M331137M331137
八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱器模組，尤指一種用於壓接晶片模組實現晶片模組 和電連接器電性連接之散熱器模組。 【先前技術】 • 習知電連接器’特別係平面栅格陣列型電連接器，其包括容設有複數導電 端子之絕緣本體，且其一般需要金屬壓板將晶片模組固持於電連接器之絕緣本 -體中，以確保容設於絕緣本體内之導電端子與晶片模組之間穩定之電性連接。 -進一步，爲了達到更好效果，許多時候絕緣本體上還設有下鐵殼、撥桿及上鐵 镰殼。上述技術手段，可參考中國大陸專利公告第CN2786831Y號專利和第 CN2609218Y 號專利。 上述傳統設計手段能夠使晶片模組與電路板之間建立電性連接，惟，由於 上述。又α十手#又& σ又了下鐵设、撥桿和上鐵殼等提供下壓力之金屬部件，因此， 此類設計往往必麵牲額外之空間，對於某些空間需求比較苛刻之應用，此種 設計就比較難以實施；此夕卜，由於此類設計採用之金屬材質之上鐵殼、下鐵殼 和撥桿往往形狀較爲特殊，使得電連接器之成本提高了。 a 寥於上述狀況，猶必要提供—種改良之散熱器模組，可雌接晶片模組 1現晶片模組和電連接器電性連接以解決傳統技術方案中存在之缺陷。、、 .【新型内容】 *本創作要解決之問舰提供—種可以提供難晶賴組之下壓力實現晶 片模組和電連接器電性連接之散熱器模組。 .本創作係這樣解決上述問題：一種散熱器模組，躲塵接晶片模組實現晶 片模組和電連接②電性連接，其包括散熱器和下壓裝置，其巾，下魏置固持 於散熱=下端’其設有板狀基體’該基翻向電連接S—側凸伸設有顯部。 與習知技術相比較，本創作散熱器模組利用固持於散熱器下端之下辭置 均勾施加勤於晶賴組上並傳遞給導電端子，使導電端子與晶片模组以及、電 f板導通，_提供纖電·雛私目的。賴狀散綠池不需要電 連接減置上驗、下鐵殼及搖桿等零部件，具有節約絲空間以及降低 68. New Description: [New Technology Field] This creation is about a heat sink module, especially a heat sink module for crimping a wafer module to realize electrical connection between the chip module and the electrical connector. [Prior Art] • The conventional electrical connector 'specially is a planar grid array type electrical connector, which includes an insulating body that houses a plurality of conductive terminals, and generally requires a metal platen to hold the wafer module to the electrical connector. Insulating the body to ensure a stable electrical connection between the conductive terminals housed in the insulating body and the wafer module. - Further, in order to achieve better results, many times the insulating body is provided with a lower iron shell, a lever and an upper iron shell. For the above technical means, reference may be made to the Chinese Patent Publication No. CN2786831Y and the No. CN2609218Y. The above conventional design means can establish an electrical connection between the chip module and the circuit board, however, due to the above. And α 十手#又& σ has the lower pressure metal parts such as the lower iron set, the lever and the upper iron shell. Therefore, such designs often have extra space, and some space requirements are more demanding. Application, this kind of design is more difficult to implement; in addition, due to the metal material of this type of design, the iron shell, the lower iron shell and the lever tend to have a special shape, so that the cost of the electrical connector is increased. a In the above situation, it is necessary to provide an improved heat sink module, which can be connected to the wafer module. The current wafer module and the electrical connector are electrically connected to solve the defects in the conventional technical solutions. [, new content] * The ship to be solved by this creation provides a heat sink module that can provide the electrical connection between the wafer module and the electrical connector under the pressure of the difficult layer. The present invention solves the above problems in this way: a heat sink module, the dust-removing chip module realizes the electrical connection between the chip module and the electrical connection 2, and includes a heat sink and a pressing device, and the towel is held by the lower sleeve. Heat dissipation = lower end 'which is provided with a plate-shaped base body' which is provided with a display portion for the electrical connection S-side projection. Compared with the conventional technology, the heat sink module of the present invention is held by the lower end of the heat sink, and is applied to the crystal substrate and transmitted to the conductive terminal, so that the conductive terminal and the chip module and the electric board Conduct, _ provide fiber and youth. The Lai-like green pool does not need to be connected to the upper inspection, the lower iron shell and the rocker, etc., which saves the space and reduces the 6
/ /7* —；.r" }b ，i 、ν,·Ά·-〇ϊ 允‘ 八W M331137 HI月為3 9 TTJ X i 成本之優點；另外’工廠雜裝段省去組裝上鐵殼、T鐵殼及 組裝程式簡化，齡了人力需求；再者，省去上鐵殼、下敏及搖桿該等金屬 材質元件，減輕了産品重量，提升了表面貼裝則之效率和良率，可作爲後續 大型電連接器之産品架構。 ' ^ 【實施方式】 晴-併參’-圖至第四圖所示，其揭示本創作第—優選實施例之散執器 模組（未標示），用於壓接晶片模組2實現晶片模組2和電連接器丨之間之電性2 接，其包括散熱器6和下壓裝置4，下壓裝置4可以固持於散熱器6之下端。 電連接為1用以電性連接晶片模組2至電路板3，其包括絕緣本體1〇，絕緣 本體10大致呈縱長形，其包括收容有複數導電端子（未圖示）之收容部励以 及圍繞收容部100之側牆101。收容部100與側牆1〇1共同圍成一收容空間，晶片 模組2收容於該空間内且置於收容部1〇〇上，側牆1〇1上設置之複數彈性懸臂j〇2 及複數粒凸塊1G3-起將晶#模組2定位；其巾-對相狀彳麟⑼上開設有 缺口(未標示)以利於散發晶片模組2工作時産生之熱量，側牆上開設缺口之位置 還設有一對大致對稱之定位柱104以與下壓裝置4上對應位置處設置之定位孔 41配合。 電路板3上設有四個配合孔30，所述四個配合孔3〇之間距由絕緣本體1〇於 電路板3上所佔據區域之大小來決定，四個配合孔3〇所限定之區域足以放置絕 緣本體10。 下壓裝置4爲一彈篑板，由金屬材料衝壓而成，大致呈方形之平板狀結構， 下壓裝置4之中央设有開口（未標示）以收容晶片模組2上凸出之部份。下壓裝 置4上設有四處安裝孔40，所述四處安裝孔4〇與電路板3上之所設之四個配合孔 30位置一一對應，下壓裝置4之一對側邊上設有一對定位孔41。此外，下壓裝 置4上還設有複數壓接部42，請重點參考第四圖，該壓接部42凸出於下壓裝置4 之表面以與晶片模組2接觸。散熱器6之底面上設有四個突出之定位凸柱6〇以與 下壓裝置4之安裝孔40配合，所述四個定位凸柱6〇上均設有螺紋孔（未標示） 以與連接件5配合，此處，連接件5爲四個長度適宜之螺栓。 組裝時，首先將晶片模組2嵌入電連接器1之收容空間並置於收容部1〇〇 M331137 | 補兄 上；然後將晶片模組2連同電連接器1 一起放置於電路板3上四個配合孔3〇所限 定之區域内；再將下壓裝置4、散熱器6依次放置於電連接器1和晶片模組2之上 、 方，下壓裝置4之壓接部42朝向晶片模組2所在一侧並與晶片模組2接觸，下麼 裝置4上之四個安裝孔40與電路板3上之配合孔30--對應並且使散熱器6之定 、 位凸柱60插入到下壓裝置4上之安裝孔40中，下壓裝置4上之定位孔41與絕緣本 . 體10上之定位柱1〇4配合；最後，連接件5從電路板3之下方穿過配合孔3〇以及 下壓裝置4並且與散熱器6定位凸柱60上所設之螺紋孔配合，從而電連接、 -電路板3、下壓裝置4與散熱器6組裝成一體。散熱器6藉下壓裝置4均勻施加壓 • 力於晶片模組2上，下壓裝置4上所設置之凸出之壓接部42可確保下壓裝置4能 • 壓到晶片模組2並將壓力傳遞給導電端子使其與電路板3上之電路圖案以及晶 片模組2上之導電元件電性導通，從而達到提供電氣連接之預期目的。 «月參閱弟五圖至弟七圖所示，其揭示本創作第二優選實施例之散熱器模組 (未標示）’用於壓接晶片模組（未標示）實現晶片模組和電連接器（未標示） 之電性連接，其也包括散熱器90和下壓裝置80，下壓裝置8〇固持於散熱器9〇下 端。 ' " 詳細說，第二優選實施例與第一優選實施例之不同之處在於，下壓裝置8〇 爲壓板’下壓裝置8〇爲中空框體構造，它包括四個侧邊及其圍成之空間，其兩 _ •相對之侧邊分別爲第一側邊81及第二側邊82。下壓裝置8〇自連接第一侧邊幻及 _第二側邊82之兩相對侧邊之中部背離散熱器9〇之方向鼓起，形成朝電連接器方 $凸出之壓接部83。下壓裝置之第—侧邊81及第二側邊82朝外對稱之分別凸伸 设有複數定位部84，定位部84之中央位置設有複數貫孔85。該散埶 括連接下壓裝和散熱器90之定位件ηι，該定位件⑽複數螺 氐面另叹有複數疋位凸塊9〇1，該定位凸塊9〇1設有收容定位件in之孔洞 =，散熱㈣在複數定位凸塊9G·設之中央位置還凸峰有散熱模塊9〇3， 过、、、模塊903在將散熱器9〇鎖固於電路板上時亦會壓接於晶片模組凸出之部 份。 、 、、且衣時’先將電連接器焊接於電路板(未標示)上，將晶片模組組設於電連 為上，同時定位件ln穿過下壓裝置8〇之貫孔％收容於散熱器奶定位凸塊則 8/ /7* —;.r" }b ,i ν,·Ά·-〇ϊ 允 ' 八 W M331137 HI month is 3 9 TTJ X i cost advantage; in addition 'factory miscellaneous section to save assembly iron The shell, T-iron shell and assembly program are simplified, and the manpower needs are younger. In addition, the metal components such as the upper iron shell, the lower sensitive and the rocker are omitted, which reduces the weight of the product and improves the efficiency and yield of the surface mount. It can be used as a product architecture for subsequent large-scale electrical connectors. ' ^ 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施The electrical connection between the module 2 and the electrical connector , includes a heat sink 6 and a pressing device 4, and the pressing device 4 can be held at the lower end of the heat sink 6. The electrical connection is 1 for electrically connecting the chip module 2 to the circuit board 3, and includes an insulative housing 1 . The insulative housing 10 has a substantially elongated shape and includes a housing portion for receiving a plurality of conductive terminals (not shown). And a side wall 101 surrounding the receiving portion 100. The accommodating portion 100 and the side wall 〇1 together form a accommodating space, and the wafer module 2 is received in the space and placed on the accommodating portion 1 ,, and the plurality of elastic cantilevers j 〇 2 disposed on the side wall 〇 1 and The plurality of grain bumps 1G3 are positioned to position the crystal module 2; the towel-to-phase unicorn (9) is provided with a notch (not labeled) to facilitate the dissipation of heat generated during operation of the wafer module 2, and a gap is formed in the side wall. The position is also provided with a pair of substantially symmetrical positioning posts 104 to cooperate with the positioning holes 41 provided at corresponding positions on the pressing device 4. The circuit board 3 is provided with four matching holes 30, and the distance between the four matching holes 3〇 is determined by the size of the area occupied by the insulating body 1 on the circuit board 3, and the area defined by the four matching holes 3〇 Sufficient to place the insulative body 10. The pressing device 4 is an elastic plate which is stamped from a metal material and has a substantially square flat structure. The center of the pressing device 4 is provided with an opening (not shown) for receiving the protruding portion of the wafer module 2. . The pressing device 4 is provided with four mounting holes 40, and the four mounting holes 4〇 are in one-to-one correspondence with the four matching holes 30 provided on the circuit board 3, and one side of the pressing device 4 is provided on one side. Pair the positioning holes 41. In addition, the pressing device 4 is further provided with a plurality of crimping portions 42. Referring to the fourth drawing, the crimping portion 42 protrudes from the surface of the pressing device 4 to be in contact with the wafer module 2. The bottom surface of the heat sink 6 is provided with four protruding positioning protrusions 6 配合 to cooperate with the mounting holes 40 of the pressing device 4, and the four positioning protrusions 6 are provided with threaded holes (not labeled) to The connector 5 is mated, here the connector 5 is four bolts of suitable length. When assembling, the wafer module 2 is first embedded in the receiving space of the electrical connector 1 and placed on the receiving portion 1 〇〇 M331137 | 补兄; then the wafer module 2 is placed on the circuit board 3 together with the electrical connector 1 The pressing device 4 and the heat sink 6 are sequentially placed on the electrical connector 1 and the wafer module 2, and the crimping portion 42 of the pressing device 4 faces the wafer module. 2 is located on one side and is in contact with the wafer module 2, and the four mounting holes 40 on the device 4 correspond to the matching holes 30 on the circuit board 3, and the fixed projection 60 of the heat sink 6 is inserted into the lower portion. In the mounting hole 40 of the pressing device 4, the positioning hole 41 on the pressing device 4 is engaged with the positioning post 1〇4 on the insulating body 10. Finally, the connecting member 5 passes through the matching hole 3 from below the circuit board 3. The cymbal and the pressing device 4 are engaged with the threaded holes provided in the positioning post 60 of the heat sink 6, so that the electrical connection, the circuit board 3, the pressing device 4 and the heat sink 6 are integrally assembled. The heat sink 6 uniformly applies pressure to the wafer module 2 by means of the pressing device 4, and the protruding crimping portion 42 provided on the pressing device 4 ensures that the pressing device 4 can be pressed onto the wafer module 2 and The pressure is transmitted to the conductive terminals to electrically conduct with the circuit patterns on the circuit board 3 and the conductive elements on the wafer module 2, thereby achieving the intended purpose of providing electrical connections. «Monthly, see the fifth figure to the seventh figure of the brother, which discloses that the heat sink module (not shown) of the second preferred embodiment of the present invention is used for crimping a wafer module (not shown) to realize a chip module and an electrical connection. The electrical connection of the device (not shown) also includes a heat sink 90 and a pressing device 80, and the pressing device 8 is held at the lower end of the heat sink 9〇. In detail, the second preferred embodiment is different from the first preferred embodiment in that the pressing device 8 is a pressure plate 'pressing device 8' is a hollow frame structure including four sides and In the enclosed space, the opposite sides are the first side 81 and the second side 82, respectively. The pressing device 8 is swelled from the opposite side of the opposite side of the connecting first side edge and the second side edge 82 away from the heat sink 9〇 to form a crimping portion 83 protruding toward the electrical connector side . The first side 81 and the second side 82 of the pressing device are respectively convexly protruded outwardly symmetrically, and a plurality of positioning portions 84 are provided. The central portion of the positioning portion 84 is provided with a plurality of through holes 85. The splicing includes a positioning member ηι connected to the lower press fitting and the heat sink 90. The locating member (10) has a plurality of shank faces and a plurality of yoke bumps 9〇1, and the positioning protrusion 9〇1 is provided with a receiving positioning member in Hole =, heat dissipation (4) In the central position of the plurality of positioning projections 9G, there is a heat sink module 9〇3, and the module 903 is also crimped when the heat sink 9〇 is locked on the circuit board. The protruding part of the wafer module. , , and , at the time of clothing, first solder the electrical connector to the circuit board (not shown), set the chip module to the electrical connection, and at the same time, the positioning member ln passes through the through hole of the pressing device 8 For the radiator milk positioning bumps 8
修j£| 士获..六' m 7L· M331137 之孔洞902中，這樣就將下壓裝置8〇固持於散熱器9〇下端；再將散熱 接件(未標不)固定於電路板上，在此過程中，下壓裝置8〇之壓接部83與晶片模 組先接觸，當壓接部83之彈性變形達到一定程度時，散熱器9〇之散熱模塊9〇3 亦抵壓在晶片模組凸出之部份。這樣，散熱器9〇藉下壓裝置8〇和散熱模塊9〇3 均勻施加壓力於晶片模組上，下壓裝置8G上所設置之凸出之壓接部83和散熱模 塊903可確保能壓到晶片模組並將壓力傳遞給導電端子使其與電路板上之電路 圖案以及晶片模組上之導電元件電性導通，從而達到提供電氣連接之預期目 的0 本創作之散熱器模組，利用固持於散熱器下端之下壓裝置均勻施加壓力於 晶片模組上並傳遞給導電端子，使導電端子與晶片模組以及電路板導通，達到 提供預期電氣連接性能之目的。本創作之散熱器模組不需要電連接器設置上鐵 设、下鐵殼及搖桿等零部件，因此具有節約安裝空間以及降低成本之優點；另 外’工廠内組裝段省去組裝上鐵殼、下鐵殼及搖桿等組裝工站，組裝程式簡化， 減少了人力需求；再者，省去上鐵殼、下鐵殼及搖桿該等金屬材質元件，減輕 了産品重量，提升了表面貼裝貼片之效率和良率，可作爲後續大型電連接器之 産品架構。 綜上所述，本創作符合新型專利要件，爰依法提出專利申請。惟，以上所 述者僅為本創作之較佳實施例，本創作之範圍並不以上述實施例為限；舉凡熟 習本案技藝之人士援依本創作之精神所作之等效修飾或變化，皆應涵蓋於以下 申清專利範圍内。 【圖式簡單說明】 第一圖係本創作第一優選實施例散熱器模組組設於電連接器、晶片模組及電路 板上之立體分解圖。 第二圖係第一圖所示另一視角之立體分解圖。 第二圖係第一圖所示絕緣本體之立體圖。 苐四圖係第一圖所示下壓裝置之立體圖。 第五圖係本創作第二優選實施例散熱器模組組設於電連接器、晶片模組及電路 M331137 I ,,餘 年丨丨月竓日2 1 稍 板上之立體分解圖。 第六圖係第五圖所示散熱器模組中下壓裝置之立體圖 第七圖係第五圖所示散熱器模組組設於電連接器上之立體組合圖 【主要元件符號説明】 電連接器 1 絕緣本體 10 收容部 100 侧牆 101 彈性懸臂 102 凸塊 103 定位柱 104 晶片模組 2 電路板 3 配合孔 30 下壓裝置 4、80 安裝孔 40 定位孔 41 壓接部 42、83 第一側邊 81 第二侧邊 82 定位部 84 貫孔 85 連接件 5 散熱器 6λ 90 定位凸柱 60 定位凸塊 901 孔洞 902 散熱模塊 903 定位件 111 10修j£| 士得..6' m 7L· M331137 hole 902, so that the pressing device 8 〇 is fixed on the lower end of the heat sink 9 ;; then the heat sink (not marked) is fixed on the circuit board During this process, the crimping portion 83 of the pressing device 8 is in contact with the wafer module. When the elastic deformation of the crimping portion 83 reaches a certain level, the heat sink module 9〇3 of the heat sink 9 is also pressed against The protruding part of the wafer module. In this way, the heat sink 9 均匀 uniformly applies pressure to the wafer module by the pressing device 8 〇 and the heat dissipation module 9 〇 3 , and the protruding crimping portion 83 and the heat dissipation module 903 provided on the pressing device 8G can ensure the pressure. Passing the chip module and transmitting the pressure to the conductive terminals to electrically connect with the circuit patterns on the circuit board and the conductive elements on the chip module, thereby achieving the intended purpose of providing electrical connection. The pressure device is uniformly applied to the lower end of the heat sink to apply pressure to the wafer module and is transmitted to the conductive terminals, so that the conductive terminals are electrically connected to the wafer module and the circuit board, thereby achieving the intended electrical connection performance. The heat sink module of the present invention does not require an electrical connector to be provided with components such as an iron frame, a lower iron shell and a rocker, thereby saving the installation space and reducing the cost; and the 'factory assembly section eliminates the assembly of the iron shell. The assembly station of the lower iron shell and the rocker, the assembly procedure is simplified, and the manpower requirement is reduced; in addition, the metal components such as the upper iron shell, the lower iron shell and the rocker are omitted, the weight of the product is reduced, and the surface is improved. The efficiency and yield of the placement patch can be used as a product architecture for subsequent large electrical connectors. In summary, this creation is in line with the new patent requirements, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments; the equivalent modifications or changes made by those who are familiar with the skill of the present invention in accordance with the spirit of the present creation are It should be covered in the scope of the following patents. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective view of a first preferred embodiment of a heat sink module disposed on an electrical connector, a chip module, and a circuit board. The second figure is an exploded perspective view of another view shown in the first figure. The second figure is a perspective view of the insulative body shown in the first figure. Figure 4 is a perspective view of the pressing device shown in the first figure. The fifth figure is a second preferred embodiment of the present invention. The heat sink module is assembled on the electrical connector, the chip module and the circuit M331137 I, and the three-dimensional exploded view of the second board on the next day of the next month. The sixth figure is the perspective view of the lower pressure device in the heat sink module shown in the fifth figure. The seventh figure is the three-dimensional combination diagram of the heat sink module set on the electrical connector. [Main component symbol description] Connector 1 Insulating body 10 accommodating part 100 Side wall 101 Elastic cantilever 102 Bump 103 Positioning post 104 Chip module 2 Circuit board 3 Cooperating hole 30 Pressing device 4, 80 Mounting hole 40 Positioning hole 41 Crimp part 42, 83 One side edge 81 Second side edge 82 Positioning portion 84 Through hole 85 Connector 5 Radiator 6λ 90 Positioning boss 60 Positioning projection 901 Hole 902 Heat dissipation module 903 Positioning member 111 10