接部120c與主印刷電路板11〇的正面連接，^ 中第二接墊124與第一接墊是用錫膏焊接，以將連接部 120c固定於主印刷電路板11〇表面。 藉由第二接墊124麵接至第一接墊，主印刷電路板 可提供外界電源至副印刷電路板120,以使發光二極體122 產生光源，進而將光源通過液晶顯示面板（未標示）以產生 影像。 然而’由於;fcp接錫賞置難以準確掌握，所以經常迭成 第一接墊與第二接墊124的連接情況不佳。當錫膏量過少 時，會造成主印刷電路板110與副印刷電路板12〇電性連 接狀況不佳，甚至有斷路的情事發生。當錫膏量過多時， 又會造成液晶顯示面板110與副印刷電路板120焊合不 均，甚至有短路的情事發生。 此外，將第一接墊與第二接墊124焊合之刷焊與壓焊 製程相當耗費工時，而使得液晶顯示模組1〇〇的製作成本 提高。另外，當主印刷電路板110或是副印刷電路板12〇 發生問題時，則必須要進行重工的過程，而要先將第一接 墊與第二接墊124解焊，再分別對主印刷電路板11〇與副 6 M342518 電路板12〇進行測試，如此—來，重工的步驟繁複， ^解知亦相當耗費卫時’因而大幅提升重卫的困難度與成 本0 2者，由於副印刷電路板12〇之光源部12〇&與連接部 120c是反折，而固定於主印刷電路板11〇表面，因此當液 晶顯示模組議與其他構件結合時(如手機的外殼），彎折 部120b之凸兀則容易與其他構件產生結構干涉，進而降低 液晶顯示模組100的可靠度與品質。 【新型内容】 有鑑於此，本創作之目的是提供—種液晶顯示模組， 其具有組裝容易、重工簡便之特點。 為達上述或是其他目的，本創作提出一種液晶顯示模 組’包括-液晶顯示面板、-主印刷電路板、―背光模组 以及至少-彈性導電s件’其中液晶顯示面板與背光模組 均配置於框帥am_，且背光是魏晶顯示面板疊 設’且主印刷電路板連接液晶顯示面板，並具有至少一個 第-接墊，而背光模組包括-導光板、—副印刷電路板與 多個發光S件，導光板疊設於液晶顯示面板表面，並具有 -入光面及-對應於液晶顯示面板之出光面，而副印刷電 路板具有至少—個第二㈣’轉光轉錄連接至副印 刷電路板，ϋ對躲導絲之，且彈性導電元件配 置於第-接墊與第二接塾之間，並_第—接墊與第二接 墊。 綜上所述，本創作之液晶顯示模組是利用彈性導電元 7 M342518 件耦接第一接墊與第二接墊，藉以電性 與副印刷電路板，如此即無需焊接製程電路板 晶顯示模組的纪裂過程；此外，由於重工、夜簡化液 雪紘、度66制h ’便日日顯示模組無 以重X的過程簡便，而可大幅降低製^ 為讓本創作之上述和其他目的、特徵 易懂’下文特舉較佳實施例，並配合 更明顯 明如下。 π附圖式’作詳細說 【實施方式】 圖2Α為依據本創作一實施例之液晶顯示模组立With the advancement of modern video technology, liquid crystal display modules have been widely used on the display screens of consumer electronic products such as mobile phones, notebook computers, personal computers, and personal digital assistants (pDAs). Generally, the liquid crystal display module is composed of a liquid crystal display panel, a main printed circuit board and a backlight module, wherein the main printed circuit board is used for providing external power to the liquid crystal display panel and the backlight module, so that the backlight module A light source is generated to cause the liquid crystal display panel to display an image. In addition, the backlight module is generally composed of a sub-printed circuit board, a light emitting diode (LED), and a light guide plate, wherein the light emitting diode is disposed on the surface of the sub printed circuit board and adjacent to the light guide plate. At the light entrance, and the sub printed circuit board is soldered and assembled with the main printed circuit board to obtain an external power source to cause the light emitting diode to generate a light source. 1A is a rear perspective view of a conventional liquid crystal display module, and FIG. 1B is a top view of a sub-printed circuit board and a body of the liquid crystal display module of FIG. 1A. Referring to FIG. 1B, the conventional printed circuit board 120 of the 'Lu θ θ 1 X-one/night crystal display module 100 includes a connected light source portion 12 such as a bent portion η 仳 and a connecting portion 120 c. L shape, and a plurality of light emitting diodes are disposed in the light source portion 120a' and the sub printed circuit board 120 has two second pads 5 M342518 (Pad) 124, and the two second pads 124 are located at the connecting portion 12〇c And the positive and negative polarities are represented by A and K, respectively. The main printed circuit board 11 of the above liquid crystal display module 100 has a first pad (not shown) corresponding to the second pad 124, and the light source part 120a of the sub printed circuit board 120 is stuck in the main printed circuit. On the back side of the stack (in Fig. 1A, since the light source portion 120a is covered by the outer frame (not shown), the see-through state is indicated by a broken line). In addition, the conventional technique bends the bent portion 12〇b upward so that the connecting portion 120c is connected to the front surface of the main printed circuit board 11〇, and the second pad 124 and the first pad are soldered with solder paste. The connecting portion 120c is fixed to the surface of the main printed circuit board 11. The main printed circuit board can provide external power to the sub-printed circuit board 120 by the second pad 124, and the light-emitting diode 122 generates a light source, thereby passing the light source through the liquid crystal display panel (not labeled) ) to produce images. However, because the fcp connection is difficult to accurately grasp, the connection between the first pad and the second pad 124 is often poor. When the amount of the solder paste is too small, the main printed circuit board 110 and the sub-printed circuit board 12 are electrically connected in a poor condition, and even an open circuit occurs. When the amount of the solder paste is too large, the liquid crystal display panel 110 and the sub-printed circuit board 120 may be unevenly soldered, and even a short circuit may occur. In addition, the brushing and pressure welding process of welding the first pad and the second pad 124 is labor-intensive, and the manufacturing cost of the liquid crystal display module 1 is improved. In addition, when there is a problem in the main printed circuit board 110 or the sub-printed circuit board 12, the process of rework must be performed, and the first pad and the second pad 124 are first desoldered, and then the main printing is performed separately. The circuit board 11〇 and the sub 6 M342518 circuit board 12〇 are tested, so that the steps of the heavy work are complicated, and the knowledge is also quite time-consuming, thus greatly improving the difficulty and cost of the re-environment. The light source part 12〇& of the circuit board 12 is folded back and fixed to the surface of the main printed circuit board 11b, so when the liquid crystal display module is combined with other components (such as the outer casing of the mobile phone), the bend The protrusion of the folded portion 120b easily interferes with the structure of other members, thereby reducing the reliability and quality of the liquid crystal display module 100. [New content] In view of this, the purpose of this creation is to provide a liquid crystal display module, which has the characteristics of easy assembly and simple workmanship. In order to achieve the above or other purposes, the present invention proposes a liquid crystal display module 'including a liquid crystal display panel, a main printed circuit board, a backlight module, and at least an elastic conductive member. The liquid crystal display panel and the backlight module are both Arranged in the frame handsome am_, and the backlight is Wei Jing display panel stack 'and the main printed circuit board is connected to the liquid crystal display panel, and has at least one first pad, and the backlight module includes - light guide plate, - sub printed circuit board and a plurality of light-emitting elements, the light guide plate is superposed on the surface of the liquid crystal display panel, and has a light-incident surface and a light-emitting surface corresponding to the liquid crystal display panel, and the sub-printed circuit board has at least one second (four) 'trans-lighted transcription connection To the sub-printed circuit board, the pair of wire guide wires are disposed, and the elastic conductive element is disposed between the first pad and the second port, and the first pad and the second pad. In summary, the liquid crystal display module of the present invention uses the elastic conductive element 7 M342518 to couple the first pad and the second pad, thereby electrically and sub-printed circuit boards, so that no soldering process circuit board crystal display is required. The process of the module's fragmentation process; in addition, due to heavy work, night simplification of liquid snow shovel, degree 66 system h', the daily display module has no process to increase the weight of X, and can greatly reduce the system to make the above and Other objects and features are readily understood. The preferred embodiments are set forth below, and the combinations are more apparent as follows. [FIG. 2A] A liquid crystal display module according to an embodiment of the present invention is shown.
圖，而圖2β為圖2Α之液晶顯示模組、、、一 么图9Λ +<刀解圖，且圖2C =。θ ΓΛ晶顯雜組之神刷魏板與發光元件的上 =圖3Α為圖2Α之液晶顯示模組沿Αα連線的局部剖 視圖’而圖3Β為圖2Α之液晶顯示模組沿βΒ連線的剖視 圖，且圖4Α為圖2Α之液晶顯示模組移除部份構件後=分 解圖。請參考圖2A〜2C、3Α〜3Β以及4Α，本創作之液晶 顯不模組200包括一液晶顯示面板21〇、一主印刷 220、一背光模組23〇、至少一彈性導電元件24〇、一框架 250以及一外框26〇，其中主印刷電路板22〇電性連接於液 晶顯示面板210與背光模組230。 液晶顯示面板210及背光模組230配置於框架250 内’而背光模組是與液晶顯示面板疊設，且外框26〇與框 架250對位組裝，以供背光模組23〇位於外框26〇與液晶 顯示面板210之間。在本實施例中，主印刷電路板220之 M342518 f折部222是彎折而連接至液晶顯示面板210之錯位區 212 ’以使主印刷電路板22〇貼附於外框26〇朝外（即異於 .背光模組230)之表面，且主印刷電路板220具有第一接墊 224 〇 此外，背光模組230包括一導光板232、一副印刷電 . 路板234與多個發光元件236，其中導光板232疊合於液 晶顯示面板210表面，且該導光板232具有一入光面（圖中 _ 未標號)及一對應於該液晶顯示面板210之出光面（圖中未 標號），而副印刷電路板234配置於導光板232之入光面側 邊處，且發光元件236電性連接於副印刷電路板234表面， 又發光元件236位於導光板232之入光面處，並用以產生 光源至導光板232 ’即導光板232之入光面位於側邊處， 且副印刷電路板234對應配置於導光板232之側邊處。 另外，副印刷電路板234具有對應第一接墊224之第 二接墊238，而彈性導電元件240配置於第一接墊224與 第二接墊238之間，並耦接第一接墊224與第二接墊238， ’且彈性導電元件240可與第一接墊224或第二接墊238連 ' 接或分離。 - 具體而言，彈性導電元件240之一端可固定於第一接 墊224，而另端是彈性抵頂於第二接墊238 ;或者，彈性導 電元件240之一端可固定於該第二接墊238，而另端彈性 抵頂於該第一接墊224 ;或者，彈性導電元件238之兩端 可分別彈性抵頂於該第一接墊224及該第二接墊238，而 本創作並不限定彈性導電元件240、第一接墊224與第二 接墊238之間的固定或是彈性抵頂方式。 9 M342518 由於第一接墊224與第二接墊238並非以焊接的方式 而將主印刷電路板220與副印刷電路板234電性導通，以 透過彈性導電元件240的彈性擴展而直接接觸第一接墊 212與第二接墊224,因此無需進行焊接製程而簡化組裝流 程，而使本創作之液晶顯示模組200得以減少組裝工時並 降低製作成本。 此外，當液晶顯示模組200組裝測試發現異常時，亦 僅需將主印刷電路板220自外框260之表面拆卸，即可與 副印刷電路板234分離，之後再分別對主印刷電路板220 或疋田彳印刷電路板234進行測試’由於本創作無需進行解 焊製程便可進行重工，因此可大幅提升重工的效率，並減 少重工的工時。 另外，習知技藝之液晶顯示模組1〇〇(如圖1A所示）會 有錫貧厚度不均的問題，甚至會造成結構干涉而影響可靠 度。反之，由於本創作無需進行焊接或是壓焊的製程便可 電性連接主印刷電路板220與副印刷電路板234，或可供 主印刷路板220或副印刷電路板234其中之一與該彈性導 電元件230之一端預先焊固，而於組裝時，彈性導電元件 230會依據實際組裝情形而以彈性擴展自動調整大小以降 低結構干涉的情事，同時彈性導電元件230之另端不需焊 固，而達到方便組裝，且具有較佳的品質與可靠度。 再者，習知技藝之副印刷電路板120(如圖1B所示）在 單獨測試時需要於第二接墊124處作壓鉗壓著動作，而本 創作之副印刷電路板234僅靠點對點的接觸方式即可進行 電性測試，如此亦可以避免習知技藝需要人工對位所造成 M342518 的不便。 在本實施例中，第一接墊224與第二接墊238的數量 分別是兩個，且為正、負極兩兩相對，然而，本創作並不 限定第一接墊224與第二接墊238的數量，舉例而言，熟 悉此項技藝者當可增設第一接墊224與第二接墊238的數 量以作為接地之用等等，此外，發光元件236可為發光二 極體’且發光元件236的數量為三個，然而，本創作亦不 限定發光元件236的種類與數量。 請再參考圖2A〜2C、3A〜3B以及4A，為進一步提升 背光模組230的光源品質，本實施例之背光模組230可更 包括鋁製之反射片231，且反射片231配置於導光板232 與外框260之間，以將朝外框260方向射出之光源再反射 回導光板232中，進而提高光源利用率。 此外，背光模組230亦可包括光學膜片233以提升光 源的均勻度，其中光學膜片233是配置於導光板232與液 晶顯示面板210之間，在本實施例中，光學膜片233的數 量例如為三片，且其可為擴散膜、增亮膜或棱鏡片 ，不過 本創作並不限制光學膜片233之數量與種類。 值得一提的是，相較於習知技藝之副印刷電路板 120(如圖iB所示）為L形狀而言，本創作之副印刷電路板 234之开》狀為一字形狀，如此可以增加副印刷電路板234 的排版利用率以降低成本，並可降低副印刷電路板234組 裝至主印刷電路板22〇的困難度，此外，副印刷電路板2料 與主印刷電路板220均可為軟性印刷電路板，以提升组裝 上的彈性。 11 M342518 在本實施例中，外框260例如是以卡合的方式而與框 架MO結合組裝，主印刷電路板220可藉由第一黏合件 262，而黏合至外框26〇異於背光模組23〇之表面，第一黏 合件262例如為雙面膠帶，液晶顯示面板21〇可藉由第二 =合件252而固定於框架250中’第二黏合件252例如為 黑，雙面膠帶以避免漏光之情事，且彈性導電元件24〇例 =導電_，㈣本創作並*限定彈性導電元件24〇的 重頌’以下將再配合圖示另舉實施例。 圖4B與圖4C分別為依據本創作另一眚 、 且移除部份構件後的分解圖。請參考= 顯示模組鳥、2嶋與液晶顯示模組200(如圖 導電彈簧與導電彈二Fig. 2β is a liquid crystal display module of Fig. 2, Fig. 9 Λ + < Knife map, and Fig. 2C =. θ ΓΛ 显 显 之 之 魏 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = A cross-sectional view, and FIG. 4A is an exploded view of the liquid crystal display module of FIG. 2A to 2C, 3Α3Β, and 4Α, the liquid crystal display module 200 of the present invention includes a liquid crystal display panel 21〇, a main printing 220, a backlight module 23〇, at least one elastic conductive element 24〇, A frame 250 and an outer frame 26 are, wherein the main printed circuit board 22 is electrically connected to the liquid crystal display panel 210 and the backlight module 230. The liquid crystal display panel 210 and the backlight module 230 are disposed in the frame 250. The backlight module is stacked on the liquid crystal display panel, and the outer frame 26 is assembled with the frame 250 for the backlight module 23 to be located on the outer frame 26 Between the 〇 and the liquid crystal display panel 210. In the present embodiment, the M342518 f-folded portion 222 of the main printed circuit board 220 is bent and connected to the dislocation area 212' of the liquid crystal display panel 210 such that the main printed circuit board 22 is attached to the outer frame 26 to face outward ( That is, the surface of the backlight module 230) is different from the surface of the backlight module 230, and the main printed circuit board 220 has a first pad 224. In addition, the backlight module 230 includes a light guide plate 232, a pair of printed circuits, and a plurality of light-emitting elements. 236, wherein the light guide plate 232 is superposed on the surface of the liquid crystal display panel 210, and the light guide plate 232 has a light incident surface (not labeled in the figure) and a light emitting surface corresponding to the liquid crystal display panel 210 (not labeled in the figure). The sub-printed circuit board 234 is disposed at the side of the light-incident surface of the light guide plate 232, and the light-emitting element 236 is electrically connected to the surface of the sub-printed circuit board 234, and the light-emitting element 236 is located at the light-incident surface of the light guide plate 232, and is used. The light incident surface of the light guide plate 232 is generated at the side of the light guide plate 232, and the sub printed circuit board 234 is disposed at the side of the light guide plate 232. In addition, the sub-printed circuit board 234 has a second pad 238 corresponding to the first pad 224 , and the elastic conductive element 240 is disposed between the first pad 224 and the second pad 238 , and is coupled to the first pad 224 . And the second pad 238, 'and the elastic conductive element 240 can be connected or separated from the first pad 224 or the second pad 238. Specifically, one end of the elastic conductive element 240 may be fixed to the first pad 224, and the other end is elastically abutted against the second pad 238; or one end of the elastic conductive element 240 may be fixed to the second pad 238, and the other end is elastically abutted against the first pad 224; or the two ends of the elastic conductive element 238 can be elastically abutted against the first pad 224 and the second pad 238, respectively, and this creation does not The elastic conductive element 240, the fixing between the first pad 224 and the second pad 238 or the elastic abutting manner is defined. 9 M342518: The first pad 224 and the second pad 238 are electrically connected to the sub-printed circuit board 234 not by soldering, so as to directly contact the first through the elastic expansion of the elastic conductive element 240. The pad 212 and the second pad 224 simplify the assembly process without performing a soldering process, so that the liquid crystal display module 200 of the present invention can reduce the assembly time and reduce the manufacturing cost. In addition, when the assembly of the liquid crystal display module 200 is found to be abnormal, the main printed circuit board 220 only needs to be detached from the surface of the outer frame 260, and can be separated from the sub-printed circuit board 234, and then separately to the main printed circuit board 220. Or the test of the 疋田彳 printed circuit board 234 'Because this creation does not require a desoldering process to carry out heavy work, it can greatly improve the efficiency of heavy work and reduce the labor time of heavy work. In addition, the conventional liquid crystal display module 1 (shown in Fig. 1A) may have a problem of uneven thickness of tin, and may even cause structural interference and affect reliability. On the contrary, since the present process can be electrically connected to the main printed circuit board 220 and the sub printed circuit board 234 without performing a soldering or soldering process, or one of the main printed circuit board 220 or the sub printed circuit board 234 can be used. One end of the elastic conductive element 230 is pre-welded, and when assembled, the elastic conductive element 230 is automatically resized by elastic expansion according to the actual assembly situation to reduce the structural interference, and the other end of the elastic conductive element 230 does not need to be welded. , to achieve convenient assembly, and has better quality and reliability. Moreover, the sub-printed circuit board 120 of the prior art (shown in FIG. 1B) needs to be clamped at the second pad 124 during the separate test, and the sub-printed circuit board 234 of the present invention is only point-to-point. The contact method allows for electrical testing, which also avoids the inconvenience of the M342518 caused by manual alignment. In this embodiment, the number of the first pads 224 and the second pads 238 are respectively two, and the positive and negative electrodes are opposite to each other. However, the present invention does not limit the first pads 224 and the second pads. For example, those skilled in the art can add the number of first pads 224 and second pads 238 for grounding, etc. Further, the light-emitting element 236 can be a light-emitting diode' The number of the light-emitting elements 236 is three, however, the creation does not limit the kind and number of the light-emitting elements 236. 2A to 2C, 3A to 3B, and 4A, in order to further improve the light source quality of the backlight module 230, the backlight module 230 of the present embodiment may further include a reflective sheet 231 made of aluminum, and the reflective sheet 231 is disposed on the guide. Between the light plate 232 and the outer frame 260, the light source emitted in the direction of the outer frame 260 is reflected back into the light guide plate 232, thereby improving the light source utilization rate. In addition, the backlight module 230 may further include an optical film 233 for accommodating the uniformity of the light source. The optical film 233 is disposed between the light guide plate 232 and the liquid crystal display panel 210. In this embodiment, the optical film 233 is The number is, for example, three sheets, and it may be a diffusion film, a brightness enhancement film, or a prism sheet, but the creation does not limit the number and kind of the optical sheets 233. It is worth mentioning that, in view of the L-shaped shape of the sub-printed circuit board 120 (shown in FIG. 1B) of the prior art, the opening of the sub-printed circuit board 234 of the present invention has a shape of a word, so that The layout utilization of the sub printed circuit board 234 is increased to reduce the cost, and the difficulty in assembling the sub printed circuit board 234 to the main printed circuit board 22 can be reduced. Further, both the sub printed circuit board 2 and the main printed circuit board 220 can be reduced. It is a flexible printed circuit board to enhance the flexibility of assembly. 11 M342518 In this embodiment, the outer frame 260 is assembled with the frame MO, for example, by a snap fit. The main printed circuit board 220 can be bonded to the outer frame 26 by the first adhesive member 262, which is different from the backlight module. For the surface of the group 23, the first bonding member 262 is, for example, a double-sided tape, and the liquid crystal display panel 21 can be fixed in the frame 250 by the second = fitting 252. The second bonding member 252 is, for example, black, double-sided tape. In order to avoid light leakage, and the elastic conductive element 24 〇 = conductive _, (d) this creation and * define the weight of the elastic conductive element 24 颂 ' will be further exemplified in the following embodiments. 4B and 4C are exploded views of another embodiment of the present invention, respectively, with the components removed. Please refer to = display module bird, 2 inch and liquid crystal display module 200 (such as conductive spring and conductive bomb 2
¥電元件的種類，舉例而+，㈣道：]作亚不限疋弹性 屬=電膠布或是其他合相件亦可為彈性金 :上:ί ^ ^ ^ ^ ^ T ,.J : 與第二接塾，導；^性㈣元件_第一接塾 板’如此即無需焊接ρ刷電路板與副印刷電路 二、 重工液晶c大幅簡化組農過程。 工的過程簡便，而心1需=:悍的製程，所以重 三、 彈性導電元 民衣作成本。 小以降低結構干涉‘依據實際組裝情形而自動調整大 品質與可靠度。 Θ ，故可大幅提升液晶顯示模組的 —W狀為一字―増一 12 M342518 刷電路板的排版利用率以降低成本。 雖然本創作已以較佳實施例揭露如上，甘 限f本創作，任何熟習此技藝者，在不脫離^其並非用以 和範圍内，當可作此 創作之精神 範圍當視後附之申；專^與潤飾’因此本創作之保護 r明專利靶圍所界定者為準。 【圏式簡單說明】 圖1A為習知之一插 圖〗R盘同t /日日頒示模組的立體圖。 固1B為圖ία之液晶 一 圖。 〜7^杈、、且之副印刷電路板的上視 圖 體 圖2A為依據本創作—訾 錢施例之液晶顯示模組的立 圖2B為圖2A之液晶龜—> 圖2C為圖2A之液曰題#組的5解圖。 元件的上視圖 顯轉組之副印刷電路板與發光 圖。圖3A為圖2A之液晶顯示模組沿AA方向的局部剖視 ==2=、=^模組沿邱方向的剖視圖。 ® 示模組移除部份構件後的分解 不 圖4B與圖4C分別為依據本創作另一 模組移除部份構件後的分解圖。 只⑪例之液日曰，，，、頁 【主要元件符號說明】 100 ·液晶顯不模組 13 M342518 110 :主印刷電路板 120 :副印刷電路板 120a :光源部 120b ··彎折部 120c :連接部 122 :發光二極體 124 :第二接墊 200、200a、200b :液晶顯示模組¥Electronic components, for example, +, (4) Road:] for Asia is not limited to elastic = = electric tape or other phase parts can also be elastic gold: top: ί ^ ^ ^ ^ ^ T, .J : and The second interface, the guide; the (4) component _ the first interface board, so that there is no need to solder the ρ brush circuit board and the secondary printed circuit 2. The heavy liquid crystal c greatly simplifies the group farming process. The process of the work is simple, and the heart 1 needs =: the process of 悍, so the third is the cost of the elastic conductive element. Small to reduce structural interference ‘Automatically adjust for quality and reliability based on actual assembly conditions. Θ, it can greatly improve the liquid crystal display module's -W shape is a word - 増 12 M342518 brush board layout efficiency to reduce costs. Although the present invention has been disclosed in the above preferred embodiments, it is intended that any person skilled in the art will be able to make a claim within the scope of the spirit of the creation. ;Special ^ and retouching 'Therefore, the definition of the protection of this creation, the definition of the patent target enclosure shall prevail. [Simplified explanation of the 圏 type] Fig. 1A is a perspective view of one of the conventional plug-in diagrams and the t/day-issuing module. Solid 1B is a picture of the liquid crystal of Fig. 2A is a top view of the secondary printed circuit board. FIG. 2A is a schematic view of the liquid crystal display module according to the present invention. FIG. 2B is a liquid crystal turtle of FIG. 2A. FIG. 2C is FIG. 2A. The solution of the liquid 曰 # # group of 5 solutions. Top view of the component Sub-printed circuit board and illuminating diagram of the display group. 3A is a partial cross-sectional view of the liquid crystal display module of FIG. 2A along the AA direction == 2=, = ^ module along the Qiu direction. ® Decomposition after removing some components from the module No Figure 4B and Figure 4C are exploded views of the other module removed according to the creation of the module. Only 11 cases of liquid Japanese, Japanese, Japanese, page [Description of main components] 100 · LCD display module 13 M342518 110 : Main printed circuit board 120 : Sub printed circuit board 120a : Light source part 120b · · Bending part 120c : connecting portion 122 : light emitting diode 124 : second pad 200 , 200a , 200b : liquid crystal display module
210 ： 液晶顯不面板 212 ： 錯位區 220 ： 主印刷電路板 222 ： 彎折部 224 ： 第一接墊 230 ： 背光模組 231 ： 反射片 232 ： 導光板 233 ： 光學膜片 234 ： 副印刷電路板 236 ： 發光元件 238 ： 第二接墊 240、240a、240b ··彈性導電元件 250 :框架 252 ··第二黏合件 260 :外框 262 :第一黏合件 14210 : LCD display panel 212 : Dislocation area 220 : Main printed circuit board 222 : Bending part 224 : First pad 230 : Backlight module 231 : Reflecting sheet 232 : Light guide plate 233 : Optical film 234 : Sub printed circuit Plate 236 : Light-emitting element 238 : Second pad 240 , 240a , 240b · Elastic conductive element 250 : Frame 252 · Second adhesive part 260 : Outer frame 262 : First adhesive part 14