M332314 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種電連接器，尤指一種電性連接晶片模組至電路板之 電連接器。 【先前技術】 ZIF(Zero Inserti〇n Force)電連接器（即通常所稱之零插入力電連接器） 廣泛地應用於電腦系統中，以將晶片模組電性連接至電路板。習知技術揭 ^ 了多種ZIF電連接器，如美國專利公告6623298號、65〇8658號、6471536 號以及中國大陸專利公告CN252〇〇33、CN252〇588、CN252〇〇i3等。M332314 VIII. New Description: [New Technology Field] This paper is about an electrical connector, especially an electrical connector that electrically connects a chip module to a circuit board. [Prior Art] ZIF (Zero Inserti〇n Force) electrical connectors (commonly referred to as zero insertion force electrical connectors) are widely used in computer systems to electrically connect a chip module to a circuit board. A variety of ZIF electrical connectors have been disclosed in the prior art, such as U.S. Patent Publication No. 6623298, No. 65,865, No. 6,471,536, and Chinese Patent Publications CN252〇〇33, CN252〇588, CN252〇〇i3, and the like.
電連接器-般包括紐、可動組接於基體上之蓋體以及❿容於基體與蓋體 =間=驅動蓋體自―開啓位置向-閉合位置滑動之驅動裝置，其中基體中 叹有複數收容有導電端子之端子收容槽，蓋體上對應基體上端子收容槽之 位置開設有複數通孔。ZIF冑連接器於電性連接晶片模組至電路板時，晶片 模組置於蓋體上方，晶賴組之針腳穿過蓋體上之通孔並伸人到端子收容 槽之中；進而於驅動裝置之帶動下移動並與導電端子接觸。The electrical connector generally includes a button body that is movably coupled to the base body, and a driving device that is slidably engaged with the base body and the cover body=the drive cover body from the “open position” to the closed position, wherein the base body has a plurality of sighs The terminal receiving groove for receiving the conductive terminal is provided with a plurality of through holes at positions corresponding to the terminal receiving grooves on the base body of the cover body. When the ZIF connector is electrically connected to the circuit board, the chip module is placed above the cover body, and the pins of the group pass through the through holes in the cover body and extend into the terminal receiving slots; The driving device moves and contacts the conductive terminals.
惟，上述電連接器至少存在以τ缺陷，晶片模組之針腳通常需要先穿 f體上之通孔，織插人到端子收容射去，並且還必聽證於插入端 子收谷槽之雜帽量不解電端子接觸，達到零插人力之目的，故對導 電端子正赠以及端子收容槽與蓋體上狐之姆位置之要求 格，導電端子與晶片模組針腳達成電性連接之方式也比較複雜。 2此，確有必要提供_種改進之電連接器，以克服上述電連接器存 【新型内容】 本創料解決之技姻職提供—種電連接器，料電端子能夠方便 地與晶片模組之針腳達成電性連接。 上問題’本創作提供—種電連接器，可電性連接晶片模 ，電路板，包括基體、可動地組接於基體上方之蓋體、容置於 =間用以驅動蓋體相對於基體滑動之驅動裝置，以及二 中基體對應設有-組端子收容_收料電端子，蓋體對應針 M332314 收容槽設有-組通孔，其中導電端 部，所述鋪部與通孔内壁之間留有可=片2；=^孔之令之接觸 體作動後帶動晶片模組之針腳朝向接觸 谁^插，之空間，蓋 電性接觸。 丁接觸«動’進而使針腳與接觸部達成 與習知技蟄相比’本創作之電連接器且曰 J須插入:]端子收容槽中即可方便地與導電端子達:電:二:: 子之正位紅縣也降低了。 狀科孤 【實施方式】 以第—圖至第三圖，本創作關於—種電連接11卜可用以承載晶片 二且亚电性連接晶片模組2至印刷電路板（未圖示），進而使 與印刷電路板之間能夠傳遞信號及電流。 彳、、、、 電連接器1包括基體10、蓋體14及收容於基體1〇中之一組 12 ^中基體1()設有對接面刚，對接面卿上設有一組端子收⑽ 以收谷對應之導電端子丨2。 盍體14可動地組設於基體1〇上，其設有與基體1〇對接面则相 I表面M0及與下表Φ 14〇相對之上表面142，貫穿上表面142及下表面 40設有-組與端子收容槽1〇2對應之通孔146，該等通孔146可供晶片模 ^引過，並且通孔146於靠近上表面142處設置有倒角形成之 v引槽（未私唬），以方便晶片模組2之針腳2〇插入通孔146。 基體10與蓋體14之間還可設置一驅動裝置（未圖示），如同習知技藝 之IF型連接器，該驅動裝置可爲驅動杆或者偏心凸輪，可驅動蓋體 對於基體10滑動，該種設計爲公衆熟知。 導電端子12分別容置於對應之端子收容槽1〇2中，導電端子12設有 固持於端^收容槽102内之基部12〇、自基部12〇 一側延伸而出之彈性臂 =2 ’以及設於基部120下端之焊接部124。彈性臂122包括基部⑽之上 ^向上延伸而出之連接部122〇，以及自連接冑122〇末端延伸之接觸部 2 ’、中接觸部1222 S置於蓋體μ上之通孔146中，其靠近通孔146 内壁之Γ處且與_其他部分之間留有可供晶錢組2之針腳2G插入之空 間。當蓋體14或者基體10之間設有辅助裝置（如蓋體14下表φΐ4〇設有 朝向基體10之凸塊，此處未圖示）使蓋體Μ之下表面刚與基體之對 6 M332314 接面100之間具有一定之空間時，連接部1220自基部120向上延伸出來端 子收容槽102之後，連接部1220係延伸於基體10與蓋體14之間，其既可 以位於端子收容槽1〇2之正上方，也可以向相鄰端子收容槽1〇2方向偏移 並最終位於基體10對接面1〇〇之上方、相鄰端子收容槽1〇2之間。焊接部 124自基部120延伸出端子收容槽1〇2,並且與彈性臂122分別置於基部12〇 之兩側。蓋體14作動後帶動晶片模組2之針腳2〇朝向接觸部1222移動， 進而使針腳20與接觸部1222達成電性接觸。 曰曰月棋、、且2設有一組針腳20,晶片模組2可安裝至蓋體14之上表面 142 ’所述針腳20可伸入對應之通孔146中。However, the above-mentioned electrical connector has at least a defect of τ, and the pins of the wafer module usually need to pass through the through hole on the f body, and the woven inserter is placed in the terminal to be taken and shot, and must also be heard in the miscellaneous cap inserted into the terminal valley. The quantity does not solve the electrical terminal contact, and achieves the purpose of zero insertion manpower. Therefore, the requirements for the position of the conductive terminal and the position of the terminal receiving groove and the fox body on the cover body, and the manner in which the conductive terminal and the chip module pin are electrically connected are also quite complicated. 2, it is really necessary to provide _ an improved electrical connector to overcome the above-mentioned electrical connector storage [new content] This material solution to provide technical support - a kind of electrical connector, material electrical terminals can be easily with the wafer module The pins of the group reach an electrical connection. The above problem is provided by the present invention, an electrical connector for electrically connecting a wafer mold, a circuit board, a base body, a cover body movably assembled to the upper portion of the base body, and a space for driving the cover body to slide relative to the base body The driving device and the two middle bases respectively have a set-group terminal receiving_receiving electric terminal, and the cover corresponding pin M332314 is provided with a set of through holes, wherein the conductive end portion is between the paving portion and the inner wall of the through hole Leave the film 2; = ^ hole of the contact body after the action of the chip module to drive the pin of the chip toward the contact, the space, the cover electrical contact. Ding contact «moving' and then the stitches and contacts are compared with the conventional technology. 'The electrical connector of this creation and the 曰J must be inserted into the terminal receiving slot can be conveniently connected with the conductive terminal: electricity: two: : The red county of Zizhi is also reduced. [Embodiment] In the first to third figures, the present invention relates to an electrical connection 11 for carrying a wafer 2 and electrically connecting the wafer module 2 to a printed circuit board (not shown), and further Enables signal and current transfer between the printed circuit board. The electrical connector 1 includes a base body 10, a cover body 14 and a group 12 in which the base body 1 is mounted. The base body 1 () is provided with a mating surface, and the docking surface is provided with a set of terminals (10). The conductive terminal 丨2 corresponding to the valley. The body 14 is movably disposed on the base 1 , and is provided with a surface I aligning with the base 1 , and a surface M0 and a surface 142 opposite to the lower surface Φ 14 , are disposed through the upper surface 142 and the lower surface 40 . - a through hole 146 corresponding to the terminal receiving groove 1 〇 2, the through hole 146 is permeable to the wafer, and the through hole 146 is provided with a chamfered v groove near the upper surface 142 (not private)唬), in order to facilitate the insertion of the pins 2 of the wafer module 2 into the through holes 146. A driving device (not shown) may be disposed between the base body 10 and the cover body 14. Like the IF type connector of the prior art, the driving device may be a driving rod or an eccentric cam, and the driving cover body may slide the base body 10, This design is well known to the public. The conductive terminals 12 are respectively received in the corresponding terminal receiving slots 1〇2, and the conductive terminals 12 are provided with a base portion 12固 held in the end receiving groove 102, and an elastic arm extending from the side of the base portion 12=2' And a soldering portion 124 disposed at a lower end of the base portion 120. The elastic arm 122 includes a connecting portion 122 之上 extending upward from the base portion (10), and a contact portion 2 ′ extending from the end of the connecting 胄 122 、, and the middle contact portion 1222 S is disposed in the through hole 146 of the cover body μ, It is close to the inner wall of the through hole 146 and has a space for the insertion of the stitch 2G of the crystal money group 2 between the other portions. When the cover 14 or the base 10 is provided with an auxiliary device (for example, the cover 14 is provided with a projection toward the base 10, not shown here), the lower surface of the cover is just opposite to the base. When the connection portion 1220 extends from the base portion 120 to the terminal receiving slot 102, the connecting portion 1220 extends between the base 10 and the cover 14 and can be located in the terminal receiving slot 1 Just above the 〇2, it may be offset in the direction of the adjacent terminal receiving groove 1〇2 and finally located above the mating surface 1〇〇 of the base 10 and between the adjacent terminal receiving grooves 1〇2. The soldering portion 124 extends from the base portion 120 to the terminal receiving groove 1〇2, and is disposed on both sides of the base portion 12B with the elastic arms 122, respectively. After the cover 14 is actuated, the pins 2 of the wafer module 2 are moved toward the contact portion 1222, thereby electrically contacting the pins 20 with the contact portion 1222. The cymbal, and 2 is provided with a set of pins 20, and the wafer module 2 can be mounted to the upper surface 142' of the cover 14 so that the pins 20 can extend into the corresponding through holes 146.
請參考第二圖及第三圖，當晶片模組2組接至電連接器i時，晶片模 組2置於蓋體14上’所述針腳20僅插入蓋體14上之通孔146而並不需要 插入到端子收容槽102之中。最初針腳2〇並不與導電端子U之彈性臂122 上之接觸部1222接觸，此時，蓋體14之位置通常稱作開啓位置；晶片模 組2之針腳20插入到通孔146中後，操作驅動裝置，使蓋體14相對於美 體1〇滑動。蓋體Η沿第三圖中X箭頭所示方向作動後 ==_麵部1222纖抵細請樣现終與= 插之針腳2。無須 針導電端子d Λ 子達成電性連接，相應地 ^ 4子12之正位度之要求也降低了；導電端子12可以 構（如只需要一個彈性臂），並且導電端子ΐ2 ς : 容槽脱之中，對端子收容槽1()2之空間要求較低。卩今置•子收 述，本創作符合新型專利要件，差依法提出專利申請。惟，以 上所述者僅為本創作之較佳實施例，本 【圖式簡單說明】 ’其中晶片模組尚未組 ’顯示了晶片模組已組 第-圖係本創作電連接器與晶片模組之示 接至電連接器。 第二圖係本創作電連接器與晶片模組之示意圖 7 M332314 設至Ϊ連接11，鮮針腳尚未鱗電端子之_部接_之狀態。 ‘=、本創作電連接11與晶片模組之示意圖，顯示了蓋體於外力作 /月動後$動晶片模組之針腳與導電端子之接觸部産生接觸之 【主要元件符號說明】 a形。 電連接器 1 對接面 100 導電端子 12 彈性臂 122 接觸部 1222 蓋體 14 上表面 142 晶片模組 2Referring to the second and third figures, when the chip module 2 is assembled to the electrical connector i, the wafer module 2 is placed on the cover 14 and the pin 20 is only inserted into the through hole 146 of the cover 14. It is not necessary to insert into the terminal receiving groove 102. The first pin 2 is not in contact with the contact portion 1222 of the elastic arm 122 of the conductive terminal U. At this time, the position of the cover 14 is generally referred to as an open position; after the pin 20 of the wafer module 2 is inserted into the through hole 146, The driving device is operated to slide the cover 14 relative to the body 1 . After the cover 作 is moved in the direction indicated by the X arrow in the third figure, the == _ face 1222 is spliced to the end and the pin 2 is inserted. The needle-free conductive terminal d 达成 is electrically connected, and the requirement of the positive position of the sub-four 12 is also reduced; the conductive terminal 12 can be configured (eg, only one elastic arm is required), and the conductive terminal ΐ2 ς : In the case of the disconnection, the space requirement for the terminal receiving groove 1 () 2 is low. According to the current report, the creation meets the requirements of the new patent, and the patent application is submitted according to law. However, the above is only a preferred embodiment of the present invention. This [simplified description of the drawing] 'where the chip module has not been assembled' shows the chip module has been assembled - the image of the original electrical connector and the wafer module The group is connected to the electrical connector. The second figure is a schematic diagram of the present electrical connector and the chip module. 7 M332314 is set to the Ϊ connection 11, and the fresh pin is not yet connected to the squaring terminal. '=, the schematic diagram of the creative electrical connection 11 and the wafer module, showing that the cover body is in contact with the contact portion of the conductive terminal of the movable wafer module after the external force/monthly movement [main component symbol description] . Electrical connector 1 docking surface 100 conductive terminal 12 resilient arm 122 contact 1222 cover 14 upper surface 142 wafer module 2
基體 10 端子收容槽102 基部 120 連接部 1220 焊接部 124 下表面 140 通孔 146 針腳 20Base 10 Terminal receiving groove 102 Base 120 Connection 1220 Weld 124 Lower surface 140 Through hole 146 Pin 20