M328428 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種顯跡防拆安全封袋，尤指一種用 於顯不封口及周邊是否已經過拆封之安全封袋。 【先前技術】M328428 VIII. New Description: [New Technology Field] This creation department is about a kind of tamper-evident safety sealing bag, especially a safety sealing bag used for unsealing and whether the surrounding has been unpacked. [Prior Art]
隨著科技快速發展之下，人們對於文件及包裝安全性 保護的要求也相對的提高’而目前一般的包裝材料，如現 金袋、文件袋、快遞包裝、法庭證物袋、以及機密文件、 管制藥品等封袋仍具有保密性不佳，不肖人士可輕易對該 封袋拆封再還原出與未拆封時如出一轍之包裝，進而造成 收件人之混賴認，並導致重敎件倾外流而不自㈣ h况產生’造成企業經營、科技研發及社會安全的重大風 險0 -般習知之文件包㈣，其側邊皆為無糖邊之溶 封邊結構’㈣只在文件料圍觀料融以製造 狀封邊’-般人士只需拆封該線狀封邊再加以炫融二 以目前技誠設備可完全抹除拆封痕跡，料於封口處 僅以戳記、封蠟或膠帶等簡單安全措施，來加 資料安全’而面對目前高科技破解手段，則仍有安錄 足之疑慮。 个 【新型内容】 有鑑於先前技術所產生的缺點，補作之 供一種祕㈣封π及闕是否已_拆狀安全封= • M328428 為達到上述目的，本創作提供一種用於顯示封口及周 • 邊是否已經過拆封之安全封袋，其包括有： • 一上基材及一下基材，皆為PE材質之薄片； 一封邊’似縣方岐上下基獅合成具有一寬度 之一融合層； -辨識層’形成於該上下基材融合之融合層外侧且環 繞於遠顯跡防拆安全封袋周邊； • 一封口，其上基材於封口處具有一黏著層，該黏著層 Φ 與上基材之父界端设置有第一防沾黏基材，下基材於封口 處设置有第二防沾黏基材；其中，當封上封口時，第一防 沾黏基材璺置於第二防沾黏基材之上層，文件資料置於第 二防沾黏基材之下層或可藉由第二防沾黏基材阻擋文件 接觸黏著層；另外，該封口處之黏著層貼合後再受外力撕 起，將於上基材處發生脫膠現象，該膠劑以一預設之符號 脫離上基材，而粘黏於下基材之封口處，形成顯示有撕開 狀態之識別符號，上基材之脫膠處也呈現相對於下基材粘 黏處之識別符號，顯示該封口已遭受外力開啟； . 一高溫感應黏著層，形成於該上基材之黏著層區域， 該區域遇熱則高溫感應黏著層即改變顏色。 以下藉由特定實施方式闡明本創作，使熟悉相關技術 人士可由本說明書及圖式揭示之内容輕易的了解本創作之 優點與功效，在基於本創作之精神下，說明書中之各項細 節亦可基於不同觀點與應用進行各種實施與變更。 【實施方式】 6 M328428 為使貴審查委員能對本創作之特徵、目的及功能有更 進一步的認知與瞭解，下文特將本創作相關細部結構以及 設計理念原由進行說明，以使得貴審查委員可以了解本創 作之特點，詳細說明陳述如下： 茲配合下列圖式說明本創作之詳細結構及其連結關 係，以利審查委員作一了解。 請參閱圖一及圖二所示，係為顯跡防拆安全封袋之上 下基材、封邊及辨識層示意圖，該顯跡防拆安全封袋，其 具有一上基材11及一下基材12,其上下基材皆為薄片狀， 將上下基材疊置並以熔融方式使上下基材側邊黏合成具有 一寬度之融合層21為安全封袋之封邊，該封邊外側具有可 識別遭拆封與否之符號群組為一辨識層22，該辨識層22 可為印刷產生或其他可形成符號群組之方式產生，該辨識 層22位於融合層21外侧且環繞於顯跡防拆安全封袋周 邊；該封口處於上基材11侧設置有一黏著層13，該黏著 層區域範圍設置有高溫感應黏著層51，該黏著層區域可視 需求全部或部分設置為高溫感應黏著層，該黏著層13與上 基材11之交界端設置有第一防沾黏基材15，該封口處於 下基材12側設置有第二防沾黏基材16，其第一及第二防 沾黏基材皆為薄片狀，此外，該下基材12於封口處具有一 往封口外延伸之基材為一資訊標示區14，可書寫資料相 關事項。 請參閱圖三所示，係為顯跡防拆安全封袋之封口之結 構，該封口處於其上基材側具有一黏著層13，該黏著層13 與上基材之交界端設置有第一防沾黏基材15，下基材12 M328428 時， 該 不 於封口處設置有第二防沾黏基材16;其中，當封上封口 第一防沾黏基材15疊置於第二防沾黏基材16之上層 黏著層13將第一防沾黏基材15與第二防沾黏基材丨6 / 合，當文件資料31置入安全封袋中，文件資料31將 二防沾黏基材16之阻擋或受第二防沾黏基材16覆蓋又第 會接觸到黏著層13而受粘汙。With the rapid development of technology, people's requirements for the protection of documents and packaging security have been relatively improved. The current general packaging materials, such as cash bags, paper bags, express packaging, court bags, and confidential documents, controlled drugs The sealed bag still has poor confidentiality, and the unscrupulous person can easily unpack the bag and restore the package that is the same as that when it was not unpacked, which will cause the recipient to confuse and cause the heavy piece to flow out. Not from (4) h conditions produce a 'significant risk of business management, scientific research and development and social security 0 - the general knowledge of the package (four), the side of which is the sugar-free edge of the seal edge structure ' (four) only in the document materials Sealing in the form of manufacturing--the average person only needs to unpack the line-shaped edge banding and then smash it. The current technology equipment can completely erase the unsealing marks. It is only necessary to stamp only the seal, seal wax or tape. Security measures, to add data security' and face the current high-tech cracking methods, there are still doubts about the record. [New content] In view of the shortcomings of the prior art, the supplement for a secret (4) seal π and 阙 has been _ detached security seal = • M328428 In order to achieve the above purpose, the creation provides a display for sealing and Zhou • Whether it has been unsealed and sealed, it includes: • An upper substrate and a lower substrate, all of which are made of PE material; an edge of the same as the county 岐 岐 基 基 具有 具有 具有 具有a layer; an identification layer formed on the outer side of the fusion layer of the upper and lower substrates and surrounding the periphery of the far-track tamper-proof security envelope; • a mouth on which the substrate has an adhesive layer at the seal, the adhesive layer Φ a first anti-adhesive substrate is disposed on the parent end of the upper substrate, and a second anti-adhesive substrate is disposed on the lower substrate; wherein, when the seal is sealed, the first anti-adhesive substrate is Placed on top of the second anti-adhesive substrate, the document material is placed on the lower layer of the second anti-adhesive substrate or the adhesive layer can be blocked by the second anti-adhesive substrate; and the adhesive layer at the seal After being fitted, it will be torn by external force and will be on the upper substrate. In the phenomenon of raw degumming, the glue is separated from the upper substrate by a predetermined symbol, and is adhered to the sealing portion of the lower substrate to form an identification symbol showing a tearing state, and the degumming portion of the upper substrate is also opposite to the lower portion. The identification mark of the adhesive surface of the substrate indicates that the seal has been subjected to external force opening. A high temperature induction adhesive layer is formed on the adhesive layer region of the upper substrate, and when the region is hot, the high temperature induction adhesive layer changes color. In the following, the present invention will be clarified by a specific embodiment, so that those skilled in the art can easily understand the advantages and effects of the present invention by the contents disclosed in the specification and the drawings. In the spirit of the present creation, the details in the specification may also be Various implementations and changes are made based on different perspectives and applications. [Embodiment] 6 M328428 In order to enable your review committee to have a further understanding and understanding of the features, purposes and functions of this creation, the following is a description of the detailed structure and design concept of this creation, so that your review board can understand The characteristics of this creation, the detailed description is as follows: The following structure is used to explain the detailed structure of the creation and its connection relationship, so that the review committee can understand. Please refer to FIG. 1 and FIG. 2 , which are schematic diagrams of the upper substrate, the edge sealing and the identification layer on the tamper-proof security sealing bag. The tamper-proof security sealing bag has an upper substrate 11 and a lower base. The upper and lower substrates of the material 12 are in the form of flakes, and the upper and lower substrates are stacked and the side edges of the upper and lower substrates are melted into a fused layer 21 having a width as a sealing edge of the security envelope, and the outer side of the sealing edge has The group of symbols that can be identified as being unpacked or not is an identification layer 22, which can be generated in the form of printing or other groups of symbols that can be formed outside the fusion layer 21 and surrounding the display track. The periphery of the upper surface of the substrate 11 is provided with an adhesive layer 13 , and the adhesive layer region is provided with a high temperature induction adhesive layer 51 , and the adhesive layer region can be disposed in whole or in part as a high temperature induction adhesive layer. The first anti-adhesive substrate 15 is disposed at the boundary between the adhesive layer 13 and the upper substrate 11. The second anti-adhesive substrate 16 is disposed on the lower substrate 12 side, and the first and second anti-sticking materials are disposed. The adhesive substrate is in the form of a sheet, and in addition, the lower substrate 12 The substrate extending outside the sealing portion at the sealing portion is an information marking area 14 for writing related matters. Referring to FIG. 3, the structure of the seal of the tamper-proof security bag is provided with an adhesive layer 13 on the upper substrate side, and the first end of the adhesive layer 13 and the upper substrate is disposed first. When the anti-adhesive substrate 15 and the lower substrate 12 M328428 are disposed, the second anti-adhesive substrate 16 is disposed at the sealing portion; wherein, when the sealing first sealing anti-adhesive substrate 15 is placed on the second protection The adhesive layer 13 on the adhesive substrate 16 has the first anti-adhesive substrate 15 and the second anti-adhesive substrate 丨6, and when the document data 31 is placed in the security envelope, the document data 31 will be two-proof. The barrier of the adhesive substrate 16 is either covered by the second anti-adhesive substrate 16 and may contact the adhesive layer 13 to be stained.
請參閱圖四及圖五所示，係為顯跡防拆安全 封袋封 黏封後及高溫感應黏著層受熱後之示意圖，該下基材声 第二防沾黏基材可視需求，印製上不同符號型態之封％ 別符號41，該封口識別符號41於顯跡防拆安全封袋 黏封後，即浮現於高溫感應黏著層51處，若未確實毒占 該封口識別符號41則不會顯現，為可依此判定該封〇Please refer to Figure 4 and Figure 5 for the schematic diagram of the tamper-evident security seal after sealing and the high-temperature induction adhesive layer. The second substrate anti-adhesive substrate can be printed according to the needs. The seal symbol 41 of the different symbol type is displayed on the high-temperature induction adhesive layer 51 after the seal tamper-evident security bag is sealed, and if the seal identification symbol 41 is not actually poisoned, Will not appear, in order to judge the seal
D 之 圭子 封則 是否 已確貫黏封之安全措施，除此之外’該南溫感應龜著居 形成於該上基材之黏著層13區域，該黏著層區域可視^长 全部或部分設置為高溫感應黏著層，當上基材遇熱時該區 域中之高溫感應黏著層51即改變顏色，該高溫感應黏著層 51Whether the seal of D has been confirmed to be a security measure for the adhesive seal, in addition to the fact that the south temperature induction turtle is formed in the adhesive layer 13 region of the upper substrate, and the adhesive layer region can be set in whole or in part. For the high temperature induction adhesive layer, the high temperature induction adhesive layer 51 in the region changes color when the upper substrate is heated, and the high temperature induction adhesive layer 51
51未遇熱時為白色，當遇熱達攝氏六十度以上時，該高溫 感應黏著層51將由白色變為粉紅色，而浮現於高溫感應黏 著層51處之封口識別符號41，不受溫度改變影響。 請參閱圖六所示，係為顯跡防拆安全封袋上、下基材 封口處撕開狀態之識別符號，該封口處上基層之黏著層貼 合後再受外力撕起，將於上基材撕開處發生脫膠，該膠劑 以一預設之符號脫離上基材，粘黏於下基材之封口處，於 下基材上顯示撕開狀態之識別符號61，上基材之脫膠處也 顯現出相對於下基材粘黏處之撕開狀態之識別符號61 ’顯 8 M328428 示該封口已遭受外力開啟，另，為了擴大使用範圍及使用 環境，該黏著層之材料於攝氏零度至零下四十度以内時， 進行貼合後再撕起之動作，仍可形成顯示有撕開狀態之識 別符號。 綜上所述，本創作之目的及功效上均深富實施之進步 性，極具產業之利用價值，且為目前市面上前所未見之新 型，完全符合新型專利之可專利要件，爰依法提出申請。 - 為以上所述者，僅為本新型之較佳實施例，當不能以之限 I 定本新型所實施之範圍。極大凡依本新型申請專利範圍所 作之均等變化與修飾，皆應仍屬本新型專利涵蓋之範圍 内，謹請貴審查委員明鑑，並祈惠准，是所至禱。 【圖式簡單說明】 第一圖：係為顯跡防拆安全封袋之上下基材之示意圖。 第二圖··係為顯跡防拆安全封袋之封邊及辨識層示意圖。 第三圖：係為顯跡防拆安全封袋之封口之結構圖。 第四圖：係為顯跡防拆安全封袋封口黏封後之示意圖。 第五圖A:係為顯跡防拆安全封袋封口黏著層之部分區域 為南溫感應黏者層受熱後之不意圖。 第五圖B ··係為顯跡防拆安全封袋封口黏著層之全部區域 為高溫感應黏著層受熱後之示意圖。 第六圖：係為顯跡防拆安全封袋上、下基材封口處撕開狀 態之識別符號。 【主要元件符號說明】 9 M328428 11上基材 • 12下基材 . 13黏著層 14資訊標示區 15第一防沾黏基材 16第二防沾黏基材 • 51高溫感應黏著層 ， 21融合層 # 22辨識層 31文件資料 41封口識別符號 61撕開狀態之識別符號51 is white when it is not hot, when the heat reaches 60 degrees Celsius or more, the high temperature induction adhesive layer 51 will change from white to pink, and the sealing identification 41 appearing at the high temperature induction adhesive layer 51 is not subject to temperature. Change the impact. Please refer to Figure 6 for the identification symbol of the tearing state of the upper and lower substrate seals of the tamper-proof security bag. The adhesive layer on the base layer is attached and then torn by external force. Degumming occurs at the tearing of the substrate, the glue is separated from the upper substrate by a predetermined symbol, and is adhered to the sealing portion of the lower substrate, and the identification symbol 61 of the tearing state is displayed on the lower substrate, and the upper substrate is The degumming point also shows the identification symbol of the tearing state relative to the adhesiveness of the lower substrate. 61 'M8428 shows that the sealing has been subjected to external force opening. In addition, in order to expand the scope of use and the environment of use, the material of the adhesive layer is in Celsius. When the temperature is from zero to minus 40 degrees, the action of tearing up after the bonding is performed can still form an identification symbol showing the tearing state. In summary, the purpose and efficacy of this creation are both rich in the progressiveness of the implementation, extremely valuable in the use of the industry, and it is a new type that has never been seen before in the market, and fully meets the patentable requirements of the new patent. submit application. - For the above, it is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited. The average change and modification of the scope of this new patent application shall remain within the scope of this new patent. I would like to ask your review committee to give a clear understanding and pray for it. [Simple description of the diagram] The first picture is a schematic diagram of the substrate above and below the tamper-proof security envelope. The second picture is a schematic diagram of the edge sealing and identification layer of the tamper-proof security envelope. The third picture is a structural diagram of the seal of the tamper-proof security envelope. The fourth picture is a schematic diagram of the sealing of the tamper-proof safety sealing bag. Figure 5A: Part of the adhesive layer of the tamper-evident security bag sealing layer. It is not intended to be heated by the south temperature sensory layer. The fifth figure B ·· is the schematic tamper-proof security envelope sealing the entire layer of the adhesive layer is a schematic diagram of the high-temperature induction adhesive layer after heating. Figure 6: Identification symbol for the tearing state of the upper and lower substrate seals of the tamper-evident security bag. [Main component symbol description] 9 M328428 11 upper substrate • 12 lower substrate. 13 adhesive layer 14 information marking area 15 first anti-adhesive substrate 16 second anti-adhesive substrate • 51 high temperature induction adhesive layer, 21 fusion Layer #22 Identification layer 31 Document data 41 Seal identification symbol 61 Identification symbol of tearing state