M329761 八、新型說明： 【新型所屬之技術領域】 具有良好散熱功 本創作有關一種發光模組，特別是有關一種 能之發光模組，例如發光二極體(LED)模組。 【先前技術】 . 傳統讀絲置個日絲泡、日紐管、歧燈泡為其光 源產生器。近年來，則有發光二極體元件做為光源產生器之發展。 籲偷發光二極顏於冷發光，具她f量低、元件壽命長、益須 ，燈時間、反應速度快等優點，再加上其體積小、财震動、適合 罝產’容易配合朗需求製成極小或陣列式的元件，因此發光二 極體元件已普遍使躲資訊、軌·雜電子產品的指雜鱼 顯示裝置上，例如行動電話、PDA螢幕背光源、戶外各種顯示器、 交通號誌燈、車燈，甚至能應用於液晶顯示器產品。 # 〃關於習知之發光二極體模組有例如第i及2圖所示之例。如 第1圖所示之習知發光二極體模組包含有一基材1〇，複數顆發光 二極體單元12設於基材H)上方，以及-封騎料層M覆蓋於這 些發光一極體單元12上方。如第2圖所示之習知發光二極體模 組，包含有一基材16，一絕緣層18以及一印刷電路板2〇依序設 於基材16上方，以及複數顆已封裝完成之發光二極體封裝體22 設於印刷電路板2〇上方並電連接至印刷電路板2〇。發光二極體封 裝體22係先完成封裳，例如利用麵或灌膠方式形成封裝材料層 6 M329761 24，再集結於基材16上，形成發光二極體模組。 此外’為降低熱量或散熱之目的’美國專利申請案公開第 4099874號提供一種發光二極體之封裝結構及其元件和方法， 此封裝結構包含-傳導板、—絕緣層係位於傳導板上、一導體層 具有-開口係位於絕緣層上，以及—反射層。另外，已知有一種 發光二極醜_單顆發光二極體封裝結構及方法，包括形成有 -凹槽或-貫通孔之—絕緣承做，其凹槽或貫通孔之深度足夠 用以完全容納—發光二極體。又已知—種發光二極體模組的多顆 毛光-極體串接封裝結構，包括有單—之散熱柱及印刷電路板， 發光晶片置於散熱柱上方。 夕然而’在先前關於發光模組，例如LED模組，之封裝技術， 多=導電支架或印刷電路板(PCB)為基材，將多顆發光二極體晶片 固著於y基材之上，或將職完成之LED再結合成一模組 或光引擎。於使用上’多與散熱則直接結合使用以達散熱目的。 P使如此於模組或光引擎上仍然易有散熱不均勻與局部熱點的 狀况發生。此種局部高溫將會造成部份LED之壽命較差、顏色不 均、或光強度不均。 因此，對於能夠具有均勻散熱而避免局部熱點之新穎之發光 模組，仍有需求。 M329761 【新型内容】 本創作之目的是提供一 引擎或發光模組易有之散熱 種發光模組，以避免發生如習知之光 不均勻與局部熱點之狀況。 為達上述目的，依據本創作之一具體實施例，本創作之發光 模組包括—發光單元、—熱傳板、及複數個散熱則。發林元 係提供光源。熱傳板係、位於發光單元之底部表面 元產生之熱量。複數個散直於發光單元^ ^ 之方向㈣’並具心槽，崎容置麟減發光私 傳板所傳來之熱量傳遞至環境中。藉此，達成均勻散熱之目的: 又為達上述目的，依據摘作之另—具體實糊，本 發光模組包括-發光單元、複數個熱傳管、及複數個散⑽片。 發光單元係提供歧。魏麵㈣係與發光單元之底^ 接複數個散熱鰭片之表面分別與熱傳管接觸。 之可靠度與壽命 本創作之發光模組將熱傳板或熱傳管與散熱鰭片與發光單元 起建構結合之結果，使光源元件例如高功率LED模組或光引擎 散熱極佳，不會有散熱不均與熱點之發生，因此，提昇光源元件M329761 VIII. New description: [New technology field] Good heat dissipation The present invention relates to a light-emitting module, in particular to a light-emitting module, such as a light-emitting diode (LED) module. [Prior Art] The traditional reading wire is provided with a daily light bulb, a Japanese neon tube, and a light bulb as its light source generator. In recent years, there have been developments in light-emitting diode elements as light source generators. Screaming to illuminate the two-color face in cold light, with her low amount of f, long life of components, benefits, light time, fast response, etc., coupled with its small size, financial vibration, suitable for production, easy to meet the needs of Lang Made of very small or arrayed components, so LED components have been commonly used to hide information, track and miscellaneous electronic products on the fish display device, such as mobile phones, PDA screen backlights, outdoor displays, traffic signs Lamps, lights, and even for LCD products. # 〃 About the conventional light-emitting diode module, for example, the examples shown in Figures i and 2. The conventional light-emitting diode module as shown in FIG. 1 includes a substrate 1 , a plurality of light-emitting diode units 12 are disposed above the substrate H), and a sealing layer M covers the light-emitting ones. Above the polar body unit 12. A conventional light-emitting diode module as shown in FIG. 2 includes a substrate 16, an insulating layer 18, and a printed circuit board 2, which are sequentially disposed above the substrate 16, and a plurality of encapsulated light. The diode package 22 is disposed above the printed circuit board 2 并 and electrically connected to the printed circuit board 2 〇. The LED package 22 is formed by first forming a sealing material layer 6 M329761 24 by surface or potting, and then assembling on the substrate 16 to form a light emitting diode module. In addition, U.S. Patent Application Publication No. 4,099,874, the disclosure of which is incorporated herein by reference in its entirety, the entire disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of A conductor layer has an opening on the insulating layer and a reflective layer. In addition, there is known a light-emitting diode ugly _ single light-emitting diode package structure and method, including an insulating support formed with a groove or a through hole, the depth of the groove or the through hole is sufficient for completely Accommodate - the light-emitting diode. It is also known that a plurality of light-polar body serially connected package structures of a light-emitting diode module include a heat-dissipating column and a printed circuit board, and the light-emitting chip is placed above the heat-dissipating column. However, in the previous previous lighting module, such as LED module, packaging technology, multiple = conductive bracket or printed circuit board (PCB) as the substrate, a plurality of light-emitting diode wafers were fixed on the y substrate. , or the LEDs that complete the job are combined into a module or light engine. In use, more than heat is used directly to achieve heat dissipation. P causes such a situation that heat dissipation unevenness and local hot spots are still prone to occur on the module or the light engine. Such local high temperatures will cause some LEDs to have poor lifetime, uneven color, or uneven light intensity. Therefore, there is still a need for a novel light-emitting module that can have uniform heat dissipation and avoid local hot spots. M329761 [New Content] The purpose of this creation is to provide an illumination module that is easy to dissipate in an engine or a light-emitting module to avoid the occurrence of light unevenness and local hot spots. In order to achieve the above object, according to a specific embodiment of the present invention, the light-emitting module of the present invention comprises a light-emitting unit, a heat transfer plate, and a plurality of heat dissipation. The hairline system provides a light source. The heat transfer plate is the heat generated by the bottom surface element of the light-emitting unit. The plurality of lights are scattered in the direction (4) of the light-emitting unit ^^ and have a heart slot, and the heat transferred from the radiant private board is transmitted to the environment. Thereby, the purpose of uniform heat dissipation is achieved: in order to achieve the above object, the light-emitting module comprises a light-emitting unit, a plurality of heat-transfer tubes, and a plurality of scattered (10) sheets. The lighting unit provides a difference. The surface of the Wei (4) system and the bottom of the light-emitting unit are connected to the heat transfer tubes respectively. Reliability and Lifetime The light-emitting module of the present invention combines the heat transfer plate or the heat transfer tube with the heat-dissipating fin and the light-emitting unit, so that the light source component such as the high-power LED module or the light engine is excellent in heat dissipation. There are uneven heat dissipation and hot spots, so the light source components are improved.
【實施方式J 請參考第3圖，第3圖為依據本創作之一發光模組之剖面厂、 M329761 意圖。如第3圖所示，本創作之發光模組3〇包含有一發光單元％、 一熱傳板38、及複數個散熱鰭片40。 發光單元32係提供絲，—純括基板34與發光元件％。 基板34較佳為平面狀，以對應配合熱傳板％之職。發光元件 36可以是傳統之燈泡光源，蚁已封裝完成之咖元件、模組、 或光引擎，例如上述之習知㈣，不限於燈泡型或表面黏著型， 可以是-個或複數個LED之集合之封裝體，或是—個或複數個 =封叙集合體，可以使用市f之產品。由於高亮度之需求， =發光元件36可能產錄大之熱量。基板％較佳選擇熱傳 $良好之材質，歸㈣傳導。熱量之料方向 熱流42所示。 不口丁 傳板38係位於發光單70 32之底部表面，例如以銀膠或焊 ^才2式_於基板34而與基板34 ，哺遞發光單元32產 ^熱量°熱傳板38為-雙層壁之中空結構，如第8圖所示，外 :為熱料性材質’例如金屬。_54為多孔性熱傳導性材 二列如可利關粉沉積於外壁之内表面而形成，可吸附液體。 括一=均包括熱傳導性材料，因此可傳遞熱量。熱傳㈣内尚包 ^體56 ’被多孔性内壁54吸附，其為一種熱媒材料，在吸收 内之54之H祕揮發成為氣體，而散佈於熱傳板38 =58，減量娜導錄較，或可她冷叙内壁上凝 、、。回设成為液體，因内壁為多孔性結構，具有毛細現象，凝 9 M329761 結的液體可因毛細現象的作用流至他處 ，例如流到較熱處之内 壁上，待受熱時再揮發為氣體，如此循環流動。 熱傳板38與發光單元32係容置於複數個散熱鰭片40中。散 熱鰭片疋種熱料性片材，例如金屬，—般使用糾材或銅片 材積大，以方便散熱。在本創作中，散熱鰭片40係以垂直於 發光單元32之底部表面之方向g立排列，並具有對應於熱傳板兕 與發光單元32之尺寸與職之吟以便容置饰細目貼附。 複數個散熱鰭片40可排列成交又格狀，例如第4圖所示之頂視 圖，凹槽的部分容置發料元32與熱傳板38，形狀並不做特別限 制，配合產品設計與個目的即可，如此，可將熱傳板％所傳來 之熱量傳遞至環境空氣中。 可在本創作之發光模組之發光單元32、熱傳板％、及散熱鮮 片4〇之各界面之間佈滿散熱膏或散_#，增加熱傳導之觸^ 積，使得散熱更有效率。 在發光產品設計上屬於扁平之形狀時，本___ 板。而在發光產品設計上屬於長柱形時’本創作可以熱傳 熱傳板，以配合形狀。如第5圖所示’其為依據本創;之:― 體實施例之發光模組5〇，包括-發光單元32、魏個 7 及複數個散熱鰭片40。 B 44 > M329761 〜發光單元32，储供歧，如上述。概鋪鮮44與發光 早兀32之基板34底部表面貼附而連接，以傳遞發光元件％產生 之熱量。所使用之熱傳管44之結構較佳如第8圖所示，為一雙層 密閉中空管狀結構，外壁與内壁結構與上述熱傳板％類似。^ 管内亦包括—液體56為熱媒，在·多孔性㈣％之熱量後， 能夠揮發成為氣體，而散佈於熱傳管44内之郎兄，把熱量再傳 導至較冷處，或可絲冷細如輯發光單元讀麵之内壁上 凝結而回復成驗體，_壁為多紐結構，具有毛細現象， 凝結的液體刊毛細财的作駿至他處，例如流到較熱處之 内壁上’待受鱗再揮發為氣體，如此循環流動。 ，數個散賊片4〇係分顺熱傳f接觸，崎熱傳管所傳來 之熱里傳遞至％境中。如第6圖所示之縱剖面圖，散熱鰭片4〇可 僅與位於外圍之熱傳管44利用縛或蟬錫等連接而往外延伸。熱 傳管之間之空隙46可進—步充滿散齡或散讎材，以利進一步 ，熱。或者，如第7圖所示之橫截面圖，散熱鰭片4〇可形成互相 又又之才。子排列’將熱傳管44插置於格子内，互相接觸，以傳導 熱與散熱，散細片40與熱傳#44之間之空隙可進—步充滿散 熱局或散熱膠材。 如上述之結構可知’本創作之發光模組將鋪板或熱傳管與 ，細片與發光單元―起搭配使用，由於熱料或熱傳板内含液 悲之熱媒’熱量傳導至多孔性的内壁後，内壁上所吸附之液體吸 11 M329761 收此熱量，紐錢體而迅速於崎之雜散糊，而於較低溫 的内壁再凝結成賴，同時熱量也能經由較低溫之管壁散出，如 此達到快速政熱之效果。熱傳管或熱傳板之採用，需搭配整體光 源之使用設賴配合，麟板可配合扁平式光源之結構，熱傳管 則適合長條形空間與高密度亮度之絲。與f知之發光裝置比較 之’本創作之發光馳，可為小體積但高散熱之結構設計，使高 功率LED模組或糾擎胁搭配錢，散減且均自，不會有熱 點發生，故可提昇LED麵之可靠度與壽命。本_之發光模組 ，有變更應雜，可鮮同的制搭料同之祕板或熱傳 笞之叹计，應用於不同之產品用途，例如一般照明、LCD背光模 組、車用照明、裝飾照明等。 以上所述僅為本創作之較佳實施例，凡依本創作申請專利範 圍所做之均等變化與修飾，皆應屬本創作之涵蓋範圍。 【圖式簡單說明】 第1圖為習知一發光二極體模組的剖面示意圖。 #第2圖為習知-包含有數個單顆發光二極體塊之發光二極 體模組的剖面示意圖。 第3圖為依據本創作之一發光模組之剖面示意圖。 第4圖為依據本創作之一發光模組之頂視示意圖。 第5圖為依據賴狀紐實_之發光·之剖面示 12 M329761 第6圖為依據本創作之另一具體實施例之發光模組之側視示 意圖。 第7圖為依據本創作之又一具體實施例之發光模組之橫截面 示意圖。 第8圖為熱傳管與熱傳板傳熱路徑及剖面結構示意圖。 【主要元件符號說明】 10、16 :基材 > 12 :發光二極體單元 14、24 :封裝材料層 18 :絕緣層 20 :印刷電路板 22 :發光二極體封裝體 30、50 :發光模組 32 :發光單元 _ 34 :基板 36 :發光元件 38 ··熱傳板 40 :散熱鰭片 42 :熱流 44 :熱傳管 46 :空隙 52 ··外壁 13 M329761 54 :内壁 56 :液體 58 :空間[Embodiment J Please refer to Figure 3, and Figure 3 is a schematic diagram of the cross-section factory of the light-emitting module according to the present invention, M329761. As shown in FIG. 3, the light-emitting module 3A of the present invention comprises a light-emitting unit%, a heat transfer plate 38, and a plurality of heat-dissipating fins 40. The light-emitting unit 32 is provided with a wire, a pure substrate 34 and a light-emitting element%. The substrate 34 is preferably planar to correspond to the heat transfer plate %. The light-emitting element 36 can be a traditional light bulb light source, a coffee component, a module, or a light engine that has been packaged by an ant. For example, the above-mentioned conventional (four) is not limited to a bulb type or a surface-adhesive type, and may be one or a plurality of LEDs. The package of the collection, or one or a plurality of = seal assembly, can use the product of the city f. Due to the high brightness requirement, the illuminating element 36 may produce a large amount of heat. The substrate % is preferably selected from the heat transfer material and is (four) conductive. The direction of heat is shown by heat flow 42. The non-mouth transfer plate 38 is located on the bottom surface of the light-emitting unit 70 32, for example, by silver glue or soldering type 2 on the substrate 34 and the substrate 34, and the light-emitting unit 32 is fed to generate heat. The heat transfer plate 38 is - The double-walled hollow structure, as shown in Fig. 8, is external: it is a hot material such as metal. _54 is a porous heat conductive material. The second column is formed by depositing a powder on the inner surface of the outer wall to adsorb the liquid. Included = all include thermally conductive materials, so heat can be transferred. The heat transfer (4) is still contained in the body 56' adsorbed by the porous inner wall 54, which is a heat medium material, and the H secret in the absorption is volatilized into a gas, and is dispersed in the heat transfer plate 38 = 58. Relatively, or she can condense on the inner wall. It is turned into a liquid, because the inner wall is porous and has a capillary phenomenon. The liquid of the condensed 9 M329761 can flow to other places due to the phenomenon of capillary action, for example, flowing to the inner wall of the hotter place, and then volatilized into gas when heated. , so the circulation flows. The heat transfer plate 38 and the light emitting unit 32 are housed in a plurality of heat radiating fins 40. Heat-dissipating fins, such as metal, use a piece of material or a large amount of copper to facilitate heat dissipation. In the present creation, the heat dissipating fins 40 are arranged in a direction perpendicular to the bottom surface of the light emitting unit 32, and have a size corresponding to the heat transfer plate and the light emitting unit 32 for accommodating the decorative details. . The plurality of heat dissipating fins 40 can be arranged in a grid shape, for example, the top view shown in FIG. 4, the portion of the recess accommodating the sending element 32 and the heat transfer plate 38, and the shape is not particularly limited, and the product design is combined with The purpose is to transmit the heat transferred from the heat transfer plate to the ambient air. The heat-dissipating paste or the _# can be filled between the light-emitting unit 32 of the light-emitting module of the present invention, the heat transfer plate%, and the heat-dissipating fresh film 4〇, thereby increasing the contact of the heat conduction, so that the heat dissipation is more efficient. . This ___ board is used when the illuminating product is designed to have a flat shape. When the design of the illuminating product belongs to the long column shape, the creation can heat transfer the heat transfer plate to match the shape. As shown in FIG. 5, it is based on the present invention; the light-emitting module 5A of the embodiment: includes a light-emitting unit 32, a Wei 7 and a plurality of heat-dissipating fins 40. B 44 > M329761 ~ illuminating unit 32, storage and disambiguation, as described above. The fresh tile 44 is illuminated and the bottom surface of the substrate 34 of the early 32 is attached and connected to transfer the heat generated by the light-emitting element. The structure of the heat transfer tube 44 used is preferably as shown in Fig. 8, which is a double-layered closed hollow tubular structure, and the outer wall and inner wall structure are similar to the above-mentioned heat transfer plate. ^ The tube also includes - the liquid 56 is a heat medium, which is capable of volatilizing into a gas after being porous (4%) of heat, and is distributed in the heat transfer tube 44 to transfer heat to a cold place, or a wire. On the inner wall of the reading surface of the cold-light illuminating unit, it condenses and returns to the test body. The wall of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ On the 'to be scaled and then volatilized into a gas, so the circulation flows. A number of scattered thief films are distributed in the heat of the heat transfer. As shown in the longitudinal section of Fig. 6, the heat radiating fins 4 can be extended only by the connection of the heat transfer tubes 44 located at the periphery by means of binding or soldering. The gap 46 between the heat transfer tubes can be stepped into a full-length or loose coffin for further heat. Alternatively, as shown in the cross-sectional view of Fig. 7, the fins 4 〇 can form a mutual relationship. The sub-arrangement inserts the heat transfer tubes 44 into the grids to contact each other to conduct heat and heat, and the gap between the fine sheets 40 and the heat transfer #44 can be further filled with the heat dissipation or heat-dissipating glue. As can be seen from the above structure, the light-emitting module of the present invention uses a plate or a heat transfer tube and a thin piece together with a light-emitting unit, and the heat medium of the hot material or the heat transfer plate contains heat to the porosity. After the inner wall, the liquid adsorbed on the inner wall absorbs 11 M329761 to absorb the heat, and the money body quickly spreads into the stray paste, and then condenses on the lower temperature inner wall, and the heat can also pass through the lower temperature wall. Dissipate, so achieve the effect of rapid political heat. The use of heat transfer tubes or heat transfer plates is compatible with the use of the entire light source. The Lin board can be combined with the structure of a flat light source, and the heat transfer tube is suitable for long strip spaces and high density brightness wires. Compared with the light-emitting device of the knowing light, the design of the light-emitting device can be designed for a small-volume but high-heat-dissipating structure, so that the high-power LED module or the engine is matched with the money, and the light is reduced and all from the hot spot. Therefore, the reliability and life of the LED surface can be improved. The illuminating module of this _ has any changes, and can be used in different product applications such as general lighting, LCD backlight module, vehicle lighting, etc. Decorative lighting, etc. The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made in accordance with the scope of the patent application of this creation should be covered by this creation. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a conventional light-emitting diode module. #图图 2 is a schematic cross-sectional view of a light-emitting diode module including a plurality of single light-emitting diode blocks. Figure 3 is a schematic cross-sectional view of a light-emitting module according to the present invention. Figure 4 is a top plan view of a light-emitting module according to the present invention. Fig. 5 is a cross-sectional view showing the illumination according to the singularity of the singularity. 12 M329761 Fig. 6 is a side view showing the illumination module according to another embodiment of the present invention. Figure 7 is a cross-sectional view of a light emitting module in accordance with yet another embodiment of the present invention. Figure 8 is a schematic diagram of the heat transfer path and cross-sectional structure of the heat transfer tube and the heat transfer plate. [Description of main component symbols] 10, 16: substrate] 12: light-emitting diode unit 14, 24: encapsulating material layer 18: insulating layer 20: printed circuit board 22: light-emitting diode package 30, 50: light Module 32: light-emitting unit _ 34: substrate 36: light-emitting element 38 · heat transfer plate 40: heat-dissipating fin 42: heat flow 44: heat transfer pipe 46: void 52 · outer wall 13 M329761 54: inner wall 56: liquid 58: space