M327278 忒曰曰片毛路薄膜丨’上之電路12，，貼附於該SIM卡丨之晶片 12上而該溥膜上之晶片12，則嵌入該容納孔11内定位（如 第一圖叫，使該_卡】置於手機之卡槽内，提供如同 又卡之功此’且可依需要功能裝設所需晶片電路薄膜1，， 以提供不同用途之遠端控制效果。 • 明參閱第二圖、第二圖-A、第三、六、七圖所示，本 _發明係由一座體2上設一高台21，該高台21側邊開設有 ⑩榼向鏤空部22，該高台21前端以一枢軸23穿設一第一軸 孔231而樞設一按壓握把24於該高台21之第二軸孔241， 使該按壓握把24位於該高台21上方，且位於該高台21 後方開設一縱向滑孔25，供一傳動桿26穿入按壓握把24 之固定軸孔232再穿設於該縱向滑孔25後，貫穿一衝刀模 27之固定孔271，而將該衝刀模27嵌入位於該高台21所 縱向貫穿之刀模通道212内，再藉一彈簧28置於該高台 21之容納槽211内，並頂推該按壓握把24，而帶動衝刀模 _ 27向上懸空，如述樞軸23及傳動桿26兩端則分別藉由一 C型扣j衣a固疋於按壓握把24上；一平台3，係可橫向嵌 入橫向鏤空部22内，其上設一插孔31，其適當位置設一 與SIM卡1相同形狀之放置槽32,且位於放置該srM卡1 無曰b片位置之放置槽32上開設一衝孔33，經一插銷34由 向台21上之通孔221貫穿至橫向鏤空部22而穿設於該平 台3之插孔31，且嵌入該樞接孔222，使該平台藉由插銷 34為轴心旋轉進入該橫向鏤空部22内；請參閱第六圖所 示：當按壓握把24下壓，使該傳動桿26帶動衝刀模27 M327278 對 SIJVI 卡 i 徐:φ 4 & 衝出该衝孔33形狀，使 容納孔11 (如塗一罔Ώ、、， 使邊SIM卡1上形成一 29掉落（士 # 回_ 亚令該廢料B由下方之廢料孔 推復歸，再將w, Γ/ 8將按壓握把24頂 取下已n〆σ由5亥也田'向鏤空部22内予以轉出，並 卜匕凡成衝孔之SIM卡1，（如穿 、 呈有曰Η Q如弟—圖-Β)，以提供另一 ^ ㈣線路之晶片電路薄膜}”貼附於該讓卡！ 卡1，^,圖C)’同時該薄膜上之晶片12”恰能嵌入該SIM 卜夕曰Γ、内孔11内’而該晶片電路薄膜】”則與SIM卡1 種所:功二W(立如第一圖_D )，達到該圖卡1，具有各 可^ρΓ:供隨意附加之使用效益；因此，本衝孔裝置 ::德地作S〗M卡1之裝配擴充附加，具有使用之方便 厂參閱第一圖及第二圖_八所示，前述平台3底部設有 一 &形槽35,該弧形槽35前端兩側分別設一圓槽％，使 ::台3以一插銷34縱向穿設於該高台21而後穿設於該 口 3之插孔31内樞接’再藉一限位桿々由座體2底部鎖 入限位孔2〇 1而穿設於該弧形槽35内，同時再以一彈性元 件之螺絲5頂推-壓縮彈簧52將一鋼珠5" 體2之疋位孔202位置，同時令該鋼珠5丨可再平台3左右 擺動至極限時嵌入前述兩圓槽36内定位，以提供該平台3 以忒插銷34為軸心作扳開或推入該高台2 1下方之橫向鏤 空部22的極限定位，使該SIM+ !能在推入橫向鎮空部 22準確衝孔者。 请芩閱第二圖及第六、七圖所示，該衝刀模27之刀 9 M327278 具，係製成一特定形狀，且於端面凹入而於週邊形成一衝 刀272，以對SIM卡1衝孔而不會產生毛邊者。 M327278 彈簣28 廢料孔29 平台3 插孔31 放置槽32 衝孔33 插銷34 廢料B 弧形槽35 圓槽36 限位桿4 彈性元件5 鋼珠51 限位孔201 定位孔202 12The circuit 12 of the M327278 毛 毛 丨 , , , , , , , 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路In the card slot of the mobile phone, the card circuit 1 can be provided as needed, and the desired chip circuit film 1 can be installed as needed to provide remote control effects for different purposes. The second figure and the second figure-A, the third, the sixth and the seventh figure show that the body_2 is provided with a platform 21 on the side of the body 2, and the side of the platform 21 is provided with a 10-turn hollow portion 22, the platform A first shaft hole 231 is bored in a front end of the first shaft hole 231 , and a pressing handle 24 is pivoted to the second shaft hole 241 of the upper table 21 , so that the pressing grip 24 is located above the height table 21 and located at the height table 21 . A longitudinal sliding hole 25 is defined in the rear, and a transmission rod 26 is inserted into the fixing shaft hole 232 of the pressing grip 24 and then inserted through the longitudinal sliding hole 25, and penetrates through the fixing hole 271 of the punching die 27, and the punching The die 27 is embedded in the die passage 212 extending longitudinally of the platform 21, and is placed in the receiving slot 211 of the platform 21 by a spring 28. And pushing the pressing handle 24, and driving the punching die _ 27 to hang upward, as the pivoting shaft 23 and the driving rod 26 are respectively fixed on the pressing grip 24 by a C-shaped buckle j A platform 3 can be laterally embedded in the lateral hollow portion 22, and a jack 31 is disposed thereon, and a placement slot 32 having the same shape as the SIM card 1 is disposed at an appropriate position, and the srM card 1 is placed on the sbM card. A punching hole 33 is defined in the positioning slot 32, and is inserted through the through hole 221 of the mounting table 21 to the lateral hollow portion 22, and is inserted into the insertion hole 31 of the platform 3, and is embedded in the pivot hole 222. The platform is rotated into the lateral hollow portion 22 by the pin 34; as shown in the sixth figure: when the pressing handle 24 is pressed, the driving rod 26 drives the punching die 27 M327278 to the SIJVI card i Xu: φ 4 & rush out of the shape of the punching hole 33, so that the receiving hole 11 (such as coating a 罔Ώ, ,, so that the side of the SIM card 1 forms a 29 drop (Shi #回_ 亚令 the waste B from below The scrap hole is pushed back, and then w, Γ / 8 will press the grip 24 to remove the already n〆σ from 5 Hai Yetian' to the hollow part 22, and the divination into the hole SIM card 1, (such as wearing, showing 曰Η Q such as brother - Figure - Β), to provide another ^ (four) line of the wafer circuit film} "attached to the card! Card 1, ^, Figure C) ' At the same time, the wafer 12" on the film can be embedded in the SIM 曰Γ 曰Γ, the inner hole 11 'and the wafer circuit film 】" and the SIM card 1 type: Gong 2 W (as shown in the first figure _D) , to achieve the card 1, with each can be: ρ Γ 供 供 供 供 供 供 供 供 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此And the bottom of the platform 3 is provided with a & shape groove 35, and a circular groove % is respectively arranged on both sides of the front end of the curved groove 35, so that: the table 3 is longitudinally disposed on the platform by a pin 34 21 is then pivotally connected to the jack 31 of the port 3, and then a limit rod is inserted into the limit hole 2〇1 by the bottom of the base 2 to be inserted into the arc groove 35, and then An elastic element screw 5 push-compression spring 52 positions the position of the ball hole 5 of the steel ball 5" body 2, and at the same time, the steel ball 5 丨 can be tilted to the limit when the platform 3 is swung to the limit, and is inserted into the two circular grooves 36 to The platform 3 is provided with the pin 34 as an axis for opening or pushing into the extreme positioning of the lateral hollow portion 22 below the upper table 21, so that the SIM+! can be accurately punched in the lateral hollow portion 22. Please refer to the second figure and the sixth and seventh figures. The knife 9 M327278 of the punching die 27 is made into a specific shape, and is recessed at the end face to form a punching knife 272 at the periphery to the SIM. Card 1 is punched without burrs. M327278 magazine 28 waste hole 29 platform 3 jack 31 placement slot 32 punching 33 pin 34 scrap B arc groove 35 circular groove 36 limit rod 4 elastic element 5 steel ball 51 limit hole 201 positioning hole 202 12