M336542 八、新型說明： 【新型所屬之技術領域】 一種發光裝置，經電流導通後可產生光，本 創作尤指一種利用一發光二極體模組及一光學 模組組構而成的發光裝置。 【先前技術】 發光裝置一般係泛指可產生光源的裝置，例 如常見的燈管、燈泡、發光二極體均屬之，而 本創作所稱之發光裝置，則係以發光二極體作 為發光源為主的發光裝置；請參閱「第1圖」， 圖中所示係為一種習知的發光裝置，其即係以 發光二極體作為發光源，如圖中所示的發光裝 置10，其係於一底座（Substrate)lOl的凹杯102 中，固設一發光二極晶片（light - emitting diode，LED) 103，經完成打線作業以連接電極 後，再受電流導通，則發光二極體晶片1 0 3即 可產生發光；請參閱「第2圖」，圖中所示係為 習知的另一種發光裝置，如圖中所示，此發光 裝置 2 0 亦具有一底座 2 0 1，發光二極體晶片 (light-emitting diode，LED)203 則倒覆固設於 凹杯 2 0 2中，其係利用成型於發光二極體晶片 2 0 3表面的兩電極（2 0 3 1、2 0 3 2 )，分別黏著固定 於凹杯 2 0 2中相對應的電極位置，以省去打線 M336542 的作業，同時，亦可達到使發光二極體晶片203 上平面的發光，可不受金屬導線的影響，進而 提昇其整體的發光效率；唯，僅管如此，就目 前的技術的而言，以發光二極體晶片作為發光 源，其效率仍然有限，就整體的發光效率而言， 仍有待大幅的提昇，方可取代現有的燈管或燈 泡式的發光裝置，故，目前多數應用於照明的 發光二極體，多朝高功率的方向研發；目前市 面上已有許多利用發光二極體作為發光源的燈 具陸續受到應用，例如 M R 1 6 (發光二極體燈泡） 即是一例，其整體的體積可謂相當的大，其預 留的空間除組設有數顆發光二極體之外，尚需 裝設一反射部，以作為光反射面，藉由此光反 射面，提昇發光二極體的發光效率，唯，多顆 或應用高功率發光二極體結果，係會使整個發 光裝置的熱度提昇，進而影響到整體的發光效 率，例如，當高溫產生時，發光二極體的光衰 減的速度則更快，如此無法兼顧的情況，一直 為業界以來無法解決的問題。 【新型内容】 有鑒於上述的問題及需求，本創作者係針對 光的特性以及發光二極體構造進行研究及分 析，期能找出適切的解決方案，本創作的主要 6 M336542 目的即在於提供一種發光效率佳，製造過程簡 易，且更適用於作為照明使用的發光裝置。 為達上述的目的，本創作係以一發光二極體 模組作為光源，再以一經過光學設計，且預先 製成的光學模組，與之完成組構，由於此光學 模組係經過特殊之光學設計，主要在使光通過 時，能受到有效的聚焦再行發散，故可大幅提 ‘ 升其發光效率，再者，可使發光裝置整體趨於 • 薄型化，如此，將之應用於現在的燈泡結構中， 則可使燈泡空出的部份另行作為散熱的應用。 為使承審委員可以充份了解本創作的結構 組成及其功效’兹以下列說明搭配圖不’請蒼 酌。 【實施方式】 請參閱「第3圖」，圖中所示係為本創作發 ^ 光裝置的剖視圖，如圖中所示的發光裝置30, - 其主要係由一發光二極體模組3 0 1，以及一光學 . 模組3 0 2所組構而成，其中發光二極體模組3 0 1 係包括一反射座 3 0 1 1、以及一發光二極體晶片 3 0 1 2，發光二極體晶片3 0 1 2係受固定於反射座 3 0 1 1中，反射座 3 0 1 1 外部係成型有一組電極 3 0 13，反射座3 0 1 1可由矽材料或是陶瓷材料製 成，亦可以是金屬鍍上絕緣層；另，光學模組 7 M336542 3 Ο 2係包括一可透光的基板 3 Ο 2 1、以及分別成 型於基板3021下平面的一聚光部3022、及成型 於基板3 0 2 1上平面的一散射部3 0 2 3 ;如圖中所 示，發光二極體模組3 0 1及光學模組3 0 2係分 別獨立成型，組構時，係將光學模組 3 0 2蓋覆 於發光二極體模組3 0 1的反射座3 0 1 1上方，使 發光二極體晶片3 0 1 2，對應於光學模組3 0 2的 聚光部3 0 2 2，再使發光二極體模組3 0 1與光學 模組3 02完成相互固定，即可完成；請參閱「第 4圖」，圖中所示，即為組構完成的發光裝置3 0 之側視圖，如圖中所示，當發光二極體晶片3 0 1 2 經電流導通後，即可產生發光，部份的光會經 反射座3 0 1 1產生折射後，射向聚光部3 0 2 2，當 光線通過基板3 0 2 1後，即由散射部 3 0 2 3向外 散出，又，其中之散射部3 0 2 3可依發光角度需 求，例如發光角度集中或發光角度發散，而製 成凸透鏡或是凹透鏡；如上，其不僅可提昇發 光效率，且其模組式的組構，簡化了發光裝置 的製造過程，再者，發光二極體模組與光學模 組可依需求進行薄型化設計，如此一來，更可 擴大其應用的範圍。 請參閱「第5圖」，圖中所示係為本創作的 一較佳實施例（一），如圖中所示本創作所稱之發 光裝置 3 0，係可供應用於現有的發光二極體燈 8 M336542 泡40中，以作為其發光源，且其所需的組設 間小，依本創作之設計，其係可裝置在接近 發光二極體燈泡4 0的透光面4 0 1，如此，燈 402餘下的空間，則可供作其它相關的應用， 如散熱設計，如圖中所示，可在其燈殼 402 型有複數個透孔4 0 2 1，以使燈殼4 0 2内的熱 快速發散，達到高散熱的需求。 請參閱「第6圖」，圖中所示係為本創作 另一較佳實施例（二），如圖中所示的發光裝 3 0，其係於發光二極體晶片3 0 1 2的上方，覆 有一層螢光層3 0 3，如此，可使發光二極體晶 3 0 1 2所發出的光與螢光層3 0 3的組成物質產 混色的作用，以達到可產生多種色系的要求 請參閱「第7圖」，圖中所示係為本創作的另 較佳實施例（三），此發光裝置3 0所應用的發 二極體晶片3 0 4，係為一種蓋覆式的發光二極 晶片，亦即，係利用其表面所預先成型的電 3 04 1，使發光二極體晶片 3 04可直接固設於 射部3 0 1 1的表面上，同時亦完成電性連結， 類型的發光二極體晶片因無法再作金屬線打 的作業，故其發光的面積不會受到金屬線的 蔽，就整體的發光效率而言，係較優於以金 導線完成電性連結的發光二極體晶片，又， 表面亦可同樣覆蓋有一層螢光層303，以達到 空 於 殼 例 成 氣 的 置 蓋 片 生 光 體 極 反 此 線 遮 屬 其 混 9 M336542 光及調整色系的功效；再請參閱圖中所示 可以在散射部 3 0 2 3 的表面，塗佈一層螢 3 024，此螢光層 3 024即是讓透出散射部 的光，可產生混色的效果，其作用等同於 的螢光層3 0 3，且直接塗佈在散射部3 0 2 3 面，更可進一步預防螢光層3024因高溫所 的破壞性變化，可有效的延長發光裝置的 壽命。 # 請參閱「第8圖」，圖中所示係為本創 另一較佳實施例（四），如圖中所示的發光 3 0，其係由一發光二極體模組 3 0 1以及另 學模組 3 0 5所組構而成，如圖中所示，其 係在於光學模組3 0 5的基板3 0 5 1的下平面 型有一聚光部3052，並於聚光部3052的周 成型有一呈連續鋸齒狀的第一導光部 3053 及，於基板 3051 的上平面，成型有一散 3054，並於散射部3054的周邊，成型有一 ， 續鋸齒狀的第二導光部 3 0 5 5，如圖中所示 • 第一導光部3 0 5 3主要係使發光二極體晶片 所發出的光，可被有效的導向聚光部3 0 5 2 增加其聚光的效果，又，第二導光部 3 0 5 5 可使散射部3 0 5 4所散射光，可被更有效率 出，以提昇整體的發光效率。 請參閱「第9圖」，圖中所示係為本創 ，亦 光層 3 0 2 3 上述 的表 產生 使用 作的 裝置 一光 主要 ，成 邊， ，以 射部 呈連 ，此 3 0 12 ， 以 ，則 的散 作的 10 M336542 另一較佳實施例（五），圖中所示的發光裝置 4 0，係由一發光二極體模組 4 0 1以及一光學模 組 4 02所組構而成，如圖所示，發光二極體模 4 0 1係由一發光二極體晶片 4 0 1 1以及一基座 4 0 1 2構成，又，光學模組 4 0 2則具有一基板 4021，其下平面成型有一聚光部 4022，其上平 面則成型有一散射部 402 3 ;再請參閱圖中所 示，發光二極體模組4 0 1的基板4 0 1 2係呈平面 狀，即無反射部之設計，其係利用光學模組4 0 2 的聚光部 4022，直接覆蓋於發光二極體晶片 4 0 1 1的上方，利用聚光部4 0 2 2直接使發光二極 體晶片 4 0 1 1所發出的光線直接受到聚光的效 果，並由散射部4 0 2 3散出，此結構可簡化發光 二極體模組 4 0 1的製造過程，大幅降低製造成 本〇 請參閱「第1 〇圖」，圖中所示係為本創作的 另一較佳實施例（六），如圖中所示的發光裝置 5 0，係採堆疊式的組構，其主要係由一發光二 極體模組501、一第一光學模組502以及一第二 光學模組 5 0 3所組構而成，其中，第一光學模 組5 0 2係組構於發光二極體模組5 0 1的上方， 第二光學模組 5 0 3則進一步組構於第一光學模 組上方；再請參閱圖中所示，第一光學模組5 0 2 係利用其基板5 0 2 1下平面的聚光部5 0 2 2，將發 11 M336542 光二極體模組 5 Ο 1所發出的光聚集，使其通過 基板5 0 2 1，再經由其散射部5 0 2 3散出，又，第 一光學模組5 0 2與第二光學模組5 0 3之間，係 墊設有一環圈狀且不透光的環牆部5 0 4，如此， 可使由第一光學模組5 0 4散出的光，受到包圍， 以迫使光線再受到第二光學模組 5 0 3之聚光部 5 0 3 2的再一次聚集，並穿射過基板5 0 3 1後，由 其散射部 5 0 3 3 散出；請參閱圖中所示的虛線 5 0 5，其為光線經過的理想角度，透過本創作所 揭的堆疊方式，可讓光發射效率更佳，同時， 可符合客製化的需求。 如上所述可知，本創作所揭之發光裝置，主 要係利用一已預製完成的發光二極體模組，以 及一個以上的光學模組作相互的搭配組構，以 製成一個高發光效率的發光裝置，其係可供應 用於現在的照明裝置之需求，同時可符合高散 熱的需求；綜上，本創作其據以實施後，確實 可以達到提供一種發光效率佳，製造過程簡 易，且更適用於作為照明使用的發光裝置之目 的。 唯，以上所述者，僅為本創作之較佳之實施 例而已，並非用以限定本創作實施之範圍；任 何熟習此技藝者，在不脫離本創作之精神與範 圍下所作之均等變化與修飾，皆應涵蓋於本創 12 M336542 作之專利範圍内。 綜上，本創作發光裝置係具有專利之創作 性，以及對產業的利用價值；申請人爰依專利 法之規定，向 鈞局提起新型專利之申請。M336542 VIII. New description: [New technical field] A kind of light-emitting device can generate light after being turned on by current. This creation especially refers to a light-emitting device which is formed by using a light-emitting diode module and an optical module. . [Prior Art] A light-emitting device generally refers to a device that can generate a light source, such as a common light tube, a light bulb, and a light-emitting diode, and the light-emitting device referred to in the present invention uses a light-emitting diode as a light-emitting device. Source-based illuminating device; please refer to "FIG. 1", which is a conventional illuminating device, which uses a light-emitting diode as a light-emitting source, as shown in the illuminating device 10, It is attached to a recessed cup 102 of a base (Substrate) 101, and a light-emitting diode (LED) 103 is fixed. After the wire bonding operation is completed to connect the electrodes, the current is turned on, and the light-emitting diode is turned on. The body wafer 1 0 3 can generate light; please refer to "Fig. 2", which is a conventional light-emitting device. As shown in the figure, the light-emitting device 20 also has a base 2 0 1 The light-emitting diode (LED) 203 is overturned and fixed in the concave cup 220, and is formed by two electrodes (2 0 3 1) formed on the surface of the light-emitting diode wafer 203. , 2 0 3 2 ), respectively adhered to the concave cup 2 0 2 corresponding The pole position eliminates the operation of the wire M336542, and at the same time, the light on the upper surface of the light-emitting diode wafer 203 can be achieved, which is not affected by the metal wire, thereby improving the overall luminous efficiency; only, in this case, In the current technology, the efficiency of the illuminating diode chip as the illuminating source is still limited, and the overall luminous efficiency still needs to be greatly improved to replace the existing lamp or bulb type illuminating device. Therefore, most of the current LEDs used for illumination are developed in the direction of high power; many luminaires using light-emitting diodes as illumination sources have been applied, such as MR 1 6 (light-emitting diodes). The bulb is an example, and its overall volume can be said to be quite large. In addition to the set of several light-emitting diodes, it is necessary to install a reflecting portion as a light reflecting surface. The reflecting surface enhances the luminous efficiency of the light-emitting diode. However, the result of multiple or high-power light-emitting diodes will increase the heat of the entire light-emitting device, thereby affecting The overall luminous efficiency, for example, when a high temperature is generated, the light attenuation rate of the light emitting diode is faster, thus not take into account the circumstances, the industry has been unable to solve the problem. [New content] In view of the above problems and needs, the creator researches and analyzes the characteristics of light and the structure of light-emitting diodes, and can find a suitable solution. The main purpose of this creation is to provide It has a good luminous efficiency, a simple manufacturing process, and is more suitable for a light-emitting device used as illumination. In order to achieve the above purpose, the present invention uses a light-emitting diode module as a light source, and an optical module that has been optically designed and pre-formed to complete the structure, since the optical module is specially The optical design is mainly effective in focusing and then diverging when passing light, so that the luminous efficiency can be greatly increased, and the overall illumination device can be thinned, so that it can be applied. In the current structure of the bulb, the portion of the bulb that is vacated can be used separately for heat dissipation. In order to enable the trial committee to fully understand the structure and function of the creation, the following descriptions are not included. [Embodiment] Please refer to "3", which is a cross-sectional view of the light-emitting device of the present invention, as shown in the figure, the light-emitting device 30, which is mainly composed of a light-emitting diode module 3 0 1, and an optical. The module is formed by the module 302, wherein the LED module 3 0 1 includes a reflector 3 0 1 1 and a light-emitting diode chip 3 0 1 2, The light-emitting diode chip 3 0 1 2 is fixed in the reflection seat 3 0 1 1 , and the reflection seat 3 0 1 1 is externally formed with a set of electrodes 3 0 13. The reflection seat 3 0 1 1 can be made of tantalum material or ceramic material. The optical module 7 M336542 3 Ο 2 includes a light-transmissive substrate 3 Ο 2 1 , and a concentrating portion 3022 respectively formed on the lower surface of the substrate 3021 . And a scattering portion 3 0 2 3 formed on the upper surface of the substrate 3 0 2 1 ; as shown in the figure, the LED module 301 and the optical module 308 are separately formed, and when assembled, The optical module 300 is covered over the reflective seat 3 0 1 1 of the LED module 310, so that the LED chip 3 0 1 2 corresponds to the optical mode. The concentrating part 3 0 2 2 of the 3 0 2 is completed by fixing the LED module 301 and the optical module 308 to each other; see "Fig. 4", as shown in the figure, That is, a side view of the illuminating device 30 that is assembled, as shown in the figure, when the illuminating diode chip 3 0 1 2 is turned on by current, light can be generated, and part of the light passes through the reflecting seat 3 0 After the refraction of 1 1 is generated, it is directed to the concentrating portion 3 0 2 2, and when the light passes through the substrate 3 0 2 1 , it is scattered outward by the scattering portion 3 0 2 3 , and wherein the scattering portion 3 0 2 3 According to the illuminating angle requirement, for example, the illuminating angle is concentrated or the illuminating angle is diverged to form a convex lens or a concave lens; as above, not only can the luminous efficiency be improved, but also the modular structure simplifies the manufacturing process of the illuminating device, and further The light-emitting diode module and the optical module can be thinned according to requirements, so that the scope of application can be expanded. Please refer to "figure 5", which is a preferred embodiment (1) of the present invention. The illuminating device 30, which is referred to in the present invention, is applicable to the existing illuminating two. The body lamp 8 M336542 is used as its light source, and its required assembly space is small. According to the design of the present invention, it can be installed close to the light-transmissive surface of the light-emitting diode bulb 40. 1. Thus, the remaining space of the lamp 402 can be used for other related applications, such as heat dissipation design, as shown in the figure, there may be a plurality of through holes 4 0 2 1 in the lamp housing 402 type to make the lamp housing The heat in 4 0 2 is quickly diverged to meet the demand for high heat dissipation. Please refer to FIG. 6 , which shows another preferred embodiment (2) of the present invention. The illuminating device 30 shown in the figure is attached to the LED chip 3 0 1 2 . The upper layer is covered with a layer of phosphor 3 3 3 , so that the light emitted by the LED body 3 0 2 2 can be mixed with the constituent materials of the phosphor layer 3 0 3 to achieve a plurality of colors. Please refer to "Figure 7" for the requirements of the system. The figure shows a preferred embodiment (3) of the present invention. The hair diode 3004 used in the illumination device 30 is a cover. The overlying light-emitting diode chip, that is, the pre-formed electric film 1041 on the surface thereof, allows the light-emitting diode wafer 304 to be directly fixed on the surface of the radiation portion 3 0 1 1 while also completing Electrically connected, the type of light-emitting diode wafer can not be used for metal wire work, so the area of its light-emitting area is not blocked by the metal wire, and the overall luminous efficiency is better than that of the gold wire. The electrically connected LED chip, and the surface may also be covered with a phosphor layer 303 to achieve The case of the cover case is a gas-emitting cover, and the line is covered with the effect of mixing 9 M336542 light and adjusting the color system; then, as shown in the figure, a layer can be coated on the surface of the scattering portion 3 0 2 3 Firefly 3 024, this phosphor layer 3 024 is the light that allows the scattering portion to pass through, which can produce a color mixing effect, which is equivalent to the fluorescent layer 300 and is directly coated on the scattering portion 3 0 2 3 surface. Moreover, the destructive change of the fluorescent layer 3024 due to high temperature can be further prevented, and the life of the light emitting device can be effectively extended. # Please refer to "Figure 8", which shows another preferred embodiment (4). The illuminating 30 shown in the figure is a light-emitting diode module 3 0 1 And a module of the other module 305 is arranged, as shown in the figure, the lower surface of the substrate 3 0 5 1 of the optical module 305 has a concentrating portion 3052, and is in the concentrating portion. The first light guiding portion 3053 having a continuous zigzag shape is formed on the periphery of the 3052, and a scattering 3054 is formed on the upper surface of the substrate 3051, and a second light guiding portion is formed on the periphery of the scattering portion 3054. 3 0 5 5, as shown in the figure. • The first light guiding portion 3 0 5 3 mainly causes the light emitted by the light emitting diode wafer to be effectively guided to the collecting portion 3 0 5 2 to increase the concentration thereof. The effect is that the second light guiding portion 3 0 5 5 can make the light scattered by the scattering portion 3 0 5 4 more efficient, so as to improve the overall luminous efficiency. Please refer to "Fig. 9", which is shown in the figure. It is also a light layer. The above-mentioned table is used to produce a device. The light is mainly used, the edge is formed, and the shot is connected. This 3 0 12 10 M336542 Another preferred embodiment (5), the light-emitting device 40 shown in the figure is a light-emitting diode module 40 1 and an optical module 04 As shown in the figure, the LED module 401 is composed of a light-emitting diode chip 4 0 1 1 and a pedestal 4 0 1 2, and the optical module 420 has A substrate 4021 has a concentrating portion 4022 formed on a lower surface thereof, and a scattering portion 402 3 is formed on the upper surface thereof. Referring to the figure, the substrate 4 0 1 2 of the LED module 401 is The planar shape, that is, the design of the non-reflecting portion, is directly covered by the concentrating portion 4022 of the optical module 420, over the LED array 4 0 1 1 , and directly by the concentrating portion 4 0 2 2 The light emitted by the LED chip 4 0 1 1 is directly absorbed by the light, and is scattered by the scattering portion 4 0 2 3 , which simplifies the light emission. The manufacturing process of the polar body module 401 greatly reduces the manufacturing cost. Please refer to the "1st drawing", which is another preferred embodiment (6) of the creation, as shown in the figure. The illuminating device 50 is a stacking structure, which is mainly composed of a light emitting diode module 501, a first optical module 502 and a second optical module 503. The first optical module is configured to be above the light-emitting diode module 510, and the second optical module 503 is further configured above the first optical module; As shown, the first optical module 502 converges the light emitted by the 11 M336542 photodiode module 5 Ο 1 by using the concentrating portion 5 0 2 2 of the lower surface of the substrate 5 0 2 1 Passing through the substrate 5 0 2 1 and then passing through the scattering portion 5 0 2 3, and between the first optical module 502 and the second optical module 503, the pad is provided with a loop shape and not The light-transmitting ring wall portion 504 is such that the light emitted by the first optical module 504 can be surrounded to force the light to be received by the concentrating portion 5 of the second optical module 503. 0 3 2 gathers again and passes through the substrate 5 0 3 1 and is scattered by the scattering portion 5 0 3 3 ; see the dotted line 5 0 5 shown in the figure, which is the ideal angle through which the light passes. The stacking method revealed by this creation can make the light emission efficiency better, and at the same time, it can meet the needs of customization. As can be seen from the above, the illuminating device disclosed in the present invention mainly uses a prefabricated LED module and more than one optical module as a mutual collocation structure to form a high luminous efficiency. The illuminating device can be applied to the needs of the current illuminating device, and can meet the requirement of high heat dissipating; in summary, after the implementation of the creator, the illuminating efficiency can be achieved, the manufacturing process is simple, and Suitable for the purpose of lighting devices used as lighting. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; any person skilled in the art can make equal changes and modifications without departing from the spirit and scope of the present invention. , should be covered by the patents of this creation 12 M336542. In summary, the creation of the illuminating device is patented and the value of the use of the industry; the applicant filed a new patent application with the shackle in accordance with the provisions of the Patent Law.
13 M336542 【圖式簡單說明】 第 1 圖 ，為 - 種 習 知 的 發 光 裝 置 〇 第 2 圖 ，為 一 另 種 習 知 的 發 光 裝 置 〇 第 3 圖 ，為 本 創 作 發 光 裝 置 的 剖 視 圖。 第 4 圖 ，為 組 構 完 成 的 發 光 裝 置 之 側視圖 第 5 圖 ，為 本 創 作 的 一 較 佳 實 施 例 (一）。 第 6 圖 ，為 本 創 作 的 另 一 較 佳 實 施 例（二） 第 7 圖 ，為 本 創 作 的 另 一 較 佳 實 施 例（三） 第 8 圖 ，為 本 創 作 的 另 一 較 佳 實 施 例（四） 第 9 圖 ，為 本 創 作 的 另 一 較 佳 實 施 例（五） 第1 〇圖，為本創作的另一較佳實施例（六 主要元件符號說明 10 發， 光 裝 置 10 1 底 座 102 凹 杯 103 發 光 二 極 20 發 光 裝 置 20 1 底 座 202 凹 杯 20 3 發 光 二 極 2 0 3 1 電 極 2 0 3 2 電 極 30 發 光 裝 置 極體晶片 14 M336542 30 1 發光二極體模組 30 11 反射座 30 12 發光二極體晶片 30 13 電極 3 02 光學模組 3 0 2 1 基板 " 3 0 2 2 聚光部 " 3 0 2 3 散射部 • 3 0 2 4 螢光層 303 螢光層 304 發光二極體晶片 3 0 4 1 電極 305 光學模組 3 0 5 1 基板 3 0 5 2 聚光部 3 0 5 3 第一導光部 ^ 3 0 5 4 散射部 、 3 0 5 5 第二導光部 . 40 發光二極體燈泡 40 1 透光面 402 燈殼 4 0 2 1 基板 4 0 2 2 聚光部 4 0 2 3 散射部 15 M336542 50 發 光 裝 置 50 1 發 光 二 極 體 模 502 第 光 學 模 組 5 0 2 1 基 板 5 0 2 2 聚 光 部 5 0 2 3 散 射 部 503 第 '— 光 學 模 組 5 0 3 1 基 板 5 0 3 2 聚 光 部 5 0 3 3 散 射 部 504 環 牆 部 505 虛 線13 M336542 [Simple Description of the Drawings] Figure 1 is a conventional illuminating device. Figure 2 is a different illuminating device. Figure 3 is a cross-sectional view of the illuminating device. Figure 4 is a side view of the assembled illuminating device, Figure 5, which is a preferred embodiment of this creation (1). Figure 6 is another preferred embodiment of the present invention. (2) Figure 7 is another preferred embodiment (3) of the present invention. Figure 8 is another preferred embodiment of the present invention. Figure 9 is another preferred embodiment (5) of the present invention. Fig. 1 is another preferred embodiment of the present invention (six main component symbol descriptions 10, light device 10 1 base 102 concave cup) 103 Light-emitting diode 20 Light-emitting device 20 1 Base 202 Concave cup 20 3 Light-emitting diode 2 0 3 1 Electrode 2 0 3 2 Electrode 30 Light-emitting device Pole chip 14 M336542 30 1 Light-emitting diode module 30 11 Reflector 30 12 LED Diode Wafer 30 13 Electrode 3 02 Optical Module 3 0 2 1 Substrate " 3 0 2 2 Concentration " 3 0 2 3 Scattering Section • 3 0 2 4 Fluorescent Layer 303 Fluorescent Layer 304 Luminous Polar body wafer 3 0 4 1 electrode 305 optical module 3 0 5 1 substrate 3 0 5 2 concentrating portion 3 0 5 3 first light guiding portion ^ 3 0 5 4 scattering portion, 3 0 5 5 second light guiding portion . 40 LEDs Bubble 40 1 Translucent surface 402 Lamp housing 4 0 2 1 Substrate 4 0 2 2 Concentrating portion 4 0 2 3 Scattering portion 15 M336542 50 Light-emitting device 50 1 Light-emitting diode mold 502 Optical module 5 0 2 1 Substrate 5 0 2 2 concentrating part 5 0 2 3 scattering part 503 '- optical module 5 0 3 1 substrate 5 0 3 2 concentrating part 5 0 3 3 scattering part 504 ring wall part 505 dotted line
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