Μ33Ϊ747 八、新型說明： 【新型所屬之技術領域】 • 本創作係有關於一種銲球接合強度測試裝置，可運 用於半導體晶片封裝，用於檢測一待測iC(integrated ci^uit，積體電路）元件之銲球接合強度。 【先前技術】 近年來’利用有關銲球作為外接端子之1C元件已快 速地發展’例如半導體球格陣列（ban grid array，Bga) 藝封裝構造與覆晶封裝（Flip chip)組件。其中，所謂的球 格陣列封裝構造係為一種常見的1C元件，其内封設有 一晶片’並以複數個銲球（s〇lder ball)作對外電性導 接。一般電子產品在封裝時，由於ie元件受溫度變化 產生形變’再加上1C元件與外接印刷電路板之間熱膨 脹係數不相匹配與溫度不一致，故容易會有剪向應力作 用於其間之銲球，將影響銲點的可靠度。所以在IC元 • 件製成之後（即SMT接合使用之前），會進行最終成品測 忒，例如老化試驗、電性試驗、拉力試驗、銲球接合強 度試驗等’以確保接合使用於電子產品之品質與可靠 性。尤其是應用於一般日常用品中常見的電腦螢幕、行 ，動電話、數位相機、PDA等等電子產品通常對撞擊與抵 抗應力之特性要求更高，故相關測試變得更為重要。 以銲球接合強度試驗來說，傳統以手工測量極不準 確，且再現性差。但習知銲球接合強度測試裝置，例如 揭示於我國發明專利公告編號1274873號之「接合強度 4 M331747 測試裝置」’僅能針對IC元件某一特定位置之銲球進行 測試，無法快速地調整以測試任意位置之銲球，故在測 試時僅設定在單一位置，無法作銲球之接合強度在不同 位置之比對分析。此外，當Ic元件依產品種類在尺寸 與銲球位置有所變化時，導致其測試點的調整亦相當複 雜而不方便。再者，習知高準度之銲球接合強度測試裝 置不但體積龐大更是造價昂責’無法達到低成本之需 求。 ®【新型内容】 本創作之主要目的係在於提供一種銲球接合強度測 試裝置，玎針對1C元件上任意位置之任一銲球做準確 地定位與測試，具有體積小、機構簡單化及低成本之優 點，並能有效地測試出任意位置之銲球抗剪向應力之接 合強度。 依據本創作之一種銲球接合強度測試裝置，主要包 # 含一基座、一剪應力提供機構、一待測物固定台以及一測 試頂針。該基座係設有一 X軸滑執與一 γ軸滑執。該剪 . 應力提供機構係可滑動地設置於該X軸滑軌。該待測物 固定台係以可調整Y軸位置的方式結合於該Y軸滑 執’用以位置调整並固定一設有複數個銲球之待測ic 疋件。該測試頂針其係設置於該剪應力提供機構，用以 頂推其中一銲球。 本創作的目的及解決其技術問題還可採用以下技術 措施進一步實現。 5 M331747 在削述的銲球接合強度測試裝置中，該剪應力提供機 構係可包含有一張力計以及一張力計固定台，其中該張力計 係連接該測試頂針之一端並結合於該張力計固定台。 在則述的銲球接合強度測試裝置中，該待測ic元件 係可為一半導體球格陣列封裝構造或覆晶組件。 【實施方式] 口月參閱第1及2圖所示，本創作之一種銲球接合強 度測试裝置1 00主要包含一基座Π 0、一剪應力提供機 ►構120、~待測物固定台130以及一測試頂針140。該 基座1 1 〇係設有一 X軸滑執n丨與一 γ軸滑軌丨丨2，該Μ33Ϊ747 八, new description: [New technology field] • This creation is about a solder ball joint strength test device, which can be used in semiconductor chip package to detect an iC (integrated ci^uit, integrated circuit) The solder ball bonding strength of the component. [Prior Art] In recent years, the 1C element using the solder ball as an external terminal has been rapidly developed, for example, a ban grid array (Bga) package structure and a flip chip package. Among them, the so-called grid array package structure is a common 1C element, which is internally sealed with a wafer ' and is electrically connected by a plurality of solder balls. In general, when the electronic product is packaged, the IE component is deformed by temperature changes. In addition, the thermal expansion coefficient between the 1C component and the external printed circuit board does not match the temperature, so it is easy to have the shearing stress acting on the solder ball. Will affect the reliability of the solder joint. Therefore, after the IC component is manufactured (before the SMT is used), final product testing, such as aging test, electrical test, tensile test, solder joint strength test, etc., is performed to ensure bonding for use in electronic products. Quality and reliability. In particular, electronic products such as computer screens, mobile phones, digital cameras, PDAs, etc., which are commonly used in general daily necessities, generally require higher impact and stress resistance characteristics, so related tests become more important. In the case of the solder ball joint strength test, the conventional manual measurement is extremely inaccurate and the reproducibility is poor. However, the conventional solder ball bonding strength testing device, for example, the "joining strength 4 M331747 test device" disclosed in the Chinese Patent Publication No. 1274873 can only be tested for a specific position of the solder ball of the IC component, and cannot be quickly adjusted. Test the solder balls at any position, so it is only set at a single position during the test, and it is impossible to analyze the joint strength of the solder balls at different positions. In addition, when the Ic component varies in size and solder ball position depending on the product type, the adjustment of the test point is also complicated and inconvenient. Furthermore, the high-precision solder ball joint strength tester is not only bulky but also costly. ® [New Content] The main purpose of this creation is to provide a solder ball bonding strength test device that accurately positions and tests any solder ball at any position on the 1C component, and has a small size, a simple mechanism, and a low cost. The advantages, and can effectively test the joint strength of the ball against shear stress at any position. According to the present invention, a solder ball joint strength testing device mainly includes a base, a shear stress providing mechanism, a test object fixing table, and a test thimble. The base is provided with an X-axis slide and a γ-axis slide. The shear providing mechanism is slidably disposed on the X-axis slide rail. The object to be tested is coupled to the Y-axis slide in a position to adjust the position of the Y-axis for position adjustment and fixing an ic element to be tested provided with a plurality of solder balls. The test thimble is disposed on the shear stress providing mechanism for pushing one of the solder balls. The purpose of this creation and solving its technical problems can be further realized by the following technical measures. 5 M331747 In the illustrated solder ball joint strength testing device, the shear stress providing mechanism may include a tension meter and a force meter fixing table, wherein the tension meter is connected to one end of the test thimble and is fixed to the tension meter. station. In the solder ball bonding strength test apparatus described above, the ic element to be tested may be a semiconductor ball grid array package structure or a flip chip assembly. [Embodiment] Referring to Figures 1 and 2, the solder ball joint strength testing device 100 of the present invention mainly comprises a base Π 0, a shear stress providing machine ► structure 120, ~ the object to be tested is fixed The stage 130 and a test thimble 140. The base 1 1 is provided with an X-axis slide n丨 and a γ-axis slide rail 2, which
X轴α轨111與該該γ軸滑執112係互為垂直。該X 轴滑軌111可用以調整與固定該剪應力提供機構12〇之 位置，該Υ軸滑軌1 1 2可用以調整與固定該待測物固定 台1 3 0之仇置。 違剪應力提供機構丨2〇係可滑動地設置於該χ軸滑 • 轨11 1。該待測物固定台1 3 0係以可調整Υ軸位置的方 式結合於該Υ軸滑軌1 1 1，用以位置調整並固定一設有 複數個銲球210之待測ic元件200。 如第2圖所示，該待測ic元件200係可為一半導體 球格陣列封裝構造或是其他使用銲球之覆晶封裝組 件’其表面係具有複數個銲球2 1 0，可呈矩陣排列。 該測試頂針140係設置於該剪應力提供機構120， 用以頂推其中一銲球210,並具有一受力端141與相對 於忒爻力端141的一推球端142，其中該受力端Ml係 6 M3 3‘1747 連接至S亥剪應力提供機構12〇。 在本實施例中’該剪應力提供機構120係可包含有 一張力計121以及—張力計固定台122，其中該張力計 121係連接該測試頂# 14〇之該受力# ΐ4ι並結合於爷 張力計固定台122。 μ 如第2圖所示’在進行銲球強度測試時，在該待測 物固定台130上放置一個待測IC元件2〇〇，The X-axis alpha rail 111 and the gamma-axis slider 112 are perpendicular to each other. The X-axis slide rail 111 can be used to adjust and fix the position of the shear stress providing mechanism 12, which can be used to adjust and fix the object to be tested. A violation stress providing mechanism 可 2 is slidably disposed on the yoke slide rail 11 1 . The test object fixing table 130 is coupled to the x-axis slide rail 1 1 1 in an adjustable shaft position for positionally adjusting and fixing an ic element 200 to be tested provided with a plurality of solder balls 210. As shown in FIG. 2, the ic device 200 to be tested may be a semiconductor ball grid array package structure or other flip chip package assembly using solder balls. The surface thereof has a plurality of solder balls 2 1 0, which may be in a matrix. arrangement. The test thimble 140 is disposed on the shear stress providing mechanism 120 for pushing one of the solder balls 210 and has a force receiving end 141 and a pushing end 142 opposite to the clamping end 141, wherein the force is applied. The end M1 is a 6 M3 3'1747 connected to the S-shear stress providing mechanism 12A. In the present embodiment, the shear stress providing mechanism 120 can include a tension meter 121 and a tensiometer fixing table 122, wherein the tension meter 121 is connected to the test top #14〇 and is combined with the force. Tensiometer fixed table 122. μ As shown in Fig. 2, when performing the solder ball strength test, an IC component to be tested 2 is placed on the test object fixing table 130,
測物固定…所固定。之後，利用該乂轴滑二 與該Y軸滑軌112調整與固定該待測物固定台13〇與該 剪應力提供機才冓120之位置(如箭頭方向），使該測試頂 針140之該推球端142可對準至該待測ic元件上 任意位置之某一銲球21〇。之後，固定該待測物固定台 13〇於該Y軸滑軌112。之後，該剪應力提供機構12〇 提供一推力予該測試頂針14〇，以該測試頂針14〇該推 球端142頂推一被選定之銲球21〇(如第3圖所示）。同 時會產生一反作用力至該受力端141，其推力力量可被 該張力計121測得。經適當計算後可作為該銲球210之 抗剪向應力之接合強度。 如第2圖所示，在本實施例中，該張力計i2i係具 有一指針與刻度，可量測施力的數據，在另一較佳實施 例中也可使用具有數字顯示之張力計。在使用該張力 什1 2 1則須先確認指針位於校正點，之後可施加一力量 至該測試頂針140以推迫與該推球端142接觸之一銲球 2 10可以施力直到該銲球2 1 0產生斷裂，則該張力計 M331747 1 2 1量測的數據可計算得該銲球2 1 0之最大抗剪向應力 之接合強度。利用該X軸滑執1 1 1與該Υ轴滑軌1 12 調整該剪應力提供機構120或該待測物固定台130之位 置’以選擇性測試該IC元件2 〇 〇上任意位置之銲球2 1 0。 因此’藉由該銲球接合強度測試裝置丨〇〇可準確的 選定該待測物固定台130之任一銲球210進行銲球接合 強度測試，具有體積小、機構簡單化與低成本之優點， 並旎有效地測試出任意位置之銲球抗剪向應力之接合 強度。 口 μ上所述，僅是本創作 …•八，一乃〜N π υ '业非3 創作作任何形式上的限制，雖然本創作已以較佳實名 例揭露如上，然而並非用以限定本創作，任何熟悉本^ 技術者，在不脫離本創 、〜 居J 之甲喷專利耗圍内，所作的卞 改、等效性變化與修飾，皆涵蓋於本創作㈣ _ 【圖式簡單說明】 第1圖··依據本創作之一 一 種鋅球接合強度測試裝置之立覺 示意圖。 第2圖 依據本創作之—藉々 一 種鲜球接合強度測試裝置之頂右 不意圖以及待測ΤΓ - Μ 第3圖 、Ic 70件之局部放大圖。 依據本創作之一 一立 種#球接合強度測試袭置之側相 不意圖以及蜊試了f # 置之側韻 Γ 士 * - 飞貝針之局部放大圖。 【主要兀件符號說明】 1风穴團 1〇〇銲球接合強度測試裳置 M3 31747 11 0基座 111 X軸滑執 112 Υ軸滑軌 120剪應力提供機構 121張力計 122張力計固定台 130待測物固定台 140測試頂針 141受力端 142推球端 200待測1C元件 210銲球The test object is fixed... fixed. Then, the position of the object to be tested 13 and the shear stress providing mechanism 120 (such as the direction of the arrow) is adjusted and fixed by the yoke 2 and the Y axis slide 112, so that the test thimble 140 The pusher end 142 can be aligned to a certain solder ball 21〇 at any position on the ic element to be tested. Thereafter, the fixture fixing table 13 is fixed to the Y-axis rail 112. Thereafter, the shear stress providing mechanism 12 provides a thrust to the test thimble 14A, and the test thimble 14 〇 pushes the push end 142 to push a selected solder ball 21 (as shown in FIG. 3). At the same time, a reaction force is generated to the force receiving end 141, and the thrust force can be measured by the tensiometer 121. The joint strength of the shear stress of the solder ball 210 can be used as appropriate. As shown in Fig. 2, in the present embodiment, the tension meter i2i has a pointer and a scale for measuring the force applied data, and in another preferred embodiment, a tension meter having a digital display can also be used. When the tension is used, it is necessary to confirm that the pointer is at the calibration point, and then a force can be applied to the test thimble 140 to urge the solder ball 2 to contact the push ball end 142. The force can be applied until the solder ball is applied. When the fracture occurs in 2 1 0, the data measured by the tensiometer M331747 1 2 1 can calculate the joint strength of the maximum shear stress of the solder ball 2 1 0. Using the X-axis slide 1 1 1 and the x-axis slide 1 12 to adjust the position of the shear stress providing mechanism 120 or the test object fixing table 130 to selectively test the welding of the IC element 2 on any position Ball 2 1 0. Therefore, the solder ball bonding strength test can be accurately selected by the solder ball bonding strength testing device 任一, and has the advantages of small size, simple mechanism, and low cost. , and 旎 effectively test the joint strength of the ball against shear stress at any position. As stated on the mouth μ, this is only the creation...•eight, one is ~N π υ 'Industry is not limited to any form of creation, although this creation has been disclosed as a better real name, but not for limiting this Creation, any person who is familiar with this technology, in the patents that do not deviate from the creation, ~ J, the tampering, equivalence change and modification, are covered in this creation (4) _ [Simple description Fig. 1 is a schematic diagram of a zinc ball joint strength testing device according to one of the creations. Fig. 2 According to the creation of the present invention, a fresh ball joint strength test device is not intended and the test ΤΓ - Μ Fig. 3, Ic 70 partial enlargement. According to one of the original creations, a ball joint strength test is used to detect the side phase. It is not intended and the f# set side rhyme Γ 士 * - Partial enlargement of the flying bayonet needle. [Main components symbol description] 1 wind hole group 1〇〇 solder ball joint strength test skirt M3 31747 11 0 base 111 X-axis slipper 112 Υ shaft slide 120 shear stress supply mechanism 121 tension meter 122 tension meter fixed table 130 test object fixing station 140 test thimble 141 force end 142 push ball end 200 to be tested 1C component 210 solder ball