M333568 八、新型說明： 【新型所屬之技術領域】 本創作係一種晶片檢測裝置之改良結構，尤指一種於底座 上設一壓合機構，而壓合機構之樞轴設一具複數壓柱之壓板， 且於樞軸一側設有壓桿者。其可於底座上置一具插槽之檢測電 路板，並於插槽内插置一置放欲檢測晶片之轉接板，當旋轉壓 杯一弧度以壓合檢測晶片並與檢測電路導通，用以檢測晶片内 • 之電路是否正常者。另於底座與壓合機構上則可設有相對應之 磁吸元件或/及可祕δ周之壓柱，以利用磁性原理定位及可微調壓 柱與晶片之間的接觸距離’進而達到構造簡單、檢測容易、準 確之嶄新設計者。 【先前技術】M333568 VIII. New description: [New technical field] This is a modified structure of a wafer inspection device, especially a press-fit mechanism on the base, and the pivot of the press mechanism is provided with a plurality of press columns. The pressure plate is provided with a pressure bar on one side of the pivot. The socket can be mounted on the base with a detection circuit board, and an adapter plate for detecting the chip is inserted into the slot. When the rotary cup is rotated by one arc to press the detection chip and is electrically connected to the detection circuit. Used to detect if the circuit in the wafer is normal. In addition, the base and the pressing mechanism may be provided with corresponding magnetic components or/and the δ week-shaped pressure column to position and finely adjust the contact distance between the pressure column and the wafer by the magnetic principle to further achieve the structure. Simple, easy to detect, accurate new designers. [Prior Art]
係置於固定架12,上，其包括一檢 於檢測片31，上設有複數個晶片槽 M333568 3121’供置放檢測晶片6’，於檢測板3,下方設有一呈“L”型之 轉接卡32’，該轉接卡32’係置於固定架12,上方，於轉接卡32， 之另一面則插置於底座Γ上之檢測電路板5,插槽。藉旋轉壓 桿25’，透過壓捍25’之連動，使得壓板23,前端之壓柱24,壓 石才戏’則板3上曰曰片槽3121内之晶片6’’使檢測晶片6，、檢測 板3、轉接卡32’及檢測電路板5’形成一迴路而導通，以達成 將晶片6’之電路檢測之功效。惟上述習用晶片檢測裝置，雖 可解決席用手壓晶片之缺失，然其壓板23,前端係固設有複數 壓柱24’，並利用一彈力件26產生一回復力而達到檢測晶片 的功效，但彈力件26易於損壞，且壓柱24,與檢測晶片6,無 法確實接觸，如遇到不同高度的晶片也無法調整與壓柱24,之 間的距離’不但易使量測不準確，也容易使晶片6，接觸到壓 柱24’過大的壓力而損壞。另晶片槽3121，係單一尺寸，因此 若有檢測晶片6’之尺寸規格大小不同時，需將檢測板3,之檢 測片31’拆下更換，其造成檢測上極為不便。 由此可見，上述習用物品仍有諸多缺失，實非一良善之設 計者，而亟待加以改良。 【新型内容】 本創作係一種晶片檢測裝置之改良結構，主要係包括底 座、壓合機構、檢測板，其中，該底座上設一固定架，並於底 座之固定架上固設一壓合機構，其壓合機構兩側之支撐桿上穿 設一枢軸，而樞軸上則固設有一設有複數個壓柱之壓板，於枢 M333568 抽一側設樣桿。藉由底座上置-具插槽之制電路板，並使 '檢測板之轉接卡插於_，再將欲檢測晶纽置於檢測板内， .於搖動_使樞軸旋轉—孤度，職板之餘壓合待檢測晶 片並使才欢測晶片與檢測電路導通，並輸出檢測訊號於一顯示 . 裝置上’用以檢測晶片内之電路是否正常者。另外，亦得於底 座錢合上财設有姆紅魏猶或/及可微調之壓 柱藉磁!·生原理疋位及可微調壓柱與晶片之間的接觸距離，進 • ❿達到構造簡單、檢測容易、準確等功效之勒新設計者。 本：ij作之主要目的係在提供一種於底座上設一墨合機 構，而壓合機構之樞軸設一具複數麗柱之壓板，且於枢轴一側 設有壓桿之晶片檢峨置。其可於底座上置—具減之檢測電 路板’並於浦内插置-具檢測板之轉接板，於檢測板置放欲 檢測之晶片’藉旋讎桿-弧度以壓合檢測晶片並與檢測電路 導通’用以檢須J晶片内之電路是否正常，而具有構造簡單、檢 _ 測容易、準確之功效。 本創作之次一目的係在一種於壓板上設有複數個壓柱，並 於壓柱上設有調整槽供微調壓柱與晶片間接觸距離之晶片檢 、 測裝置，便於不同高度的晶片檢測之功效。 本創作之另一目的係在於提供一種於底座與壓合機構上 則可5又有相對應之磁吸元件之晶片檢測裝置，利用磁吸壓力壓 合晶片，則檢測者不需持續按壓晶片，除可節省人力，亦使壓 力保持固定，且晶片與檢測電路導通良好等功效之增進。 M333568 本創作之再一目的係在於提供一種於檢測板之檢測片設 有複數個容置槽，於容置槽内可容設一晶片治具，其晶片治具 内則設有不同大小之晶片槽，以因應檢測晶片之尺寸規格大小 不同之需’其不需將檢測板之檢測片拆下更換，便於晶片之檢 測0 有關本創作之特徵與實作，茲配合圖示作最佳實施例詳細 說明如下。The utility model is disposed on the fixing frame 12, and comprises a detecting piece 31, a plurality of chip slots M333568 3121' for placing the detecting wafer 6', and an "L" type under the detecting board 3. The riser card 32' is placed on the fixed frame 12, above the riser card 32, and the other side is inserted into the detection circuit board 5, the slot on the base. By means of the rotary pressing rod 25', through the linkage of the pressure cymbal 25', the pressure plate 23, the pressure column 24 at the front end, and the pressure metal granules are used to detect the wafer 6 in the wafer 6'' in the squeezing groove 3121 of the plate 3. The detecting board 3, the riser card 32' and the detecting circuit board 5' form a loop and are turned on to achieve the function of detecting the circuit of the wafer 6'. However, the above-mentioned conventional wafer detecting device can solve the problem of detecting the wafer by the fact that the pressing plate 23 has a plurality of pressing columns 24' fixed to the front end thereof and a restoring force is generated by the elastic member 26. However, the elastic member 26 is easily damaged, and the pressing column 24 and the detecting wafer 6 cannot be surely contacted. If the wafer of different heights is encountered, the distance between the pressing column 24 and the pressing column 24 cannot be adjusted, which is not only easy to make the measurement inaccurate, It is also easy for the wafer 6 to be damaged by contact with the excessive pressure of the press column 24'. Further, the wafer groove 3121 is of a single size. Therefore, if the size and size of the detecting wafer 6' are different, the detecting plate 3 and the detecting piece 31' need to be removed and replaced, which causes great inconvenience in detection. It can be seen that there are still many shortcomings in the above-mentioned items, which is not a good designer and needs to be improved. [New content] The present invention is an improved structure of a wafer detecting device, which mainly comprises a base, a pressing mechanism and a detecting plate, wherein a fixing frame is arranged on the base, and a pressing mechanism is fixed on the fixing frame of the base. A pivot shaft is arranged on the support rods on both sides of the pressing mechanism, and a pressure plate with a plurality of pressure columns is fixed on the pivot shaft, and a sample rod is arranged on the side of the pivot M333568. By placing the circuit board with the socket on the base, and inserting the 'detection card of the detection board into the _, and then placing the crystal to be detected in the detection board, the rocking _ pivoting - the degree of separation The remaining pressure of the job board is combined with the detection chip and the wafer and the detection circuit are turned on, and the detection signal is outputted in a display. The device is used to detect whether the circuit in the wafer is normal. In addition, it is also necessary to use the base of the money to set up the money, and the fine-tuning column can be magnetically magnetized! · The principle of the position and the contact distance between the column and the wafer can be fine-tuned. A new designer who is simple, easy to detect, and accurate. The main purpose of this: ij is to provide an ink-collecting mechanism on the base, and the pivoting mechanism of the pressing mechanism is provided with a plurality of pressure plates of a plurality of columns, and the wafer is provided with a pressure bar on one side of the pivot. Set. It can be placed on the base - with a reduced detection circuit board and inserted into the puddle - an adapter plate with a detection plate, and the wafer to be inspected is placed on the detection plate. And the detection circuit is turned on 'to check whether the circuit in the J chip is normal, and has the advantages of simple structure, easy detection and accurate. The second purpose of the present invention is to provide a plurality of press columns on a press plate, and an adjustment groove for adjusting the contact distance between the press columns and the wafer on the press column to facilitate wafer inspection at different heights. The effect. Another object of the present invention is to provide a wafer detecting device which can correspond to a magnetic element on a base and a pressing mechanism. When the wafer is pressed by magnetic pressure, the tester does not need to continuously press the wafer. In addition to saving manpower, the pressure is kept constant, and the efficiency of the wafer and the detection circuit is good. M333568 Another object of the present invention is to provide a plurality of accommodating grooves in the detecting piece of the detecting plate, and a wafer jig can be accommodated in the accommodating groove, and the wafer jigs are provided with different sized wafers. The slot is required to detect the size and size of the wafer. It does not need to remove the replacement of the test piece of the test board to facilitate the detection of the wafer. 0 Regarding the characteristics and implementation of the creation, the best embodiment is shown with the illustration. The details are as follows.
【實施方式】 茲為便於貴審查委員能更進一步對本創作之構造、 使用及其特徵有更深一層，明確、詳實的認識與瞭解，創 作人舉出較佳之實施例，配合圖式詳細說明如下： 請參閱第2圖至第5圖所示之一種晶片檢測裝置之改良結 構，其包括： 底座1 ’係包括一機板10、一顯示裂置11及一固定架 12 其機板10設有-顯示裝置u及—固定架12，該固定架 ''由兩側板121及一前板122組成一呈口型，於一側板⑵ 之外側得設有一止擋柱123 ; —Μ δ機構2 ’其包括至少二個支撐桿21、一柩轴以 方逢板23，該切桿21係_設於固定㈣右左兩側』 _ ^支撐桿Μ上穿設—樞軸22，該樞軸22上固設有一 ^ 處板23上設有複數個穿孔231供壓柱24套設·， "^主24則包括—柱體241、—彈性體242及-壓蓋243，Μ M333568 柱體241係穿設於壓板23,於突出於壓板23之柱體241上再 套設有一彈性體242，而柱體241頂端旋設一壓蓋243以頂住 彈性體242,該柱體241另一端則設有一調整槽2411，該調整 槽2411可為一、十字型或多角形之凹槽，並於二支撐桿21 之一外側設有一與樞轴22相互連接之壓桿25，其壓桿邠恰 位於止擋柱123之上方； 一檢測板3，係包括一檢測片31及一轉接卡32，於檢測 _ 片31上設有複數個容置槽311，且該容置槽311内可容設一 晶片治具312,且該晶片治具312内設有一晶片槽3121，於檢 測片31下方設有一呈“L”型之轉接卡32,該轉接卡32係置 於固定架12上方。 至少一磁吸結構4，其係包括一導磁元件41及磁性元件 42 ’該導磁元件41係固設於兩支撐桿21内側之枢軸22，並 具有導磁性之金屬柱體而可被磁性元件42吸附；該磁性元件 _ 42係位於固定架12兩側板121内側並固設於前板122上，且 與導磁元件41相對應，而磁性元件42係磁性吸附於-定位片 犯，該定位片43喺呈“L”型並設有複數個定位柱431及至少 一個穿孔432，而磁性元件42恰可容置於複數定位柱431間， 其穿孔432供螺固元件433螺設定位片43於固定架12上。再 者，於磁性兀件42另一侧得磁性吸附於具導磁性並設有複數 個定位柱441之另一定位片44。 藉由上述構件組成之晶片檢測裝置之改良結構，其實施檢 M333568 測時，則請配合第4圖、第5圖及第6圖所示，係將一檢測電 路板5置於底座1之機板1()上，且檢測電路板5之檢測電路 與顯示裝置11電性連接，該顯示裝置U可為液晶螢幕、映像 g顯不為等，再將檢測板3固設之轉接卡32插設於檢測電路 板5之轉接卡插槽51内，使檢測板3、轉接卡32、檢測電路 板5與顯示裝置n呈電性連接，再者，將待檢測之晶片6放 置於晶片治具312之晶片槽3121内，然後轉動限位於止擋柱 123上之壓桿25，透過壓桿25帶動樞軸22上之壓板23及導 磁元件41轉動，促使導磁元件41與固定架12上之磁性元件 42磁性相吸，其磁吸力使壓板23之壓柱24緊壓於晶片治具 312晶片槽3121内之晶片6,於導通晶片6並與檢測電路板5 後，則輪出檢測訊號至顯示裝置11上，而得以檢測晶片内之 電路是否正常。藉此磁吸壓力壓合晶片，則檢測者不需持續按 壓晶片，除可節省人力，亦使壓力保持固定，且晶片與檢測電 路$通良好。若晶片之尺寸規格大小不同時，其僅需更換晶片 治具’實便於不同規格之晶片檢測。 再者，當檢測之晶片高度較低，造成壓柱24長度χ不足 以觸石亚或僅些微觸碰到晶片6時，則請配合第7圖及第8圖所 不，藉由一、十字型或多角形工具插置於調整槽24ιι，並逆 時針旋轉壓柱24，使輕後的長度χ，Α於未調整長度 X，且再檢測時屋柱24恰可接觸到晶片6 (如第7圖所示）， 同理’當檢測之晶片較高’壓柱24長度y太長時，容易使晶 11 M333568 片6受壓4主24壓力過大而損壞，此時，可順時針旋轉調整壓 柱24 ’使調整後的長度y，小於未調整長度y，且再檢測時壓 柱24對晶片6壓力達到適中，以減少晶片受損及提高檢測的 準確性(如第8圖所示）。藉由於壓柱上設有調整槽供微調壓柱 與晶片間接觸距離之晶片檢測裝置，便於不同高度的晶片檢測 之功效。 上列詳細說明係針對本創作之一可行實施例之具體說 明，惟該實施例並非用以限制本創作之專利範圍，凡未脫離本 創作技藝精神所為之等效實施紐更，例如:等變化之等效性 實施例，均應包含於本案之專利範圍中。 、，綜上所述，本案在物品之形狀、構造或裝置上有所創新， jl幸乂白mu冑進上柄效，應已充分符合新紐及進步性之 法定新型專利要件，爰依法提出申請，懇請責局核准本件新 型專利中請案，以勵創作，至感德便。 【圖式簡單說明】 第1圖係習知晶片檢測裝置之示意圖； 2圖係本創作之晶片檢測農置之改良結構之立體示意圖 3圖係本創作之晶片檢測農置之改良結構之立體分解圖 4圖係本創作之晶·測裝置之改I輔實施示意圖（ 5圖係本創作之晶片檢測裝置之改良結構實施示意圖（. Z本創作之晶片檢測裝置之改I轉實施示意圖（」 回糸本創作之壓柱與晶片接驗力調整示意圖（一）; 12 M333568 第8圖係本創作之壓柱與晶片接觸壓力調整示意圖（二）。 【主要元件符號說明】 1、 Γ底座 10機板 11、 11’顯示裝置 12、 12’固定架 121侧板 122前板 123止擋柱 2、 2’壓合機構 21、 21’支撐桿 22、 22’樞轴 23、 23’壓板 231穿孔 24、 24’壓柱 241柱體 2411調整槽 242彈性體 243壓蓋 25、 25’壓桿 26彈力件 3、 3’檢測板 13 M333568 31、 31’檢測片 311容置槽 312晶片治具 3121、3121’ 晶片槽 32、 32’轉接卡 4磁吸結構 ^ 41導磁元件 _ 42磁性元件 43、44定位片 431、441定位柱 432穿孔 433螺固元件 5、5’檢測電路板 51插槽 φ 6、6’晶片 14[Embodiment] In order to facilitate the examination committee to further develop a clearer, more detailed understanding and understanding of the structure, use and characteristics of this creation, the authors give a better example, with the following detailed description: Please refer to the improved structure of a wafer detecting device shown in FIG. 2 to FIG. 5, which includes: the base 1' includes a plate 10, a display split 11 and a fixed frame 12. The plate 10 is provided with - The display device u and the fixing frame 12 are formed by two side plates 121 and a front plate 122. The stop plate 123 is provided on the outer side of the one side plate (2); the Μδ mechanism 2' The utility model comprises at least two support rods 21 and a cymbal cymbal cymbal 23, which is arranged on the fixed (four) right and left sides _ _ ^ support rod 穿 is disposed on the pivot 22, the pivot 22 is fixed There is a plurality of perforations 231 for the press column 24 to be disposed on the plate 23, and the main 24 includes a column 241, an elastic body 242 and a gland 243, and the M333568 column 241 is worn. It is disposed on the pressing plate 23, and is further sleeved with an elastic body 242 on the column 241 protruding from the pressing plate 23, and the column body 241 is topped. A pressing cover 243 is arranged to be pressed against the elastic body 242. The other end of the cylindrical body 241 is provided with an adjusting groove 2411. The adjusting groove 2411 can be a cross-shaped or polygonal groove, and is disposed on the two supporting rods 21 An outer side is provided with a pressing rod 25 connected to the pivot shaft 22, and the pressing rod 邠 is located just above the stopping post 123; a detecting board 3 includes a detecting piece 31 and a riser card 32 for detecting _ pieces A plurality of accommodating slots 311 are disposed on the 301, and a dicing fixture 312 is disposed in the accommodating slot 311, and a wafer slot 3121 is disposed in the dicing fixture 312, and an "L" is disposed under the detecting piece 31. The adapter card 32 of the type is placed above the holder 12. At least one magnetic structure 4 includes a magnetic conductive component 41 and a magnetic component 42. The magnetic conductive component 41 is fixed to the pivot 22 of the inner side of the two support rods 21, and has a magnetically conductive metal cylinder and can be magnetically The magnetic element 42 is located inside the two sides 121 of the fixing frame 12 and is fixed on the front plate 122, and corresponds to the magnetic conductive element 41, and the magnetic element 42 is magnetically attracted to the positioning piece. The positioning piece 43A is in an "L" shape and is provided with a plurality of positioning posts 431 and at least one through hole 432, and the magnetic member 42 is just accommodated between the plurality of positioning posts 431, and the through holes 432 are provided for the screwing member 433 to set the position piece. 43 is on the holder 12. Further, the other side of the magnetic element 42 is magnetically attracted to another positioning piece 44 which is magnetically conductive and is provided with a plurality of positioning posts 441. With the improved structure of the wafer detecting device composed of the above components, when performing the M333568 measurement, please match the detection circuit board 5 on the base 1 as shown in Figs. 4, 5, and 6. On the board 1 (), and the detecting circuit of the detecting circuit board 5 is electrically connected to the display device 11, the display device U can be a liquid crystal screen, the image g is not displayed, etc., and the riser card 32 for fixing the detecting board 3 is Inserted into the riser card slot 51 of the detection circuit board 5, the detection board 3, the riser card 32, the detection circuit board 5 and the display device n are electrically connected, and further, the wafer 6 to be detected is placed on The inside of the wafer slot 3121 of the wafer fixture 312 is then rotated to the pressing rod 25 on the stop post 123. The pressing plate 25 drives the pressing plate 23 on the pivot 22 and the magnetic conductive member 41 to rotate, thereby promoting the magnetic guiding element 41 and fixing. The magnetic element 42 on the frame 12 is magnetically attracted, and the magnetic attraction force presses the pressing column 24 of the pressing plate 23 against the wafer 6 in the wafer groove 3121 of the wafer fixture 312, after turning on the wafer 6 and detecting the circuit board 5, then the wheel The detection signal is sent to the display device 11 to detect whether the circuit in the wafer is normal. By this, the magnetic pressure is pressed against the wafer, so that the tester does not need to continuously press the wafer, in addition to saving manpower, the pressure is kept constant, and the wafer and the detection circuit are well connected. If the size and size of the wafer are different, it only needs to replace the wafer fixture to facilitate wafer inspection of different specifications. Moreover, when the height of the detected wafer is low, causing the length of the pressing column 24 to be insufficient to touch the stone or only slightly touch the wafer 6, please cooperate with the figures of FIG. 7 and FIG. The type or polygonal tool is inserted into the adjustment groove 24 ιι, and the pressure column 24 is rotated counterclockwise so that the length of the light is χ, Α to the unadjusted length X, and the column 24 is just in contact with the wafer 6 when re-detected (such as 7)), the same reason 'When the wafer to be tested is higher', the length y of the column 24 is too long, it is easy to damage the crystal 11 M333568 piece 6 under pressure 4 main 24 pressure too much, at this time, can be adjusted clockwise rotation The pressing column 24' makes the adjusted length y smaller than the unadjusted length y, and the pressure of the pressing column 24 on the wafer 6 is moderately detected during re-detection to reduce wafer damage and improve detection accuracy (as shown in Fig. 8). . The wafer inspection device is provided with an adjustment groove on the pressing column for finely adjusting the contact distance between the pressing column and the wafer, thereby facilitating the detection of wafers of different heights. The detailed description above is a detailed description of one of the possible embodiments of the present invention, but the embodiment is not intended to limit the scope of the patent of the present invention, and the equivalent implementation of the novel is not deviated from the spirit of the present invention, for example: Equivalent embodiments are to be included in the scope of the patent. In summary, the case has been innovative in the shape, structure or installation of the article. Jl Xingyu Baimu has entered the handle and should have fully complied with the new and progressive statutory new patent requirements. To apply, please ask the responsible office to approve the application in this new type of patent, in order to encourage creation, to the sense of virtue. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional wafer detecting device; 2 is a three-dimensional schematic diagram of an improved structure of the wafer detecting agricultural device of the present invention. Fig. 4 is a schematic diagram of the modification of the crystal and measuring device of the present invention. (Fig. 5 is a schematic diagram of the improved structure of the wafer detecting device of the present invention. Schematic diagram of the adjustment of the pressure and the test force of the 糸本 creation (1); 12 M333568 Fig. 8 is a schematic diagram of the pressure adjustment of the pressure column and the wafer of the creation (2). [Main component symbol description] 1. Γ base 10 machine Plate 11, 11' display device 12, 12' holder 121 side plate 122 front plate 123 stop column 2, 2' pressing mechanism 21, 21' support rod 22, 22' pivot 23, 23' pressure plate 231 perforation 24 24' pressure column 241 cylinder 2411 adjustment groove 242 elastic body 243 gland 25, 25' pressure bar 26 elastic member 3, 3' detection plate 13 M333568 31, 31' detection piece 311 accommodation groove 312 wafer fixture 3121 3121' chip slot 32, 32 4 ^ riser structure 41 permeable magnetic elements 43 and 44 _ positioning piece 42 of the magnetic element 431, 441 perforating positioning post 432 433 screw component 5, 5 'detecting circuit board 51 slots φ 6,6' wafer 14