M336644 八、新型說明： 【新型所屬之技術領域】 本創作係-種導電錢，尤指—種表面上形成有至 少-條彎折線的導電基落，且基箱本體對應於各該彎折線 的部位不致目反覆彎折，而導致所產生的剪應力，將該導 電基泪鋪紐數㈣立的基n，財效轉該導電基箱 的導磁特性。 【先前技術】 按’近年來’由於科技產業突飛猛進，各式電子產品 (如：手機、筆記本型電腦、數位相機··.等)不僅品質及功 能曰益提升’產品價格亦日趨便宜，使得該等電子產品已 成為-般人有能力購買的消f性電子產品，而被廣泛地使 用在人們的日常生活及工作中，且已成為日f生活及工作 中的重要工具’因此，該等電子產品的品f穩定性亦已成 為一般消費者在購買該等料性電子產品時的—重要考量 因素一般§’電子產品的品質穩定性的優劣與否，與矣 内所安裝的1C晶片有極為密切的_，Ic晶片的設計及 製ie时質及安裝在電子產品内的位置，均將影響κ晶片的 效能。以-般手持式電子產品為例，如：無線電話及行動 電話··.等，由於，其内所安裝的IC晶片皆位於高電磁波的 袞境因此’ s電子產品被使用時，内部的IC晶片極易被 周邊其他電子料所產生的電磁聽響 算過程中受到電磁波的干擾，而造成以片發^算速度 M336644 變緩或運算錯誤特事，使得電子產品紐被正常地使 用。針對此一電磁波干擾的問題，目前業者均係在IC晶片 被:ic裝至電子產品内後，將一導電基箔貼附在Ic晶片上鄰 近於易受電磁波干擾的位置，以作為電磁波遮蔽材，阻隔 周邊其他1：子零件所產生的電磁波，避免該IG晶片受到外 界電磁波的干擾影響，進而有效降低故障機率，大幅提升 該1C晶片的效能。 晴參照第1圖及第2 ®所示，_般所使用的導電基語 1均係包括一基箔本體11，該基箔本體n係由銅或其它導 電及導磁性極佳的金屬材料所製成，一般業者在製造導電 基箔1時，係根據欲貼附在IC晶片上的部位，在基箔本體 11表面上沖壓至少一條彎折線12，各該彎折線12係由基 箔本體11之一側緣延伸至另一侧緣，以便作業人員利用彎 折線12 ’將基箱本體u彎折成所需之形狀後，輕易地將 導電基H 1雜至1C晶片上易受電磁波干擾的位置。 惟’由於’作業人員在將導電基箔1包覆在IC晶片 上易受電磁波干擾的部位時，經常會因個人習慣、作業疏 失或其它因素’反覆彎折基箔本體U上對應於彎折線12 的位置，以期將導電基箔i彎折成所需之形狀，此一習慣 或疏失’卻導致在導電基箔1被彎折成所需之形狀後，衍 生出下列的問題： 1、復請參閱第1圖及第2圖所示，由於基箔本體11表面 上經沖壓形成至少一條彎折線12後，該彎折線12係由 基猪本體11之一側緣延伸至另一侧緣，延伸至整個基 M3 3 6644 泊本體11的表面1在基穌體u上形成—凹陷的刻 痕C，使得基穌體u上誠於各該f躲12的部位， 成為剪應力料的位置，如此，當作業人請基笛本體 11反覆進行彎折時，導電錢1之絲本體11對應於 該彎折線12的部倾歸贿應力，極料致基笛本 體11斷裂，甚至被撕裂成複數片獨立的基落，而破壞 了該導電基箔1的導磁特性。 當作業人員對基箔本體11反覆進行彎折後，如第2及 3圖所示’基箔本體11對應於該彎折線12的部位所累 積的剪應力，極易使導電基箔1之基箔本體n從該彎 折線12的兩端位置開始斷裂，使得基箔本體u的兩侧 緣形成多個撕裂端13，甚至使基箔本體n被撕裂成複 數片獨立的基箔，而破壞了該導電基箔1的導磁特性； 此時，包覆在導電基箔1内的1C晶片2，會透過該導 電基箔1的撕裂端13裸露出來，極易遭受電路板3上 所安裝的周邊電子零件31(如：天線等）產生的電磁波 影響，導致該1C晶片2在運算過程中受到電磁波干擾， 造成該1C晶片2發生運算速度變缓或運算錯誤等情 事，而使電子產品無法被正常地使用。因此，作業人員 在將傳統導電基箔1貼附至1C晶片2上時，必須相當 謹慎地操作，以避免因反覆彎折或施力過當，而導致該 導電基箔1破損或斷裂成複數塊基箔，造成導電基箔1 的導磁性能降低，或完全無法阻隔電磁波的干擾，進而 降低了 1C晶片2的效能。 M336644 存在县於;^可知’傳統導電基錄被彎折使用時，顯然 缺點’因此，如何_—料於騎但 实雪其電基’以解決上賴題，即成為現今眾多 導電基^造麵亟思解決之—重要課題0 【新型内容】 、有t於此為改進前述傳統導電基箱之缺點，創作人經 2長久努力研究與實驗，終糊發設計&本辦之一種具 号折線之導電絲，以雜由本創作能有效解決導電基羯 易破損之缺點。 本们作之—目的，係提供—種具彎折線之導電基猪，係 =附，1C晶片外側表面，用以接地導磁，該導電基荡包括 基篇本體(如·鋪）及至少—條彎折線，其中該彎折線 係形成在該基ϋ本咖表面上，且該f折線之兩端係分別 與，基穌禮之_邊_持-固定距離，如此，當作業 人員/ 口各該着折線，對該基荡本體進行弯折，且將該基绪 本體貼附至IG晶料絲面時，可避免該錢本體因反覆 彎折，使得絲本體龍於各該騎_雜成為剪應力 集中的位置，而導致職生时應力，將該隸本體撕裂 成複數片獨立的H而破壞了該基穌體的導磁特性。 本創作之另一目的，係在該彎折線之兩端分別與基箔本 趙之兩側邊緣縣-m定距離，麟絲本體上未形成該 彎折線的部位，能保持結構上的連續性，而不易斷裂，且 能提供一導磁路徑，使基箔本體所吸收之電磁波，能經由 M336644 該導磁路徑，傳遞至接地端，以防止ic晶片受電磁波的干 擾。 本創作之又一目的，係基箔本體上未形成該彎折線的部 位仍能保持結構上的連續性，故當作業人員沿該彎折線， 對該基箔本體進行彎折時，不易因施力過大而導致該基箔 本體的破裂，除確保作業人員能夠輕易且快速地彎折該導 電基箔外，亦可避免因導電基箔的破裂，而發生IC晶片裸 露出來的問題。 為便貴審查委員能對本創作目的、技術特徵及其功 效，做更進一步之認識與瞭解，茲舉實施例配合圖式，詳 細說明如下： 【實施方式】 請參閱第4及5圖所示’第4圖係本創作具彎折線之導 電基箔之一實施例立體示意圖，該導電基箔4係貼附至IC 晶片外側表面，用以接地導磁，該導電基箔4包括一基箔 本體41及至少一條彎折線42，其中該基箔本體41係由銅 或其它導電及導磁性極佳的金屬材料所製成，其表面經沖 壓後，形成該彎折線42，該彎折線42之兩端係分別與該 基箔本體41之兩側邊緣保持一固定距離l，復請參閱第5 圖所示之導電基箔4之剖面示意圖，該基箔本體41的表面 經沖壓後，在該彎折線42的對應位置產生一凹陷的刻痕 D，由於，該彎折線42之兩端分別與該基箔本體41之兩侧 邊緣保持一固定距離L，使得基羯本體41上未形成該彎折 M336644 線42的部位(如··固定距離L對應的部位)仍能保持結構上 的連續性，而不易斷裂。如此，當作業人員對該基箔本體 41進行彎折時，僅需利用該彎折線42上的凹陷刻痕d，即 可輕易且快速地將該基箔本體41彎折成所需的形狀，且當 該基箔本體41被彎折時，基箔本體41在該彎折線42處所 產生的剪應力，亦能透過基箔本體41上未形成該彎折線 42的部位，予以釋放，使得該基箔本體41不易發生斷裂， 而能維持良好的導磁效果。另，由於，基箔本體41上未形 成該彎折線42的部位(如：固定距離L對應的部位)在結構 上係保持連續性，故即使基箔本體41上對應於該彎折線 42的部位發生斷裂，基箔本體41上未形成該彎折線42的 αΡ位(如·固疋距離[對應的部位)仍將提供一導磁路徑， 使基箱本體41所吸收之電磁波，能經由該導磁路徑，傳遞 至接地端，以防止1C晶片受電磁波的干擾。M336644 VIII. New description: [New technical field] The creative system is a type of conductive money, especially a conductive base on which at least one bending line is formed, and the base body corresponds to each of the bending lines. The part is not bent back and forth, and the shear stress generated is caused by the conductive base tearing the number of bases (four), and the financial effect is transferred to the conductive magnetic box. [Prior Art] According to the 'in recent years', due to the rapid advancement of the technology industry, various electronic products (such as mobile phones, notebook computers, digital cameras, etc.) not only improve the quality and function, but also the price of the products is becoming cheaper. Other electronic products have become widely used in people's daily lives and work, and have become an important tool in daily life and work. Therefore, these electronic products The stability of the product f has also become an important consideration for the general consumers when purchasing these electronic products. ** The quality stability of the electronic products is excellent or not, and the 1C wafer installed in the 有 is extremely Close _, Ic chip design and manufacturing time and the location of the electronic product will affect the performance of the κ wafer. For example, hand-held electronic products, such as wireless phones and mobile phones, etc., because the IC chips installed in them are located in the high electromagnetic wave environment, so when the electronic products are used, the internal IC The chip is easily interfered by electromagnetic waves during the electromagnetic sounding process generated by other surrounding electronic materials, and the M336644 is slowed down or the operation error is made by the chip issuing speed, so that the electronic product is normally used. In response to this electromagnetic wave interference problem, the current industry is attached to the IC chip after the IC chip is mounted into the electronic product, and a conductive base foil is attached to the Ic wafer adjacent to the position susceptible to electromagnetic interference to serve as an electromagnetic wave shielding material. The electromagnetic wave generated by the other 1: sub-parts is blocked, and the IG chip is prevented from being affected by external electromagnetic waves, thereby effectively reducing the probability of failure and greatly improving the performance of the 1C chip. Referring to Figures 1 and 2, the conductive term 1 used in the present invention includes a base foil body 11 which is made of copper or other conductive and magnetically conductive metal material. When the conductive base foil 1 is manufactured, at least one bending line 12 is punched on the surface of the base foil body 11 according to the portion to be attached to the IC wafer, and each of the bending lines 12 is formed by the base foil body 11 One side edge extends to the other side edge, so that the operator can bend the base box body u into a desired shape by using the bending line 12', and the conductive group H1 is easily mixed to the 1C wafer and is susceptible to electromagnetic interference. position. However, due to the fact that the operator is covering the conductive chip foil 1 on the IC chip that is susceptible to electromagnetic interference, it often causes the basic foil body U to correspond to the bending line due to personal habits, work loss or other factors. The position of 12, in order to bend the conductive base foil i into the desired shape, this habit or omission 'causes after the conductive foil 1 is bent into the desired shape, the following problems are derived: Referring to FIGS. 1 and 2, since at least one bending line 12 is formed by stamping on the surface of the base foil body 11, the bending line 12 extends from one side edge of the base pig body 11 to the other side edge. Extending to the entire base M3 3 6644, the surface 1 of the body 11 forms a concave-shaped score C on the base body u, so that the base body u is in a position to hide the 12, and becomes the position of the shear stress material. In this way, when the operator asks the base body 11 to repeatedly bend, the wire body 11 of the conductive money 1 corresponds to the portion of the bending line 12, and the base body 11 is broken or even torn. a plurality of independent bases, which destroy the magnetic permeability of the conductive base foil 1 . When the operator repeatedly bends the base foil body 11 as shown in FIGS. 2 and 3, the shear stress accumulated in the portion of the base foil body 11 corresponding to the bending line 12 makes it easy to make the base of the conductive base foil 1. The foil body n is broken from the position of both ends of the bending line 12, so that the two side edges of the base foil body u form a plurality of tearing ends 13, and even the base foil body n is torn into a plurality of independent base foils, and The magnetic permeability of the conductive base foil 1 is destroyed; at this time, the 1C wafer 2 coated in the conductive base foil 1 is exposed through the tear end 13 of the conductive base foil 1, and is highly susceptible to being on the circuit board 3. The electromagnetic wave generated by the mounted peripheral electronic component 31 (such as an antenna) causes the 1C wafer 2 to be interfered by electromagnetic waves during the operation, causing the 1C wafer 2 to have a slower operation speed or an operation error, and the like. The product cannot be used normally. Therefore, when attaching the conventional conductive base foil 1 to the 1C wafer 2, the operator must operate with considerable caution to avoid the conductive base foil 1 being broken or broken into a plurality of blocks due to repeated bending or urging. The base foil causes the magnetic permeability of the conductive base foil 1 to be lowered, or the electromagnetic wave interference is completely blocked, thereby reducing the performance of the 1C wafer 2. M336644 exists in the county; ^ knows that 'the traditional conductive base record is used when bent, obviously the shortcoming 'so how _ - expected to ride but the snow is its electric base' to solve the problem, that is, today's many conductive base Face to solve the problem - important topic 0 [new content], there are t here to improve the shortcomings of the traditional conductive base box, the creator has been working hard for 2 years of research and experiment, the final paste design & The conductive wire of the fold line can effectively solve the shortcomings of the conductive base being easily broken by the present invention. The purpose of this is to provide a conductive pig with a bent line, attached = 1C wafer outer surface for grounding magnetic conduction, the conductive base includes the base body (such as · shop) and at least - a bending line, wherein the bending line is formed on the surface of the base coffee, and the two ends of the f-fold line are respectively separated from each other by a fixed distance, so that when the operator/mouth The folding line is bent, and when the base body is attached to the IG crystal filament surface, the money body can be prevented from being repeatedly bent, so that the silk body is formed in each of the riding bodies. The position where the shear stress is concentrated causes the stress at the time of occupation, and the body is torn into a plurality of independent H to destroy the magnetic permeability of the base. Another purpose of the creation is that the two ends of the bending line are respectively spaced apart from the edge of the base foil, and the portion of the bending line is not formed on the body of the lining, which can maintain structural continuity. It is not easy to break, and can provide a magnetic conductive path, so that the electromagnetic wave absorbed by the base foil body can be transmitted to the ground through the magnetic guiding path of M336644 to prevent the ic chip from being interfered by electromagnetic waves. Another object of the present invention is that the portion of the base foil body on which the bending line is not formed can still maintain structural continuity, so when the operator bends the base foil body along the bending line, it is not easy to apply If the force is too large, the base foil body is broken, and in addition to ensuring that the operator can bend the conductive base foil easily and quickly, the problem that the IC wafer is exposed due to cracking of the conductive base foil can be avoided. In order to make the reviewer's purpose, technical features and efficacy, further understanding and understanding, the following examples are combined with the drawings, and the details are as follows: [Embodiment] Please refer to Figures 4 and 5' 4 is a perspective view showing an embodiment of a conductive base foil having a bent line attached to an outer surface of an IC wafer for grounding magnetic conduction, and the conductive base foil 4 includes a base foil body. 41 and at least one bending line 42, wherein the base foil body 41 is made of copper or other conductive and magnetically conductive metal material, and the surface thereof is stamped to form the bending line 42, two of the bending lines 42 The end portions are respectively fixed at a fixed distance l from the two side edges of the base foil body 41. Referring to the cross-sectional view of the conductive base foil 4 shown in FIG. 5, the surface of the base foil body 41 is stamped and then bent. The corresponding position of the fold line 42 produces a concave score D, since both ends of the bend line 42 are respectively maintained at a fixed distance L from the both side edges of the base foil body 41, so that the bend is not formed on the base body 41. M336644 line 42 part (such as · A portion corresponding to a fixed distance L) can maintain structural continuity, and prone to breaking. Thus, when the operator bends the base foil body 41, the base foil body 41 can be easily and quickly bent into a desired shape by using the recessed score d on the bending line 42. When the base foil body 41 is bent, the shear stress generated by the base foil body 41 at the bending line 42 can also be released through the portion of the base foil body 41 where the bending line 42 is not formed, so that the base is released. The foil body 41 is less prone to breakage and maintains a good magnetic permeability. Further, since the portion of the base foil body 41 where the bending line 42 is not formed (for example, the portion corresponding to the fixed distance L) is structurally continuous, even the portion of the base foil body 41 corresponding to the bending line 42 is provided. When the fracture occurs, the α-position of the bending line 42 on the base foil body 41 (for example, the solid-web distance [corresponding portion) still provides a magnetic conductive path through which the electromagnetic wave absorbed by the base body 41 can pass. The magnetic path is transmitted to the ground to prevent the 1C chip from being disturbed by electromagnetic waves.
在本創作之一較佳實施例中，請參閱第6圖所示，係以 一電路板6為例，該電路板6上安裝有一 IC晶片5，該導 電基v# 4係貼附至該I c晶片5的頂面及侧面，對應於易 受周邊電子零件7(如：天線)所產生電磁波影響的位置。 由於，如第4圖及第5圖所示，該導電基箔4之基箔本體 41的表面上沖壓有至少一條彎折線42,生產線上作業人員 在將該導電基箔4貼附至該1C晶片5的頂面及側面時，必 需先對該基箔本體41上的彎折線42，施以適當力道，且 沿彎折線42，將該基箔本體41彎折成能貼附至該ic晶片 5頂面及側面的形狀，以使該基箔本體41能完全包覆住IC 11 M3 3 6644 晶片5上易受周邊電子零件7(如：天線)的電磁波影響的 部位。如此，當作業人員依照1C晶片5外型，對該基箔本 體41進行彎折，且將該基箔本體41貼附至IC晶片5外侧 表面時，由於，該彎折線42之兩端分別與基箔本體41之 邊緣保持一固定距離L，使得基箔本體41上未形成該彎折 線42的部位，仍能保持結構上的連續性，而不易斷裂，若 基箔本體41上對應該彎折線42的部位發生斷裂時，基箔 本體41上未斷裂的部位仍能提供一良好的導磁路徑，使基 、治本體41所吸收之電磁波，能經由該導磁路徑，傳遞至接 地區8，該接地區8係與該電路板6之接地端相連接，因 此可將所吸收之電磁波再傳導至該電路板6的接地端，以 有效防止1C晶片5受周邊電子零件7的電磁波干擾，大幅 提升1C晶片5的效能及運算的正確性。此外，由於在本創 作中，基箔本體41上未形成該彎折線42的部位，係保持 結構上的連續性，故當作業人員沿彎折線42，對基箔本體 &進行彎折時，不易因施力過大而導致基箔本體41斷裂 成複數片的獨立基箔，不僅可有效避免破壞該基箔本體41 的導磁特性，更可確保作業人員能輕易且快速地彎折基箱 本艘41。 以上所述，僅係本創作之最佳實施例，惟，本創作在實 際方e作時，並不侷限於此，按，凡熟悉該項技藝者可輕易 思及之等效變化或修飾，皆應被含蓋在以下本案之專利範 圍内。 12 M3 3 6644 【圖式簡單說明】 第1圖係傳統導電基箔之立體示意圖； 第2圖係傳統導電基箔之剖面示意圖； 第3圖係傳統導電基箔之使用狀態示意圖； 第4圖係本創作具彎折線之導電基箔之一實施例立體 示意圖； 第5圖係本創作具彎折線之導電基箔之剖面示意圖；及 第6圖係本創作具彎折線之導電基箔之一較佳實施例。 【主要元件符號說明】 導電基箔 .........4 基箔本體 .........41 彎折線 42 1C晶片 5 電路板 6 周邊電子零件 .........7 接地區 8In a preferred embodiment of the present invention, as shown in FIG. 6, a circuit board 6 is exemplified, and an IC chip 5 is mounted on the circuit board 6, and the conductive base v# 4 is attached thereto. The top surface and the side surface of the IC chip 5 correspond to positions susceptible to electromagnetic waves generated by peripheral electronic components 7 such as antennas. As shown in FIGS. 4 and 5, at least one bending line 42 is stamped on the surface of the base foil body 41 of the conductive base foil 4, and the operator on the production line attaches the conductive base foil 4 to the 1C. For the top surface and the side surface of the wafer 5, it is necessary to apply an appropriate force to the bending line 42 on the base foil body 41, and bend the base foil body 41 along the bending line 42 to be attached to the ic wafer. The shape of the top surface and the side surface is such that the base foil body 41 can completely cover the portion of the IC 11 M3 3 6644 wafer 5 which is susceptible to electromagnetic waves of peripheral electronic components 7 (e.g., antennas). In this manner, when the worker bends the base foil body 41 according to the appearance of the 1C wafer 5, and attaches the base foil body 41 to the outer surface of the IC wafer 5, since both ends of the bending line 42 are respectively The edge of the base foil body 41 is maintained at a fixed distance L, so that the portion of the base foil body 41 where the bending line 42 is not formed can maintain structural continuity and is not easily broken, if the base foil body 41 corresponds to the bending line. When the portion of the portion 42 is broken, the unbroken portion of the base foil body 41 can still provide a good magnetic permeability path, so that the electromagnetic wave absorbed by the base and the treatment body 41 can be transmitted to the connection region 8 via the magnetic permeability path. The grounding region 8 is connected to the grounding end of the circuit board 6, so that the absorbed electromagnetic wave can be re-conducted to the grounding end of the circuit board 6, so as to effectively prevent the 1C wafer 5 from being interfered by the electromagnetic wave of the peripheral electronic component 7, greatly Improve the performance and accuracy of the 1C chip 5. In addition, since the portion of the base foil body 41 where the bending line 42 is not formed in the present creation maintains structural continuity, when the operator bends the base foil body & along the bending line 42, The independent base foil which is not easy to be broken into a plurality of sheets due to excessive application force can not only effectively prevent the magnetic permeability of the base foil body 41 from being damaged, but also ensure that the operator can bend the base box easily and quickly. Ship 41. The above description is only the preferred embodiment of the present invention. However, the present invention is not limited to this when it is actually used, and any equivalent change or modification that can be easily considered by those skilled in the art, All should be covered by the following patents in this case. 12 M3 3 6644 [Simple description of the drawing] Fig. 1 is a schematic perspective view of a conventional conductive base foil; Fig. 2 is a schematic cross-sectional view of a conventional conductive base foil; Fig. 3 is a schematic view showing a state of use of a conventional conductive base foil; A schematic diagram of an embodiment of a conductive base foil having a bent line; FIG. 5 is a schematic cross-sectional view of a conductive base foil having a bent line; and FIG. 6 is one of conductive foils of the present invention having a bent line Preferred embodiment. [Description of main component symbols] Conductive base foil...4 base foil body.........41 bend line 42 1C wafer 5 circuit board 6 peripheral electronic parts...... ...7 pick up area 8
刻痕 .........DScoring .........D
固定距離 .........L 13Fixed distance .........L 13